CN204470756U - Through-hole reflow positioning fixture - Google Patents
Through-hole reflow positioning fixture Download PDFInfo
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- CN204470756U CN204470756U CN201520055968.4U CN201520055968U CN204470756U CN 204470756 U CN204470756 U CN 204470756U CN 201520055968 U CN201520055968 U CN 201520055968U CN 204470756 U CN204470756 U CN 204470756U
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Abstract
The utility model relates to a kind of Through-hole reflow positioning fixture, comprise substrate, four corners of described substrate have installing hole, two symmetrically arranged grooves are had in the middle part of described substrate, the upper and lower side being positioned at two grooves has the locating groove placing surface-mounted integrated circuit, the middle part of described plate locating groove is provided with pickup groove, and the substrate being positioned at pickup groove two ends is provided with keeper respectively by straight pin; The substrate of described groove side has spaced USB welding groove, and the front end of each USB welding groove is respectively arranged with two pallets, and the upper end of each USB welding groove has locating hole.The utility model compact conformation, rationally, by the effect of positioning fixture, the welding job to surface-mounted integrated circuit can be completed easily, can not produce the phenomenon that solder drops during welding, welding is firm, there will not be the phenomenon of rosin joint, substantially increase operating efficiency, ensure crudy.
Description
Technical field
The utility model relates to positioning fixture technical field, especially a kind of Through-hole reflow positioning fixture.
Background technology
Solder reflow techniques is not strange at electronic manufacturing field, element on the various boards used in our computer is all welded on wiring board by this technique, there is a heater circuit inside of this equipment, air or nitrogen are heated to sufficiently high temperature after-blow to the wiring board posting element, allow the solder of elements on either side melt after and mainboard bond.The advantage of this technique is that temperature is easy to control, and can also avoid oxidation in welding process, manufacturing cost also more easily controls.
In prior art, the welding job of electronic integrated circuit plate adopts manual welding method, components and parts are plugged on electronic integrated circuit plate top by manually direct, then soldering is carried out to the lead-in wire of components and parts, when soldering, the phenomenon that the solder after often there is fusing drops, makes troubles to welding job, inefficiency, electronic integrated circuit plate crudy is poor.
Utility model content
The applicant, for the shortcoming in above-mentioned existing production technology, provides a kind of Through-hole reflow positioning fixture rational in infrastructure, thus improves welding efficiency, and the phenomenon that when effectively preventing from welding, solder drops, ensures the crudy of electronic integrated circuit plate.
The technical scheme that the utility model adopts is as follows:
A kind of Through-hole reflow positioning fixture, comprise substrate, four corners of described substrate have installing hole, two symmetrically arranged grooves are had in the middle part of described substrate, the upper and lower side being positioned at two grooves has the locating groove placing surface-mounted integrated circuit, the middle part of described locating groove is provided with pickup groove, and the substrate being positioned at pickup groove two ends is provided with keeper respectively by straight pin; The substrate of described groove side has spaced USB welding groove, and the front end of each USB welding groove is respectively arranged with two pallets, and the upper end of each USB welding groove has locating hole.
Further improvement as technique scheme:
Described pallet long circle structure;
Described substrate squarely structure, rectangular configuration or circular configuration.
The beneficial effects of the utility model are as follows:
The utility model compact conformation, rationally, by the effect of positioning fixture, the welding job to surface-mounted integrated circuit can be completed easily, can not produce the phenomenon that solder drops during welding, welding is firm, there will not be the phenomenon of rosin joint, substantially increase operating efficiency, ensure crudy.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the upward view of Fig. 1.
Wherein: 1, substrate; 2, installing hole; 3, locating hole; 4, USB welding groove; 5, pallet; 6, locating groove; 7, pickup groove; 8, straight pin; 9, keeper; 10, groove.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described.
As depicted in figs. 1 and 2, the Through-hole reflow positioning fixture of the present embodiment, comprise substrate 1, four corners of substrate 1 have installing hole 2, two symmetrically arranged grooves 10 are had in the middle part of substrate 1, the upper and lower side being positioned at two grooves 10 has the locating groove 6 placing surface-mounted integrated circuit, and the middle part of locating groove 6 is provided with pickup groove 7, and the substrate 1 being positioned at pickup groove 7 two ends is provided with keeper 9 respectively by straight pin 8; The substrate 1 of groove 10 side has spaced USB welding groove 4, and the front end of each USB welding groove 4 is respectively arranged with two pallets 5, and the upper end of each USB welding groove 4 has locating hole 3.
Pallet 5 long circle structure.
Substrate 1 squarely structure, rectangular configuration or circular configuration.
In actual use procedure, be fixed on the machine by installing hole 2 by substrate 1 described in the utility model, substrate 1 hangs installation for unsettled, is placed in locating groove 6 by the substrate 1 of surface-mounted integrated circuit, and by rotatable positioning member 9, the substrate 1 of surface-mounted integrated circuit is fixed.Then adopt weldering arm manipulator to be dripped by solder as in pallet 5 one by one, solder enters in pallet 5 through the jack on surface-mounted integrated circuit, in jack, then inserts the components and parts of required welding, can complete the welding job of components and parts on surface-mounted integrated circuit.
The utility model is by the effect of pallet 5, and effectively prevent solder from dropping, there will not be the situation of rosin joint in welding process, welding effect is good, and operating efficiency is high.
The design of the utility model USB welding groove 4, can carry out the welding job of USB interface easily to the side of surface-mounted integrated circuit.
More than describing is to explanation of the present utility model, and be not the restriction to utility model, the utility model limited range, see claim, within protection domain of the present utility model, can do any type of amendment.
Claims (3)
1. a Through-hole reflow positioning fixture, it is characterized in that: comprise substrate (1), four corners of described substrate (1) have installing hole (2), described substrate (1) middle part has two symmetrically arranged grooves (10), the upper and lower side being positioned at two grooves (10) has the locating groove (6) placing surface-mounted integrated circuit, the middle part of described locating groove (6) is provided with pickup groove (7), and the substrate (1) being positioned at pickup groove (7) two ends is provided with keeper (9) respectively by straight pin (8); The substrate (1) of described groove (10) side has spaced USB welding groove (4), and the front end of each USB welding groove (4) is respectively arranged with two pallets (5), and the upper end of each USB welding groove (4) has locating hole (3).
2. Through-hole reflow positioning fixture as claimed in claim 1, is characterized in that: described pallet (5) long circle structure.
3. Through-hole reflow positioning fixture as claimed in claim 1, is characterized in that: described substrate (1) squarely structure, rectangular configuration or circular configuration.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520055968.4U CN204470756U (en) | 2015-01-27 | 2015-01-27 | Through-hole reflow positioning fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520055968.4U CN204470756U (en) | 2015-01-27 | 2015-01-27 | Through-hole reflow positioning fixture |
Publications (1)
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CN204470756U true CN204470756U (en) | 2015-07-15 |
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Family Applications (1)
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CN201520055968.4U Active CN204470756U (en) | 2015-01-27 | 2015-01-27 | Through-hole reflow positioning fixture |
Country Status (1)
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CN (1) | CN204470756U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269111A (en) * | 2015-10-22 | 2016-01-27 | 中国电子科技集团公司第四十一研究所 | Precision positioning welding clamp for microwave signal transmission terminal and welding method |
CN107317212A (en) * | 2017-06-22 | 2017-11-03 | 深圳市宇隆宏天科技有限公司 | The plug fixture of TYPE C plug modules |
-
2015
- 2015-01-27 CN CN201520055968.4U patent/CN204470756U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269111A (en) * | 2015-10-22 | 2016-01-27 | 中国电子科技集团公司第四十一研究所 | Precision positioning welding clamp for microwave signal transmission terminal and welding method |
CN107317212A (en) * | 2017-06-22 | 2017-11-03 | 深圳市宇隆宏天科技有限公司 | The plug fixture of TYPE C plug modules |
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C14 | Grant of patent or utility model | ||
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