CN204470756U - Through-hole reflow positioning fixture - Google Patents

Through-hole reflow positioning fixture Download PDF

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Publication number
CN204470756U
CN204470756U CN201520055968.4U CN201520055968U CN204470756U CN 204470756 U CN204470756 U CN 204470756U CN 201520055968 U CN201520055968 U CN 201520055968U CN 204470756 U CN204470756 U CN 204470756U
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China
Prior art keywords
welding
positioning
slots
groove
positioning fixture
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Expired - Fee Related
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CN201520055968.4U
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Chinese (zh)
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严晓洁
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WUXI GOOD ELECTRONICS CO Ltd
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WUXI GOOD ELECTRONICS CO Ltd
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Abstract

本实用新型涉及一种通孔回流焊定位夹具,包括基板,所述基板的四个角落处分别开有安装孔,所述基板中部开有两个对称设置的通槽,位于两个通槽的上下端分别开有放置集成电路板的定位卡槽,所述板定位卡槽的中部设置有取件槽,位于取件槽两端的基板上分别通过圆柱销安装有定位件;所述通槽一侧的基板上开有间隔设置的USB焊接槽,每个USB焊接槽的前端分别设置有两个托盘,每个USB焊接槽的上端开有定位孔。本实用新型结构紧凑、合理,通过定位夹具的作用,可以方便的完成对集成电路板的焊接工作,焊接时不会产生钎料掉落的现象,焊接稳固,不会出现虚焊的现象,大大提高了工作效率,保证加工质量。

The utility model relates to a positioning fixture for through-hole reflow soldering, which includes a base plate. Mounting holes are respectively opened at four corners of the base plate, and two symmetrically arranged through slots are opened in the middle of the base plate. The upper and lower ends are respectively provided with positioning slots for placing integrated circuit boards, and the middle part of the board positioning slots is provided with pick-up slots, and positioning pieces are respectively installed on the substrates at both ends of the pick-up slots through cylindrical pins; There are USB welding grooves arranged at intervals on the side substrate, two trays are respectively arranged at the front end of each USB welding groove, and a positioning hole is opened at the upper end of each USB welding groove. The utility model has a compact and reasonable structure. Through the function of the positioning fixture, the welding work of the integrated circuit board can be conveniently completed. During welding, the solder material will not drop, the welding is stable, and there will be no false welding phenomenon, greatly Improve work efficiency and ensure processing quality.

Description

通孔回流焊定位夹具Through-hole reflow positioning fixture

技术领域 technical field

本实用新型涉及定位夹具技术领域,尤其是一种通孔回流焊定位夹具。 The utility model relates to the technical field of positioning fixtures, in particular to a positioning fixture for through-hole reflow soldering.

背景技术 Background technique

回流焊技术在电子制造领域并不陌生,我们电脑内使用的各种板卡上的元件都是通过这种工艺焊接到线路板上的,这种设备的内部有一个加热电路,将空气或氮气加热到足够高的温度后吹向已经贴好元件的线路板,让元件两侧的焊料融化后与主板粘结。这种工艺的优势是温度易于控制,焊接过程中还能避免氧化,制造成本也更容易控制。 Reflow soldering technology is not new in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. There is a heating circuit inside this device, which uses air or nitrogen After heating to a high enough temperature, it is blown to the circuit board on which the components have been pasted, so that the solder on both sides of the components melts and bonds with the main board. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control.

现有技术中,电子集成电路板的焊接工作采用手工焊接方法,通过人工直接在电子集成电路板上部插上元器件,然后对元器件的引线进行钎焊,在钎焊时,往往会出现熔化后的钎料发生掉落的现象,给焊接工作带来麻烦,工作效率低,电子集成电路板加工质量差。 In the prior art, the welding work of the electronic integrated circuit board adopts a manual welding method, and the components are directly inserted on the upper part of the electronic integrated circuit board manually, and then the lead wires of the components are brazed. During brazing, melting often occurs. The phenomenon that the last brazing material falls off will bring trouble to the welding work, the work efficiency is low, and the processing quality of the electronic integrated circuit board is poor.

实用新型内容 Utility model content

本申请人针对上述现有生产技术中的缺点,提供一种结构合理的通孔回流焊定位夹具,从而提高焊接效率,有效的防止焊接时钎料掉落的现象,保证电子集成电路板的加工质量。 The applicant aims at the shortcomings in the above-mentioned existing production technology, and provides a positioning fixture for through-hole reflow soldering with reasonable structure, thereby improving the welding efficiency, effectively preventing the solder from falling during welding, and ensuring the processing of electronic integrated circuit boards quality.

本实用新型所采用的技术方案如下: The technical scheme adopted in the utility model is as follows:

一种通孔回流焊定位夹具,包括基板,所述基板的四个角落处分别开有安装孔,所述基板中部开有两个对称设置的通槽,位于两个通槽的上下端分别开有放置集成电路板的定位卡槽,所述定位卡槽的中部设置有取件槽,位于取件槽两端的基板上分别通过圆柱销安装有定位件;所述通槽一侧的基板上开有间隔设置的USB焊接槽,每个USB焊接槽的前端分别设置有两个托盘,每个USB焊接槽的上端开有定位孔。 A positioning fixture for through-hole reflow soldering, including a base plate, mounting holes are respectively opened at the four corners of the base plate, and two symmetrically arranged through slots are opened in the middle of the base plate, and the upper and lower ends of the two through slots are respectively opened. There is a positioning card slot for placing the integrated circuit board, and the middle part of the positioning card slot is provided with a pick-up slot, and positioning pieces are respectively installed on the substrates at both ends of the pick-up slot through cylindrical pins; There are USB welding grooves arranged at intervals, two trays are respectively arranged at the front end of each USB welding groove, and a positioning hole is opened at the upper end of each USB welding groove.

作为上述技术方案的进一步改进: As a further improvement of the above technical solution:

所述托盘成长圆形结构; The tray has an elongated circular structure;

所述基板成方形结构、矩形结构或圆形结构。 The substrate is in a square structure, a rectangular structure or a circular structure.

本实用新型的有益效果如下: The beneficial effects of the utility model are as follows:

本实用新型结构紧凑、合理,通过定位夹具的作用,可以方便的完成对集成电路板的焊接工作,焊接时不会产生钎料掉落的现象,焊接稳固,不会出现虚焊的现象,大大提高了工作效率,保证加工质量。 The utility model has a compact and reasonable structure. Through the function of the positioning fixture, the welding work of the integrated circuit board can be conveniently completed. During welding, the solder material will not drop, the welding is stable, and the phenomenon of virtual welding will not occur, greatly Improve work efficiency and ensure processing quality.

附图说明 Description of drawings

图1为本实用新型的结构示意图。 Fig. 1 is the structural representation of the utility model.

图2为图1的仰视图。 Fig. 2 is a bottom view of Fig. 1 .

其中:1、基板;2、安装孔;3、定位孔;4、USB焊接槽;5、托盘;6、定位卡槽;7、取件槽;8、圆柱销;9、定位件;10、通槽。 Among them: 1. Substrate; 2. Mounting hole; 3. Positioning hole; 4. USB welding slot; 5. Tray; 6. Positioning card slot; 7. Pick-up slot; 8. Cylindrical pin; Through slot.

具体实施方式 Detailed ways

下面结合附图,说明本实用新型的具体实施方式。 Below in conjunction with accompanying drawing, illustrate the specific embodiment of the present utility model.

如图1和图2所示,本实施例的通孔回流焊定位夹具,包括基板1,基板1的四个角落处分别开有安装孔2,基板1中部开有两个对称设置的通槽10,位于两个通槽10的上下端分别开有放置集成电路板的定位卡槽6,定位卡槽6的中部设置有取件槽7,位于取件槽7两端的基板1上分别通过圆柱销8安装有定位件9;通槽10一侧的基板1上开有间隔设置的USB焊接槽4,每个USB焊接槽4的前端分别设置有两个托盘5,每个USB焊接槽4的上端开有定位孔3。 As shown in Figures 1 and 2, the positioning fixture for through-hole reflow soldering in this embodiment includes a substrate 1, and mounting holes 2 are respectively opened at the four corners of the substrate 1, and two symmetrically arranged through-slots are opened in the middle of the substrate 1. 10. The upper and lower ends of the two through slots 10 are respectively provided with positioning card slots 6 for placing integrated circuit boards. The middle part of the positioning card slots 6 is provided with a pick-up slot 7. The pin 8 is equipped with a positioning part 9; the substrate 1 on the side of the through groove 10 has USB welding grooves 4 arranged at intervals, and the front end of each USB welding groove 4 is respectively provided with two trays 5, and each USB welding groove 4 The upper end has a positioning hole 3.

托盘5成长圆形结构。 Tray 5 has an elongated circular structure.

基板1成方形结构、矩形结构或圆形结构。 The substrate 1 is in a square structure, a rectangular structure or a circular structure.

实际使用过程中,将本实用新型所述的基板1通过安装孔2固定在机器上,基板1为悬空挂置安装,将集成电路板的基板1放置在定位卡槽6内,并通过旋转定位件9,将集成电路板的基板1固定住。然后采用焊臂机械手将钎料逐一滴如托盘5中,钎料穿过集成电路板上的插孔进入至托盘5内,然后在插孔中插入所需要焊接的元器件,即可完成集成电路板上元器件的焊接工作。 In the actual use process, the substrate 1 described in the utility model is fixed on the machine through the installation hole 2, the substrate 1 is suspended and installed, and the substrate 1 of the integrated circuit board is placed in the positioning slot 6, and positioned by rotation Part 9 fixes the substrate 1 of the integrated circuit board. Then use the welding arm manipulator to drop the solder into the tray 5 one by one, the solder passes through the socket on the integrated circuit board and enters into the tray 5, and then inserts the components to be welded into the socket to complete the integrated circuit Soldering of components on the board.

本实用新型通过托盘5的作用,有效的防止钎料掉落,在焊接过程中不会出现虚焊的情况,焊接效果好,工作效率高。 The utility model effectively prevents the brazing material from falling through the action of the tray 5, and no false welding occurs during the welding process, and the welding effect is good and the work efficiency is high.

本实用新型USB焊接槽4的设计,可以方便的对集成电路板的侧边进行USB接口的焊接工作。 The design of the USB welding groove 4 of the utility model can conveniently carry out the welding work of the USB interface to the side of the integrated circuit board.

以上描述是对本实用新型的解释,不是对实用新型的限定,本实用新型所限定的范围参见权利要求,在本实用新型的保护范围之内,可以作任何形式的修改。 The above description is an explanation of the utility model, not a limitation of the utility model. For the scope limited by the utility model, please refer to the claims. Within the protection scope of the utility model, any form of modification can be made.

Claims (3)

1. a Through-hole reflow positioning fixture, it is characterized in that: comprise substrate (1), four corners of described substrate (1) have installing hole (2), described substrate (1) middle part has two symmetrically arranged grooves (10), the upper and lower side being positioned at two grooves (10) has the locating groove (6) placing surface-mounted integrated circuit, the middle part of described locating groove (6) is provided with pickup groove (7), and the substrate (1) being positioned at pickup groove (7) two ends is provided with keeper (9) respectively by straight pin (8); The substrate (1) of described groove (10) side has spaced USB welding groove (4), and the front end of each USB welding groove (4) is respectively arranged with two pallets (5), and the upper end of each USB welding groove (4) has locating hole (3).
2. Through-hole reflow positioning fixture as claimed in claim 1, is characterized in that: described pallet (5) long circle structure.
3. Through-hole reflow positioning fixture as claimed in claim 1, is characterized in that: described substrate (1) squarely structure, rectangular configuration or circular configuration.
CN201520055968.4U 2015-01-27 2015-01-27 Through-hole reflow positioning fixture Expired - Fee Related CN204470756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520055968.4U CN204470756U (en) 2015-01-27 2015-01-27 Through-hole reflow positioning fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520055968.4U CN204470756U (en) 2015-01-27 2015-01-27 Through-hole reflow positioning fixture

Publications (1)

Publication Number Publication Date
CN204470756U true CN204470756U (en) 2015-07-15

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Application Number Title Priority Date Filing Date
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Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269111A (en) * 2015-10-22 2016-01-27 中国电子科技集团公司第四十一研究所 Precision positioning welding clamp for microwave signal transmission terminal and welding method
CN107317212A (en) * 2017-06-22 2017-11-03 深圳市宇隆宏天科技有限公司 The plug fixture of TYPE C plug modules

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269111A (en) * 2015-10-22 2016-01-27 中国电子科技集团公司第四十一研究所 Precision positioning welding clamp for microwave signal transmission terminal and welding method
CN107317212A (en) * 2017-06-22 2017-11-03 深圳市宇隆宏天科技有限公司 The plug fixture of TYPE C plug modules

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150715

CF01 Termination of patent right due to non-payment of annual fee