CN111491439A - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
- Publication number
- CN111491439A CN111491439A CN202010305664.4A CN202010305664A CN111491439A CN 111491439 A CN111491439 A CN 111491439A CN 202010305664 A CN202010305664 A CN 202010305664A CN 111491439 A CN111491439 A CN 111491439A
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- Prior art keywords
- circuit board
- shielding
- electronic device
- shielding layer
- shielding film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
Abstract
The invention discloses a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a circuit board body, an electronic device and a shielding film assembly, wherein the electronic device is arranged on the surface of the circuit board body, and the shielding film assembly is covered on the electronic device; the circuit board body is provided with a first grounding area, the shielding film assembly comprises a shielding layer and an insulating layer which are sequentially stacked, the insulating layer is positioned between the shielding layer and the electronic device, and the edge of the shielding layer is electrically connected with the first grounding area; the shielding film assembly is provided with an avoiding area, the electronic device comprises a first device, the first device comprises a device body and a grounding terminal, and in the avoiding area, the shielding layer penetrates through the insulating layer and is electrically connected with the grounding terminal. According to the scheme, the problem that the shielding effect is reduced due to the fact that the shielding film and the insulating film fall off easily when the current circuit board assembly is subjected to thinning treatment can be solved.
Description
Technical Field
The embodiment of the invention relates to the technical field of communication equipment, in particular to a circuit board assembly and electronic equipment.
Background
With the rapid development of technology, the performance of electronic devices (such as mobile phones, tablet computers, etc.) is optimized, and meanwhile, in order to obtain better experience, the light and thin design of electronic devices has become a development trend. At present, in order to realize the light and thin design of electronic equipment, one of the thinning processes is improved based on a circuit board assembly, an insulating film is attached to the surfaces of a circuit board and a device, a layer of shielding film with conductive property is attached to the surface of the insulating film, the edge of the shielding film is connected with a grounding pad of the circuit board, a faraday cage is formed to carry out electromagnetic shielding on the circuit board assembly, so that the traditional metal shielding frame and the metal shielding cover are replaced, the thickness of the circuit board assembly is further thinned, and finally the light and thin of the electronic equipment is realized.
When the thinning treatment process is applied, gaps are easily formed between the shielding film and the insulating film and between the insulating film and the device, and bubbles are left, so that the attaching reliability of the shielding film and the insulating film can be weakened, and once the shielding film and the insulating film fall off, the shielding effect can be reduced, and the electromagnetic interference is caused.
Disclosure of Invention
The embodiment of the invention provides a circuit board assembly and electronic equipment, and aims to solve the problem that a shielding film and an insulating film are easy to fall off to reduce the shielding effect when the conventional circuit board assembly is thinned.
In order to solve the above problems, the present invention is realized by:
in a first aspect, an embodiment of the present invention provides a circuit board assembly, which includes a circuit board body, an electronic device, and a shielding film assembly, where the electronic device is disposed on a surface of the circuit board body, and the shielding film assembly covers the electronic device; the circuit board body is provided with a first grounding area, the shielding film assembly comprises a shielding layer and an insulating layer which are sequentially stacked, the insulating layer is located between the shielding layer and the electronic device, and the edge of the shielding layer is electrically connected with the first grounding area.
The shielding film assembly is provided with an avoiding region, the electronic device comprises a first device, the first device comprises a device body and a grounding terminal, and the shielding layer penetrates through the insulating layer and is electrically connected with the grounding terminal in the avoiding region.
In a second aspect, an embodiment of the present invention further provides an electronic device, including the circuit board assembly as described above.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the embodiment of the invention, the shielding layer is electrically connected with the grounding terminal of the first device to fix the shielding layer, so that the shielding film assembly is fixed. Compared with the prior art, the circuit board assembly disclosed by the embodiment of the invention can prevent the shielding film assembly from falling off from the surface of the electronic device, and can reliably ground the shielding layer, thereby ensuring that the circuit board assembly has a better shielding effect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the disclosure;
FIG. 2 is a schematic structural diagram of an extension portion from a top view according to an embodiment of the disclosure;
description of reference numerals:
100-circuit board body, 110-first grounding area, 120-second grounding area,
200-shielding film component, 210-shielding layer, 211-extending part, 220-insulating layer, 230-avoiding area,
300-first device, 310-device body, 320-ground terminal, 321-electrical connection.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, an embodiment of the invention discloses a circuit board assembly, which includes a circuit board body 100, an electronic device, and a shielding film assembly 200.
The circuit board body 100 is a base member of the circuit board assembly, which provides a mounting support base for both the electronic device and the shielding film assembly 200. It should be understood that the electronic device may generate electromagnetic waves during operation, and these electromagnetic waves may generate electromagnetic interference to other devices outside the circuit board assembly, and accordingly, the electronic device on the circuit board assembly may also be easily interfered by the electromagnetic interference of other devices, so that the electronic device on the circuit board assembly may need to be electromagnetically shielded in order to ensure the electronic device can operate normally. In the embodiment of the present invention, the electromagnetic shielding is achieved by the shielding film assembly 200.
In the embodiment of the present invention, the electronic device is disposed on the surface of the circuit board body 100, and the shielding film assembly 200 covers the electronic device to shield the electronic device on the circuit board body 100.
The circuit board body 100 has a first grounding area 110, and the first grounding area 110 is generally connected to a Ground (GND) of the circuit board body 100. The shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220, which are sequentially stacked, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that shielding film assembly 200 enables a reduced thickness design of the circuit board assembly, and in order to enable shielding film assembly 200 to be attached to the surface of an electronic device, shielding film assembly 200 should be a flexible structure. With such a configuration, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, and the circuit board assembly is thinned.
Since the shielding layer 210 is in direct contact with the electronic device to cause short circuit, the insulating layer 220 is located between the shielding layer 210 and the electronic device to separate the shielding layer 210 from the electronic device, thereby avoiding short circuit failure.
Meanwhile, the edge of the shielding layer 210 is electrically connected to the first ground region 110. It will be appreciated that the shielding structure is usually grounded, and since currents are generated on the shielding structure, a potential difference is generated at different positions of the shielding structure, and the ground signal has a low impedance, and the currents can be conducted away after the shielding structure is grounded. Specifically, the edge of the shielding layer 210 is connected to a Ground Network (GND) on the circuit board body 100 through the first ground region 110, so as to realize grounding, and the current on the shielding layer 210 can be conducted away through the first ground region 110. The first ground region 110 may be a ground pad, and the shielding layer 210 may be electrically connected to the ground pad by soldering, hot press molding, or the like.
In the embodiment of the present invention, the shielding film assembly 200 is provided with a relief area 230, and it should be understood that the relief area 230 is an area where the shielding film assembly 200 is windowed. In the prior art, since a part of large-sized electronic devices (e.g., integrated circuits, etc.) exist in the circuit board assembly, if the shielding film assembly 200 is attached to the surface of these electronic devices, the thickness of the circuit board assembly as a whole is increased; meanwhile, there are some electronic devices whose top surfaces are mostly made of resin, glass, or the like, and thus have good insulating properties, and which do not need to be shielded.
Therefore, the shielding film assembly 200 is usually windowed on the surfaces of the electronic devices, and at least a part of the shielding film assembly 200 projected on the surfaces of the electronic devices is peeled off, i.e. the avoiding region 230 is formed, but at the same time, the edge of the shielding film assembly 200 surrounding the avoiding region 230 is difficult to be connected with the ground network of the circuit board body 100, and the shielding effect is affected. Of course, in the embodiment of the present invention, there is no limitation on the specific windowing of the shielding film assembly 200, for example, all of the electronic devices may be windowed correspondingly. It should be noted that the shielding layer 210 and the insulating layer 220 are generally connected by adhesion, and the shielding layer 210 and the insulating layer 220 are not separated during the process of windowing the shielding film assembly 200.
In an embodiment of the present invention, the electronic device may include the first device 300, wherein the first device 300 includes a device body 310 and a ground terminal 320, specifically, the ground terminal 320 is connected to the device body 310, and the ground terminal 320 may be connected to the circuit board body 100 to fix the first device 300 on the circuit board body 100 and achieve grounding.
Meanwhile, in the relief region 230, the shielding layer 210 penetrates the insulating layer 220 and is electrically connected to the ground terminal 320. It should be understood that the ground terminal 320 is electrically connected to the ground network on the circuit board body 100 and also electrically connected to the shielding layer 210, so as to achieve reliable grounding of the shielding layer 210 around the avoiding region 230, thereby preventing the shielding effect from being affected by windowing; meanwhile, the ground terminal 320 can fix the shielding layer 210 around the avoiding region 230, and as described above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding, so that with such a configuration, an attachment point is formed on the electronic device, so that the shielding film assembly 200 is fixed, and the shielding film assembly 200 can be prevented from falling off from the electronic device at the avoiding region 230.
As is apparent from the above description, in the embodiment of the present invention, the shielding layer 210 is fixed by electrically connecting the shielding layer 210 to the ground terminal 320 of the electronic component, and thus the shielding film assembly 200 is fixed. Compared with the prior art, the circuit board assembly disclosed by the embodiment of the invention can prevent the shielding film assembly 200 from falling off from the surface of the electronic device, and can reliably ground the shielding layer 210, thereby ensuring that the circuit board assembly has a better shielding effect.
Please refer to fig. 1 and fig. 2 again:
in the embodiment of the present invention, the relief area 230 at least partially covers the ground terminal 320 in the direction perpendicular to the circuit board body 100. The specific type of the avoiding region 230 is not limited in the embodiment of the present invention, and only a part of the ground terminal 320 may be exposed in the avoiding region 230, or all of the ground terminal 320 may be exposed, and only the shielding layer 210 needs to be electrically connected to the ground terminal 320.
Of course, only the ground terminal 320 may be exposed to the shielding film assembly 200 through the relief area 230. Thus, the avoiding region 230 only needs to be small-sized windowing, and the influence of the small-sized windowing on the overall shielding effect of the circuit board assembly is small.
In the embodiment of the present invention, there may be various electrical connection relationships between the ground terminal 320 and the shielding layer 210, and the embodiment of the present invention does not limit the electrical connection relationships, such as adhesion, thermoforming, etc., but all of the electrical connection relationships need to ensure the electrical connection relationship between the ground terminal 320 and the shielding layer 210. In a specific embodiment, the ground terminal 320 may be soldered to the shielding layer 210, so that the connection stability and reliability of the ground terminal 320 and the shielding layer 210 may be improved.
As previously mentioned, the shielding film assembly 200 should be a flexible structure. Based on this, in an alternative scheme, the shielding layer 210 may be a copper layer, i.e., a copper foil. The copper foil is a conventional material in the electronic field and is convenient to obtain. With such a configuration, the shielding layer 210 has good conductive characteristics and soldering characteristics, which is beneficial to realize stable connection between the shielding layer 210 and the ground terminal 320; meanwhile, the shielding layer 210 has good flexibility, and is also beneficial to the attachment of the shielding film assembly 200 to an electronic device. Of course, the embodiment of the present invention does not limit the specific type of the shielding layer 210, and the shielding layer may also be a conductive metal layer such as an aluminum layer, a zinc layer, or the like, or a non-metal layer with conductive characteristics.
In order to facilitate the connection of the ground terminal 320 with the circuit board body 100 and to improve the connection stability and reliability of the two, in an alternative scheme, the circuit board body 100 may have the second ground region 120, and the shielding layer 210 is electrically connected with the second ground region 120 through the ground terminal 320. With this arrangement, the grounding process of the grounding terminal 320 can be completed only by mounting the grounding terminal 320 on the second grounding section 120.
Of course, the embodiment of the present invention does not limit the specific structure type of the second ground region 120, in a specific embodiment, the second ground region 120 may be selected as a ground pad region, and in a specific mounting process, only the ground terminal 320 needs to be mounted on the ground pad region corresponding to the second ground region 120, so that the stable mounting of the first device 300 is achieved.
When the shielding film assembly 200 is windowed, the shielding layer 210 and the insulating layer 220 in the area of the relief region 230 are generally cut and then peeled off, but in this case, the shielding layer 210 around the relief region 230 is generally separated from the ground terminal 320 by a distance and cannot be directly connected.
Based on this, in an alternative scheme, the ground terminal 320 is provided with an electrical connector 321 near one side of the shielding film assembly 200, the electrical connector 321 at least partially protrudes from the device body 310, and the shielding layer 210 is electrically connected with the ground terminal 320 through the electrical connector 321. It should be understood that the electrical connection member 321 at least partially protrudes from the device body 310, that is, the electrical connection member 321 has a length dimension that can compensate for the distance between the ground terminal 320 and the shielding layer 210, and the electrical connection member 321 connects the ground terminal 320 and the shielding layer 210 together, so as to fix the shielding film assembly 200.
Of course, there may be various specific types of the electrical connection members 321 in the embodiments of the present invention, and the embodiments of the present invention are not limited thereto, for example, the electrical connection members 321 may be raised electrodes, copper bars, and the like.
In another alternative, the shielding layer 210 may have an extension portion 211, and the extension portion 211 penetrates the insulating layer 220 in the relief region 230 and is electrically connected to the ground terminal 320. Like the electrical connector 321, the extension portion 211 electrically connects the ground terminal 320 and the shielding layer 210 together, the extension portion 211 has a certain length, which can compensate the distance between the ground terminal 320 and the shielding layer 210, and meanwhile, the shielding layer 210 is connected with the ground terminal 320 through the extension portion 211, so that the shielding film assembly 200 is fixed. Of course, the embodiment of the present invention does not limit the specific type of the extension 211.
In further alternative, the extension portion 211 may be integrally formed with the shielding layer 210, and it may be understood that the extension portion 211 is led out from the shielding layer 210, or the shielding layer 210 forms the extension portion 211 by electroplating. With such a configuration, the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, and thus the grounding effect is better.
In a specific embodiment, when the shielding layer 210 is cut, the portion is not peeled off, and a side of the portion is brought into a connection relation with the shielding layer 210, thereby forming the extension portion 211. It should be understood that the extension 211 is part of the shield layer 210 in the region of the relief region 230. Specifically, the extending portion 211 is bent and extends into the avoiding region 230, and the extending portion 211 can penetrate through the avoiding region 230 and is electrically connected with the ground terminal 320 after being bent, so that the shielding layer 210 is electrically connected with the ground terminal 320, and finally, the shielding film assembly 200 is attached and fixed.
The electronic device may include a plurality of first devices 300, although embodiments of the invention are not limited to a specific number of first devices 300. While the specific relationship between the first devices 300 and the keep-out regions 230 is not limited by the embodiments of the present invention, in one embodiment, the ground terminal 320 of each first device 300 is at least partially covered by the keep-out regions 230 in the direction perpendicular to the circuit board body 100, and the ground terminal 320 of each first device 300 is electrically connected to the shielding layer 210.
In this case, since the plurality of first devices 300 are provided, the number of the ground terminals 320 is increased, and at this time, the number of connection points between the ground terminals 320 and the shielding layer 210 is also increased, so that when the density of the ground terminals reaches a certain level, the mounting adhesion of the whole shielding film assembly 200 can be improved, and even when the circuit board assembly is deformed and subjected to thermal stress, the shielding film assembly 200 can be prevented from falling off.
Generally, the electronic device further includes a second device, and the shielding film assembly 200 covers the second device in a direction perpendicular to the circuit board body 100. It is to be understood that, in order to ensure the shielding effect of the shielding film assembly 200, the size of the range of the escape area 230 needs to be limited, and thus there is a second device in the circuit board assembly that is completely covered by the shielding film assembly 200.
In the embodiment of the present invention, no limitation is made on the specific shape of the avoidance region 230, and in order to adapt to the external shape of the electronic device itself, the avoidance region 230 may be a square avoidance region or a rectangular avoidance region, and of course, the avoidance region 230 may also be in other shapes, such as a circle, an irregular shape, and the like.
Based on the circuit board assembly, the embodiment of the invention also discloses an electronic device which comprises the circuit board assembly. The electronic device in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device, or other devices, and the embodiment of the present invention does not limit the specific type of the electronic device.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A circuit board assembly, comprising a circuit board body (100), an electronic device disposed on a surface of the circuit board body (100), and a shielding film assembly (200) covering the electronic device; the circuit board body (100) is provided with a first grounding area (110), the shielding film assembly (200) comprises a shielding layer (210) and an insulating layer (220) which are sequentially stacked, the insulating layer (220) is positioned between the shielding layer (210) and the electronic device, and the edge of the shielding layer (210) is electrically connected with the first grounding area (110);
the shielding film assembly (200) is provided with a relief area (230), the electronic device comprises a first device (300), the first device (300) comprises a device body (310) and a ground terminal (320), and the shielding layer (210) penetrates through the insulating layer (220) in the relief area (230) and is electrically connected with the ground terminal (320).
2. The circuit board assembly according to claim 1, characterized in that the relief area (230) at least partially covers the ground terminal (320) in a direction perpendicular to the circuit board body (100).
3. The circuit board assembly according to claim 1, characterized in that the circuit board body (100) has a second grounding region (120), the shielding layer (210) being electrically connected with the second grounding region (120) through the grounding terminal (320).
4. A circuit board assembly according to claim 3, wherein the second ground region (120) is a ground pad region.
5. The circuit board assembly according to claim 1, wherein the ground terminal (320) is provided with an electrical connector (321) near a side of the shielding film assembly (200), the electrical connector (321) at least partially protrudes from the device body (310), and the shielding layer (210) is electrically connected with the ground terminal (320) through the electrical connector (321).
6. A circuit board assembly according to claim 1, characterized in that the electronic device comprises a plurality of first devices, in a direction perpendicular to the circuit board body (100), the ground terminal (320) of each first device (300) is at least partially covered by the relief area (230), and the ground terminal (320) of each first device (300) is electrically connected to the shielding layer (210).
7. The circuit board assembly according to claim 1, wherein the electronic device further comprises a second device, the shielding film assembly (200) covering the second device in a direction perpendicular to the circuit board body (100).
8. The circuit board assembly of claim 1, wherein the bypass area (230) is a square bypass area or a rectangular bypass area.
9. The circuit board assembly of claim 1, wherein the shielding layer (210) has an extension (240), and the extension (240) penetrates the insulating layer (220) and is electrically connected to the ground terminal (320) in the relief region (230).
10. An electronic device, characterized in that it comprises a circuit board assembly according to any one of the preceding claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010305664.4A CN111491439A (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
| PCT/CN2021/087243 WO2021208967A1 (en) | 2020-04-17 | 2021-04-14 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010305664.4A CN111491439A (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111491439A true CN111491439A (en) | 2020-08-04 |
Family
ID=71812871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010305664.4A Pending CN111491439A (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111491439A (en) |
| WO (1) | WO2021208967A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021208967A1 (en) * | 2020-04-17 | 2021-10-21 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
| WO2021208974A1 (en) * | 2020-04-17 | 2021-10-21 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
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| CN111491439A (en) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
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- 2020-04-17 CN CN202010305664.4A patent/CN111491439A/en active Pending
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- 2021-04-14 WO PCT/CN2021/087243 patent/WO2021208967A1/en active Application Filing
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| US20050095410A1 (en) * | 2001-03-19 | 2005-05-05 | Mazurkiewicz Paul H. | Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
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| CN101932223A (en) * | 2009-06-22 | 2010-12-29 | 通用电气公司 | Form the system and method for isolated conformal shielding areas |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021208967A1 (en) * | 2020-04-17 | 2021-10-21 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
| WO2021208974A1 (en) * | 2020-04-17 | 2021-10-21 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021208967A1 (en) | 2021-10-21 |
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Application publication date: 20200804 |