JPH08330682A - Flexible printed board to mount semiconductor component - Google Patents

Abstract

PURPOSE: To unnecessitate an additional light shielding part and reduce the manufacturing cost by extending at least an insulation film of a flexible printed board body and making it serve as a light shielding part. CONSTITUTION: A light shielding part 13b which covers a semiconductor component 14 to shield a light is formed by extending an insulation film 12a on a flexible printed board body 13a and forming a conductor pattern 11b for light shielding on the formed insulation film 12b, and the part 13b is bent in a manner to cover the semiconductor component 14 with the pattern 11b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component mounting type flexible printed board on which semiconductor components affected by light and / or noise are mounted.

[0002]

2. Description of the Related Art A conventional semiconductor component-mounted flexible printed circuit board will be described with reference to FIGS. 4A and 4B are views showing a conventional semiconductor component mounting type flexible printed circuit board with a light shielding function, FIG. 4A is a plan view, and FIG. 4B is a sectional view. FIG. 5 is a diagram showing a conventional semiconductor component mounting type flexible printed circuit board having a light shielding function and a noise preventing function.

As shown in FIG. 4, a conventional flexible printed circuit board mounted with a semiconductor component having a light-shielding function has a flexible printed circuit board 3 in which the front and back surfaces of a conductor pattern 1 are sandwiched by insulating films 2, and a light is affected. A first semiconductor component 4 which is mounted on the conductor pattern 1 exposed by removing a part of the insulating film 2 of the flexible printed circuit board 3 and a first semiconductor which covers the first semiconductor component 4 The light shielding tape 5 for shielding the light to the component 4 is provided.

The semiconductor component 4 is, for example, an IC chip, which has a photoelectric effect, and the LCD driver IC chip is irradiated with light.
Since the LCD has a high contrast and is dark even in the non-display portion, display input is impossible. In addition, when strong light such as strobe light is emitted, latch-up (C
This is an abnormal operation peculiar to a MOS circuit, and abnormal current continues to flow between the power supply and ground. This state continues until the power is turned off. ) Occurs and malfunctions occur. At worst,
It becomes destruction of IC. Therefore, sufficient light shielding measures are indispensable.

A flexible printed circuit board having a semiconductor component mounted thereon, which has the above-described structure and which is a countermeasure against noise from other components and equipment, has a light-shielding function and a noise-preventing function.

As shown in FIG. 5, the flexible printed circuit board mounted with a semiconductor component having the light shielding function and the noise prevention function has a flexible printed circuit board 3 in which the front and back surfaces of a conductor pattern 1 are sandwiched by insulating films 2, and And the conductor pattern 1 exposed by the noise by removing a part of the insulating film 2 of the flexible printed board 3.
And a metal foil tape 6 that covers the second semiconductor component 4a to block light to the second semiconductor component 4 and to prevent noise. Is.

As shown in FIG. 5 (b), the metal foil tape 6 is connected to the ground pattern (earth land) of the conductor pattern 1 with solder 7, whereby the second semiconductor component 4a is connected. Cut off the noise to.

In this conventional example, the second semiconductor component 4a
In order to insulate the metal foil tape 6 from the metal foil tape 6, the metal foil tape 6 is replaced with an insulating tape (polyester tape: PET).
Etc.) and then the second semiconductor component 4
a is covered.

[0009]

In order to obtain a light-shielding effect on the mounted semiconductor component 4 in the conventional flexible printed circuit board with a semiconductor component-mounted type having a light-shielding function,
A dedicated light-shielding tape must be cut to a predetermined size (slightly larger than the semiconductor component 4), which requires a cutting die, and the tape material must also be considered. Therefore,
High cost.

Also in the conventional semiconductor component mounting type flexible printed circuit board with a light shielding function and a noise prevention function, in order to obtain the noise prevention effect, the metal foil tape has to be cut into a predetermined size in the same manner as described above. A mold was needed. Further, when the insulating treatment is required, the metal foil tape 6 needs to be laminated with an insulating material, which is also high in cost in the conventional example.

In view of the above problems, the present invention is a semiconductor capable of cost reduction by extending at least an insulating film of a flexible printed circuit board main body which is a base material, and using the extended formed portion as a light shielding portion. A component-mounted flexible printed circuit board is provided.

[0012]

According to another aspect of the present invention, there is provided a semiconductor component mounting type flexible printed circuit board, a flexible printed circuit board main body having a conductor pattern formed on an insulating film, and a flexible printed circuit board body which is affected by light. In a semiconductor component mounting type flexible printed circuit board including a semiconductor component mounted on a flexible printed circuit board body and a light shielding portion that covers the semiconductor component and blocks light, the light shielding portion extends and forms the insulating film. The light-shielding conductor pattern is formed on the extended insulating film, and the light-shielding portion is bent to cover the semiconductor component with the light-shielding conductor pattern. .

Further, a semiconductor component mounting type flexible printed circuit board according to a second aspect of the present invention is characterized in that the light shielding conductor pattern is formed by extending a ground pattern of the conductor pattern.

Further, in a semiconductor component mounting type flexible printed circuit board according to a third aspect of the present invention, the light-shielding portion covers the front surface side of the semiconductor component and the light-shielding portion covers the back surface of the semiconductor component. And a light-shielding portion.

In addition, a semiconductor component mounting type flexible printed circuit board according to a fourth aspect of the present invention is characterized in that the light shielding conductor pattern and the semiconductor component are electrically connected by a conductive material. It is a thing.

In addition, a semiconductor component mounting type flexible printed circuit board according to a fifth aspect of the present invention includes a flexible printed circuit board main body having a conductive pattern formed on an insulating film, and the flexible printed circuit board affected by light. In a semiconductor component mounting type flexible printed circuit board having a semiconductor component mounted on a main body and a light shielding portion that covers the semiconductor component and shields light, the insulating film is a light shielding film, and the light shielding portion is the The present invention is characterized in that an insulating film is extendedly formed, and the light shielding portion is bent to cover the semiconductor component.

[0017]

According to the above construction, the flexible printed circuit board with mounted semiconductor components according to the first to fifth aspects of the present invention has a structure in which at least the insulating film of the flexible printed circuit board main body is extended to form a light shielding portion. When the printed circuit board body is manufactured with a mold, the light shielding portion can be manufactured at the same time, it is not necessary to use a separate light shielding member, and the mold for manufacturing the light shielding member can be eliminated.

In the flexible printed circuit board mounted with a semiconductor component according to claim 1 of the present invention, a light-shielding portion extends the insulating film, and a light-shielding conductor pattern is formed on the extended insulating film. Since the light-shielding portion is bent and the semiconductor component is covered with the light-shielding conductor pattern, the light emitted to the semiconductor component can be blocked by the light-shielding conductor pattern.

Further, in the semiconductor component mounting type flexible printed circuit board according to claim 2 of the present invention, since the light shielding conductor pattern is formed by extending the ground pattern of the conductor pattern, the semiconductor component is affected. It is also possible to block the noise that it causes.

In addition, in the semiconductor component mounting type flexible printed circuit board according to claim 3 of the present invention, the light shielding portion covers the front surface side of the semiconductor component and the back surface which covers the rear surface of the semiconductor component. Since it is composed of the side light shielding portion, it is possible to shield light and / or noise on the front surface side and the back surface side of the semiconductor component.

In addition, the semiconductor component mounting type flexible printed circuit board according to a fourth aspect of the present invention has a structure in which the light shielding conductor pattern and the semiconductor component are electrically connected by a conductive material. The static electricity generated at 2 can be released by the light-shielding conductor pattern formed of the ground pattern.

In addition, in the semiconductor component mounting type flexible printed circuit board according to claim 5 of the present invention, the insulating film is a light-shielding film, and the light-shielding portion is formed by extending the insulating film. Since the semiconductor component is bent and covered, the light applied to the semiconductor component can be blocked by an insulating film made of a light-shielding film.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a semiconductor component mounting type flexible printed circuit board according to an embodiment of the present invention.
(A) is a plan view showing a state before bending the light shielding part,
(B) is a plan view showing a state after bending the light shielding part, that is, a completed product, and (c) is a sectional view of (b).

The semiconductor component mounting type flexible printed circuit board of this embodiment has a conductor pattern 11 as shown in FIG.
The flexible printed circuit board 13 whose front and back surfaces are sandwiched between the insulating films 12 and the conductor pattern 11 exposed to light by removing a part of the insulating film 12 of the flexible printed circuit board 13 is exposed. A flexible printed circuit board body 13a on which the semiconductor component 14 is mounted; and a light-shielding portion for covering the semiconductor component 14 and shielding light to the semiconductor component 14. 13b.

As the semiconductor component 14, for example, an LCD driver IC chip or the like is used as in the conventional case.

The conductor pattern 11 includes a wiring conductor pattern 11a on which the semiconductor component 14 is mounted, and a light-shielding conductor pattern 11 that blocks light and covers the semiconductor component 14.
b and an earth pattern 11c, which are made of copper foil, for example.

The light shielding portion 13b includes the light shielding conductor pattern 11b and the flexible printed circuit board body 13.
a second insulating film portion 12b which is integrally formed with the first insulating film portion 12a of a and covers the light shielding conductor pattern 11b, and the semiconductor component 14 is covered with the light shielding conductor pattern 11b. By bending the light shielding portion 13b on the semiconductor component mounting surface of the flexible printed circuit board body 13a, the light radiated to the semiconductor component 14 is blocked. That is, the light shielding portion 13b is shown in FIG.
The state of FIG. 1A is changed to the state of FIG.

The flexible printed circuit board body 13a
The light-shielding portion 13b and the light-shielding portion 13b are bonded to each other by, for example, forming the bonding terminals 15a and 15b on a part thereof
A and 15b are fixed with solder 16 or a conductive adhesive. In this embodiment, the flexible printed circuit board body 13
A bonding terminal 15a is separately provided on a, and a part of the light-shielding conductor pattern 11b of the light-shielding portion 13b is bonded to the bonding terminal 15a.
b.

Further, the light-shielding conductor pattern 11b and the ground pattern 11c are electrically connected to each other, so that the light-shielding portion 13b allows the semiconductor component 1 to be connected.
It is also possible to cut off the noise that affects the number 4.

The flexible printed circuit board body 13
a between the a and the light shielding portion 13b, the conductor pattern 1
When there is no contact between 1a and 11b, the flexible printed board 13 may have a structure in which the insulating film 12 on the mounting surface of the semiconductor component 14 is removed.

As described above, the semiconductor component mounting type flexible printed circuit board according to this embodiment has the conductor pattern 11
1. An insulating film 12 is formed on at least the back surface side of the 1
The flexible printed circuit board 13 includes a flexible printed circuit board body 13a on which a semiconductor component 14 is mounted and a light shielding portion 13b covering the semiconductor component 14.
3b has a light-shielding conductor pattern 11b formed on the surface of the second insulating film portion 12b. The light-shielding portion 13b is bent and the semiconductor component 14 is covered with the light-shielding conductor pattern 11b.
The light radiated on the light is blocked by the light-shielding conductor pattern 11b. Therefore, malfunction of the semiconductor component 14 due to light can be prevented.

In addition, the flexible printed circuit board body 13
Since the a and the light-shielding portion 13b are formed by one flexible printed circuit board 13, it is possible to manufacture the flexible printed circuit board body 13a and the light-shielding portion 13b with a common mold, and a conventional light-shielding member. A separate mold for manufacturing is not required. Therefore, the manufacturing cost can be reduced. As a result, the cost of the semiconductor component-mounted flexible printed circuit board itself can be reduced.

Further, since the light-shielding conductor pattern 11b and the ground pattern 11c are electrically connected to each other, noise is drawn into the ground, and noise affecting the semiconductor component 14 is also blocked. can do. Therefore, the semiconductor component 14 due to noise
The malfunction of can be prevented. In addition, the semiconductor component 14
Even if is the source of noise and signals, it can be completely shielded, and since noise and signals do not leak to others, it is possible to take measures against unwanted radiation.

In the above embodiment, the light-shielding conductor pattern 13b is provided to provide the light-shielding function. However, if only the light-shielding function is provided, the insulating film 12 may be used as the light-shielding film without providing the light-shielding conductor pattern 13. good. Also by this, the same effect as that of the above embodiment can be obtained.

FIG. 2 is a view showing a flexible printed circuit board having a semiconductor component and a light shielding function and a noise prevention function according to another embodiment of the present invention. FIG. 2 (a) is a plan view showing a state before the light shielding portion is bent. Yes, (b) is a sectional view of the finished product. Only the points of this embodiment different from the above embodiments will be described.

As shown in FIG. 2, the semiconductor component mounting type flexible printed circuit board of the present embodiment further includes a light shielding portion 13c having the same structure as the light shielding portion 13b, and the light shielding portion 13c allows the back surface of the semiconductor component 14 to be provided. It is configured to cover the side.

In this embodiment, the earth pattern 11
c is connected to the connection terminal 15a.

As a result, the semiconductor component-mounted flexible printed circuit board according to this embodiment can shield light and / or noise on the front surface side and the back surface side of the semiconductor component 14, and is completely shielded.

FIG. 3 is a view showing a semiconductor component mounting type flexible printed circuit board according to still another embodiment.
(A) is a plan view showing a state before bending the light shielding part,
(B) is a sectional view of the finished product. In this embodiment, only the points different from the embodiment shown in FIG. 2 will be described.

As shown in FIG. 3, in the semiconductor component mounting type flexible printed circuit board of this embodiment, the light-shielding conductor pattern 11b of the light-shielding portion 13b and the upper surface of the semiconductor component 14 are made of silver paste or a conductive adhesive. The conductive material 17 is directly electromechanically bonded.

Specifically, at least the light-shielding conductive pattern portion of the light-shielding portion 13b corresponding to the upper surface of the semiconductor component 14 is exposed, and the exposed portion is directly electromechanically connected via the conductive material 17. . In FIG. 3, the window portion 1
8 are provided.

As a result, in the semiconductor component mounting type flexible printed circuit board according to this embodiment, the static electricity generated in the semiconductor component 14 can be released by the light shielding conductor pattern 11b which is the ground pattern. Therefore, electrostatic charge of the semiconductor component 14 can be prevented.

Needless to say, the electrostatic charging of the semiconductor component 14 can be prevented by adding the structure of this embodiment to the structure of FIG.

[0044]

As described above, according to the first aspect of the present invention.
According to the semiconductor component mounting type flexible printed circuit board of any one of 5 to 5, since at least the insulating film of the flexible printed circuit board main body is formed to extend and serve as a light shielding part, the flexible printed circuit board main body and the light shielding part are produced by a common mold. It is possible to eliminate the need for a separate mold for manufacturing the light shielding member as in the conventional case, and it is possible to reduce the cost of the semiconductor component-mounted flexible printed circuit board.

According to the semiconductor component mounting type flexible printed circuit board of the present invention, a light-shielding portion extends the insulating film, and a light-shielding conductor pattern is formed on the extended insulating film. Is formed and the light-shielding portion is bent to cover the semiconductor component with the light-shielding conductor pattern, so that the light emitted to the semiconductor component can be blocked by the light-shielding conductor pattern. The malfunction of semiconductor components due to light is prevented.

Furthermore, according to the semiconductor component mounting type flexible printed circuit board of the present invention, the light shielding conductor pattern is formed by extending the ground pattern of the conductor pattern. It is possible to cut off even noise that has an influence, and prevent malfunction of semiconductor components due to noise.

In addition, according to the semiconductor component mounting type flexible printed circuit board of the present invention, the light shielding portion covers the front surface side light shielding portion which covers the front surface side of the semiconductor component and the rear surface side of the semiconductor component. Since it is composed of the back side light-shielding portion, it is possible to block light and / or noise on the front surface side and the back surface side of the semiconductor component, and the semiconductor component is completely shielded.

In addition, according to the semiconductor component mounting type flexible printed circuit board of the fourth aspect of the present invention, the light shielding conductor pattern and the semiconductor component are electrically connected by a conductive material. Static electricity generated in the semiconductor component can be released by the light-shielding conductor pattern including the ground pattern, and electrostatic charge of the semiconductor component can be prevented.

In addition, according to the flexible printed circuit board on which semiconductor components are mounted according to claim 5 of the present invention, the insulating film is a light-shielding film, and the light-shielding portion is formed by extending the insulating film. Since the portion is bent to cover the semiconductor component, the light applied to the semiconductor component can be blocked by the insulating film made of the light-shielding film, and malfunction of the semiconductor component due to light can be prevented.

[Brief description of drawings]

1A and 1B are diagrams showing a semiconductor component-mounted flexible printed circuit board according to an embodiment of the present invention, FIG. 1A is a plan view showing a state before a light-shielding portion is bent, and FIG. It is a top view, (c) is sectional drawing of (b).

2A and 2B are diagrams showing a semiconductor component-mounted flexible printed circuit board according to another embodiment, FIG. 2A is a plan view showing a state before bending a light shielding part, and FIG. 2B is a sectional view of a completed product. is there.

3A and 3B are views showing a semiconductor component-mounted flexible printed circuit board according to still another embodiment, FIG. 3A is a plan view showing a state before bending a light-shielding portion, and FIG. 3B is a sectional view of a completed product. Is.

4A and 4B are diagrams showing a conventional semiconductor component mounting type flexible printed circuit board with a light shielding function, FIG. 4A is a plan view, and FIG. 4B is a sectional view.

FIG. 5 is a diagram showing a conventional semiconductor component mounting type flexible printed circuit board with a light shielding function and a noise prevention function,
(A) is a plan view and (b) is a sectional view.

[Explanation of symbols]

 11 conductor pattern 11a wiring conductor pattern 11b light-shielding conductor pattern 11c earth pattern (ground pattern) 12 insulating film 13 flexible printed circuit board 13a flexible printed circuit board body 13b, 13c light-shielding section 14 semiconductor component 17 conductive material

Claims (5)

[Claims] 1. A flexible printed circuit board main body having a conductor pattern formed on an insulating film, a semiconductor component which is influenced by light and is mounted on the flexible printed circuit board main body, and a semiconductor component coated on the flexible printed circuit board. In a flexible printed circuit board having a semiconductor component mounted thereon, the light-shielding portion is formed by extending the insulating film, and a light-shielding conductor pattern is formed on the extended insulating film. A flexible printed circuit board mounted with a semiconductor component, wherein the light shielding portion is bent and the semiconductor component is covered with the light shielding conductor pattern. 2. The semiconductor component mounting type flexible printed circuit board according to claim 1, wherein the light-shielding conductor pattern is formed by extending a ground pattern of the conductor pattern. 3. The semiconductor device according to claim 2, wherein the light-shielding portion comprises a front-side light-shielding portion that covers a front surface side of the semiconductor component and a back-side light-shielding portion that covers a rear surface side of the semiconductor component. Component mounted flexible printed circuit board. 4. The semiconductor component-mounted flexible printed circuit board according to claim 2, wherein the light-shielding conductor pattern and the semiconductor component are electrically connected by a conductive material. 5. A flexible printed circuit board main body having a conductor pattern formed on an insulating film, a semiconductor component which is affected by light and is mounted on the flexible printed circuit board main body, and a semiconductor component coated on the flexible printed circuit board. A semiconductor component mounting type flexible printed circuit board having a light-shielding portion for shielding the light-shielding portion, wherein the insulating film is a light-shielding film, the light-shielding portion is formed by extending the insulating film, and the semiconductor is formed by bending the light-shielding portion. A flexible printed circuit board mounted with a semiconductor component, characterized in that the component is covered.