JP4031549B2 - Terminal shield structure - Google Patents

Terminal shield structure Download PDF

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Publication number
JP4031549B2
JP4031549B2 JP05655497A JP5655497A JP4031549B2 JP 4031549 B2 JP4031549 B2 JP 4031549B2 JP 05655497 A JP05655497 A JP 05655497A JP 5655497 A JP5655497 A JP 5655497A JP 4031549 B2 JP4031549 B2 JP 4031549B2
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Prior art keywords
terminal
shield
shield ring
connector
noise
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JP05655497A
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JPH10256774A (en
Inventor
栄治郎 渡邊
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Denso Ten Ltd
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Denso Ten Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、プリント配線基板に半田付けされたコネクタ等の端子をノイズからシールドする端子のシールド構造に関する。
【０００２】
【従来の技術】
プリント配線基板に設けられたコネクタ等の端子をノイズからシールドする方法としては、コネクタ全体を銅等の金属板で覆い、その金属板の一端を接地する方法が一般的である。また、コネクタを基板上でノイズ源から離して配置する等の方法がある。
【０００３】
【発明が解決しようとする課題】
コネクタ全体を金属板で覆う方法及びコネクタを基板上でノイズ源から離して配置する方法では、プリント配線基板の面積が広くなるという問題がある。
本発明は、基板の面積をあまり広くすることなくコネクタ等の端子をノイズからシールドする端子のシールド構造を提供することを目的とする。
【０００４】
【課題を解決するための手段】
上記目的を達成するために本発明は、基板に搭載された部品の端子をノイズから遮蔽する端子のシールド構造において、
前記端子が通過可能なスリットが形成されており、前記端子を覆う接地された導電性の筒状体からなることを特徴とするものである。
【０００５】
また、前記筒状体の内部が絶縁性の材料で被覆されてなることを特徴とするものである。
【０００７】
【実施例】
図１は本発明の第１の実施例のコネクタ端子のシールド構造を説明するための図で、（ａ）はシールドリングの斜視図、（ｂ）はシールドリングの基板取付け状態を示す斜視図である。また、図２は本発明の第１の実施例のコネクタ端子のシールド構造に用いる第２のシールドリングの構造を示す斜視図である。また、図３は本発明の第１の実施例のコネクタ端子のシールド構造に用いる第３のシールドリングの構造を示す斜視図である。また、図４は本発明の第１の実施例のコネクタ端子のシールド構造に用いる第４のシールドリングの構造を示す図で、（ａ）は斜視図、（ｂ）は側断面図である。以下、図に従って説明する。
【０００８】
８は電子部品及びコネクタ９等を搭載する基板である。９は複数の端子９１を有するコネクタである。１はコネクタ９の端子９１を電気的に非接触状態（離れている、あるいは、端子９１あるいはシールドリングに絶縁層が施されている）で覆う銅等の導電性の材料で円筒状に形成されたシールドリングである。
通常、ノイズ対策を必要とする端子９１は微弱な信号線等に限られ、コネクタ９の全端子９１にシールド対策を施す必要はない。本実施例では、ノイズ対策としてシールドを必要とする信号線等の端子９１のみシールドリング１を被せた後、コネクタ９を基板８に搭載して通常の半田ディップ等の方法で半田付けする。半田付けによりコネクタ９の各端子９１は基板８の所定のランド（図示せず）に接続されると共に、シールドリング１も基板８のアースパターン（図示せず）に接続される。その結果、シールドリング１の設けられた端子９１はノイズからシールドされる。尚、シールドすべき複数の端子が隣接している場合には、まとめて１つの円筒状または楕円筒状のシールドリングを使用してもよい。
【０００９】
また、シールドリング１の外部を異なる色の塗料を塗布することにより、シールドリング１の色を見ただけで端子９１の識別が容易になるという利点がある。また、この際、絶縁性の塗料を使用することによりシールドリング１が隣接する端子９１に接触しても短絡する恐れがないようにできる。
また、図２のように、銅等の導電性の材料からなるシールドリング２の円筒部２１の内壁に樹脂またはガラス質の絶縁層２２を設けることにより、高密度コネクタのように端子９１間隔が狭くても、半田付けに際してシールドリング２が傾いて、端子９１とシールドリング２の内壁が接触してもアースに短絡される恐れがないようにできる。
【００１０】
さらに、図３のように、銅等の導電性の材料からなる円筒部３１と平板部３２から形成されたシールドリング３を使用し、平板部３２を基板８に固着することにより、シールドリング３を基板８に安定に立てることが可能になる。つまり、ノイズ対策を必要とするコネクタ９の端子９１のみシールドリング３を被せた後、コネクタ９を基板８に搭載して通常の半田ディップ等の方法で半田付けする。その際、シールドリング３の平板部３２が基板８のアースパターン（図示せず）に広い面積で接触するため、シールドリング３の円筒部３１が基板８に対して垂直に半田付けできると共に、アースパターンへの接続が確実に行えるという利点がある。尚、本シールドリング３においてもシールドリング２と同様に、円筒部３１の内壁に絶縁層を設けることにより、半田付けに際して万一、端子９１とシールドリング３の内壁（円筒部３１）が接触してもアースに短絡される恐れがないようにできる。
【００１１】
また、図４のように、銅等の導電性の材料からなる円筒部４１の外壁に樹脂またはガラス質等の帯状の絶縁性突起４２を設けることにより、高密度コネクタのように端子間隔が狭い時に、適度の厚さの絶縁性突起４２がスペーサの作用をして隣接する端子９１に接触してシールドリング４が保持されて倒れず、半田付けに際して端子９１がシールドリング４の円筒部４１の内壁に接触しないようにできる。尚、本シールドリング４においてもシールドリング２と同様に、円筒部４１の内壁に絶縁層を設けることにより、半田付けに際して端子９１がシールドリング４の内壁に接触してもアースに短絡される恐れがないようにできる。
【００１２】
以上のように本実施例では、ノイズ対策を必要とする端子にのみシールドリングを設けるので、コネクタの装着部の面積、つまり基板面積を大きくすることなくノイズ対策が行える。
図５は本発明の第２の実施例のコネクタのシールド構造を説明するための図で、（ａ）はシールドカバーの斜視図、（ｂ）はシールドカバーの基板取付け方法を示す側面図である。以下、図に従って説明する。
【００１３】
５はコネクタ９の端子９１を覆う銅等の導電性の材料で概略Ｌ字型に形成されカバー部５１の内側（下部）にスリット５２の設けられたシールドカバーである。スリット５２の幅はシールド効果を高めるために端子の幅と概略同じに設定されている。尚、基板８、コネクタ９は第１の実施例と名称、機能及び作用が同じであるので同一番号を付し説明は省略する。
【００１４】
本実施例では従来と同じ方法で、コネクタ９を基板８に搭載して通常の半田ディップ等の方法で半田付けする。半田付けにより端子９１は基板８の所定のランドに接続される。その後、ノイズ対策としてシールドを必要とする信号線等の端子９１のみをシールドカバー５で覆う。この時シールドカバー５にはスリット５２が設けられているのでコネクタ９の半田付け後でも、ノイズ対策の必要な端子９１を覆うことが可能である。そして、シールドカバー５を基板８のアースパターンに半田付け等により接続する。その結果、端子９１は垂直部９１ａだけでなく水平部９１ｂもシールドカバー５で覆われるので、シールド効果が一層よくなる。
【００１５】
尚、本例においては、コネクタ９の半田付け後にノイズ対策の必要な端子にだけ内側にスリット５２の設けられたシールドカバー５を取り付けるようにしたが、スリットをシールドカバー５の外側に設けることも可能である。この場合はシールドカバー５をコネクタ９の端子半田付けと同時にできる利点がある。
また、本シールドカバー５においてもシールドリング１と同様に、シールドカバー５の内壁に絶縁層を設けることにより、半田付け後にシールドカバー５を端子９１に被せる際に、端子９１がシールドカバー５の内壁に接触してもアースに短絡される恐れがないようにできる。
【００１６】
以上のように本実施例では、ノイズ対策を必要とする端子にのみシールドカバーを設けるので、コネクタの装着部の面積、つまり基板面積を大きくすることなくノイズ対策が行える。また、端子の半田付け後に必要に応じてシールドカバーが取り付けられる。
図６は本発明の第３の実施例のコネクタ端子のシールド構造を説明するための図で、（ａ）はシールドリングの斜視図、（ｂ）はシールドリングの基板取付け状態を示す斜視図である。以下、図に従って説明する。
【００１７】
６はコネクタの端子９１を覆う銅等の導電性の材料で円筒部６１とノイズ対策部品を接続固定するタグ部（接続端子）６２からなるシールドリングであり、プレス等の方法で一体に形成される。尚、基板８、端子９１は第１の実施例と名称、機能及び作用が同じであるので同一番号を付し説明は省略する。本実施例ではシールドを必要とする端子９１をシールドリング６で覆い接地するだけでなく、コンデンサ等のノイズ対策部品６３をシールドリング６と端子９１間に接続してノイズを低減するものである。
【００１８】
通常、ノイズを低減するコンデンサ等はプリント配線基板上において所望の端子９１とアース間に設けられるが、空中を伝搬するノイズに対してはノイズ対策部品（コンデンサ６３）を基板８よりも高い位置（端子と概略同じ高さ）に設ける方が効果が大きい。コンデンサ６３は一方のリード線を端子９１の溶接点６３ａに、他方のリード線をシールドリング６のラグ部６２の溶接点６３ｂに接続され、ノイズはコンデンサ６３を介してアースに接地される。
【００１９】
尚、本シールドリング６においてもシールドリング１と同様に、シールドリング６の内壁に絶縁層を設けることにより、半田付けに際して端子９１がシールドリング６の内壁に接触してもアースに短絡される恐れがないようにできる。
以上のように本実施例では、ノイズ対策を必要とする端子にのみシールドリングを設けるので、コネクタの装着部の面積、つまり基板面積を大きくすることなくノイズ対策が行える。また、シールドリングにラグ部が設けられているのでノイズ対策部品を取付け易く、空中を伝搬するノイズについても有効になる。
【００２０】
【発明の効果】
以上説明したように、本発明では基板の面積をあまり広くすることなく端子をノイズからシールドできる。
【図面の簡単な説明】
【図１】本発明の第１の実施例のシールド構造を示す構成図である。
【図２】シールドリングの１例を示す斜視図である。
【図３】シールドリングの１例を示す斜視図である。
【図４】シールドリングの１例を示す構成図である。
【図５】本発明の第２の実施例のシールド構造を示す構成図である。
【図６】本発明の第３の実施例のシールド構造を示す構成図である。
【符号の説明】
１、２、３、４・・・・シールドリング、 ５２・・・・スリット部、
５・・・・・シールドカバー、 ６２・・・・ラグ端子、
１１、２１、３１、４１、６１・・・円筒部、 ８・・・・・基板、
５１・・・・カバー部、 ２２・・・・絶縁層、
３２・・・・平板部、 ９・・・・・コネクタ、
４２・・・・絶縁性突起、 ９１・・・・端子。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a terminal shield structure that shields terminals such as connectors soldered to a printed wiring board from noise.
[0002]
[Prior art]
As a method of shielding terminals such as connectors provided on a printed wiring board from noise, a method of covering the entire connector with a metal plate such as copper and grounding one end of the metal plate is common. Further, there is a method of arranging the connector away from the noise source on the board.
[0003]
[Problems to be solved by the invention]
In the method of covering the whole connector with a metal plate and the method of arranging the connector away from the noise source on the substrate, there is a problem that the area of the printed wiring board becomes large.
It is an object of the present invention to provide a terminal shield structure that shields terminals such as connectors from noise without enlarging the area of the substrate.
[0004]
[Means for Solving the Problems]
To achieve the above object, the present invention provides a terminal shield structure that shields terminals of components mounted on a substrate from noise.
A slit through which the terminal can pass is formed, and the terminal is made of a grounded conductive cylindrical body covering the terminal .
[0005]
Also, the interior of the tubular body is characterized in that become covered with an insulating material.
[0007]
【Example】
FIGS. 1A and 1B are diagrams for explaining a shield structure of a connector terminal according to a first embodiment of the present invention. FIG. 1A is a perspective view of a shield ring, and FIG. 1B is a perspective view showing a board attachment state of the shield ring. is there. FIG. 2 is a perspective view showing the structure of a second shield ring used in the connector terminal shield structure of the first embodiment of the present invention. FIG. 3 is a perspective view showing the structure of a third shield ring used in the connector terminal shield structure of the first embodiment of the present invention. FIGS. 4A and 4B are views showing the structure of a fourth shield ring used in the connector terminal shield structure according to the first embodiment of the present invention. FIG. 4A is a perspective view and FIG. 4B is a side sectional view. Hereinafter, it demonstrates according to a figure.
[0008]
Reference numeral 8 denotes a substrate on which electronic components, a connector 9 and the like are mounted. Reference numeral 9 denotes a connector having a plurality of terminals 91. 1 is formed in a cylindrical shape with a conductive material such as copper that covers the terminal 91 of the connector 9 in an electrically non-contact state (separated or the terminal 91 or shield ring is provided with an insulating layer). Shield ring.
Normally, the terminals 91 that need noise countermeasures are limited to weak signal lines and the like, and it is not necessary to take shield measures for all the terminals 91 of the connector 9. In this embodiment, as a countermeasure against noise, only the terminal 91 such as a signal line that needs to be shielded is covered with the shield ring 1, and then the connector 9 is mounted on the substrate 8 and soldered by a method such as normal solder dipping. Each terminal 91 of the connector 9 is connected to a predetermined land (not shown) of the substrate 8 by soldering, and the shield ring 1 is also connected to an earth pattern (not shown) of the substrate 8. As a result, the terminal 91 provided with the shield ring 1 is shielded from noise. When a plurality of terminals to be shielded are adjacent to each other, a single cylindrical or elliptical cylindrical shield ring may be used together.
[0009]
Further, by applying different color paints to the outside of the shield ring 1, there is an advantage that the terminal 91 can be easily identified only by looking at the color of the shield ring 1. At this time, by using an insulating paint, even if the shield ring 1 comes into contact with the adjacent terminal 91, it is possible to prevent a short circuit.
Further, as shown in FIG. 2, by providing a resin or glassy insulating layer 22 on the inner wall of the cylindrical portion 21 of the shield ring 2 made of a conductive material such as copper, the distance between the terminals 91 can be reduced as in a high-density connector. Even if it is narrow, the shield ring 2 can be tilted during soldering, and even if the terminal 91 and the inner wall of the shield ring 2 come into contact with each other, there is no possibility of being short-circuited to the ground.
[0010]
Further, as shown in FIG. 3, the shield ring 3 is formed by fixing the flat plate portion 32 to the substrate 8 using the shield ring 3 formed of the cylindrical portion 31 and the flat plate portion 32 made of a conductive material such as copper. Can be stably placed on the substrate 8. That is, only the terminal 91 of the connector 9 that needs noise countermeasures is covered with the shield ring 3, and then the connector 9 is mounted on the substrate 8 and soldered by a method such as normal soldering dipping. At this time, since the flat plate portion 32 of the shield ring 3 contacts a ground pattern (not shown) of the substrate 8 in a wide area, the cylindrical portion 31 of the shield ring 3 can be soldered perpendicularly to the substrate 8 and the ground There is an advantage that the connection to the pattern can be reliably performed. In the shield ring 3 as well, as with the shield ring 2, by providing an insulating layer on the inner wall of the cylindrical portion 31, the terminal 91 and the inner wall (cylindrical portion 31) of the shield ring 3 are in contact with each other in the event of soldering. Even so, there is no danger of being shorted to ground.
[0011]
Further, as shown in FIG. 4, by providing a strip-like insulating protrusion 42 made of resin or glass or the like on the outer wall of the cylindrical portion 41 made of a conductive material such as copper, the terminal interval is narrow like a high-density connector. Sometimes, the insulating protrusion 42 having an appropriate thickness acts as a spacer to contact the adjacent terminal 91 so that the shield ring 4 is held and does not fall down, so that the terminal 91 is in contact with the cylindrical portion 41 of the shield ring 4 during soldering. The inner wall can be prevented from touching. In this shield ring 4 as well as the shield ring 2, by providing an insulating layer on the inner wall of the cylindrical portion 41, even if the terminal 91 contacts the inner wall of the shield ring 4 during soldering, it may be short-circuited to the ground. There can be no.
[0012]
As described above, in this embodiment, since the shield ring is provided only for the terminals that need noise countermeasures, noise countermeasures can be performed without increasing the area of the connector mounting portion, that is, the board area.
FIGS. 5A and 5B are views for explaining the shield structure of the connector according to the second embodiment of the present invention. FIG. 5A is a perspective view of the shield cover, and FIG. 5B is a side view showing a method of attaching the shield cover to the board. . Hereinafter, it demonstrates according to a figure.
[0013]
Reference numeral 5 denotes a shield cover which is formed in an approximately L shape with a conductive material such as copper covering the terminal 91 of the connector 9 and is provided with a slit 52 on the inner side (lower part) of the cover part 51. The width of the slit 52 is set to be approximately the same as the width of the terminal in order to enhance the shielding effect. The board 8 and the connector 9 have the same names, functions, and actions as those of the first embodiment, and are therefore given the same reference numerals and will not be described.
[0014]
In the present embodiment, the connector 9 is mounted on the substrate 8 and soldered by a normal method such as solder dipping in the same manner as before. The terminal 91 is connected to a predetermined land on the substrate 8 by soldering. Thereafter, only the terminal 91 such as a signal line that requires a shield as a noise countermeasure is covered with the shield cover 5. At this time, since the shield cover 5 is provided with the slit 52, even after the connector 9 is soldered, it is possible to cover the terminal 91 that needs noise countermeasures. Then, the shield cover 5 is connected to the ground pattern of the substrate 8 by soldering or the like. As a result, not only the vertical portion 91a but also the horizontal portion 91b of the terminal 91 is covered with the shield cover 5, so that the shielding effect is further improved.
[0015]
In this example, after the connector 9 is soldered, the shield cover 5 provided with the slits 52 is attached only to the terminals that need noise countermeasures. However, the slits may be provided outside the shield cover 5. Is possible. In this case, there is an advantage that the shield cover 5 can be simultaneously soldered to the terminal 9 of the connector 9.
Further, in the shield cover 5 as well as the shield ring 1, by providing an insulating layer on the inner wall of the shield cover 5, when the shield cover 5 is put on the terminal 91 after soldering, the terminal 91 is placed on the inner wall of the shield cover 5. Even if it touches, it can be prevented from being short-circuited to the ground.
[0016]
As described above, in this embodiment, since the shield cover is provided only for the terminals that need noise countermeasures, noise countermeasures can be performed without increasing the area of the connector mounting portion, that is, the board area. Further, a shield cover is attached as necessary after the terminals are soldered.
FIGS. 6A and 6B are diagrams for explaining the shield structure of the connector terminal according to the third embodiment of the present invention. FIG. 6A is a perspective view of the shield ring, and FIG. is there. Hereinafter, it demonstrates according to a figure.
[0017]
6 is a shield ring comprising a tag portion (connection terminal) 62 for connecting and fixing the cylindrical portion 61 and the noise countermeasure component with a conductive material such as copper covering the terminal 91 of the connector, and is integrally formed by a method such as pressing. The The substrate 8 and the terminal 91 have the same names, functions, and operations as those of the first embodiment, and are therefore given the same numbers and will not be described. In the present embodiment, not only the terminal 91 that needs to be shielded is covered and grounded by the shield ring 6, but also a noise countermeasure component 63 such as a capacitor is connected between the shield ring 6 and the terminal 91 to reduce noise.
[0018]
Normally, a capacitor or the like for reducing noise is provided between a desired terminal 91 and the ground on the printed wiring board. However, a noise countermeasure component (capacitor 63) is positioned higher than the board 8 for noise propagating in the air ( It is more effective to install at approximately the same height as the terminal. In the capacitor 63, one lead wire is connected to the welding point 63 a of the terminal 91, and the other lead wire is connected to the welding point 63 b of the lug portion 62 of the shield ring 6, and the noise is grounded to the ground through the capacitor 63.
[0019]
In this shield ring 6 as well as the shield ring 1, by providing an insulating layer on the inner wall of the shield ring 6, even if the terminal 91 contacts the inner wall of the shield ring 6 during soldering, it may be short-circuited to the ground. There can be no.
As described above, in this embodiment, since the shield ring is provided only for the terminals that need noise countermeasures, noise countermeasures can be performed without increasing the area of the connector mounting portion, that is, the board area. Further, since the lug portion is provided in the shield ring, it is easy to attach a noise countermeasure component, and it is effective for noise propagating in the air.
[0020]
【The invention's effect】
As described above, in the present invention, the terminal can be shielded from noise without enlarging the area of the substrate.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a shield structure according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing an example of a shield ring.
FIG. 3 is a perspective view showing an example of a shield ring.
FIG. 4 is a configuration diagram showing an example of a shield ring.
FIG. 5 is a configuration diagram showing a shield structure according to a second embodiment of the present invention.
FIG. 6 is a configuration diagram showing a shield structure according to a third embodiment of the present invention.
[Explanation of symbols]
1, 2, 3, 4, ... Shield ring, 52 ... Slit part,
5 ... Shield cover, 62 ... Lug terminal,
11, 21, 31, 41, 61 ... cylindrical portion, 8 ... substrate,
51... Cover part, 22 ... Insulating layer,
32 ... Flat plate part, 9 ... Connector,
42... Insulating protrusion, 91.

Claims (2)

基板に搭載された部品の端子をノイズから遮蔽する端子のシールド構造において、
前記端子が通過可能なスリットが形成されており、前記端子を覆う接地された導電性の筒状体からなることを特徴とする端子のシールド構造。In the terminal shield structure that shields the terminals of components mounted on the board from noise,
A terminal shield structure , wherein a slit through which the terminal can pass is formed, and the terminal shield structure is a grounded conductive cylindrical body covering the terminal. 前記筒状体の内部が絶縁性の材料で被覆されてなることを特徴とする請求項１記載の端子のシールド構造。2. The terminal shield structure according to claim 1, wherein the inside of the cylindrical body is covered with an insulating material.
JP05655497A 1997-03-11 1997-03-11 Terminal shield structure Expired - Fee Related JP4031549B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05655497A JP4031549B2 (en) 1997-03-11 1997-03-11 Terminal shield structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05655497A JP4031549B2 (en) 1997-03-11 1997-03-11 Terminal shield structure

Publications (2)

Publication Number Publication Date
JPH10256774A JPH10256774A (en) 1998-09-25
JP4031549B2 true JP4031549B2 (en) 2008-01-09

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DE10064969B4 (en) * 2000-01-20 2007-11-15 Heidelberger Druckmaschinen Ag Filter device for at least one to be connected from the outside to a housing electrical line
JP5718081B2 (en) * 2011-02-14 2015-05-13 日本電産サンキョー株式会社 Motor with magnetic sensor unit and encoder

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