CN107623989B - Printed circuit board and mobile terminal - Google Patents
Printed circuit board and mobile terminal Download PDFInfo
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- CN107623989B CN107623989B CN201711012049.9A CN201711012049A CN107623989B CN 107623989 B CN107623989 B CN 107623989B CN 201711012049 A CN201711012049 A CN 201711012049A CN 107623989 B CN107623989 B CN 107623989B
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Abstract
The application provides a printed circuit board and a mobile terminal including the same. The ground plane layers are respectively arranged on two opposite sides of an important signal line layer in the printed circuit board, and at least one ground wire is respectively arranged on two sides of the important signal line layer, so that the periphery of each important signal line can be protected in a covering mode, the interference on the important signals transmitted through the important signal lines is avoided, the transmission quality of the signals transmitted through the important signal lines and the stability of the performance in the working process are ensured, and the signal quality of the printed circuit board is improved.
Description
Technical Field
The present application relates to the field of mobile terminals, and more particularly, to a printed circuit board and a mobile terminal including the same.
Background
In the prior art, a Printed Circuit Board (PCB) is an important electronic component for supporting an electronic component and serving as a carrier for electrical connection of the electronic component. When the PCB is designed, factors such as signal interference and signal reflection in the PCB need to be considered so as to achieve the purpose of improving the signal quality, and the reasonable design of the stacking arrangement mode of the PCB is the key for improving the signal quality of the PCB.
Disclosure of Invention
The application provides a printed circuit board and a mobile terminal with better signal quality.
The printed circuit board comprises a plurality of conductive layers and a plurality of insulating layers which are arranged in a stacked mode, and one insulating layer is arranged between every two adjacent conductive layers; the multilayer conducting layer comprises at least one important signal line layer and a plurality of ground plane layers, and two opposite sides of each important signal line layer are respectively provided with one ground plane layer; the important signal line layer comprises at least one important signal line and a plurality of ground lines, and at least one ground line is arranged on two sides of each important signal line.
The mobile terminal comprises the printed circuit board.
The ground plane layers are respectively arranged on two opposite sides of the important signal line layer in the printed circuit board, and at least one ground wire is respectively arranged on two sides of the important signal line layer, so that the surrounding of each important signal line can be protected in a ground covering mode, signals of the important signal lines are prevented from being interfered, the transmission quality of the important signals transmitted through the important signal lines and the stability of the performance in the working process are ensured, and the signal quality of the printed circuit board is improved.
Drawings
To more clearly illustrate the structural features and effects of the present application, a detailed description is given below in conjunction with the accompanying drawings and specific embodiments.
FIG. 1 is a schematic cross-sectional view of a printed circuit board according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a printed circuit board according to another embodiment of the present application;
fig. 3 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The drawings are for illustrative purposes only and are merely schematic representations, not intended to limit the present patent.
Referring to fig. 1, the present application provides a printed circuit board 100. The printed circuit board 100 includes a plurality of conductive layers 10 and a plurality of insulating layers 20 stacked on each other, and one insulating layer 20 is disposed between two adjacent conductive layers 10, that is, the conductive layers and the insulating layers 20 are alternately disposed at intervals. The insulating layer 20 separates two adjacent conductive layers 10, and signals transmitted in the two adjacent conductive layers 10 are prevented from influencing each other. Further, via holes 40 are disposed between the conductive layers 10, and the conductive layers 10 are electrically connected through the via holes 40, so as to realize signal connection between the conductive layers 10. The components 50 are disposed on the printed circuit board, electrically connected to the conductive layers 10, and transmit signals through the conductive layers 10. In this embodiment, the printed circuit board includes 10 conductive layers 10 and 9 insulating layers 20, and the 5 th conductive layer 10 and the 6 th conductive layer 10 and the 5 th insulating layer 20 therebetween form a core board 30 of the printed circuit board, and the other conductive layers 10 and the other insulating layers 20 are alternately disposed on two sides of the core board 30.
In the printed circuit board 100, the conductive layer 10 includes at least one important signal line layer 11, at least one common signal line layer 12, a plurality of ground plane layers 13 and at least two routing layers 14, and the important signal line layer 11, the common signal line layer 12, the ground plane layer 13 and the routing layers 14 are stacked according to a certain arrangement. The two opposite sides of each important signal line layer 11 are respectively provided with one ground plane layer, and the important signal line layer 11 refers to the two ground plane layers simultaneously, so that the important signal on the important signal line layer 11 flows back more completely, and the transmission quality of the important signal is improved. And, the normal signal line layer 12 is closer to the surface of the printed circuit board than the important signal line layer 11. In other words, the important signal line layer 11 is disposed at the middle position of the printed circuit board as much as possible, that is, the important signal line layer 11 is close to the core 30, and the common signal line 121 can be closer to the surface of the printed circuit board than the important signal line layer 11, so that the influence of the outside on the important signal transmitted through the important signal line layer 11 is reduced, and the quality of the important signal is ensured. Further, in this application, first insulating layer 20 and second insulating layer 20 have been stacked respectively to the both sides that important signal line layer 11 is relative, first insulating layer 20 deviates from one side of important signal line layer 11 is stacked there is the one deck ground plane layer, first insulating layer 20 deviates from one side of important signal line layer 11 is also stacked there is the one deck ground plane layer, wherein, the thickness of first insulating layer 20 is compare the thickness of second insulating layer 20 equals or slightly is bigger, thereby guarantees important signal line layer 11 refers to simultaneously ground plane layer on first insulating layer 20 reaches during the ground plane layer on the second insulating layer 20, signal backward flow can be more complete, and then guarantees the quality of the important signal of transmission on the important signal line layer 11. In this embodiment, the thickness of the first insulating layer 20 may be 1 to 1.3 times of the thickness of the second insulating layer 20.
In this embodiment, the conductive layer 10 of the printed circuit board includes a routing layer 14, a common signal line layer 12, a ground plane layer, an important signal line layer 11, a ground plane layer, a common signal line layer 12, and a routing layer 14, which are sequentially stacked. In the present embodiment, the printed circuit board has a 10-layer 3-layer laminated structure with a thickness of 0.7 mm. The thickness of the insulating layer 20 of the core board 30 is 2.5 mils, and the thickness of the insulating layer 20 adjacent to the insulating layer 20 of the core board 30 is 2.05 mils. In the two conductive layers 10 of the core board 30, one conductive layer 10 is the ground plane layer, and the other conductive layer 10 is the important signal line layer 11. At this time, the insulating layer 20 of the core board 30 is the first insulating layer 20, the insulating layer 20 adjacent to the insulating layer 20 of the core board 30 is the second insulating layer 20, and the thickness of the first insulating layer 20 is about 1.2 times of the thickness of the second insulating layer 20, so that the important signal line layer 11 can realize more complete signal backflow, and the transmission quality of the important signal on the important signal line layer 11 is ensured.
The important signal line layer 11 is provided with an important signal line 111. The important signal line 111 refers to: when a signal is transmitted through the conductive line of the printed circuit board 100, if the length of the conductive line is close to 1/7 of the signal wavelength, the conductive line at this time becomes the important signal line 111. The important signal line 111 is used for transmitting a high-frequency signal and a pulse signal, and the important signal line 111 needs to control a characteristic impedance value, that is, needs to meet a specific impedance control requirement. In this application, the important signal line 111 is used for transmitting important signals such as clock transmission, reset, MIPI, USB, and radio frequency impedance signals.
The common signal line layer 12 is provided with a common signal line 121. The common signal line 121 refers to: and the wire is used for transmitting the second signal after the first signal transmission is completed. The normal signal line 121 does not need to perform control of the characteristic impedance value. In this application, the common signal line 121 is used to transmit common signals such as an interrupt signal, a GPIO hole signal, or a small current signal.
The ground plane layer 13 is used as a reference signal layer of other signal layers to implement complete return of signals transmitted on the signal layers. Moreover, the ground plane layer 13 can protect the signal lines on the signal layers covered thereby, so as to avoid crosstalk between transmission signals on the signal lines on the respective signal layers, and shield the influence of external signals on the transmission signals on the signal layers, thereby improving the signal transmission quality on the signal layers on the printed circuit board.
In addition, in the present application, the number of the ground plane layers is multiple, and at least one layer of the ground plane layer is a complete ground plane. Wherein, the complete ground plane means that the ground plane layer is a complete conductive metal layer except for the through hole at the position of the via hole 40. Specifically, in an embodiment, the complete ground plane is a complete copper foil except for the through hole at the position of the via hole 40. Referring to fig. 2, in some other embodiments of the present application, at least one of the ground plane layers may include a ground plane block 131 and a routing block 132. The ground plane block 131 may provide a reference signal for transmission signals of other signal layers, so as to implement complete return of signals transmitted on the signal layers. And, the signal lines on the signal layers covered by the ground plane block 131 are protected in a ground covering manner, so that crosstalk between transmission signals on the signal lines on each signal layer is avoided, and influence of external signals on the transmission signals on the signal layers is shielded, thereby improving the signal transmission quality on each signal layer on the printed circuit board. The routing block 132 performs routing. Specifically, in the present application, the trace block 132 is used for disposing the common signal line 121. The ground plane layer is arranged to include the ground plane blocks 131 and the routing blocks 132, so that the ground plane layer is reasonably utilized while the function of the ground plane layer is realized, and the number of the conductive layers 10 of the printed circuit board can be reduced while good routing and signal transmission effects are realized.
Referring back to fig. 1, in the present application, each of the important signal line layers 11 has a ground plane layer on opposite sides thereof. In this embodiment, the important signal line layer 11 is adjacent to the ground plane layers on two sides of the important signal line layer, and specifically, the ground plane layers are stacked on the upper and lower sides of the important signal line layer 11, respectively. And, the important signal line layer 11 simultaneously refers to the ground plane layers on both sides thereof, thereby realizing more complete return of the transmission signal in the important signal line layer 11. It is understood that in other embodiments of the present application, the ground plane layer and the important signal line layer 11 on opposite sides of each important signal line layer 11 may not be adjacent to each other, and the important signal layer passes through the opening and is referred to the ground plane layer by opening the signal layer adjacent to the important signal line layer 11 at a position corresponding to the important signal line 111 on the important signal line layer 11, so as to achieve more complete return of the transmission signal in the signal line layer. In addition, in the present application, the important signal line layer 11 includes at least one important signal line 111 and a plurality of ground lines 112, at least one ground line is disposed on each of two sides of each important signal line 111, and an extending direction of the ground line is the same as an extending direction of the important signal line 111. Specifically, in this embodiment, the ground lines on both sides of the important signal line 111 are divided into left and right sides of the important signal line 111. The ground plane layers positioned on two sides of the important signal layer and the ground wires in the important signal layer are used for protecting the important signal wires 111 in the important signal layer from being covered by the ground, so that the adjacent important signal wires 111 cannot generate crosstalk, signals between the adjacent signal layers cannot generate crosstalk, and interference of external signals on signal transmission of the important signal wires 111 is avoided, thereby ensuring the transmission quality of the signals in the important signal wires 111 and the stability in the working process. In addition, in the present application, the cross-sectional area of the ground line needs to meet a certain size requirement, so as to isolate the important signals transmitted in the two adjacent important signal lines 111, thereby avoiding crosstalk between the important signals transmitted in the two adjacent important signal lines 111. In this embodiment, the cross-sectional area of the ground line 112 is greater than or equal to the cross-sectional area of the important signal line 111 adjacent to the ground line 112.
Further, in this embodiment, the ground plane layers on both sides of the important signal line layer 11 are all complete ground planes. The number of the important signal line layers 11 is two, and the two important signal line layers are a first signal layer and a second signal layer. In this embodiment, the first signal layer is a 4 th conductive layer 10, and the second signal layer is a 6 th conductive layer 10. The first signal layer and the second signal layer are referenced to the ground plane layer. In this embodiment, the ground plane layer is a 5 th conductive layer 10. It can be understood that, in other embodiments of the present application, the number of the important signal layers may also be multiple layers, one ground layer is disposed between any two adjacent important signal layers, and the two adjacent important signal layers refer to the ground layer between the two important signal layers, so that the number of the ground layers is reduced while the ground coverage of the signal lines in the important signal line layer 11 in each direction is realized, that is, the signal transmission quality in the important signal line 111 is realized, thereby thinning the printed circuit board.
Referring to fig. 2, in another embodiment of the present application, one of the two ground plane layers on two sides of the important signal line layer 11 is a complete ground plane, the other ground plane layer includes a ground plane block 131 and a routing block 132, a projection of the ground plane block 131 on the important signal line layer 11 adjacent to the ground plane layer covers all the important signal lines 111 on the important signal line layer 11, and the routing block 132 is used for disposing common signal lines 121. In this embodiment, the projection of the ground plane block 131 on the important signal line layer 11 adjacent to the ground plane layer covers all the important signal lines 111 on the important signal line layer 11, so that the ground plane block 131 is used as a reference plane of the important signal line layer 11, and the ground plane block 131 is used to protect the important signal lines 111. Meanwhile, the common signal lines 121 are arranged on the routing blocks 132, so that the space of the important signal layers can be fully utilized, the number of layers of the conductive layers 10 is reduced, and the thickness of the printed circuit board is reduced. It is understood that in other embodiments of the present invention, the two ground plane layers on both sides of the important signal line layer 11 may be both ground plane layers including the ground plane block 131 and the routing block 132, and the projections of the ground plane block 131 in the two ground plane layers on the important signal line layer 11 both cover the important signal line 111 on the important signal line layer 11.
Referring to fig. 3, the present application further provides a mobile terminal 200, where the mobile terminal 200 includes the printed circuit board 100. The mobile terminal refers to a computer device that can be used in mobile, including but not limited to a mobile phone, a notebook, a tablet computer, a POS machine, a vehicle-mounted computer, a camera, and the like.
The application provides a printed circuit board and a mobile terminal including the same. The ground plane layers are respectively arranged on two opposite sides of the important signal line layer 11 in the printed circuit board, and at least one ground wire is respectively arranged on two sides of the important signal line 111 of the important signal line layer 11, so that the surrounding of each important signal line 111 can be protected in a ground covering mode, signals transmitted through the important signal line 111 are prevented from being interfered, the transmission quality of important signals transmitted through the important signal line 111 and the stability of the performance in the working process are ensured, and the signal quality of the printed circuit board is improved.
The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (8)
1. The printed circuit board is characterized by comprising a plurality of conductive layers and a plurality of insulating layers which are arranged in a stacked mode, wherein one insulating layer is arranged between every two adjacent conductive layers; the multilayer conducting layer comprises at least one important signal line layer and a plurality of ground plane layers, and two opposite sides of each important signal line layer are respectively provided with one ground plane layer; the important signal line layer comprises at least one important signal line and a plurality of ground lines, wherein at least one ground line is arranged on each of two sides of each important signal line, and the length of each important signal line is 1/7 of the signal wavelength of the transmitted signal; the cross-sectional area of the ground wire is larger than that of an important signal wire adjacent to the ground wire; the printed circuit board further comprises a common signal line layer, the common signal line layer is used for arranging common signal lines, the common signal line layer is relatively close to the surface of the printed circuit board relative to the important signal line layer, and the common signal lines are wires which are used for sending second signals after first signal transmission is completed by receiving.
2. The printed circuit board of claim 1, wherein at least one of the ground plane layers comprises a ground plane block and a routing block, a projection of the ground plane block on an important signal line layer adjacent to the ground plane layer covers all the important signal lines on the important signal line layer, and the routing block is used for arranging common signal lines.
3. The printed circuit board of claim 1, wherein at least one of the ground plane layers is a complete ground plane.
4. The pcb of claim 1, wherein one of the two ground plane layers on two sides of the important signal layer is a complete ground plane, the other ground plane layer includes a ground plane block and a routing block, a projection of the ground plane block on an important signal line layer adjacent to the ground plane layer covers all the important signal lines on the important signal line layer, and the routing block is used for disposing common signal lines.
5. The printed circuit board of any of claims 2-4, wherein at least one of the layers of critical signal lines includes a first signal layer and a second signal layer, wherein a layer of the ground plane layer is disposed between the first signal layer and the second signal layer, and wherein the first signal layer and the second signal layer are each referenced to the ground plane layer.
6. The printed circuit board of claim 1, wherein the printed circuit board comprises a routing layer, a normal signal line layer, a ground plane layer, a significant signal line layer, a ground plane layer, a normal signal line layer, and a routing layer, which are sequentially stacked.
7. The printed circuit board of claim 1, wherein the at least one insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are stacked on two opposite sides of the important signal line layer, respectively, and the thickness of the first insulating layer is 1 to 1.3 times the thickness of the second insulating layer.
8. A mobile terminal, characterized in that it comprises a printed circuit board according to any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711012049.9A CN107623989B (en) | 2017-10-24 | 2017-10-24 | Printed circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711012049.9A CN107623989B (en) | 2017-10-24 | 2017-10-24 | Printed circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107623989A CN107623989A (en) | 2018-01-23 |
| CN107623989B true CN107623989B (en) | 2020-03-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711012049.9A Active CN107623989B (en) | 2017-10-24 | 2017-10-24 | Printed circuit board and mobile terminal |
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| CN (1) | CN107623989B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072329B (en) * | 2019-04-29 | 2020-09-08 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
| CN111970823A (en) * | 2020-07-17 | 2020-11-20 | 苏州浪潮智能科技有限公司 | Circuit board and server |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050103109A (en) * | 2004-04-24 | 2005-10-27 | 주식회사 팬택 | Structure of preventing connector from moving by punching pcb |
| CN202218474U (en) * | 2011-07-13 | 2012-05-09 | 青岛海信移动通信技术股份有限公司 | Main circuit board of mobile terminal and mobile terminal |
| CN103889145B (en) * | 2014-01-09 | 2017-01-18 | 上海兆芯集成电路有限公司 | Circuit board and electronic assembly |
| CN105578714A (en) * | 2015-12-11 | 2016-05-11 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | Novel lamination structure of multilayer high-speed PCB and signal via-hole optimization method |
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| CN107623989A (en) | 2018-01-23 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |
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