CN108173019A - Communication interface structure and electronic equipment - Google Patents

Communication interface structure and electronic equipment Download PDF

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Publication number
CN108173019A
CN108173019A CN201711417797.5A CN201711417797A CN108173019A CN 108173019 A CN108173019 A CN 108173019A CN 201711417797 A CN201711417797 A CN 201711417797A CN 108173019 A CN108173019 A CN 108173019A
Authority
CN
China
Prior art keywords
circuit board
communication interface
contact terminal
board substrate
connecting line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711417797.5A
Other languages
Chinese (zh)
Other versions
CN108173019B (en
Inventor
黄强元
谢长虹
朱中武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN201711417797.5A priority Critical patent/CN108173019B/en
Publication of CN108173019A publication Critical patent/CN108173019A/en
Application granted granted Critical
Publication of CN108173019B publication Critical patent/CN108173019B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727Coupling devices presenting arrays of contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The present invention relates to a kind of communication interface structures, it is connect for the communication interface with docking, including circuit board substrate, the edge of the circuit board substrate has connecting plate, contact terminal and connecting line are provided on the circuit board substrate, for being connect with the communication interface of the docking, and the contact terminal is arranged on the connecting plate, the connecting line is used to be correspondingly connected with the contact terminal contact terminal.The invention further relates to a kind of electronic equipment.The beneficial effects of the invention are as follows:Contact terminal is directly made on circuit board substrate, eliminates the tongue piece that plastic cement in the prior art makes, improve due to tongue piece made of plastic cement and caused by contact terminal the problem of being easily corroded or short circuit occurs.

Description

Communication interface structure and electronic equipment
Technical field
The present invention relates to communication product manufacture technology field more particularly to a kind of communication interface structures and electronic equipment.
Background technology
The charging of USB (Universal Serial Bus, universal serial bus) and data transmission interface are all logical at present Cross the mutual cooperation realization of USB socket and plug.As shown in Figure 1, socket includes shell 3, the tongue piece 2 being fixed in shell 3, The contact terminal 1 being set on tongue piece, one end of contact terminal 1 pass through the shell 3 to be welded with the circuit board outside shell 3 It connects, has the following problems:
Tongue piece is generally plastic cement and is made, and tongue piece and is set between the contact terminal on tongue piece there may be gap, easily Occur since liquid or foreign matter enter the gap, contact terminal is caused to be corroded or short circuit.
Invention content
In order to solve the above technical problem, the present invention provides a kind of communication interface structure and electronic equipments, improve contact jaw Sub the problem of being easily corroded or short circuit occurs.
In order to achieve the above object, the technical solution adopted by the present invention is:A kind of communication interface structure, for docking Communication interface connects;A kind of communication interface structure connect for the communication interface with docking, which is characterized in that including circuit board Substrate, the edge of the circuit board substrate have connecting plate, contact terminal and connecting line are provided on the circuit board substrate, The contact terminal with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, institute Connecting line is stated for being correspondingly connected with the contact terminal.
The beneficial effects of the invention are as follows:Contact terminal is directly made on circuit board substrate, is eliminated in the prior art The tongue piece that plastic cement makes, improve due to tongue piece made of plastic cement and caused by the contact terminal be easily corroded or occur short The problem of road.
Description of the drawings
Fig. 1 shows the side sectional views of communication interface socket in the prior art;
Fig. 2 represents the side sectional view of communication interface socket in one embodiment of the embodiment of the present invention;
Fig. 3 represents to set contact terminal connection diagram in one embodiment of the embodiment of the present invention on circuit board substrate;
Fig. 4 represents the side sectional view of communication interface socket in another embodiment of the embodiment of the present invention;
Fig. 5 represents to set the connection diagram of contact terminal in another embodiment of the embodiment of the present invention on circuit board substrate One;
Fig. 6 represents to set the connection diagram of contact terminal in another embodiment of the embodiment of the present invention on circuit board substrate Two;
Fig. 7 represents the side sectional view of Fig. 6.
Specific embodiment
The feature and principle of the present invention are described in detail below in conjunction with attached drawing, illustrated embodiment is only used for explaining this hair It is bright, protection scope of the present invention is not limited with this.
As illustrated in figs. 2-7, the present embodiment provides a kind of communication interface structures, are connect for the communication interface with docking;Packet Circuit board substrate 4 is included, the edge of the circuit board substrate 4 has connecting plate 41, is provided with and is used on the circuit board substrate 4 The contact terminal 1 being connect with the communication interface of the docking and the connecting line 2 being correspondingly connected with the contact terminal 1, it is described to connect Contravention is arranged on the connecting plate 41.
The connecting plate 41 and the circuit board substrate 4 are integral structures, and the contact terminal 1 is set to the connecting plate On 41, that is to say, that the contact terminal 1 is directly made on circuit board substrate 4, eliminates what plastic cement in the prior art made Tongue piece, improve due to tongue piece made of plastic cement and caused by the contact terminal 1 the problem of being easily corroded or short circuit occurs, And reduce cost of manufacture.
The communication interface structure further includes shell 3, and the shell 3 includes being used for being inserted into for the communication interface of the docking Openend and the blind end that is oppositely arranged with the openend, the shell 3 cover at outside the connecting plate 41.It is described outer The setting of shell 3 defines the space that the communication interface of docking is inserted into, conducive to the connection of the communication interface of docking.
The circuit board substrate 4 is structure as a whole with the connecting plate 41, and the circuit board substrate 4 is located at the shell 3 Outside.
In one embodiment of the present embodiment, the circuit board substrate 4 is equipped with circuit, and the contact terminal 1 is by described Connecting line 2 is connect with the circuit on the circuit board substrate 4.That is, the circuit board of the circuit board substrate 4 and electronic equipment integrates It is structure as a whole, that is to say, that the circuit board substrate 4 directly uses the circuit board of electronic equipment, the communication interface structure It directly makes and is formed on the circuit board of electronic equipment, as shown in Figures 2 and 3.
The circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, according to actual needs, described first The contact terminal 1 and the connecting line 2 are provided on surface or the second surface, that is, only in the side of circuit board substrate 4 Surface sets the contact terminal and the connecting line 2;Alternatively, it is respectively provided on the first surface and the second surface State contact terminal 1 and the connecting line 2.
The contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are using etching mode The integral structure of formation, but be not limited thereto.
In another embodiment of the present embodiment, it is additionally provided on the circuit board substrate 4 for the electricity with electronic equipment The solder pad 5 of road plate welding, one end of the connecting line 2 are correspondingly connected with the contact terminal 1, the connecting line 2 it is another End is correspondingly connected with the solder pad 5, as shown in figure 4, the solder pad 5 is set to the outside of the shell 3.
The circuit board of the circuit board substrate 4 and electronic equipment is separate structure, and the circuit board substrate 4 is independently arranged, I.e. described communication interface structure is separately set with corresponding electronic equipment, when communication interface structure is damaged, only needs to change phase The communication interface structure answered, the whole circuit board without replacing electronic equipment, easy to repair and replacement, and reduce cost.
As shown in figure 5, the circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, first table The contact terminal 1, the connecting line 2 and the solder pad 5, the solder pad 5 and the connecting line 2 are provided on face It is correspondingly connected with, alternatively,
The contact terminal 1, the connecting line 2 and the solder pad 5, the welding are provided on the second surface Pad 5 is correspondingly connected with the connecting line 2.
As shown in Figure 6 and Figure 7, the circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, and described the The contact terminal 1 and the connecting line 2 are both provided on one surface and the second surface,
The solder pad 5 includes the first weld part 6 and the second weld part 7, and first weld part 6 is arranged on described the On one surface, and first weld part 6 is correspondingly connected with the connecting line 2 on the first surface, and second weld part 7 is set It puts on the first surface, and second weld part 7 is arranged at intervals with first weld part 6, the circuit board substrate 4 On the 7 corresponding position of the second weld part is being provided with through-hole, second weld part 7 passes through the through-hole and described the Connecting line 2 on two surfaces is correspondingly connected with.
The welding being correspondingly connected with corresponding connecting line 2 is set respectively on the first surface and the second surface Portion, due to being respectively provided with weld part in the first surface of circuit board substrate 4 and the second surface, manufacture craft difficulty is high, In order to reduce manufacture craft difficulty, in the present embodiment, first weld part 6 and second weld part 7 are set to same table On face, first weld part 6 is connected with the 11 corresponding connecting line 2 of the first contact terminal being set on the first surface, Second weld part, the 7 corresponding position is being provided with through-hole on the circuit board substrate 4, second weld part 7 passes through The through-hole is correspondingly connected with the 12 corresponding connecting line 2 of the second contact terminal on the second surface.
Above structure is provided with conducive to the design of special USB contact terminals, and such as by Vbus, (one in contact terminal connects Contact) with other contact point designs in contact terminal in different sides, solving Vbus, (one in contact terminal contacts with D- Point) between problems of electromigration, and improve and be located at connecing on two opposite surfaces of tongue piece on Type-c USB (c-type UCB interfaces) Short circuit problem between contravention.
In order to realize being correspondingly connected with for second weld part 7 and the connecting line 2 on the second surface, the through-hole Conductive layer 9 is provided on side wall, according to actual needs, one end of the conductive layer 9, which extends outwardly, is covered in second welding At the periphery of the through-hole in portion 7, the other end of the conductive layer 9 extend outwardly be covered in it is described on the second surface At the periphery of through-hole.
In the present embodiment, the contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are The integral structure formed using etching mode.
In the present embodiment, the contact terminal 1, the connecting line 2 and first weld part 6 on the first surface For the integral structure formed using etching mode.
In the present embodiment, the circuit board 4 is printing board PCB or flexible circuit board FPC.
The above is present pre-ferred embodiments, it should be noted that those skilled in the art, Under the premise of not departing from principle of the present invention, several improvements and modifications can also be made, these improvements and modifications also should be regarded as The scope of the present invention.

Claims (10)

1. a kind of communication interface structure connect for the communication interface with docking, which is characterized in that including circuit board substrate, institute Stating the edge of circuit board substrate has connecting plate, and contact terminal and connecting line are provided on the circuit board substrate, described to connect Contravention with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, the connection Line is used to be correspondingly connected with the contact terminal.
2. communication interface structure according to claim 1, which is characterized in that the communication interface structure further includes shell, The jacket is set on outside the connecting plate, and the enclosure has the space that the communication interface for docking is inserted into, institute State the outside that circuit board substrate is located at the shell.
3. communication interface structure according to claim 1, which is characterized in that the circuit board substrate is equipped with circuit, institute Contact terminal is stated to connect with the circuit on the circuit board substrate by the connecting line.
4. communication interface structure according to claim 3, which is characterized in that the connecting plate includes be disposed opposite to each other first The contact terminal and the connection are both provided on surface and second surface, the first surface and/or the second surface Line.
5. communication interface structure according to claim 4, which is characterized in that on the same surface of the circuit board substrate The contact terminal and the connecting line are the integral structure formed using etching mode.
6. communication interface structure according to claim 2, which is characterized in that be additionally provided with and be used on the circuit board substrate With the solder pad of the welding circuit board of electronic equipment, one end of the connecting line connects the contact terminal, the connecting line The other end connect the solder pad.
7. communication interface structure according to claim 6, which is characterized in that the circuit board substrate includes what is be disposed opposite to each other First surface and second surface are provided with the contact terminal, the connecting line and the solder pad on the first surface, The solder pad is correspondingly connected with the connecting line, alternatively,
Be provided with the contact terminal, the connecting line and the solder pad on the second surface, the solder pad with The connecting line is correspondingly connected with.
8. communication interface structure according to claim 6, which is characterized in that the circuit board substrate includes what is be disposed opposite to each other The contact terminal and the connection are both provided on first surface and second surface, the first surface and the second surface Line,
The solder pad includes the first weld part and the second weld part, and first weld part is arranged on the first surface On, and first weld part is correspondingly connected with the connecting line on the first surface, second weld part is arranged on described On first surface, and second weld part is arranged at intervals with first weld part,
Position corresponding with second weld part is provided with through-hole on the circuit board substrate, second weld part passes through The through-hole is correspondingly connected with the connecting line on the second surface;
Conductive layer is provided on the side wall of the through-hole.
9. communication interface structure according to claim 8, which is characterized in that on the same surface of the circuit board substrate The contact terminal and the connecting line are the integral structure formed using etching mode.
10. a kind of electronic equipment, which is characterized in that including communication interface structure as described in any one of claim 1 to 9.
CN201711417797.5A 2017-12-25 2017-12-25 Communication interface structure and electronic equipment Active CN108173019B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711417797.5A CN108173019B (en) 2017-12-25 2017-12-25 Communication interface structure and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711417797.5A CN108173019B (en) 2017-12-25 2017-12-25 Communication interface structure and electronic equipment

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CN108173019A true CN108173019A (en) 2018-06-15
CN108173019B CN108173019B (en) 2019-11-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109586068A (en) * 2019-01-08 2019-04-05 广东杰思通讯股份有限公司 A kind of electric connector socket
CN110854573A (en) * 2019-11-22 2020-02-28 维沃移动通信有限公司 Plug of data transmission line and data transmission line

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342208A (en) * 1992-02-19 1994-08-30 Nec Corporation Package connector apparatus
CN204633058U (en) * 2015-05-18 2015-09-09 特通科技有限公司 USB Type-C connector modules
CN205693026U (en) * 2016-06-03 2016-11-16 巧连科技股份有限公司 Rigid circuit board connecting device
CN206340697U (en) * 2016-11-23 2017-07-18 巧连科技股份有限公司 USB attachment means
CN206674294U (en) * 2017-03-09 2017-11-24 鹏鼎控股(深圳)股份有限公司 USB Type C board structure of circuit and USB Type C connectors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342208A (en) * 1992-02-19 1994-08-30 Nec Corporation Package connector apparatus
CN204633058U (en) * 2015-05-18 2015-09-09 特通科技有限公司 USB Type-C connector modules
CN205693026U (en) * 2016-06-03 2016-11-16 巧连科技股份有限公司 Rigid circuit board connecting device
CN206340697U (en) * 2016-11-23 2017-07-18 巧连科技股份有限公司 USB attachment means
CN206674294U (en) * 2017-03-09 2017-11-24 鹏鼎控股(深圳)股份有限公司 USB Type C board structure of circuit and USB Type C connectors

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109586068A (en) * 2019-01-08 2019-04-05 广东杰思通讯股份有限公司 A kind of electric connector socket
CN109586068B (en) * 2019-01-08 2024-02-20 广东杰思通讯股份有限公司 Electric connector socket
CN110854573A (en) * 2019-11-22 2020-02-28 维沃移动通信有限公司 Plug of data transmission line and data transmission line
CN110854573B (en) * 2019-11-22 2021-02-09 维沃移动通信有限公司 Plug of data transmission line and data transmission line

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Publication number Publication date
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