CN201303485Y - Shield cover and component - Google Patents

Shield cover and component Download PDF

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Publication number
CN201303485Y
CN201303485Y CNU2008201397920U CN200820139792U CN201303485Y CN 201303485 Y CN201303485 Y CN 201303485Y CN U2008201397920 U CNU2008201397920 U CN U2008201397920U CN 200820139792 U CN200820139792 U CN 200820139792U CN 201303485 Y CN201303485 Y CN 201303485Y
Authority
CN
China
Prior art keywords
module
connector
utility
shield cover
motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008201397920U
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Chinese (zh)
Inventor
隋彦滨
覃军
尹邦实
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Device Co Ltd
Original Assignee
Shenzhen Huawei Communication Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Huawei Communication Technologies Co Ltd filed Critical Shenzhen Huawei Communication Technologies Co Ltd
Priority to CNU2008201397920U priority Critical patent/CN201303485Y/en
Application granted granted Critical
Publication of CN201303485Y publication Critical patent/CN201303485Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The embodiment of the utility model discloses a shield cover, comprising a first shield cover, a second shield cover and a connecting strip; the first shield cover is connected with the second shield cover by a connecting bar. The embodiment of the utility model further provides a component, comprising a module and a mother plate; the module is fixed on the mother plate; the bottom surface of the module is provided with a first connecting body, the mother plate is provided with a second connecting body, after the module is fixed on the mother plate, the first connecting body is contacted with the second connecting body for realizing electrical connection of the module and the mother plate. The shield cover provided by the utility model enhances the shielding effect to the internal circuit of a single plate and reduces the grounding impedance of the single plate. The component provided by the utility model reduces the welding link and is convenient for subsequent repairing and maintenance; in addition, a connector is saved, the material cost is reduced, layout space is reduced, thereby leading the size of the module to be smaller.

Description

A kind of radome and a kind of assembly
Technical field
The utility model relates to communication technical field, particularly a kind of radome and a kind of assembly.
Background technology
Radome has obtained increasing application as important device in the portable terminal product.The effect one of radome is to prevent that extraneous space radiation and ESD (Electro Static Discharge, static discharges) discharge from producing CPU (Center Process Unit, central processing unit) and disturbing.Another effect of radome is can suppress circuit externally to produce other equipment operate as normal of radiation effect, can also provide good ground connection effect to reduce impedance ground to complete machine.The kind of radome mainly comprises dismountable type radome and integrated shielding cover at present, and the dismountable type radome mainly is made up of mask frame and screening cover.Now, the miniaturization of portable terminal product causes the veneer layout density to strengthen, and needs the part of shielding to increase, and considers the problem of producing maintenance, and prior art mainly adopts the dismountable type radome.But the connection effect of the positive and negative radome of existing dismountable type radome is relatively poor, shield effectiveness is undesirable.
At present, the various functional units of electronic equipment have all been made modular form, a plurality of modules can be assembled on the motherboard according to product form and function needs, thereby form electronic equipment miscellaneous.
Now, module mainly is connected by the mode of welding or connector with motherboard.Specific implementation is: reserve pad on module and motherboard, module is welded direct on the motherboard; Perhaps, on module and motherboard, reserve connector, realize being electrically connected by FPC (Flexible Printed Circuits Board, flexible printed circuit board) or cable.
But welding manner need increase Reflow Soldering, and not easily-disassembled and maintenance is difficult in maintenance.The connector mode need increase connector, has increased veneer area and Material Cost.
Summary of the invention
The utility model embodiment provides a kind of radome, to realize strengthening the effect that is connected of first screening cover and secondary shielding lid, strengthens the shield effectiveness to the internal circuit of veneer; The embodiment of the invention provides a kind of assembly, to reduce the welding link, saves connector, reduces Material Cost, reduces arrangement space.
For achieving the above object, the utility model embodiment provides a kind of radome on the one hand, comprising: first screening cover, secondary shielding lid and intercell connector, described first screening cover is connected by described intercell connector with the secondary shielding lid.
On the other hand, the utility model embodiment provides a kind of assembly, comprise: module and motherboard, described module is fixed on the described motherboard, described module bottom surface has first connector, and described motherboard has second connector, after described module is fixed on the described motherboard, described first connector contacts with second connector, realizes being electrically connected of described module and described motherboard.
Compared with prior art, the utility model embodiment has the following advantages: the radome that the utility model embodiment provides, by intercell connector first screening cover and secondary shielding lid are linked together, strengthened shield effectiveness, and reduced the impedance ground of veneer the internal circuit of veneer.The assembly that the utility model embodiment provides utilizes shell fragment to realize being electrically connected of module and motherboard, has reduced the welding link, make things convenient for follow-up reprocessing and safeguarding, and saved connector, reduced Material Cost, reduced arrangement space, made the size of module can do forr a short time.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the utility model embodiment, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The structure chart of a kind of radome that Fig. 1 provides for the utility model embodiment;
The structure chart of a kind of assembly that Fig. 2 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, the structure chart of a kind of radome that provides for the utility model embodiment, the radome that the utility model embodiment provides is the dismountable type radome, this dismountable type radome comprises first screening cover 11, secondary shielding lid 12 and intercell connector 13.Wherein, first screening cover 11 is positive screening cover, and secondary shielding lid 12 is the screening cover of reverse side; Perhaps, first screening cover 11 is the screening cover of reverse side, and secondary shielding lid 12 is positive screening cover.But the utility model embodiment is the screening cover in front with first screening cover 11, and secondary shielding lid 12 is that example describes for the screening cover of reverse side.
First screening cover 11 and the radome of secondary shielding lid 12 by an integral type of intercell connector 13 formation of increase, and the mask frame of positive and negative is constant.Do like this and original positive and negative non-touching screening cover can be linked together by metallization intercell connector 13, increased the effect of bonding, avoided (PrintedCircuit Board at PCB, printed circuit board (PCB)) the abundant ground connection of the radome that causes owing to design reasons in the design causes radome to float the problem on ground.
Among the utility model embodiment, the number of intercell connector 13 and width can be according to the settings of concrete application scenarios, and the number of intercell connector 13 and the value of width do not influence the realization of the utility model embodiment.
And first screening cover 11 of the utility model embodiment and secondary shielding lid 12 are nearer apart from the edge of veneer, make 13 of intercell connectors need the less curvature of bending can realize being connected of first screening cover 11 and secondary shielding lid 12.
Above-mentioned radome, intercell connector 13 links together first screening cover 11 and secondary shielding lid 12, has strengthened the shield effectiveness to the internal circuit of veneer, and has reduced the impedance ground of veneer.
The utility model embodiment provides a kind of assembly, utilizes shell fragment to realize being electrically connected of module and motherboard, has solved existing welding manner processing and has safeguarded inconvenience, the problem that connector mode cost is high.
As shown in Figure 2, the structure chart of a kind of assembly that provides for the utility model embodiment, comprise module 21 and motherboard 22, module 21 is fixed on the motherboard 22, module 21 bottom surfaces have first connector 211, and motherboard 22 has second connector 221, after module 21 is fixed on the motherboard 22, first connector 211 contacts with second connector 221, realizes being electrically connected of module 21 and motherboard 22.Wherein, the position of first connector 211 can arrange to have very big flexibility according to specific implementation.
Among the utility model embodiment, module 21 is fixed on the motherboard 22 by screw 23.Certainly the utility model embodiment is not limited thereto, and module 21 also can be fixed on the motherboard 22 by the mode of buckle.
First connector 211 among the utility model embodiment can be the pad of reserving, and at this moment second connector 221 is a metal clips; Perhaps, first connector 211 can be metal clips, at this moment the pad of second connector 221 for reserving.
Among the utility model embodiment, when number of pads is many, in order to guarantee to weld the evenness and the contact reliability of back shell fragment, can take all factors into consideration the angularity after veneer is processed, the influence of scolding tin, guarantee contact reliability by the elastic space of controlling metal clips.In addition, shell fragment can also be made the form of a structural member, directly be enclosed within on the module 21.
The utility model embodiment has reduced the welding link, has made things convenient for follow-up reprocessing and safeguarding, and has saved connector, has reduced Material Cost, has reduced arrangement space, makes the size of module can do forr a short time.
It will be appreciated by those skilled in the art that accompanying drawing is the schematic diagram of a preferred embodiment, module in the accompanying drawing or flow process might not be that enforcement the utility model is necessary.
It will be appreciated by those skilled in the art that the module in the device among the embodiment can be distributed in the device of embodiment according to the embodiment description, also can carry out respective change and be arranged in the one or more devices that are different from present embodiment.The module of the foregoing description can be merged into a module, also can further split into a plurality of submodules.
More than disclosed only be several specific embodiment of the present utility model, still, the utility model is not limited thereto, any those skilled in the art can think variation all should fall into protection range of the present utility model.

Claims (5)

1, a kind of radome is characterized in that, comprising: first screening cover, secondary shielding lid and intercell connector, described first screening cover is connected by described intercell connector with the secondary shielding lid.
2, radome according to claim 1 is characterized in that first screening cover is the screening cover in veneer front, and the secondary shielding lid is the screening cover of veneer reverse side; Perhaps, first screening cover is the screening cover of veneer reverse side, and the secondary shielding lid is the screening cover in veneer front.
3, a kind of assembly is characterized in that, comprising: module and motherboard, described module are fixed on the described motherboard,
Described module bottom surface has first connector, and described motherboard has second connector, and after described module was fixed on the described motherboard, described first connector contacted with second connector, realizes being electrically connected of described module and described motherboard.
4, as assembly as described in the claim 3, it is characterized in that, described module by screw on described motherboard; Perhaps, described module is fixed on the described motherboard by the mode of buckle.
5, as assembly as described in the claim 3, it is characterized in that, the pad of described first connector for reserving, second connector is a metal clips; Perhaps, first connector is a metal clips, the pad of second connector for reserving.
CNU2008201397920U 2008-10-27 2008-10-27 Shield cover and component Expired - Lifetime CN201303485Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201397920U CN201303485Y (en) 2008-10-27 2008-10-27 Shield cover and component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201397920U CN201303485Y (en) 2008-10-27 2008-10-27 Shield cover and component

Publications (1)

Publication Number Publication Date
CN201303485Y true CN201303485Y (en) 2009-09-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201397920U Expired - Lifetime CN201303485Y (en) 2008-10-27 2008-10-27 Shield cover and component

Country Status (1)

Country Link
CN (1) CN201303485Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349605A (en) * 2013-08-05 2015-02-11 深圳市共进电子股份有限公司 Printed circuit board and manufacturing method thereof
WO2015032359A1 (en) * 2013-09-09 2015-03-12 华为终端有限公司 Shielding cover and mobile terminal
CN114430611A (en) * 2021-12-17 2022-05-03 苏州浪潮智能科技有限公司 PCB (printed circuit board) and server for isolating crystal oscillator module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349605A (en) * 2013-08-05 2015-02-11 深圳市共进电子股份有限公司 Printed circuit board and manufacturing method thereof
CN104349605B (en) * 2013-08-05 2018-06-05 深圳市共进电子股份有限公司 Printed circuit board and manufacturing methods
WO2015032359A1 (en) * 2013-09-09 2015-03-12 华为终端有限公司 Shielding cover and mobile terminal
CN114430611A (en) * 2021-12-17 2022-05-03 苏州浪潮智能科技有限公司 PCB (printed circuit board) and server for isolating crystal oscillator module

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: HUAWEI DEVICE CO., LTD.

Free format text: FORMER NAME: SHENZHEN HUAWEI TECHNOLOGY CO.

CP01 Change in the name or title of a patent holder

Address after: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No.

Patentee after: Huawei Device Co., Ltd.

Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No.

Patentee before: Shenzhen Huawei Communication Technology Co., Ltd.

TR01 Transfer of patent right

Effective date of registration: 20171109

Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop

Patentee after: HUAWEI terminal (Dongguan) Co., Ltd.

Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No.

Patentee before: Huawei Device Co., Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20090902

CX01 Expiry of patent term