CN109818133B - Terminal device and preparation method of terminal device - Google Patents
Terminal device and preparation method of terminal device Download PDFInfo
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- CN109818133B CN109818133B CN201910078858.2A CN201910078858A CN109818133B CN 109818133 B CN109818133 B CN 109818133B CN 201910078858 A CN201910078858 A CN 201910078858A CN 109818133 B CN109818133 B CN 109818133B
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Abstract
The invention discloses terminal equipment, which comprises a metal middle frame, a mainboard upper cover arranged on the metal middle frame, and a display module and a circuit board which are respectively arranged on two sides of the mainboard upper cover, wherein the circuit board is provided with an antenna elastic sheet, the terminal equipment also comprises a cold-melting metal layer, at least part of the cold-melting metal layer is arranged on the surface of the mainboard upper cover facing the antenna elastic sheet, the cold-melting metal layer is electrically connected with the metal middle frame, and the antenna elastic sheet is in elastic contact with the cold-melting metal layer. The invention also discloses a preparation method of the terminal equipment. The scheme can solve the problem that the coupling capacitance between the metal tongue piece and the display module in the current terminal equipment is large so as to influence the performance of the antenna.
Description
Technical Field
The invention relates to a terminal device and a preparation method of the terminal device.
Background
With the progress of technology, the functions of terminal equipment are more and more powerful, the number of electronic devices assembled in the terminal equipment is more and more, and currently, the terminal equipment is about to advance to the 5G era, the frequency bands of antennas arranged in the terminal equipment are more and more, the number of the antennas is more and more, the increase of the number of the antennas can lead to more and more feeding points of a metal middle frame, and the layout of more and more antenna feeding points in a limited space can face a serious challenge.
At present, a metal middle frame with a plastic break point is used as an antenna radiator, referring to fig. 1, a metal tongue piece 102 is disposed on an inner side of the metal middle frame 101, and the metal tongue piece 102 is in elastic contact with an antenna elastic sheet 104 on a circuit board 103, thereby realizing feed point conduction. In order to improve the conduction performance of the antenna feed point, a gold-plated sheet 105 is welded on one side of the current metal tongue piece 102 facing the circuit board 103, and the gold-plated sheet 105 can increase the conduction area, the wear resistance and the corrosion resistance of the feed point. The gold plate 105 is fixed on the metal tongue 102 by welding, and the gold plate 105 needs to occupy more (usually 6-8) welding points to improve the welding stability, which results in larger areas of the gold plate 105 and the metal tongue 102.
The display module 106 is installed on the metal middle frame 101, a parallel plate capacitor is arranged between the display module 106 and the metal tongue piece 102 with a large area, the overlapping area between the metal tongue piece 102 and the display module 106 is large due to the large area of the metal tongue piece 102, and therefore coupling capacitance is large, and the performance of the antenna is affected. Meanwhile, the main board upper cover 107 is lapped on the metal tongue piece 102 through the step surface, and the distance between the metal tongue piece 102 and the display module 106 is small, so that the coupling capacitance between the metal tongue piece 102 and the display module 106 is further large, and finally the requirement that the capacitance is small in antenna design can not be met.
Disclosure of Invention
The invention discloses a terminal device, which aims to solve the problem that the performance of an antenna is influenced by large coupling capacitance between a metal tongue piece and a display module in the conventional terminal device.
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides a terminal equipment, includes the metal center, sets up mainboard upper cover on the metal center and set up respectively display module assembly and circuit board of mainboard upper cover both sides, the circuit board is provided with the antenna shell fragment, terminal equipment still includes cold-melting metal layer, cold-melting metal layer at least part sets up mainboard upper cover orientation on the face of antenna shell fragment, cold-melting metal layer with the metal center electricity is connected, the antenna shell fragment with cold-melting metal layer elastic contact.
A preparation method of terminal equipment comprises the following steps:
fixing a main board upper cover on the metal middle frame, wherein two sides of the main board upper cover are respectively used for mounting a display module and a circuit board;
arranging a cover layer, wherein the cover layer comprises a first area and a second area which are mutually connected, the first area is arranged on the surface of the upper cover of the mainboard, which faces the circuit board, and the second area is arranged on the inner wall of the metal middle frame;
removing part of the covering layer of the connecting area of the metal middle frame and the upper cover of the main board;
forming a cold-melting metal layer in a cold-melting spraying mode in the area where part of the covering layer is removed;
and mounting the circuit board so that the antenna elastic sheet on the circuit board is in elastic contact with the cold-melting metal layer on the area of the mainboard upper cover.
The technical scheme adopted by the invention can achieve the following beneficial effects:
according to the terminal equipment disclosed by the invention, the cold-melting metal layer is formed by adopting a cold-melting technology, the cold-melting metal layer can realize the electric conduction between the antenna elastic sheet on the circuit board and the metal middle frame, and compared with the method of welding the gold-plated sheet by adopting welding spots, the cold-melting metal layer does not have the problem that the welding spots occupy a large area, so that the occupied area can be reduced on the premise that the cold-melting metal layer is ensured to be effectively conducted with the antenna elastic sheet, the coupling capacitance between the cold-melting metal layer and the display module can be finally reduced, and the influence on the terminal equipment antenna can be further reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of a partial structure of a terminal device disclosed in the prior art;
fig. 2 is a schematic view of a partial structure of a terminal device disclosed in the embodiment of the present invention;
fig. 3 is a schematic flow chart of a method for manufacturing a terminal device according to an embodiment of the present invention.
Description of reference numerals:
101-a metal middle frame, 102-a metal tongue piece, 103-a circuit board, 104-an antenna elastic piece, 105-a gold plated piece, 106-a display module and 107-a main board upper cover;
100-metal middle frame, 200-mainboard upper cover, 300-display module, 400-circuit board, 500-antenna spring, 600-cold-melting metal layer, 610-first area, 620-second area and 700-battery cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 2, an embodiment of the present invention discloses a terminal device, which includes a metal middle frame 100, a motherboard upper cover 200, a display module 300, a circuit board 400, an antenna dome 500, and a cold-melting metal layer 600.
The metal middle frame 100 is a part of a housing of the terminal device, and the housing may further include a battery cover 700, wherein the battery cover 700 is connected to the metal middle frame 100 to form an inner cavity of the terminal device. The battery cover 700 may be a metal battery cover or a glass battery cover, and the specific type of the battery cover 700 is not limited in this embodiment. In this embodiment, the metal middle frame 100 is made of a metal material, and usually, the metal middle frame 100 may be an aluminum middle frame.
The main board top cover 200 is disposed on the metal middle frame 100, and generally, the main board top cover 200 is fixedly connected to the metal middle frame 100, and specifically, the main board top cover 200 may be fixed to the metal middle frame 100 by bonding, welding, or the like. The display module 300 and the circuit board 400 are respectively disposed on both sides of the main board upper cover 200, and the circuit board 400 is disposed in the inner cavity described above. Specifically, the ports at the two ends of the metal middle frame 100 are provided with overlapping surfaces, and the display module 300 and the battery cover 700 can be respectively fixed on the metal middle frame 100 by adhesive bonding.
The antenna dome 500 is disposed on the circuit board 400, and specifically, the antenna dome 500 may be fixed on the circuit board 400 through a mounting process.
The cold-melting metal layer 600 is at least partially arranged on the surface of the main board upper cover 200 facing the antenna spring piece 500, the cold-melting metal layer 600 is formed through a cold-melting process, the cold-melting metal layer 600 is electrically connected with the metal middle frame 100, the antenna spring piece 500 is in elastic contact with the cold-melting metal layer 600, electric connection is further achieved, and finally feed point conduction of the metal middle frame 100 is achieved.
In this embodiment, the cold-fusion metal layer 600 is formed by a cold-fusion process, which is a well-known processing process. The cold-melting process is a technology that after solid metal is melted, compressed air is used for being arranged on the surface of an object at a high speed, so that a metal coating is formed on the surface of the object to cover the surface of the object. The cold-sprayed metal layer 600 formed by the cold-spraying process can achieve electrical conduction.
The cold-fuse metal layer 600 and the display module 300 are similar to a parallel plate capacitor, and the capacitance of the parallel plate capacitor is determined by the following formula:
wherein 4 pi K is a constant (the value is fixed), the capacitance is determined by three variables of dielectric constant epsilon, the coincidence area S of the two parallel plates and the distance d between the two parallel plates, and the larger the values of epsilon and S are, the larger the capacitance is; the smaller the values of epsilon and S are, the smaller the capacitance is; from the perspective of antenna design, if the capacitance C between two parallel plates is small, then epsilon and S need to be as small as possible, and d needs to be as large as possible.
In the terminal device disclosed in the embodiment of the present invention, the cold-melting metal layer 600 is formed by using a cold-melting technology, and the cold-melting metal layer 600 can realize electrical conduction between the antenna elastic sheet 104 on the circuit board 400 and the metal middle frame 101, and compared with a method of welding a gold-plated sheet by using a welding spot, the cold-melting metal layer 600 does not have a problem that the welding spot occupies a large area, so that the cold-melting metal layer 600 can reduce an occupied area on the premise of ensuring effective conduction with the antenna elastic sheet 104, and further can reduce a superposition area between the cold-melting metal layer 600 and the display module 300, which is equivalent to a superposition area of two parallel plates, and finally can reduce a coupling capacitance with the display module, and further can reduce an influence on an antenna of the terminal device.
Specifically, in this embodiment, the cold-fusion metal layer 600 may be a metal layer such as a copper layer, a zinc layer, or a nickel layer, and the specific material of the cold-fusion metal layer 600 is not limited in the implementation of the present invention. In this embodiment, the main board top cover 200 may be made of a non-metal material, and in a specific implementation, the main board top cover 200 may be made of a plastic material.
Referring again to fig. 2, in a more preferred embodiment, the cold-melt metal layer 600 may include a first region 610 and a second region 620, and the first region 610 is connected to the second region 620. The first region 610 is arranged on the surface of the main board upper cover 200 facing the antenna elastic sheet 500, and the second region 620 is arranged on the inner wall of the metal middle frame 100, in the structure, the cold-melting metal layer 600 extends from the main board upper cover 200 to the inner wall of the metal middle frame 100, so that the feed conduction stability can be improved.
Referring to fig. 2 again, in the terminal apparatus disclosed in the present embodiment, the motherboard upper cover 200 is a flat plate-shaped structure, and compared to the distance D between the motherboard upper cover and the metal tongue in fig. 1, in the present embodiment, the surface of the motherboard upper cover 200 facing the circuit board 103 may be a plane, so that the distance D between the formed cold-melting metal layer 600 and the display module 300 is larger, as can be known from the principle of parallel plate capacitance, which can further reduce the coupling capacitance between the display module 300 and the cold-melting metal layer 600.
The terminal device disclosed by the embodiment of the invention can be a mobile phone, a tablet computer, an electronic book reader, a game machine and other terminal devices, and the embodiment of the invention does not limit the specific types of the terminal devices.
Based on the terminal device disclosed in the embodiment of the present invention, the embodiment of the present invention discloses a method for manufacturing a terminal device, please refer to fig. 2 to fig. 3, the disclosed method includes:
and S101, fixing the main board upper cover 200 on the metal middle frame 100.
In this embodiment, the two sides of the motherboard upper cover 200 are respectively used for installing the display module 300 and the circuit board 400, and the circuit board 400 is provided with the antenna spring 500.
S102, arranging a covering layer.
The purpose of this step is to provide a cover layer on the metal middle frame 100 and the motherboard upper cover 200, and the cover layer plays a role of protection. It should be noted that the masking layer provided in this step is a protective layer that can be removed, and the masking layer only plays a role of temporary protection, so as to prevent a cold-fusible metal layer from being formed in a region where the cold-fusible metal layer does not need to be provided in a subsequent step. Of course, the covering layer may be an ink layer, and of course, the covering layer may also be made of other materials, and is not limited to the ink layer. The cover layer includes a first region and a second region connected to each other, the first region is disposed on the surface of the motherboard upper cover 200 facing the circuit board 400, and the second region is disposed on the inner wall of the metal middle frame 100
S103, removing part of the covering layer of the connecting area on the metal middle frame 100 and the mainboard upper cover 200.
In this step, a part of the covering layer is removed, so that corresponding parts on the metal middle frame 100 and the main board upper cover 200 are exposed, and preparation is further made for forming a cold-melting metal layer subsequently.
And S104, forming a cold-melting metal layer 600 in a cold-melting spraying mode in the area where the partial covering layer is removed.
In step S103, a laser etching process may be used to remove a portion of the masking layer on the metal middle frame 100 and the motherboard upper cover 200. Of course, other ways to remove part of the covering layer may also be adopted, and this embodiment is not limited to this.
S105, the circuit board 400 is mounted such that the antenna dome 500 on the circuit board 400 is elastically contacted on the area of the cold-melt metal layer 600 on the motherboard upper cover 200.
Of course, the step S104 may further include: and removing the residual covering layer on the metal middle frame and the main board upper cover. In general, the covering layer is a film layer which can be torn by hand, in this step, the remaining covering layer can be torn off by hand, and then the residual part can be ultrasonically cleaned.
In order to improve the bonding force, it is preferable that before forming the cold-fusion metal layer 600, the method further includes: the areas of the metal middle frame 100 and the main board upper cover 200 where part of the covering layers are removed are subjected to surface roughening treatment, so that the surface roughness of the areas is improved, and the combination of the cold-melting metal layer 600 formed subsequently is firmer. Specifically, in this embodiment, a laser etching process may be used to perform surface roughening treatment on the areas of the partial masking layers on the metal middle frame 100 and the motherboard upper cover 200.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. The terminal equipment is characterized by comprising a battery cover, a metal middle frame, a mainboard upper cover arranged on the metal middle frame, and a display module and a circuit board which are arranged on two sides of the mainboard upper cover respectively, wherein the battery cover is connected with the metal middle frame to further form an inner cavity of the terminal equipment, the circuit board is arranged in the inner cavity, the circuit board is provided with an antenna elastic sheet, the terminal equipment further comprises a cold-melting metal layer, at least part of the cold-melting metal layer is arranged on the surface of the mainboard upper cover facing the antenna elastic sheet, the cold-melting metal layer is electrically connected with the metal middle frame, and the antenna elastic sheet is in elastic contact with the cold-melting metal layer.
2. The terminal device according to claim 1, wherein the cold-melting metal layer comprises a first area and a second area, the first area is connected with the second area, the first area is arranged on a plate surface of the main board upper cover facing the antenna dome, and the second area is arranged on an inner wall of the metal middle frame.
3. The terminal device of claim 1, wherein the motherboard cover is made of a non-metallic material.
4. The terminal device of claim 1, wherein the cold-sprayed metal layer is a copper layer, a zinc layer, or a nickel layer.
5. The terminal device according to any of claims 1-4, wherein the terminal device is a mobile phone, a tablet computer, an e-book reader or a game console.
6. A preparation method of terminal equipment is characterized by comprising the following steps:
connecting the battery cover with the metal middle frame to form an inner cavity of the terminal equipment,
fixing a main board upper cover on the metal middle frame, wherein the two sides of the main board upper cover are respectively used for mounting a display module and a circuit board, and the circuit board is positioned in the inner cavity;
arranging a cover layer, wherein the cover layer comprises a first area and a second area which are mutually connected, the first area is arranged on the surface of the upper cover of the mainboard, which faces the circuit board, and the second area is arranged on the inner wall of the metal middle frame;
removing part of the covering layer of the connecting area of the metal middle frame and the upper cover of the main board;
forming a cold-melting metal layer in a cold-melting spraying mode in the area where part of the covering layer is removed;
and mounting the circuit board so that the antenna elastic sheet on the circuit board is in elastic contact with the cold-melting metal layer on the area of the mainboard upper cover.
7. The method of claim 6, further comprising, prior to forming the cold-shot metal layer:
and carrying out surface roughening treatment on the metal middle frame and the area of the main board upper cover where part of the covering layer is removed.
8. The method according to claim 7, wherein the surface roughening treatment of the metal middle frame and the area of the main board upper cover where the partial covering layer is removed comprises:
and performing surface roughening treatment on the metal middle frame and the area of the partial covering layer of the upper cover area of the mainboard by adopting a laser etching process.
9. The method of claim 6, wherein removing the metal bezel and the cover-over-motherboard portion of the cover layer comprises:
and removing the metal middle frame and part of the covering layer on the upper cover of the mainboard by adopting a laser etching process.
10. The method of claim 6, further comprising, after the step of forming the cold-melt metal layer by cold-melt spraying in the area where the portion of the masking layer is removed, the step of:
and removing the residual covering layer on the metal middle frame and the main board upper cover.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910078858.2A CN109818133B (en) | 2019-01-28 | 2019-01-28 | Terminal device and preparation method of terminal device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910078858.2A CN109818133B (en) | 2019-01-28 | 2019-01-28 | Terminal device and preparation method of terminal device |
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| CN109818133A CN109818133A (en) | 2019-05-28 |
| CN109818133B true CN109818133B (en) | 2022-02-08 |
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| CN201910078858.2A Active CN109818133B (en) | 2019-01-28 | 2019-01-28 | Terminal device and preparation method of terminal device |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129709B (en) * | 2019-12-20 | 2022-03-29 | 华为技术有限公司 | Middle frame assembly, preparation method of middle frame assembly and electronic equipment |
| CN113725593A (en) * | 2020-05-26 | 2021-11-30 | 中兴通讯股份有限公司 | Terminal device and antenna manufacturing method of terminal device |
| CN113054427B (en) * | 2021-03-10 | 2023-03-10 | 维沃移动通信有限公司 | Electronic device |
| CN113829011A (en) * | 2021-09-27 | 2021-12-24 | 惠州Tcl移动通信有限公司 | Middle frame processing method, middle frame and mobile terminal |
| CN115036717B (en) * | 2022-08-10 | 2023-01-10 | 荣耀终端有限公司 | Electric connection unit, manufacturing method and electronic equipment |
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| CN105098352A (en) * | 2015-07-31 | 2015-11-25 | 瑞声精密制造科技(常州)有限公司 | Mobile terminal |
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| CN206789694U (en) * | 2017-05-12 | 2017-12-22 | 上海德门电子科技有限公司 | A kind of PDS antenna cablings structure |
| CN207038726U (en) * | 2017-07-28 | 2018-02-23 | 维沃移动通信有限公司 | A kind of mobile terminal |
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| CN201663229U (en) * | 2010-03-19 | 2010-12-01 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal antenna |
| CN106163163A (en) * | 2015-03-31 | 2016-11-23 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
| CN207038738U (en) * | 2017-07-31 | 2018-02-23 | 维沃移动通信有限公司 | A kind of connection sheet, antenna attachment structure and mobile terminal |
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Effective date of registration: 20210304 Address after: No.168 Jinghai East Road, Chang'an Town, Dongguan City, Guangdong Province Applicant after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: No. 281, Bubugao Avenue, Wusha, Chang'an Town, Dongguan City, Guangdong Province, 523000 Applicant before: VIVO COMMUNICATION TECHNOLOGY Co.,Ltd. |
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