CN112952414B - Electronic device - Google Patents
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- CN112952414B CN112952414B CN202110107744.3A CN202110107744A CN112952414B CN 112952414 B CN112952414 B CN 112952414B CN 202110107744 A CN202110107744 A CN 202110107744A CN 112952414 B CN112952414 B CN 112952414B
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- circuit board
- socket
- electrical connection
- electronic device
- bending section
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Abstract
The application discloses electronic equipment, which belongs to the technical field of communication equipment and comprises a frame, a first circuit board and a socket assembly; the frame is provided with a socket accommodating space; the first circuit board is provided with a first electric connection part; the socket assembly comprises a second circuit board and an electric connection elastic sheet arranged on the second circuit board, wherein part of the second circuit board and the electric connection elastic sheet are both positioned in the socket accommodating space, the part of the second circuit board, which is positioned outside the socket accommodating space, is provided with a second electric connection part, and the first circuit board and the second circuit board are electrically connected through the first electric connection part and the second electric connection part. The problem that the occupied space of the socket assembly for the circuit board is large can be solved by the scheme.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.
Background
With the rapid development of electronic devices, the electronic devices are more and more widely used, and electronic devices such as mobile phones and tablet computers play more and more roles in the aspects of work, life, entertainment and the like of people.
In the related art, a socket assembly, such as a charging socket assembly or an earphone socket assembly, is provided in an electronic device. The socket assembly comprises a metal terminal and a plastic main body, the metal terminal is arranged on the plastic main body, then the socket assembly is pasted on the circuit board, and the metal terminal is electrically connected with the circuit board, so that the socket assembly and the circuit board are assembled. The circuit board may be a main board or a sub-board of the electronic device.
In the process of implementing the invention, the inventor finds that in the related art, the socket component is attached to the circuit board, so that the circuit board needs to reserve the attaching space of the socket component, and the occupied space of the circuit board is large.
Disclosure of Invention
An object of the embodiment of the application is to provide an electronic device, which can solve the problem that the occupied space of a socket assembly on a circuit board is large.
In order to solve the technical problem, the present application is implemented as follows:
an embodiment of the present application provides an electronic device, including:
the socket comprises a frame, a socket body and a socket body, wherein the frame is provided with a socket accommodating space;
a first circuit board having a first electrical connection;
the socket assembly comprises a second circuit board and an electric connection elastic sheet arranged on the second circuit board, wherein part of the second circuit board and the electric connection elastic sheet are both positioned in the socket accommodating space, the part of the second circuit board, which is positioned outside the socket accommodating space, is provided with a second electric connection part, and the first circuit board and the second circuit board are electrically connected through the first electric connection part and the second electric connection part.
In this application embodiment, socket accommodation space has been seted up to the frame, some second circuit board and electric connection shell fragment all are located socket accommodation space, socket component equipment is on the frame this moment, thereby make socket component need not additionally to set up the plastic main part and assemble socket component, and then make socket component need not the paster and carry out fixed mounting in first circuit board, first circuit board is connected with the second circuit board electricity through first electric connecting portion and second electric connecting portion, consequently first circuit board only need reserve the electric connection position with the second circuit board, the whole paster space that need not to reserve socket component, thereby make socket component less to the occupation space of first circuit board.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application;
fig. 2 to 5 are schematic exploded views of an electronic device disclosed in an embodiment of the present application;
FIG. 6 is a top view of an electronic device disclosed in an embodiment of the present application;
fig. 7 to 9 are schematic views of parts of a socket assembly of an electronic device according to an embodiment of the disclosure;
fig. 10 is a sectional view of an electronic device according to an embodiment of the present disclosure when a first circuit board and a second circuit board are connected;
fig. 11 is a schematic structural diagram of a first circuit board of an electronic device disclosed in an embodiment of the present application.
Description of reference numerals:
100-frame, 110-socket accommodating space, 120-first avoiding hole, 130-bulge part,
200-socket assembly, 210-second circuit board, 211-second electric connection part, 212-substrate, 2121-second avoidance hole, 213-wiring layer, 214-electric connection elastic sheet, 215-first bending section, 216-second bending section, 220-reinforcing plate, 230-first clamping part, 212-first clamping part,
300-a first circuit board, 310-a first electric connection part, 311-a clamping space, 320-an avoiding notch,
400-cover plate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The electronic device provided in the embodiments of the present application is described in detail with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1 to 11, an embodiment of the present application discloses an electronic device, which includes a housing, a first circuit board 300, and a socket assembly 200.
The casing provides installation space for other component parts of electronic equipment, and the casing includes frame 100 and back lid, and frame 100 encircles the marginal setting of back lid. The bezel 100 is formed with a socket receiving space 110. Alternatively, the socket receiving space 110 may be a receiving groove or a receiving hole, and the specific structure of the socket receiving space 110 is not limited herein.
The first circuit board 300 has a first electrical connection portion 310, and the first circuit board 300 may be a main board of an electronic device or a sub-board of the electronic device. In the electronic device disclosed in the present application, the first circuit board 300 may be a rigid circuit board or a flexible circuit board. Alternatively, the first circuit board 300 may be a printed circuit board, or may be a rigid-flex board. Of course, other structures can be adopted, and the structure is not limited in the text.
The socket assembly 200 includes a second circuit board 210 and an electrical connection spring 214 disposed on the second circuit board 210, wherein a portion of the second circuit board 210 and the electrical connection spring 214 are both located in the socket receiving space 110, a portion of the second circuit board 210 located outside the socket receiving space 110 has a second electrical connection portion 211, and the first circuit board 300 and the second circuit board 210 are electrically connected through the first electrical connection portion 310 and the second electrical connection portion 211. Optionally, the socket assembly 200 may include at least one of the earphone socket assembly 200 and the charging socket assembly 200.
The second circuit board 210 may be a rigid circuit board or a flexible circuit board. Alternatively, the first circuit board 300 may be a printed circuit board, or may be a rigid-flex board. Of course, other configurations may be used, and are not limited herein.
In a specific operation process, a plug is inserted into the socket accommodating space 110 from the opening of the socket accommodating space 110, the plug contacts and is electrically connected with the electrical connection elastic sheet 214, and the plug is electrically connected with the first circuit board 300 through the electrical connection elastic sheet 214 and the second circuit board 210, so that electrical connection with the electronic device is realized. It should be noted that the opening of the socket receiving space 110 is exposed to the outer surface of the frame 100.
Optionally, the first electrical connection portion 310 and the second electrical connection portion 211 may be an electrical connection structure such as a metal contact, a gold finger, a solder pad, a metal spring, or a board-to-board connector, and of course, the first electrical connection portion 310 and the second electrical connection portion 211 may also be other electrical connection structures, which is not limited herein. The electrical connection spring 214 may be made of a metal conductive material, such as copper, aluminum, silver, and other metal materials.
In the electronic device disclosed in the present application, socket receiving space 110 has been seted up on frame 100, part second circuit board 210 and electric connection shell fragment 214 all are located socket receiving space 110, socket assembly 200 assembles on frame 100 this moment, thereby make socket assembly 200 need not additionally to set up the plastic main part and assemble socket assembly 200, and then make socket assembly 200 need not the paster to carry out fixed mounting in first circuit board 300, first circuit board 300 is connected with second circuit board 210 electricity through first electric connection portion 310 and second electric connection portion 211, consequently first circuit board 300 only need reserve the electric connection position with second circuit board 210, the whole paster space with socket assembly 200 need not to be reserved, thereby make socket assembly 200 less to the occupation space of first circuit board 300.
In addition, the socket assembly 200 does not need to be additionally provided with a plastic body, so that the structure of the socket assembly 200 is simple, and the manufacturing cost of the electronic device can be reduced.
In addition, the metal terminals in the socket assembly 200 are replaced by the electrical connection elastic pieces 214, and since the structure of the metal terminals is complex, and meanwhile, since the installation positions of the metal terminals are different, the structure of each metal terminal is different, a plurality of sets of processing molds for the metal terminals are required, and thus the manufacturing cost of the socket assembly 200 is increased. In the present application, the electrical connection elastic sheet 214 is a metal sheet, and the shape thereof is the same, so the electrical connection elastic sheet 214 can be processed by stamping or bending, and a processing mold does not need to be designed separately, thereby reducing the manufacturing cost of the socket assembly 200 and facilitating the manufacturing cost of the electronic device to be reduced.
Optionally, the number of the electrical connection elastic pieces 214 may be multiple, so as to improve the data transmission performance of the socket assembly 200 and the plug.
In order to facilitate the installation of the socket assembly 200, in another alternative embodiment, the frame 100 may be formed with a first avoiding hole 120, and the first avoiding hole 120 is communicated with the socket receiving space 110. A portion of the second circuit board 210 and the electrical connection spring 214 may be mounted in the socket receiving space 110 through the first avoiding hole 120. In this scheme, when the socket assembly 200 is assembled, a portion of the second circuit board 210 and the electrically connecting elastic sheet 214 can be directly assembled in the socket accommodating space 110 through the first avoiding hole 120, so that the assembling difficulty of the socket assembly 200 is reduced, and the socket assembly 200 is further more simple and convenient to assemble.
Optionally, in the axial direction of the first avoidance hole 120, a part of the second circuit board 210 and the electrical connection elastic piece 214 form a contour shape similar to the contour of the first avoidance hole 120. That is, the shape of the socket assembly 200 can match the contours of the second circuit board 210 and the electrical connection spring 214 in the assembling direction, so that the socket assembly 200 is not easy to interfere with each other during assembling.
In the above embodiment, the first avoiding hole 120 is exposed, and dust and moisture in the environment can easily enter the socket accommodating space 110 through the first avoiding hole 120, so that poor contact between the electrical connection elastic piece 214 and the plug can be easily caused. Based on this, in another alternative embodiment, the electronic device disclosed in the present application may further include a cover plate 400, the cover plate 400 may cover the second circuit board 210, and the cover plate 400 is connected to the bezel 100. In this scheme, the cover plate 400 covers the first avoiding hole 120 while covering the second circuit board 210, so that dust and moisture in the environment can be relieved and the phenomenon of poor contact between the electrical connection elastic sheet 214 and the plug can be prevented.
In addition, the cover plate 400 covers the second circuit board 210, so that the second circuit board 210 and the electrical connection elastic sheet 214 can be protected, the second circuit board 210 and the electrical connection elastic sheet 214 are prevented from being collided in the assembling process, and the safety of the electronic device is improved.
The present application discloses a specific structure of the second circuit board 210, but other structures are also possible, and the present application is not limited thereto. Specifically, the second circuit board 210 may include a substrate 212 and a routing layer 213, the substrate 212 being used for carrying the circuit structure of the second circuit board 210. The wiring layer 213 can be disposed on the substrate 212, the wiring layer 213 is disposed with an electrical connection spring 214, and the electrical connection spring 214 is electrically connected to the second electrical connection portion 211 through the wiring layer 213. In this embodiment, the second circuit board 210 has a simple structure, and the manufacturing cost of the socket assembly 200 is further reduced.
Optionally, a bonding pad may be disposed on the routing layer 213, and the electrical connection spring 214 may be soldered on the routing layer 213 through the bonding pad. Of course, the electrical connection spring 214 and the wiring layer 213 may be connected by other methods, which is not limited herein.
In the above embodiment, when the electrical connection elastic piece 214 is engaged with a plug, when the pressure of the plug on the electrical connection elastic piece 214 is too large, the electrical connection elastic piece 214 is easily pressed against the substrate 212, and the electrical connection elastic piece 214 is easily deformed excessively, thereby damaging the electrical connection elastic piece 214. Accordingly, in another alternative embodiment, the substrate 212 may be formed with a second avoiding hole 2121, and the electrical connection elastic piece 214 is opposite to the second avoiding hole 2121. In this embodiment, when the stress on the electrical connection elastic piece 214 is large, the electrical connection elastic piece 214 can enter the second avoiding hole 2121, so that the electrical connection elastic piece 214 is not in contact with the substrate 212, and the electrical connection elastic piece 214 is not easily damaged.
In addition, when the electrical connection spring 214 is pressed against the substrate 212, the substrate 212 applies an opposite force to the electrical connection spring 214, and the force acts on the plug, which makes the plug difficult to plug. In the present application, when the electrical connection elastic sheet 214 is greatly deformed, the electrical connection elastic sheet can enter the second avoiding hole 2121, so that the substrate 212 does not apply an acting force to the electrical connection elastic sheet 214, and the plug can be easily plugged.
In the above embodiment, when the routing layer 213 covers the entire substrate 212, the second avoiding hole 2121 also penetrates through the routing layer 213.
The electrical connection elastic piece 214 can be soldered on the wiring layer 213 through a solder pad, but the process is complicated and difficult. In order to reduce the manufacturing difficulty of the socket assembly 200, in another alternative embodiment, the electrical connection spring 214 and the wiring layer 213 are an integrated stamped structural member. At this time, the electrical connection elastic sheet 214 can be punched out on the wiring layer 213 by directly using a punching process, and this structure has a simple processing process, few processes and less difficulty. In addition, the electrical connection elastic piece 214 and the wiring layer 213 are an integrated stamping structure, which also improves the connection strength between the electrical connection elastic piece 214 and the wiring layer 213, thereby effectively preventing the electrical connection elastic piece 214 and the wiring layer 213 from being broken at the connection position.
In the above embodiment, the electrical connection resilient pieces 214 may be disposed on the same side of the socket receiving space 110, and the installation distance between two adjacent electrical connection resilient pieces 214 is smaller, so that the two adjacent electrical connection resilient pieces 214 are easily interfered.
Based on this, in another alternative embodiment, the second circuit board 210 may include a first bending section 215 and a second bending section 216, the first bending section 215 and the second bending section 216 may be perpendicular, and each of the first bending section 215 and the second bending section 216 is composed of the substrate 212 and the routing layer 213 in the above.
The first bending section 215 may be located in the socket receiving space 110, the second bending section 216 may be located outside the socket receiving space 110, a portion of the second bending section 216 may be attached to a surface of the bezel 100, and the second bending section 216 may be provided with the second electrical connection portion 211. In this scheme, the electrical connection elastic pieces 214 may be distributed on the first bending section and the second bending section 216, so that the electrical connection elastic pieces 214 are distributed on two adjacent sides of the socket receiving space 110, and therefore, two electrical connection elastic pieces 214 on the same side have a larger installation distance, and interference of the electrical connection elastic pieces 214 is not easily caused.
In addition, the second circuit board 210 is divided into two board sections, so that the area of the second circuit board 210 is increased, more electric connection elastic pieces 214 can be arranged on the second circuit board 210, and the electric connection performance between the socket assembly 200 and the plug is improved.
In the above embodiment, in order to provide the socket receiving space 110 on the frame 100, the thickness of the frame 100 needs to be set to be larger, so that the weight of the electronic device is increased, and the electronic device is inconvenient to carry. In another alternative embodiment, the bezel 100 may be provided with a boss 130, and the socket receiving space 110 is opened at the boss 130. In this scheme, the protruding portion 130 is disposed on the frame 100, that is, the local thickness of the frame 100 is increased, and the thickness of other areas on the frame 100 is smaller, so that the overall weight of the frame 100 is smaller, the weight of the electronic device is smaller, and the electronic device is convenient to carry.
In order to reduce the thickness of the electronic device, in another alternative embodiment, the first circuit board 300 may be provided with a avoiding notch 320, and at least a part of the protruding portion 130 may be located in the avoiding notch 320. In this scheme, the stacking thickness of the first circuit board 300 and the frame 100 is reduced, so as to further reduce the thickness of the electronic device, and further improve the user experience. Optionally, the avoiding notch 320 of the first circuit board 300 may be manufactured by using a stamping process, a laser cutting process, or other processes, which is not limited herein.
In another alternative embodiment, the socket assembly 200 may further include a stiffener 220, and the stiffener 220 is attached to the second circuit board 210. In this embodiment, the reinforcing plate 220 can increase the strength of the second circuit board 210, so that the second circuit board 210 can be prevented from being broken, and the safety and reliability of the socket assembly 200 can be improved.
Alternatively, the reinforcing plate 220 may be adhered to the second circuit board 210, for example, the reinforcing plate 220 and the second circuit board 210 are adhered by a double-sided tape, meanwhile, the reinforcing plate 220 may be a steel sheet with a thickness of 0.25 mm, or a reinforcing plate 220 with other thickness and other materials may be adopted.
In the above embodiment, the second circuit board 210 may be attached to the sidewall of the socket receiving space 110 by using a double-sided adhesive tape, however, heat is easily generated in the electronic device, so that the double-sided adhesive tape is easily aged, and thus the second circuit board 210 is easily separated from the receiving space, which results in lower reliability and safety of the electronic device.
Based on this, in another alternative embodiment, the second circuit board 210 may be provided with a first clamping portion 230, and a second clamping portion may be provided in the socket receiving space 110, and the first clamping portion 230 is clamped and matched with the second clamping portion. In this scheme, first joint portion 230 and second joint portion are the spacing cooperation structure of machinery, and consequently electronic equipment's the joint that generates heat can not cause the influence to first joint portion 230 and second joint portion to make first joint portion 230 and second joint portion be difficult to separate, and then make second circuit board 210 be difficult to break away from in following socket accommodation space 110, and then improved electronic equipment's reliability and security.
Alternatively, the first clip portion 230 may be a protruding point disposed on the second circuit board 210, and the second clip portion may be a groove disposed on a sidewall of the socket receiving space 110, and the protruding point may be located in the groove. Of course, the first clip portion 230 and the second clip portion may have other structures, and the present disclosure is not limited thereto.
In the above embodiment, the first electrical connection portion 310 and the second electrical connection portion 211 can be connected by soldering, and in such a structure, when the first circuit board 300 and the second circuit board 210 are detached, the solder between the first electrical connection portion 310 and the second electrical connection portion 211 needs to be broken, which easily damages the first circuit board 300 and the second circuit board 210 and also facilitates the mounting and detaching of the socket assembly 200.
Based on this, in another optional embodiment, the first electrical connection portion 310 is provided with a clamping space 311, the second electrical connection portion 211 and a portion of the second circuit board 210 extend into the clamping space 311, and the first electrical connection portion 310 is in clamping fit with the second circuit board 210. In this embodiment, when the first circuit board 300 and the second circuit board 210 are detached, a portion of the second circuit board 210 can be pulled out from the clamping space 311, so that the first electrical connection portion 310 and the second electrical connection portion 211 are not damaged, and the first circuit board 300 and the second circuit board 210 are not easily damaged. In addition, when the first circuit board 300 and the second circuit board 210 are assembled, a part of the second circuit board 210 is directly inserted into the clamping space 311; when the first circuit board 300 and the second circuit board 210 are detached, the portion of the second circuit board 210 inserted into the clamping space 311 is directly pulled out. This type of mounting is simple, which further facilitates the mounting and dismounting of the receptacle assembly 200.
Optionally, the first electrical connection portion 310 may include a first clamping plate and a second clamping plate that are disposed opposite to each other, a clamping space 311 is formed between the first clamping plate and the second clamping plate, the first clamping plate is disposed on the first circuit board 300, and an electrical connection structure is disposed on the first clamping plate, and the electrical connection structure may be a metal contact, a gold finger, a metal spring, or the like, or the first clamping plate may be a board-to-board connector as a whole. The second clamping plate is provided with a jacking protrusion, and the jacking protrusion abuts against the second circuit board 210, so that the second circuit board 210 is prevented from sliding out of the clamping space 311.
The electronic equipment disclosed by the embodiment of the application can be equipment such as an intelligent watch, an intelligent bracelet and a tablet computer, and the embodiment of the application does not limit the specific type of the electronic equipment.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. An electronic device, comprising:
the socket comprises a frame, a socket body and a socket body, wherein the frame is provided with a socket accommodating space;
a first circuit board having a first electrical connection;
the socket assembly comprises a second circuit board and an electric connection elastic sheet arranged on the second circuit board, wherein part of the second circuit board and the electric connection elastic sheet are both positioned in the socket accommodating space, the part of the second circuit board, which is positioned outside the socket accommodating space, is provided with a second electric connection part, and the first circuit board and the second circuit board are electrically connected through the first electric connection part and the second electric connection part;
the second circuit board comprises a first bending section and a second bending section, the first bending section is perpendicular to the second bending section, the first bending section is located in the socket accommodating space, the second bending section is located outside the socket accommodating space, part of the second bending section is attached to the surface of the frame, the second bending section is provided with the second electric connection portion, and the first bending section and the second bending section are respectively provided with the electric connection elastic pieces.
2. The electronic device of claim 1, wherein the frame defines a first avoiding hole, the first avoiding hole is communicated with the socket receiving space, and a portion of the second circuit board and the electrical connection elastic sheet are mounted in the socket receiving space through the first avoiding hole.
3. The electronic device of claim 2, further comprising a cover plate covering the second circuit board, wherein the cover plate is connected to the bezel.
4. The electronic device of claim 1, wherein the second circuit board comprises a substrate and a routing layer, the routing layer is disposed on the substrate, the routing layer is disposed with the electrical connection spring, and the electrical connection spring is electrically connected to the second electrical connection portion through the routing layer.
5. The electronic device of claim 4, wherein the substrate defines a second avoiding hole, and the electrically connecting resilient plate is opposite to the second avoiding hole.
6. The electronic device of claim 5, wherein the electrical connection spring and the routing layer are an integral stamped component.
7. The electronic device of claim 1, wherein the bezel is provided with a protrusion, and the socket receiving space is opened in the protrusion.
8. The electronic device of claim 7, wherein the first circuit board defines an avoidance gap, and at least a portion of the protruding portion is located in the avoidance gap.
9. The electronic device of claim 1, wherein the socket assembly further comprises a stiffener, and the stiffener is attached to the second circuit board.
10. The electronic device of claim 1, wherein the second circuit board is provided with a first clamping portion, and a second clamping portion is arranged in the socket accommodating space, and the first clamping portion is in clamping fit with the second clamping portion.
11. The electronic device of claim 1, wherein the first electrical connection portion defines a clamping space, the second electrical connection portion and a portion of the second circuit board extend into the clamping space, and the first electrical connection portion is in clamping fit with the second circuit board.
12. The electronic device of claim 1, wherein the socket assembly comprises at least one of an earphone socket assembly and a charging socket assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110107744.3A CN112952414B (en) | 2021-01-27 | 2021-01-27 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110107744.3A CN112952414B (en) | 2021-01-27 | 2021-01-27 | Electronic device |
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| CN112952414A CN112952414A (en) | 2021-06-11 |
| CN112952414B true CN112952414B (en) | 2022-11-25 |
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| CN206878883U (en) * | 2017-05-24 | 2018-01-12 | 维沃移动通信有限公司 | A kind of mobile terminal shell and mobile terminal |
| CN107317138A (en) * | 2017-06-19 | 2017-11-03 | 维沃移动通信有限公司 | A kind of phone jack component and mobile terminal |
| CN110571554A (en) * | 2019-09-30 | 2019-12-13 | 维沃移动通信有限公司 | Electronic device |
| CN111182755A (en) * | 2020-02-14 | 2020-05-19 | 华为技术有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112952414A (en) | 2021-06-11 |
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