CN104767058A - Earphone socket - Google Patents

Earphone socket Download PDF

Info

Publication number
CN104767058A
CN104767058A CN201510175744.1A CN201510175744A CN104767058A CN 104767058 A CN104767058 A CN 104767058A CN 201510175744 A CN201510175744 A CN 201510175744A CN 104767058 A CN104767058 A CN 104767058A
Authority
CN
China
Prior art keywords
conducting strip
earphone socket
elastic piece
shell fragment
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510175744.1A
Other languages
Chinese (zh)
Inventor
安学良
马昌宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou TCL Mobile Communication Co Ltd
Original Assignee
Huizhou TCL Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou TCL Mobile Communication Co Ltd filed Critical Huizhou TCL Mobile Communication Co Ltd
Priority to CN201510175744.1A priority Critical patent/CN104767058A/en
Publication of CN104767058A publication Critical patent/CN104767058A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2471Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point pin shaped

Abstract

The invention discloses an earphone socket. The earphone socket comprises a circuit board and a conducting strip set arranged in the length direction of the circuit board. The conducting strip set comprises a first conducting strip and a second conducting strip which are adjacent and are insulated from each other. The tail end of the first conducting strip and the tail end of the second conducting strip are provided with a first elastic piece and a second elastic piece respectively, wherein the first elastic piece is opposite to the second elastic piece, and the second elastic piece is farther away from the circuit board compared with the first elastic piece. When an earphone plug is plugged in the earphone socket, a metal head at the tail end makes elastic contact with the first elastic piece and the second elastic piece at the same time. According to the earphone socket, a plugging signal of the earphone plug can be transferred to a control circuit, so the situation that a non-metal object is plugged by mistake, so an error judgment is made is prevented; meanwhile, due to the arrangement mode of the first elastic piece and the second elastic piece, welding feet of the first elastic piece and the second elastic piece can be made nearer, and the circuit board can be made narrower; therefore, the earphone socket can be made thinner.

Description

A kind of earphone socket
Technical field
The present invention relates to earphone syndeton, particularly relate to a kind of earphone socket.
Background technology
For convenience of using, a lot of equipment can be designed with earphone jack and outgoing loudspeaker simultaneously, and as computer, MP4, panel computer, digital television etc., similar devices is simultaneously outer to be put and earphone playback function.
In the use procedure of reality, user is requirement often, and after headset plug inserts, the outgoing loudspeaker of equipment quits work, select earplug as unique source of sound output, this needs to have circuit selection function with regard to making the earphone jack be used on similar devices.After headset plug inserts, need corresponding structure and circuit design in its jack, in order to identify the action that plug inserts, and the circuit of loud speaker is disconnected.
As shown in Figure 1, this type of traditional earphone socket, it is when realizing similar functions, and what it adopted is the structure that stator 1 matches with moving plate 2, before the plug 3 of earphone inserts, stator 1 and moving plate 2 Elastic Contact; After plug 3 inserts, plug 3 extrudes moving plate 2, and make it to produce deformation and disconnect the contact with stator 1, namely control circuit detects that stator and moving plate disconnect, then think that headset plug 3 inserts, and realizes outer disconnection of putting speaker circuit.But this earphone socket, when other nonmetallic columnar objects of insertion are as rubber stopper etc., also can be judged as that headset plug 3 inserts, thus cause error in judgement.Meanwhile, because multipair leg K to be arranged on the relative both sides of earphone jack by this kind of earphone socket, its circuit board needs to do very wide, and limit thickness and the installation position of whole earphone socket, Installation Flexibility is poor.
Summary of the invention
In view of the deficiency that prior art exists, the invention provides a kind of earphone socket effectively avoiding earphone insert state error in judgement, width narrow, flexible for installation.
In order to realize above-mentioned object, present invention employs following technical scheme:
A kind of earphone socket, the conducting strip group comprise circuit board, arranging at described circuit board length direction, described conducting strip group comprises adjacent and the first conducting strip of mutually insulated and the second conducting strip, described first conducting strip and described second conducting strip end are respectively arranged with the first shell fragment and the second shell fragment that are oppositely arranged, described second shell fragment relative to described first shell fragment further from described circuit board, the ferrule of end the first shell fragment and described second shell fragment described in Elastic Contact simultaneously when headset plug is inserted into earphone socket.
Wherein, described circuit board is FPC.
Wherein, described earphone socket also comprises housing, form the jack inserted for headset plug in described housing and is communicated with described jack, supply described conducting strip group to insert several bore a hole.
Wherein, described housing bottom is provided with the first groove and the second groove that embed for described first conducting strip and described second conducting strip respectively.
Wherein, described housing is also included in the convex tendon formed between described first conducting strip and leg corresponding to described second conducting strip.
Wherein, described housing bottom is provided with dividing plate, and described jack runs through described dividing plate.
Wherein, described conducting strip group and described housing one-body molded.
The first conducting strip in earphone socket of the present invention and the second conducting strip mutually insulated, have the first shell fragment and the second shell fragment that are oppositely arranged respectively, when headset plug does not insert, the two is off-state; When headset plug insert after, headset plug extrudes the first shell fragment and the second shell fragment towards both sides, and with the two electrical contact, can transmit insert signal to control circuit, non-metallic objectsit is not a metal object can be prevented to be mistakenly inserted and to cause error in judgement; Meanwhile, because the arrangement of the first shell fragment and the second shell fragment makes the leg of the two can do nearer, circuit board can do narrower, and therefore earphone socket can do thinner.
Accompanying drawing explanation
Fig. 1 is the earphone socket structure schematic diagram of prior art.
Fig. 2 is the earphone socket using state schematic diagram of the preferred embodiment of the present invention.
Fig. 3 is the part-structure schematic diagram of the earphone socket of the preferred embodiment of the present invention.
Fig. 4 is the structural representation of the earphone socket of the preferred embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Consult Fig. 2 and Fig. 3, earphone socket 20 of the present invention comprises circuit board 21 and conducting strip group 22, conducting strip group 22 is fixed on the length direction of circuit board 21 by leg (figure does not mark) arrangement, wherein, conducting strip group 22 comprises adjacent and the first conducting strip 221 and the second conducting strip 222 of mutually insulated, first conducting strip 221 and the second conducting strip 222 end are respectively arranged with the first shell fragment 221a and the second shell fragment 222a that are oppositely arranged, second conducting strip 222 also comprises the linking arm 222b extending to the second shell fragment 222a, second shell fragment 222a relative to the first shell fragment 221a further from circuit board 21, the ferrule of end Elastic Contact first shell fragment 221a and the second shell fragment 222a simultaneously when headset plug 10 is inserted into earphone socket 20.
First conducting strip 221 and the second conducting strip 222 can be used for the insert state of Test earphone plug 10.After headset plug 10 inserts, the ferrule (figure does not mark) of headset plug 10 end is simultaneously in the first shell fragment 221a and the second shell fragment 222a resilient electrical contact, first shell fragment 221a and the second shell fragment 222a conducting form loop, and control circuit can detect that headset plug 10 inserts.
Meanwhile, with reference to Fig. 4, earphone socket 20 also comprises housing 23, several (not shown) of boring a hole forming the jack 200 inserted for headset plug 10 in housing 23 and be communicated with jack 200, insert for conducting strip group 22.
The bottom of housing 23 is provided with respectively for the first groove 231 and the second groove 232 that the first conducting strip 221 and the second conducting strip 222 embed.Further, the first groove 231 is not communicated with the second groove 232.By such setting, first conducting strip 221 and the second conducting strip 222 are spaced apart, after having a small amount of water to enter earphone socket 20, because the first groove 231 and the second groove 232 are positioned at the bottom surface of housing 23, water is not easy to enter in the first groove 231 and the second groove 232 simultaneously, can not cause the first conducting strip 221 and the second conducting strip 222 short circuit.
First conducting strip 221 and the second conducting strip 222 can load from the bottom of housing 23, the two part except the first shell fragment 221a and the second shell fragment 222a can be held in the first groove 231 and the second groove 232 offered to bottom, even if the jack 200 of earphone socket 20 is intake, in the first groove 231 that water droplet is also difficult to enter the back side and the second groove 232.
Further, housing 23 is also included in the convex tendon 233 formed between the first conducting strip 221 and the leg of the second conducting strip 222 correspondence.Particularly, form crack (figure does not mark) between the first conducting strip 221 and the leg of the second conducting strip 222 correspondence, convex tendon 233 stretches in this crack.
Be provided with dividing plate 234 bottom housing 23, jack 200 runs through dividing plate 234.After headset plug 10 inserts jack 200, its end can continue to insert along dividing plate 234, and now, dividing plate 234 also can play guide effect.
Preferably, FPC (Flexible Printed Circuit board, i.e. flexible print wiring board) selected by circuit board 21, and the side of housing 23 is connected with circuit board 21, and without the limitation of ordinary circuit board, the installation of earphone socket 20 is more flexible.Be understandable that, conducting strip group 22 can be one-body molded with housing 23.
Due to the first conducting strip 221 and the second conducting strip 222 on the Width of circuit board 21 side by side, by the second shell fragment 222a is arranged further from circuit board 21 relative to the first shell fragment 221a, first shell fragment 221a and the second shell fragment 222a can be oppositely arranged, effectively reduce the size of whole earphone socket 20; The first groove 231 and the second groove 232 embedded for the first conducting strip 221 and the second conducting strip 222 is offered, even if water droplet instillation earphone jack 200, first conducting strip 221 and the second conducting strip 222 also can not short circuits in the bottom surface of housing 23.
Below be only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.

Claims (7)

1. an earphone socket, it is characterized in that, comprise circuit board (21), in the conducting strip group (22) that described circuit board (21) length direction is arranged, described conducting strip group (22) comprises adjacent and first conducting strip (221) of mutually insulated and the second conducting strip (222), described first conducting strip (221) and described second conducting strip (222) end are respectively arranged with the first shell fragment (221a) and the second shell fragment (222a) that are oppositely arranged, described second shell fragment (222a) relative to described first shell fragment (221a) further from described circuit board (21), the ferrule of end the first shell fragment (221a) and described second shell fragment (222a) described in Elastic Contact simultaneously when headset plug (10) is inserted into earphone socket.
2. earphone socket according to claim 1, is characterized in that, described circuit board (21) is FPC.
3. earphone socket according to claim 1 and 2, it is characterized in that, also comprise housing (23), form the jack (200) inserted for headset plug (10) in described housing (23) and is communicated with described jack (200), the described conducting strip group (22) of confession is inserted, and several are bored a hole.
4. earphone socket according to claim 3, it is characterized in that, described housing (23) bottom is provided with the first groove (231) and the second groove (232) that supply described first conducting strip (221) and described second conducting strip (222) to embed respectively.
5. earphone socket according to claim 4, it is characterized in that, described housing (23) is also included in the convex tendon (233) formed between the leg of described first conducting strip (221) and described second conducting strip (222) correspondence.
6. earphone socket according to claim 4, is characterized in that, described housing (23) bottom is provided with dividing plate (234), and described jack (200) runs through described dividing plate (234).
7. earphone socket according to claim 4, is characterized in that, described conducting strip group (22) is one-body molded with described housing (23).
CN201510175744.1A 2015-04-14 2015-04-14 Earphone socket Pending CN104767058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510175744.1A CN104767058A (en) 2015-04-14 2015-04-14 Earphone socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510175744.1A CN104767058A (en) 2015-04-14 2015-04-14 Earphone socket

Publications (1)

Publication Number Publication Date
CN104767058A true CN104767058A (en) 2015-07-08

Family

ID=53648765

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510175744.1A Pending CN104767058A (en) 2015-04-14 2015-04-14 Earphone socket

Country Status (1)

Country Link
CN (1) CN104767058A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108377437A (en) * 2018-03-30 2018-08-07 无锡睿勤科技有限公司 A kind of earphone base
CN109103638A (en) * 2018-08-09 2018-12-28 东莞市信为兴电子有限公司 A kind of earphone socket with FPC connector
CN109378609A (en) * 2018-11-16 2019-02-22 东莞市三基电子有限公司 A kind of ultra-thin band FPC waterproof earphones socket connector
CN112952414A (en) * 2021-01-27 2021-06-11 维沃移动通信有限公司 Electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842800A (en) * 2012-09-11 2012-12-26 上海华勤通讯技术有限公司 Earphone socket and electronic equipment thereof
CN103887647A (en) * 2014-03-21 2014-06-25 深圳君泽电子有限公司 Earphone connector, manufacturing method thereof and mobile terminal with earphone connector
CN203774507U (en) * 2014-03-28 2014-08-13 唯安科技有限公司 Vertical-type earphone connector
CN203850508U (en) * 2014-03-24 2014-09-24 东莞市星擎电子科技有限公司 An earphone socket with an improved structure
CN104158008A (en) * 2014-07-24 2014-11-19 惠州Tcl移动通信有限公司 Mobile terminal and earphone seat
CN104485557A (en) * 2014-12-19 2015-04-01 深圳市中兴移动通信有限公司 Earphone socket and terminal

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842800A (en) * 2012-09-11 2012-12-26 上海华勤通讯技术有限公司 Earphone socket and electronic equipment thereof
CN103887647A (en) * 2014-03-21 2014-06-25 深圳君泽电子有限公司 Earphone connector, manufacturing method thereof and mobile terminal with earphone connector
CN203850508U (en) * 2014-03-24 2014-09-24 东莞市星擎电子科技有限公司 An earphone socket with an improved structure
CN203774507U (en) * 2014-03-28 2014-08-13 唯安科技有限公司 Vertical-type earphone connector
CN104158008A (en) * 2014-07-24 2014-11-19 惠州Tcl移动通信有限公司 Mobile terminal and earphone seat
CN104485557A (en) * 2014-12-19 2015-04-01 深圳市中兴移动通信有限公司 Earphone socket and terminal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108377437A (en) * 2018-03-30 2018-08-07 无锡睿勤科技有限公司 A kind of earphone base
CN109103638A (en) * 2018-08-09 2018-12-28 东莞市信为兴电子有限公司 A kind of earphone socket with FPC connector
CN109103638B (en) * 2018-08-09 2024-01-09 东莞市信为兴电子有限公司 Earphone socket with FPC connector
CN109378609A (en) * 2018-11-16 2019-02-22 东莞市三基电子有限公司 A kind of ultra-thin band FPC waterproof earphones socket connector
CN112952414A (en) * 2021-01-27 2021-06-11 维沃移动通信有限公司 Electronic device
CN112952414B (en) * 2021-01-27 2022-11-25 维沃移动通信有限公司 Electronic device

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C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20150708

RJ01 Rejection of invention patent application after publication