CN203398401U

CN203398401U - Earphone interface structure

Info

Publication number: CN203398401U
Application number: CN201320377726.8U
Authority: CN
Inventors: 李华
Original assignee: Shanghai Simcom Ltd
Current assignee: Shanghai Simcom Ltd
Priority date: 2013-06-27
Filing date: 2013-06-27
Publication date: 2014-01-15
Anticipated expiration: 2023-06-27

Abstract

The utility model discloses an earphone interface structure. The earphone interface structure comprises an earphone plug positioning casing and elastic sheets; the earphone plug positioning casing and an electronic device casing are integrated. One end of the positioning casing is provided with a jack into which an earphone plug can be inserted. The wall of the positioning casing is provided with openings. One end of each elastic sheet extends into the positioning casing through the openings and contacts with the earphone plug, and the other end of each elastic sheet is connected with pads of a PCB of an electronic device, such that the transmission of earphone electric signals can be ensured. By means of the integrated design, the thickness of an earphone interface of the electronic device is decreased, and a bottleneck in thickness decrease of an entire unit can be broken through, and therefore, the electronic device can be thinner, and at the same time, the reliability of the connection of the earphone interface can be ensured.

Description

A kind of earphone interface structure

Technical field

The utility model relates to electronic equipment earphone interface design field.

Background technology

Day by day various along with mobile phone kind, intensified competition, increasing mobile phone manufacturer produces more and more has feel, and more and more frivolous smart mobile phone, to meet user for the demand of mobile phone product texture, sense of touch, high-grade sense.

The thickness of smart mobile phone is more and more thinner, for electronic devices and components and the manufacturing and designing of structure devices of interior of mobile phone, has higher requirement.But after being thinned to a certain degree, just there is bottleneck.As the thinlyyest in present mobile phone thickness entered in 6mm.From battery, display screen, touch-screen, USB interface, SIM card seat, electronic devices and components etc., all thickness has been accomplished to the thinnest of current technique.But earphone interface is the spaces of how many compressions never, and earphone interface become the bottleneck of mobile phone thickness, also becomes the difficult point of ultra thin handset appearance design.Because 3.5 cun of earphones have been widely used in various multimedia equipments, and do not have the better universal standard to replace in the short time, so 3.5 cun of earphone bases have become a bottleneck of current mobile phone thickness substantially.

The conventional design in current earphone interface place as shown in Figure 1, adopts modular headset connector, by surface installation technique (Surface Mounted Technology is called for short " SMT ") technology, is welded on pcb board.Existing headset connector structure generally comprises is located at the connector holder 101 that interior of mobile phone can insert for earphone, on connector holder, be embedded with a plurality of contact terminals, one end of connector holder has the jack 102 that can insert for earphone, jack coordinates with the perforate of shell 104, and earphone inserts after jack and each contact terminal conducting.Each contact terminal is equipped with a root bead pin 103, the corresponding welding hole that is provided with on pcb board, and leg is welded and fixed after stretching into welding hole.Like this, headset connector is fixed on pcb board by contact terminal, realizes the transmission of the fixing and signal of headset plug.

The diameter of current 3.5mm headset plug is 3.5mm, and the height minimum of the headset connector using can not be less than 4.5mm.Specifically as shown in Figure 2, Fig. 2 is the structural representation at the 3.5mm earphone place in conventional ultra thin handset, and pcb board 201, battery cover 202,3.5mm headset connector 203,3.5mm earphone 204, display screen 205, touch-screen 206 and fore shell 207 have been shown in Fig. 2.As can be seen from Figure 2, the thickness at earphone place is comprised of the thickness of battery cover 202, headset connector 203, touch-screen 206, fore shell 207.Because the thickness of touch-screen, battery cover and fore shell is all determined by manufacturing process, and the limit of the manufacturing process that reached of current design, under the prerequisite of reliability that guarantees mobile phone, attenuate more at present.And headset connector is owing to being to adopt modular assembly, also cannot continue attenuate.How to help complete machine to break through thickness bottleneck, what make that mobile phone can do is thinner, becomes everybody the current problem of paying close attention to most.

Utility model content

The technical problem that the utility model mainly solves is to provide a kind of earphone interface structure, can reduce electronic equipment at the thickness at earphone interface place, help complete machine to break through thickness bottleneck, what make that electronic equipment can do is thinner, has guaranteed the connection reliability of earphone interface simultaneously.

In order to solve the problems of the technologies described above, the utility model provides a kind of earphone interface structure, comprises headset plug positioning housing and shell fragment;

This positioning housing and electronic equipment casing are structure as a whole, one end of positioning housing has the jack that can insert for headset plug, on the wall body of this positioning housing, there is opening, one end of shell fragment is stretched in positioning housing by opening, contact with headset plug, the other end contacts with the pad of the pcb board of electronic equipment.

As further improvement, the shell fragment quantity that this earphone interface structure comprises is four, contacts respectively with four joints of line control earphone plug.

As further improvement, the shell fragment quantity that this earphone interface structure comprises is three, contacts respectively with three joints of non-line control earphone (being common headphones) plug.

As further improvement, the two ends of above-mentioned shell fragment are elastic connecting contact.

As further improvement, the elastic connecting contact of shell fragment can consist of the U-shaped structure of deformability.

As further improvement, shell fragment is fixed on the outside of positioning housing.

As further improvement, each shell fragment can be individually fixed in the left and right sides of positioning housing.

As further improvement, shell fragment is fixed by screws on positioning housing.

As further improvement, shell fragment consists of electric conducting material.

As further improvement, shell fragment can be aided with surface gold-plating technique in outer layer of conductive material.

The utility model execution mode compared with prior art, the main distinction and effect thereof are: the positioning housing of headset plug and electronic equipment casing are designed to integrative-structure, on positioning housing, be provided with opening, one end of shell fragment is stretched in positioning housing by opening, contact with headset plug, the other end contacts with the pad of the pcb board of electronic equipment, guarantees the conduction of the earphone signal of telecommunication.By this integrated design, can reduce electronic equipment at the thickness at earphone interface place, help complete machine to break through thickness bottleneck, what make that electronic equipment can do is thinner, has guaranteed the connection reliability of earphone interface simultaneously.

Accompanying drawing explanation

Fig. 1 is the design schematic diagram that in prior art, earphone interface is conventional;

Fig. 2 is the structural representation at the 3.5mm earphone place in ultra thin handset in prior art;

Fig. 3 is the earphone interface structure chart in the utility model one better embodiment;

Fig. 4 is before earphone interface structure improves in the utility model one better embodiment and improves rear thickness contrast schematic diagram;

Fig. 5 is the schematic diagram that in the utility model one better embodiment, shell fragment contacts with headset plug;

Fig. 6 is the schematic diagram that in the utility model one better embodiment, shell fragment contacts with the pad of PCB mainboard;

Fig. 7 is the profile of earphone interface structure in the utility model one better embodiment.

Embodiment

For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, execution mode of the present utility model is described in further detail.

The utility model one better embodiment relates to a kind of earphone interface structure, can be on ultra thin handset, or on other super-thin electronic equipment.The earphone interface structure of ultra thin handset of take below describes as example, conventionally the design of mobile phone at earphone interface place all adopts modular headset connector to realize, the earphone interface structural design that present embodiment provides does not adopt modular earphone to connect machine, but the structure location of headset plug is separated to realization with the conduction of the signal of telecommunication.

Specifically as shown in Figure 3, this earphone interface structure comprises a headset plug positioning housing 301 and four shell fragments 302, wherein, positioning housing 301 is structure as a whole with the shell 303 of mobile phone, positioning housing 301 one end has the jack 306 that can insert for headset plug, headset plug 304 inserts positioning housing 301 from this jack, shell fragment 302 is fixed on the outside of positioning housing 301, generally four shell fragments are individually fixed in the left and right sides (each two of left and right) of mobile phone positioning housing, on the wall body of positioning housing, be provided with four openings, one end of each shell fragment is stretched in positioning housing by corresponding opening, contact with headset plug 304, the other end contacts with the pad of the pcb board of electronic equipment.

Because the positioning housing of headset plug and the shell of mobile phone are structure as a whole, directly design, on the plastic shell of mobile phone, has two advantages like this:

1, saved the fixedly thickness of plastic cement of one deck on existing headset connector, and the fit-up gap of headset connector and battery cover, at least thickness of 0.7mm altogether can be saved, as shown in Figure 4.

2, in prior art, in order to reduce complete machine thickness, earphone connects machine height can be done when design very low (very thin thickness), make the plastic cement structural thickness of headset connector fixed earphone plug in short transverse can be thinner, add that earphone connects machinery requirement and adopts electrical insulating property better and be easy to the material that injection moulding is produced, and this material is more crisp at normal temperatures, this will make mobile phone when the plug that plugs in the earphone is done destructive testing, headset connector is easily destroyed, and reliability reduces.And the direct fixed earphone plug of the one plastic shell adopting in present embodiment does not just have such problem, plastic housing of mobile phone is generally used PC/PC+ABS material, this material has good impact resistance and certain toughness, and after positioning housing and phone housing become one structure, when headset plug is subject to powerful impact, the plastic shell of mobile phone can impact-absorbing, and phone housing generally can not damage, thereby has guaranteed better the connection reliability of earphone interface.

In present embodiment, the conduction of the circuit of headset plug is what by four shell fragment 302 two ends, to contact to realize respectively with the pad 601 of headset plug 304 and PCB mainboard, as shown in Figure 5 and Figure 6.Shell fragment 302 is to be all fixed on positioning housing 301 by screw 305.The two ends of shell fragment are elastic connecting contact, the U-shaped structure of deformability, consist of, and at shell fragment, the position near contact all bends as deformable U-shaped structure, as shown in Fig. 5 and Fig. 7, contact guaranteeing with the reliable of pcb board/headset plug.The resilient contact of shell fragment one end contacts with headset plug, and the resilient contact of one end and the pad of pcb board contact in addition.

The material of shell fragment can be selected the conductive material such as beryllium copper, stainless steel, titanium copper according to the test request of different product, and is aided with surface gold-plating technique, thereby can realize good conductivity performance.

Earphone interface structure in present embodiment has solved the problem that current ultra thin handset earphone interface place is difficult to reduce thickness, and what make that mobile phone can do is thinner, and has guaranteed the connection reliability of earphone interface.

The earphone interface structure of present embodiment not only can be applied to mobile phone, can also be applied to other electronic equipments.

In addition, in present embodiment, earphone interface structure has comprised four shell fragments, can contact with four joints of line control earphone plug, obtains the signal of telecommunication; Or, contact with three joints of the common headphones plug of non-line traffic control respectively, obtain the signal of telecommunication; The design of four shell fragments can compatible line control earphone and common non-line control earphone.In actual applications, if an electronic equipment is only connected with common headphones, this earphone interface structure also can only comprise three shell fragments, contacts respectively with three joints of common headphones plug, obtains the signal of telecommunication.

Although by reference some preferred implementation of the present utility model, the utility model is illustrated and described, but those of ordinary skill in the art should be understood that and can to it, do various changes in the form and details, and do not depart from spirit and scope of the present utility model.

Claims

1. an earphone interface structure, is characterized in that, comprises headset plug positioning housing and shell fragment;

Described positioning housing and electronic equipment casing are structure as a whole, one end of described positioning housing has the jack that can insert for headset plug, on the wall body of described positioning housing, there is opening, one end of described shell fragment is stretched in described positioning housing by described opening, contact with headset plug, the other end contacts with the pad of the pcb board of described electronic equipment.

2. earphone interface structure according to claim 1, is characterized in that, the shell fragment quantity that described earphone interface structure comprises is four, contacts respectively with four joints of line control earphone plug.

3. earphone interface structure according to claim 1, is characterized in that, the shell fragment quantity that described earphone interface structure comprises is three, contacts respectively with three joints of non-line control earphone plug.

4. earphone interface structure according to claim 1, is characterized in that, the two ends of described shell fragment are elastic connecting contact.

5. earphone interface structure according to claim 4, is characterized in that, the elastic connecting contact of described shell fragment consists of the U-shaped structure of deformability.

6. according to the earphone interface structure described in claim 2 or 3, it is characterized in that, described shell fragment is fixed on the outside of described positioning housing.

7. earphone interface structure according to claim 6, is characterized in that, described each shell fragment is individually fixed in the left and right sides of described positioning housing.

8. earphone interface structure according to claim 6, is characterized in that, described shell fragment is fixed by screws on described positioning housing.

9. earphone interface structure according to claim 1, is characterized in that, described shell fragment consists of electric conducting material.

10. earphone interface structure according to claim 9, is characterized in that, described shell fragment is aided with surface gold-plating technique in outer layer of conductive material.