CN111585072B - Electronic device - Google Patents

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Publication number
CN111585072B
CN111585072B CN202010474669.XA CN202010474669A CN111585072B CN 111585072 B CN111585072 B CN 111585072B CN 202010474669 A CN202010474669 A CN 202010474669A CN 111585072 B CN111585072 B CN 111585072B
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CN
China
Prior art keywords
circuit board
conductive elastic
printed circuit
flexible circuit
middle frame
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Application number
CN202010474669.XA
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Chinese (zh)
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CN111585072A (en
Inventor
叶剑
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN202010474669.XA priority Critical patent/CN111585072B/en
Publication of CN111585072A publication Critical patent/CN111585072A/en
Priority to PCT/CN2021/096344 priority patent/WO2021239053A1/en
Application granted granted Critical
Publication of CN111585072B publication Critical patent/CN111585072B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/48Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/02Connectors or connections adapted for particular applications for antennas

Abstract

The application discloses electronic equipment belongs to antenna communication technical field. The electronic device includes: the flexible printed circuit board comprises a metal middle frame, a conductive elastic piece, a flexible circuit board and a printed circuit board; the side wall of the metal middle frame is provided with a groove; the conductive elastic piece and the flexible circuit board are at least partially positioned in the groove, the conductive elastic piece is electrically connected with the flexible circuit board, the flexible circuit board is electrically connected with the metal middle frame, and the printed circuit board is electrically connected with the conductive elastic piece. Above-mentioned scheme is through setting up electrically conductive elastic component and flexible circuit board in the recess at the metal center to be connected through electrically conductive elastic component and printed circuit board electricity, can shorten the transmission distance of antenna signal after printed circuit board and metal center switch on, reduced the occupation of electrically conductive elastic component to the printed circuit board area simultaneously, and then make the corresponding matching device of antenna more be close to the metal center, reduced the loss of antenna transmission, promoted antenna transmission performance.

Description

Electronic device
Technical Field
The application belongs to the technical field of antenna communication, and particularly relates to an electronic device.
Background
In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art:
at present, in order to realize that a short transmission distance and reliable connection contact are realized between a metal side wall and a mainboard, a side pressure spring plate is designed in the conventional method at present, but the side pressure spring plate used at present has the following risks and disadvantages:
1. the transmission distance of the antenna signal of the side pressing elastic sheet after the elastic sheet is conducted with the metal side wall is longer, so that the transmission loss of the antenna is increased, and the transmission performance of the antenna is reduced;
2. the side pressure shell fragment occupies the area of PCB board, often need keep away from the metal center when arranging the corresponding matching device of antenna, leads to the interior antenna of mainboard to walk the line extension, increases antenna transmission's loss, and antenna transmission performance reduces.
Disclosure of Invention
The embodiment of the application provides an electronic equipment, can solve the current setting mode of side pressure shell fragment, can increase the loss of antenna transmission, lead to the problem that antenna transmission performance reduces.
In order to solve the technical problem, the following implementation modes are adopted in the application:
in a first aspect, an embodiment of the present application provides an electronic device, including: the flexible printed circuit board comprises a metal middle frame, a conductive elastic piece, a flexible circuit board and a printed circuit board;
the side wall of the metal middle frame is provided with a groove;
the conductive elastic piece and the flexible circuit board are at least partially positioned in the groove, the conductive elastic piece is electrically connected with the flexible circuit board, the flexible circuit board is electrically connected with the metal middle frame, and the printed circuit board is electrically connected with the conductive elastic piece.
In this application embodiment, through set up electrically conductive elastic component and flexible circuit board in the recess of metal center to be connected through electrically conductive elastic component and printed circuit board electricity, can shorten the transmission distance of antenna signal after printed circuit board and metal center switch on, reduced the occupation of electrically conductive elastic component to the printed circuit board area simultaneously, and then make the corresponding matching device of antenna more be close to the metal center, reduced the loss of antenna transmission, promoted antenna transmission performance.
Drawings
Fig. 1 is one of schematic internal structural diagrams of an electronic device according to an embodiment of the present application;
fig. 2 is a second schematic diagram of the internal structure of the electronic device according to the embodiment of the present application;
FIG. 3 is a schematic structural diagram of an assembled conductive elastic member and a flexible circuit board according to an embodiment of the present disclosure;
FIG. 4 is a second schematic structural view of the assembled conductive elastic member and the flexible circuit board according to the embodiment of the present application;
FIG. 5 is an exploded view of an assembly of a conductive elastic member and a flexible circuit board according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a conductive elastic member according to an embodiment of the present application;
FIG. 7 is a second schematic structural view of a conductive elastic member according to an embodiment of the present application;
FIG. 8 is a schematic view of an assembly structure of the conductive elastic member, the flexible circuit board and the metal middle frame according to the embodiment of the present application;
FIG. 9 is an exploded view of the assembly of the metal bezel, the conductive spring, the flexible circuit board and the printed circuit board according to the embodiment of the present application;
fig. 10 is a third schematic view of an internal structure of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 10, an embodiment of the present application provides an electronic device, including:
the metal middle frame 100, the conductive elastic member 200, the flexible circuit board 300 and the printed circuit board 400;
wherein, the side wall of the metal middle frame 100 is provided with a groove 110;
the conductive elastic member 200 and the flexible circuit board 300 are at least partially disposed in the groove 110, the conductive elastic member 200 is electrically connected to the flexible circuit board 300, the flexible circuit board 300 is electrically connected to the metal middle frame 100, and the printed circuit board 400 is electrically connected to the conductive elastic member 200.
It should be noted that, in the embodiment of the present application, at least a portion of the conductive elastic element and the flexible circuit board (i.e., the FPC) is disposed in the groove of the metal middle frame, the conductive elastic element does not need to occupy an area of the printed circuit board (i.e., the PCB), and the conductive elastic element is directly in contact with the printed circuit board to realize electrical connection, so that a transmission distance of an antenna signal after the printed circuit board is conducted with the metal middle frame can be shortened, and thus, a loss of antenna transmission is reduced, and an antenna transmission performance is improved.
As further shown in fig. 6 and 7, the conductive elastic member 200 includes:
an elastic body 210;
a conductive medium layer 220 wrapped on the outer surface of the elastic body 210;
the conductive elastic member 200 is electrically connected to the flexible circuit board 300 through the conductive medium layer 220.
It should be noted that, by wrapping the conductive medium layer on the outer surface of the elastic body, the conductive elastic member 200 can be elastically deformed, and at the same time, the electrical connection between the conductive elastic member and the flexible circuit board can be ensured.
It should be further noted that at least one through hole 211 is disposed on the elastic body 210, and an axial direction of the through hole 211 is parallel to a height direction of the metal middle frame; through set up the through-hole on elastic body 210, can make elastic body when receiving the extrusion, more easy realization elastic deformation has promoted elastic body's deformability.
It should be noted that the conductive medium layer 220 covers the outer surface of the elastic body 210 in a half-wrapped manner, that is, after the conductive elastic member 200 is completely disposed, one side of the conductive elastic member 200 that needs to be in contact with the printed circuit board 400 is wrapped with the conductive medium layer 220.
Specifically, in order to electrically connect the conductive medium layer 220 to the flexible circuit board 300, the conductive medium layer 220 includes:
a foil material;
the nickel plating layer covers one exposed surface of the foil;
a gold plating layer overlying the nickel plating layer.
It should be noted that, by covering the gold plating layer outside the nickel plating layer, the conductivity can be improved, and the wear resistance of the gold plating layer can also be improved.
Specifically, the conductive elastic member 200 is specifically composed of: plating nickel on a foil material, then plating gold, cutting into a certain shape, and then wrapping and bonding the foil material on an elastic body with a through hole through a high-viscosity hot melt adhesive, wherein the elastic body is a high-temperature resistant elastomer of silica gel type, and the high-temperature resistant elastomer can realize side pressure conductive contact conduction due to the coverage of the gold-plated foil material on the surface; it should be noted that, because the elastic body is made of silica gel material by extrusion molding, the elastic body is not easy to fatigue fracture even if being repeatedly stressed when the whole machine vibrates.
It should be further noted that, in the embodiment of the present application, two setting manners of the flexible circuit board 300 are provided, specifically:
1. when the thickness of the metal middle frame 100 is sufficiently thick, as further shown in fig. 3 to 5 and 8, the specific arrangement of the flexible circuit board 300 is as follows:
the flexible circuit board 300 includes:
a first body 310, a second body 320, and a third body 330 connected to each other;
the first body 310 is arranged outside the groove 110, an ultrasonic welding point 311 is arranged on the first body 310, and the flexible circuit board 300 is welded with the metal middle frame 100 through the ultrasonic welding point 311;
the second body 320 is attached between the conductive elastic member 200 and the sidewall of the groove 110;
the third body 330 is disposed at the bottom of the groove 110 and is fixedly connected to the conductive elastic member 200.
In this case, the flexible circuit board 300 is bent, the back surface of the third body 330 is adhered to the bottom of the groove 110 through the double-sided adhesive tape 500, and the front surface of the third body 330 is subjected to a surface mounting process to mount the conductive elastic member 200 on the flexible circuit board 300; the first body 310 is exposed on the side wall of the upper end outside the groove 110, an ultrasonic welding process is adopted, the flexible circuit board 300 and the metal middle frame 100 are welded by combining an ultrasonic welding point 311 to realize conduction, and after the conductive elastic piece, the flexible circuit board and the metal middle frame 100 are assembled, the axial direction of the through hole 211 on the elastic body 210 under the condition can be seen to be parallel to the height direction of the third body 330 on the metal middle frame 100.
It should be noted that, by designing the patch pad area and the ultrasonic welding area on the flexible circuit board 300, conduction is performed through solder; meanwhile, the double-sided adhesive tape is designed at the bottom of the flexible circuit board 300, so that the flexible circuit board is convenient to fix with a metal middle frame during assembly.
It should be noted that, this kind of mode can reduce the area that the electrically conductive elastic component took to the metal center, has promoted the compactness of structure.
2. When the thickness of the metal middle frame 100 is relatively thin, as further shown in fig. 10, the specific arrangement of the flexible circuit board 300 is as follows:
the flexible circuit board 300 is arranged at the bottom of the groove 110, an ultrasonic welding spot 311 is arranged at one end of the flexible circuit board 300, the flexible circuit board 300 is welded with the metal middle frame 100 through the ultrasonic welding spot 311, and the other end of the flexible circuit board 300 is fixedly connected with the conductive elastic member 200.
It should be noted that, in consideration of the fact that if the ultrasonic welding position is at the upper end of the side wall, there is a certain limit on the thickness of the whole machine, in this case, for a metal middle frame area with a thinner thickness, the size of the groove of the metal middle frame is set to be larger, the flexible circuit board 300 is not bent, and after being directly flattened, the flexible circuit board 300 is welded in the groove of the metal middle frame, specifically, the structure of the flexible circuit board 300 arranged behind the groove 110 is shown in fig. 10.
It should be noted that, in order to ensure the electrical connection between the conductive elastic member 200 and the printed circuit board 400, the printed circuit board 400 is provided with a protruding structure 410, and the printed circuit board 400 is in contact with the conductive elastic member 200 through the protruding structure 410.
Further, in order to better realize the electrical connection between the printed circuit board 400 and the conductive elastic member 200, a gold-plated layer 411 is disposed on a side wall of the protruding structure 410, and the printed circuit board 400 is electrically connected to the conductive elastic member 200 through the gold-plated layer 411; specifically, the sidewall of the protruding structure 410 is in contact with the conductive medium layer 220 disposed on the sidewall of the conductive elastic member 200, so as to achieve electrical connection therebetween.
It should be noted that, by designing a protruding structure 410 (i.e. a protruding portion) on the printed circuit board 400, and designing gold plating on the side wall of the protruding portion, the gold plating position of the side wall is exactly the same height as the side surface of the conductive elastic member 200 exposed by the side wall groove, contact with the contact of the conductive elastic member 200 can be realized, and a parallel feeding design with the printed circuit board 400 is realized.
It should be further noted that, in the above-mentioned parallel feeding design, only the gold-plated surface of the protruding structure 410 contacts with the sidewall of the conductive elastic element 200, and only one antenna loop exists, so that the uniformity of the antenna performance can be ensured.
In summary, the specific implementation process of the embodiment of the present application is as follows: firstly, CNC machining a side wall groove on the side wall of the metal middle frame, attaching a conductive elastic part 200 which is coated with a gold coating and can be subjected to lateral pressure on the surface of the conductive elastic part to a flexible circuit board 300 with glue at the bottom, assembling the flexible circuit board 300 into the side wall groove, and welding and conducting the flexible circuit board 300 and the metal middle frame through ultrasonic welding; meanwhile, the side wall of the printed circuit board 400 is provided with a protruding structure 410, gold plating is performed on the surface of the protruding structure 410, and the protruding structure is in contact with the side wall of the conductive elastic part 200, so that a parallel feed design with the printed circuit board 400 is realized, and the feed matching electronic device 600 is arranged at the rear end of the protruding structure 410, so that the feed matching electronic device 600 corresponding to the antenna is close to the metal middle frame, the length of antenna routing in the main board is reduced, and the loss of antenna transmission is reduced.
It should be noted that, compared with the conventional lateral pressure spring plate scheme of the patch main board, the antenna signal of the parallel feed scheme of the embodiment of the present application has a shorter transmission distance after the printed circuit board is conducted with the metal middle frame, so that the loss of antenna transmission can be reduced, and the antenna transmission performance can be improved; compare the area that conventional paster mainboard's side pressure shell fragment scheme occupied printed circuit board, the electrically conductive elastic component of this application embodiment is designed in the recess of metal center, does not occupy printed circuit board's area for the corresponding matching device of antenna is close to metal center more, can shorten the interior antenna wiring of mainboard, reduces antenna transmission's loss, has promoted antenna transmission performance.
It should be further noted that, while the foregoing advantageous effects can be achieved, at least one of the following advantageous effects can also be achieved in the embodiments of the present application:
1. the conductive elastic part is hidden in the side wall groove of the metal middle frame, so that the conductive elastic part is not easily collided and deformed by the side wall when being stressed laterally during a complete machine drop test, and the yield risk of the conductive elastic part when being impacted can be reduced;
2. compare the side pressure shell fragment scheme of conventional paster mainboard, the electrically conductive elastic component of this application embodiment need not design fluting or trompil at printed circuit board, can reduce the area occupied to printed circuit board, is favorable to the printed circuit board's of complete machine the overall arrangement that piles up.
The electronic device in the embodiment of the present application may be a mobile electronic device or a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (6)

1. An electronic device, comprising: the flexible printed circuit board comprises a metal middle frame, a conductive elastic piece, a flexible circuit board and a printed circuit board;
the side wall of the metal middle frame is provided with a groove;
the conductive elastic piece and the flexible circuit board are at least partially positioned in the groove, the conductive elastic piece is electrically connected with the flexible circuit board, the flexible circuit board is electrically connected with the metal middle frame, and the printed circuit board is electrically connected with the conductive elastic piece;
the flexible circuit board comprises a first body, a second body and a third body which are connected with each other;
the first body is arranged outside the groove, an ultrasonic welding spot is arranged on the first body, and the flexible circuit board is welded with the metal middle frame through the ultrasonic welding spot;
the second body is attached between the conductive elastic piece and the side wall of the groove;
the third body is arranged at the bottom of the groove and is fixedly connected with the conductive elastic piece.
2. The electronic device of claim 1, wherein the printed circuit board is provided with a protruding structure through which the printed circuit board contacts the conductive elastic member.
3. The electronic device according to claim 2, characterized in that the side walls of the protruding structure are provided with a gold plating layer, the printed circuit board being electrically connected with the conductive elastic member through the gold plating layer.
4. The electronic device of claim 1, wherein the conductive elastic member comprises:
an elastic body;
the conductive medium layer is wrapped on the outer surface of the elastic body;
the conductive elastic piece is electrically connected with the flexible circuit board through the conductive medium layer.
5. The electronic device according to claim 4, wherein the elastic body is provided with at least one through hole, and an axial direction of the through hole is parallel to a height direction of the metal middle frame.
6. The electronic device of claim 4, wherein the conductive medium layer comprises:
a foil material;
the nickel plating layer covers one exposed surface of the foil;
a gold plating layer overlying the nickel plating layer.
CN202010474669.XA 2020-05-29 2020-05-29 Electronic device Active CN111585072B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010474669.XA CN111585072B (en) 2020-05-29 2020-05-29 Electronic device
PCT/CN2021/096344 WO2021239053A1 (en) 2020-05-29 2021-05-27 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010474669.XA CN111585072B (en) 2020-05-29 2020-05-29 Electronic device

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Publication Number Publication Date
CN111585072A CN111585072A (en) 2020-08-25
CN111585072B true CN111585072B (en) 2022-06-17

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WO (1) WO2021239053A1 (en)

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CN114639977B (en) * 2022-04-12 2023-12-29 四川华丰科技股份有限公司 Signal transmission connector
CN116055603A (en) * 2022-08-24 2023-05-02 荣耀终端有限公司 Middle frame assembly and electronic equipment comprising same

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