CN111782078A - Conductive foam and electronic equipment - Google Patents

Conductive foam and electronic equipment Download PDF

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Publication number
CN111782078A
CN111782078A CN202010563890.2A CN202010563890A CN111782078A CN 111782078 A CN111782078 A CN 111782078A CN 202010563890 A CN202010563890 A CN 202010563890A CN 111782078 A CN111782078 A CN 111782078A
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CN
China
Prior art keywords
foam
foam body
conductive
cotton
bubble
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Granted
Application number
CN202010563890.2A
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Chinese (zh)
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CN111782078B (en
Inventor
叶剑
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202010563890.2A priority Critical patent/CN111782078B/en
Publication of CN111782078A publication Critical patent/CN111782078A/en
Priority to PCT/CN2021/100578 priority patent/WO2021254428A1/en
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Publication of CN111782078B publication Critical patent/CN111782078B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Laminated Bodies (AREA)

Abstract

The application discloses electrically conductive bubble is cotton and electronic equipment belongs to communication equipment technical field. The electrically conductive bubble of this application is cotton includes: the conductive film comprises a foam body, a conductive film and a bonding layer; the foam body comprises a first foam body, a second foam body and a supporting plate, wherein the first foam body and the second foam body are attached to each other, and the supporting plate is arranged on the second foam body; the conductive film is arranged on the first surface, the second surface and the third surface of the foam body in a wrapping mode, and the first part of the fourth surface of the foam body in a wrapping mode; the adhesive layer is disposed on a second portion of the fourth surface. This application embodiment has set up the backup pad on the cotton body of second bubble, and this backup pad has better bending resistance performance, consequently, the compressive resistance of the cotton body of promotion bubble that can be great can prevent effectively that the cladding material on electrically conductive cloth surface from taking place to split when electrically conductive bubble cotton receives heavily the pre-compaction.

Description

Conductive foam and electronic equipment
Technical Field
The application belongs to the technical field of communication equipment, and in particular relates to conductive foam and electronic equipment.
Background
Along with the development of the mobile phone industry, the visual and touch demands of consumers on mobile phone screens are stronger and stronger, so that a 3D curved flexible screen is generated, the 3D curved flexible screen can bring better holding feeling, and meanwhile, more comprehensive side wall visual feeling can be brought. On the other hand, with the development of communication technology, 5G mobile phones are becoming commercialized, and new technologies such as high-frequency signal (e.g., 5.8GHz wifi, sub 6G, etc.) antennas, Multiple Input Multiple Output (MIMO) Multiple antennas, etc. are adopted, so that requirements for grounding become more stringent.
Because the existing mobile phone needs to be compatible with 3G/4G equal frequency, 5G equal frequency antennas need to be designed on the left side and the right side of the mobile phone and just positioned at the bottom of the flexible screen. The bottom of the flexible screen is provided with metal copper foil and the like, so that the flexible screen can absorb high-frequency antennas such as 5G and the like. Therefore, a ground needs to be designed between the bottom metal middle frame and the 3D flexible screen, which not only requires small ground impedance, large contact area and reliable contact requirements, but also requires that the ground position is close to the high-frequency sidewall antenna such as 5G.
At present, the conventional grounding design between a bottom metal middle frame and a 3D flexible screen is to design a nickel-plated cloth-wrapped conductive foam in a plane area at the bottom of the screen, and in the process of implementing the application, the inventor finds that at least the following problems exist in the prior art: the conductive foam wrapped by the nickel-plated conductive cloth is used for bending the conductive cloth by 180 degrees when the conductive cloth is subjected to powerful prepressing, so that the surface coating of the conductive cloth is cracked, and the conduction resistance is influenced.
Disclosure of Invention
The purpose of the embodiment of the application is to provide a conductive foam and electronic equipment, can solve the problem that the conductive foam can lead to the surface coating of conductive cloth to be cracked when heavily precompressing.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a conductive foam, including: the conductive film comprises a foam body, a conductive film and a bonding layer;
the foam body comprises a first foam body, a second foam body and a supporting plate, wherein the first foam body and the second foam body are attached to each other, and the supporting plate is arranged on the second foam body;
the conductive film is arranged on the first surface, the second surface and the third surface of the foam body in a wrapping mode, and the first part of the fourth surface of the foam body in a wrapping mode;
the adhesive layer is disposed on a second portion of the fourth surface.
In a second aspect, an embodiment of the present application provides an electronic device, including: the screen, with the metal center that the screen is connected, its characterized in that, the metal center is provided with the recess, be provided with as above in the recess the electrically conductive bubble cotton, just the electrically conductive bubble cotton with the arc region laminating of screen.
In this application embodiment, set up the backup pad on the second bubble is cotton, this backup pad has better bending resistance performance, consequently, the compressive resistance of the promotion bubble cotton that can be great can effectively prevent to lead the cladding material emergence chap on electrical cloth surface when electrically conductive bubble cotton receives heavily the pre-compaction.
Drawings
Fig. 1 is one of schematic structural diagrams of a conductive foam according to an embodiment of the present application;
FIG. 2 is a second schematic structural diagram of the conductive foam of the embodiment of the present application;
fig. 3 is a third schematic structural diagram of the conductive foam according to the embodiment of the present application;
FIG. 4 is a fourth schematic view of the structure of the conductive foam of the embodiment of the present application;
FIG. 5 is a fifth schematic view of the structure of the conductive foam of the embodiment of the present application;
FIG. 6 is an exploded view of an embodiment of the conductive foam of the present application;
FIG. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 8 is a block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The conductive foam and the electronic device provided by the embodiment of the present application are described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
As shown in fig. 1, 2, 3, 4, 5 and 6, an embodiment of the present application provides a conductive foam, including: the conductive film comprises a foam body, a conductive film and a bonding layer;
the foam body comprises a first foam body 101, a second foam body 102 and a supporting plate 1021, wherein the first foam body and the second foam body are attached to each other;
the conductive film 103 is coated on the first surface, the second surface, the third surface of the foam body and the first portion of the fourth surface of the foam body. That is, in the embodiment of the present application, the outline of the conductive film is a non-closed curved surface. For example, the first surface is a lower surface, the second surface is a left side surface, the third surface is a right side surface, and the fourth surface is an upper surface.
The adhesive layer 104 is disposed on a second portion of the fourth surface.
In the embodiment of the present application, the first foam body 101 and the second foam body 102 are disposed in parallel, and the second foam body 102 (one or more) is disposed on two opposite sides of the first foam body 101 (as shown in fig. 1 to 4) or on one side of the first foam body 101 (as shown in fig. 5). The first foam body 101 and the at least one second foam body 102 are aligned to form a foam body. Wherein, the height of the first foam body 101 is the same as that of the second foam body provided with the support plate 1021, so as to ensure that the surface of the foam body is a plane.
Optionally, the support plate 1021 is a thermoplastic polyester PET support plate. The PET support plate is high in bending strength, long in bending life and not prone to fracture during overpressure.
Above-mentioned first bubble is cotton body and the second bubble is cotton body and is the soft cotton core material that density is very low, consequently, the cotton body of bubble of this application embodiment has super high resilience, is difficult to creep ageing, and elasticity sustainability is good.
In the embodiment of the present application, as shown in fig. 1 to 5, the conductive film is wrapped on the first surface, the second surface, the third surface of the foam body, and the first portion wrapped on the fourth surface of the foam body, the bonding layer is disposed on the second portion of the fourth surface, the bonding layer and the conductive film form a closed curved surface, the bonding layer is specifically an insulating adhesive, and since the insulating adhesive is adopted at the bottom of the conductive foam body, as shown in fig. 1, 2 parallel conduction paths are formed at the left side and the right side, so that a resistance bottleneck formed by the conductive double surfaces at the bottom is avoided.
Optionally, the conductive film is a gold-plated conductive film.
In the embodiment of the application, the conductive foam is in a cotton conductive fabric conduction state, the resistance value of the gold-plated conductive film is small and stable, the performance of the antenna can be improved, and meanwhile the consistency of the radiation power of the antenna can be guaranteed.
In addition, because the gold layer surface can not form the oxide film, be difficult to produce the clutter at the contact interface, be difficult to cause passive intermodulation interference, reduce the risk of interfering with the antenna, can effectively promote the antenna performance, in addition, because gold layer chemical property is stable, corrosion resistance is good, meets salt spray and sweat and can not take place chemical corrosion, can not take place the surface coating and blacken and drop, has good resistance of switching on.
The electrically conductive bubble of this application embodiment is cotton, has set up the backup pad on the second bubble is cotton, and this backup pad has better anti bending property, consequently, the compressive resistance of the promotion bubble cotton that can be great can prevent effectively that the cladding material on electrically conductive cloth surface from taking place to split when electrically conductive bubble cotton receives heavily the pre-compaction.
As an alternative implementation manner, as shown in fig. 1 to 4, the foam body includes two second foam bodies 102, the two second foam bodies 102 are respectively disposed on two opposite sides of the first foam body 101, and as shown in fig. 2, the two second foam bodies are disposed on two opposite sides of the first foam body along the x-axis direction (the length direction of the first foam body).
Specifically, two second foam bodies 102 are respectively attached to two side surfaces of the first foam body 101, and three foam bodies are arranged to form the foam bodies.
The two sides of the first foam body are respectively provided with the second foam body for preventing overpressure, namely, the second foam body with the overpressure preventing function on the left side and the right side is aligned with the first foam body in the middle to form a main source of foam body elasticity, so that the conductive film wrapped by the conductive film can form bending of an R angle when the conductive film is subjected to powerful prepressing, cracking of the surface plating layer of the conductive film can not be caused, and the conduction resistance value is not influenced.
As another alternative implementation manner, as shown in fig. 5, the foam body includes one second foam body 102, and one second foam body 102 is attached to a side surface of the first foam body 101.
A second foam body is arranged on the left side or the right side of the first foam body, and the second foam body and the first foam body are arranged to form the foam body.
Here, set up a second bubble cotton and arrange with first bubble cotton and form the bubble cotton, under the prerequisite of guaranteeing bubble cotton compressive resistance, can make the bubble cotton occupy less space in electronic equipment.
As an alternative implementation manner, as shown in fig. 1 and 2, the supporting plate 1021 is disposed on a first surface and a second surface of the second foam body 102, and the second surface is a surface parallel to the first surface.
For example, the supporting plates are respectively attached to the upper surface and the lower surface of the second foam body to improve the pressure resistance of the second foam body. The thickness of the support plate may be 0.1 to 2 mm.
As another alternative implementation, as shown in fig. 3 and 4, the second foam body includes:
a first foam layer 1022 and a second foam layer 1023;
the supporting plate 1021 is arranged between the first foam layer 1022 and the second foam layer 1023.
Here, set up above-mentioned backup pad in the middle of the cotton body of second bubble, can effectively prevent the problem of laminating dislocation when laminating the backup pad on the cotton body of second bubble.
The following description will be made on the process of manufacturing the conductive foam.
Firstly, 1 side wall soft cotton core (second foam body) with smaller thickness is adopted, and hard PET support plates with the thickness of 0.1-2 mm are pasted on the upper surface and the lower surface of the cotton core;
secondly, arranging the ultra-soft cotton cores with the overpressure-proof PET supporting plates on the left side and the right side and the main supporting soft cotton core (a first foam body) in the middle into a combined cotton core (a foam body);
then, the surface of a Polyimide Film (PI Film) with the thickness of 10-25 um is plated with copper with the thickness of 1-4 um for priming, and then plated with gold with the thickness of 0.05um after nickel with the thickness of 0.5-2 um is in contact plating.
And then, the PI film plated with gold is wrapped on the combined cotton core with the overpressure-proof PET supporting case, and a section of cotton core is exposed at the bottom.
And finally, adhering the double-sided adhesive with strong viscosity to the cotton core exposed in the middle of the bottom. And cutting the conductive foam into 1 small independent conductive foam by adopting a die cutting process.
In the embodiment of the application, 2 PET stromatolites of preventing excessive pressure are pasted on soft side cotton core, constitute the supporter with middle soft main cotton core to at PI membrane surface gold-plating, the bottom covers a double faced adhesive tape, form the cotton of a super soft gold-plating parcel electrically conductive bubble. Adopt the electrically conductive bubble of gilding PI parcel cotton, owing to designed the PET backup pad of preventing excessive pressure, electrically conductive bubble is cotton when energetically the pre-compaction, and the electrically conductive cloth of parcel can form the buckle that the angle of taking R is 0.2 to 0.5 millimeter, can not lead to the cladding material on the electrically conductive cloth surface of top layer to be cracked, and then does not influence the on-resistance.
As shown in fig. 7, an electronic device is further provided in an embodiment of the present application, which includes a screen 701, and a metal middle frame 702 connected to the screen, where the metal middle frame 702 is provided with a groove, the conductive foam 100 as claimed in any one of claims 1 to 10 is provided in the groove, and the conductive foam is attached to the arc-shaped area of the flexible screen.
The screen is a 3D flexible screen. As shown in fig. 7, the area of the metal middle frame corresponding to the bottom of the screen acts as a 5G high frequency antenna radiator. In the embodiment of the application, set up the recess in the metal center corresponding to the regional position of flexible screen arc, and then make the cotton ground connection position of conducting bubble be close to the antenna radiator of lateral wall, make ground connection return path shorten (ground connection return circuit route is through the dotted line indication of taking the arrow point, and current conducting bubble is cotton all to set up the screen region at the flexible screen), reduce the transmission inductance who produces, promote the ground connection efficiency of antenna, and improve antenna performance, and because the cotton ground connection position of conducting bubble is close to the antenna radiator of lateral wall, lead to the coincidence area on the return path of flexible screen bottom and metal center to reduce, parasitic capacitance has been reduced, antenna radiation performance has further been promoted. In addition, the conductive foam and the soft cotton core wrapped by the gold-plated PI generate smaller pressure on the bottom of the screen, and the flexible screen is not easy to generate poor-appearance marks. In addition, if the lower surface of the conductive foam is provided with the bonding layer, the upper surface of the conductive foam is attached to the arc-shaped area of the flexible screen.
Specifically, the bonding layer of the conductive foam is connected with the groove.
Here, the bonding layer that the one deck viscidity is very strong has been designed at the cotton bottom of electrically conductive bubble, and this bonding layer is insulating double faced adhesive tape, fixes in the recess through this bonding layer electrically conductive bubble is cotton, can prevent effectively that electronic equipment from leading to the cotton pine of electrically conductive bubble to take off when falling the vibrations.
It should be noted that the electronic device in the embodiment of the present application can implement all the implementation manners in the foregoing embodiment of the conductive foam, and can achieve the same technical effect, and details are not described here again.
Fig. 8 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.
The electronic device 800 includes, but is not limited to: a radio frequency unit 801, a network module 802, an audio output unit 803, an input unit 804, a sensor 805, a display unit 806, a user input unit 807, an interface unit 808, a memory 809, and a processor 810.
Those skilled in the art will appreciate that the electronic device 800 may further comprise a power source (e.g., a battery) for supplying power to the various components, and the power source may be logically connected to the processor 810 via a power management system, so as to manage charging, discharging, and power consumption management functions via the power management system. The electronic device structure shown in fig. 8 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is omitted here.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A conductive foam, comprising: the conductive film comprises a foam body, a conductive film and a bonding layer;
the foam body comprises a first foam body, a second foam body and a supporting plate, wherein the first foam body and the second foam body are attached to each other, and the supporting plate is arranged on the second foam body;
the conductive film is arranged on the first surface, the second surface and the third surface of the foam body in a wrapping mode, and the first part of the fourth surface of the foam body in a wrapping mode;
the adhesive layer is disposed on a second portion of the fourth surface.
2. The conductive foam of claim 1, wherein the foam body comprises two second foam bodies, and the two second foam bodies are respectively disposed on two opposite sides of the first foam body.
3. The conductive foam of claim 1, wherein the foam body comprises one second foam body, and one second foam body is attached to the side surface of the first foam body.
4. The conductive foam of claim 1, wherein the support plate is disposed on a first surface and a second surface of the second foam body, and the second surface is a surface parallel to the first surface.
5. The conductive foam of claim 1, wherein the second foam body comprises:
the first foam layer and the second foam layer;
the backup pad set up in first bubble is cotton the layer with between the second bubble is cotton the layer.
6. The conductive foam of claim 1, wherein the conductive film is a gold-plated conductive film.
7. The conductive foam of claim 1, wherein the support sheet is a thermoplastic polyester PET support sheet.
8. The conductive foam of claim 1, wherein the first foam body has the same height as the second foam body provided with the support plate.
9. An electronic device, comprising: the screen, with the metal center that the screen is connected, its characterized in that, the metal center is provided with the recess, set up in the recess and be following claim 1 to 8 any electrically conductive bubble cotton, just electrically conductive bubble cotton with the arc region laminating of screen.
10. The electronic device of claim 9, wherein the adhesive layer of the conductive foam is coupled to the recess.
CN202010563890.2A 2020-06-19 2020-06-19 Conductive foam and electronic equipment Active CN111782078B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010563890.2A CN111782078B (en) 2020-06-19 2020-06-19 Conductive foam and electronic equipment
PCT/CN2021/100578 WO2021254428A1 (en) 2020-06-19 2021-06-17 Electrically-conductive foam and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010563890.2A CN111782078B (en) 2020-06-19 2020-06-19 Conductive foam and electronic equipment

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CN111782078A true CN111782078A (en) 2020-10-16
CN111782078B CN111782078B (en) 2023-12-22

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CN112993606A (en) * 2021-02-07 2021-06-18 维沃移动通信有限公司 Electronic equipment and preparation method of elastic grounding assembly
WO2021254428A1 (en) * 2020-06-19 2021-12-23 维沃移动通信有限公司 Electrically-conductive foam and electronic device
CN114914774A (en) * 2022-07-13 2022-08-16 深圳市卓汉材料技术有限公司 Grounding elastic terminal, manufacturing method and electronic equipment
WO2022213715A1 (en) * 2021-04-08 2022-10-13 荣耀终端有限公司 Electronic device

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CN102422730A (en) * 2009-05-13 2012-04-18 莱尔德技术股份有限公司 Conductive films for emi shielding applications
CN203567288U (en) * 2013-10-31 2014-04-30 厦门精码信息技术有限公司 Conductive foam
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WO2021254428A1 (en) * 2020-06-19 2021-12-23 维沃移动通信有限公司 Electrically-conductive foam and electronic device
CN112993606A (en) * 2021-02-07 2021-06-18 维沃移动通信有限公司 Electronic equipment and preparation method of elastic grounding assembly
WO2022213715A1 (en) * 2021-04-08 2022-10-13 荣耀终端有限公司 Electronic device
CN114914774A (en) * 2022-07-13 2022-08-16 深圳市卓汉材料技术有限公司 Grounding elastic terminal, manufacturing method and electronic equipment

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