CN208570149U - Insulating film, flexible flat cable and display device - Google Patents
Insulating film, flexible flat cable and display device Download PDFInfo
- Publication number
- CN208570149U CN208570149U CN201821503780.1U CN201821503780U CN208570149U CN 208570149 U CN208570149 U CN 208570149U CN 201821503780 U CN201821503780 U CN 201821503780U CN 208570149 U CN208570149 U CN 208570149U
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- insulating coating
- insulating
- arranging wire
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- 239000000843 powder Substances 0.000 claims abstract description 99
- 238000000576 coating method Methods 0.000 claims description 66
- 239000011248 coating agent Substances 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 37
- 239000011159 matrix material Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000009413 insulation Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 239000005030 aluminium foil Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 210000000981 epithelium Anatomy 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000733 Li alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- GCICAPWZNUIIDV-UHFFFAOYSA-N lithium magnesium Chemical compound [Li].[Mg] GCICAPWZNUIIDV-UHFFFAOYSA-N 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Insulated Conductors (AREA)
Abstract
The utility model discloses an insulating involucra, soft arranging wire and display device, wherein, insulating involucra is used for the soft arranging wire, and insulating involucra includes the first insulation layer and the shielding layer of overlapping, first insulation layer and shielding layer interconnect, and this shielding layer includes the base member, is provided with conductive powder in this base member. The utility model discloses improve the structure of insulating involucra, simplified the production technology of soft arranging wire.
Description
Technical field
The utility model relates to show equipment technical field more particularly to a kind of insulating coating, soft arranging wire and display device.
Background technique
In the electronic equipments such as LCD TV, host computer, generalling use flexible soft arranging wire (FFC) will be electric between each connector
Connection.Existing flexibility soft arranging wire generally includes conductor layer, and, the insulating coating set on conductor layer side, in insulating coating
The metal foils such as one layer of aluminium foil or copper foil are also pasted with away from a side surface of conductor layer, to prevent flexible soft arranging wire by electricity
Magnetic disturbance and the transmission for influencing signal.
But it is above-mentioned in such a way that the metal foils such as aluminium foil or copper foil shield electromagnetism, it can make flexible soft
The manufacturing procedure of winding displacement is more, influences the production and processing efficiency of flexible soft arranging wire, increase the manufacturing of flexible soft arranging wire at
This.
Utility model content
The main purpose of the utility model is to provide a kind of insulating coatings, it is intended to improve the structure of insulating coating, reduce
The production craft step of soft arranging wire, and then the production efficiency of soft arranging wire is improved, reduce the manufacturing cost of soft arranging wire.
To achieve the above object, the utility model proposes a kind of insulating coatings, are used for soft arranging wire, and the insulating coating includes
The first insulating layer and shielded layer of overlapping, first insulating layer and the shielded layer are connected with each other, and the shielded layer includes base
Body is provided with conductive powder in described matrix.
Optionally, first insulating layer and described matrix are integrally formed setting.
Optionally, the material of first insulating layer is identical as the material of described matrix, and the density of the conductive powder is big
In the density of described matrix material, the conductive powder sinks in the basic material of molten condition, has described lead to be formed
The shielded layer of electro-powder, and the first insulating layer without the conductive powder.
Optionally, the material of first insulating layer is identical as the material of described matrix, and the density of the conductive powder is small
In the density of described matrix material, the conductive powder floats in the basic material of molten condition, has described lead to be formed
The shielded layer of electro-powder, and the first insulating layer without the conductive powder.
Optionally, the conductive powder includes metal powder and/or carbon dust.
Optionally, the thickness h of the insulating coating meets: 0.01mm≤h≤0.1mm.
The utility model also proposes a kind of soft arranging wire, which includes:
Conductor layer；
And insulating coating as described above, the insulating coating include the first insulating layer and shielded layer of overlapping, described the
One insulating layer and the shielded layer are connected with each other, and the shielded layer includes matrix, and conductive powder is provided in described matrix, described
Insulating coating is connect with the side of the conductor layer, and the first insulating layer of the insulating coating is bonded with conductor layer.
Optionally, the two sides of the conductor layer are equipped with the insulating coating.
Optionally, the side of the conductor layer is provided with the insulating coating, and the other side of the conductor layer is equipped with second
Insulating layer.
The utility model also proposes a kind of display device, which includes soft arranging wire as described above, the soft row
Line includes:
Conductor layer；
And insulating coating as described above, the insulating coating include the first insulating layer and shielded layer of overlapping, described the
One insulating layer and the shielded layer are connected with each other, and the shielded layer includes matrix, and conductive powder is provided in described matrix, described
Insulating coating is connect with the side of the conductor layer, and the first insulating layer of the insulating coating is bonded with conductor layer.
The utility model includes the first insulating layer and shielded layer interconnected by using the insulating coating in soft arranging wire,
Making shielded layer includes matrix, and conductive powder is arranged in matrix, so that shielded layer has the effect of anti-electromagnetic interference.As a result,
Shielded layer can replace the metal foils such as aluminium foil or copper foil, and soft arranging wire is made to no longer need to paste metal during the manufacturing
Paillon reduces the cost and thickness of soft arranging wire, it furthermore reduces pasting metal foil during manufacturing soft arranging wire
The process of piece, improves the processing efficiency of soft arranging wire, and reduces the manufacturing cost of soft arranging wire.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of display device in the utility model；
Fig. 2 is the enlarged drawing in Fig. 1 at A；
Fig. 3 be Fig. 2 in along the direction A-A cross-sectional view partial view.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 11 | Soft arranging wire | 111 | Conductor layer |
| 12 | Insulating coating | 112 | Second insulating layer |
| 13 | Display panel | 121 | First insulating layer |
| 14 | Circuit board | 122 | Shielded layer |
| 15 | Connector |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making the creative labor premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and cannot understand
For its relative importance of indication or suggestion or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the "and/or" occurred in full text contains
Justice is, including three schemes arranged side by side, by taking " A and/or B " as an example, including the side that A scheme or B scheme or A and B meet simultaneously
Case.It in addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
It is enough realize based on, will be understood that the knot of this technical solution when conflicting or cannot achieve when occurs in the combination of technical solution
Conjunction is not present, also not within the protection scope of the requires of the utility model.
The application proposes a kind of insulating coating, which is mainly used for soft arranging wire.
Referring to Fig. 3, the insulating coating 12 includes the first insulating layer 121 and shielded layer 122 of overlapping, first insulating layer
121 and shielded layer 122 be connected with each other, and in shielded layer 122 be provided with conductive powder so that there is shielded layer 122 anti-electromagnetism to do
The effect disturbed.Specifically, can make shielded layer 122 includes matrix, and conductive powder is provided in matrix, when by insulating coating
12 with the conductor layer 111 of soft arranging wire 11 when connecting, and the first insulating layer 121 is connect with the side of conductor layer 111, and shielded layer 122
Deviate from the side of conductor layer 111 in the first insulating layer 121, to prevent the conductive powder in shielded layer 122 from connecing with conductor layer 111
Touching, and prevent the conductor layer 111 of soft arranging wire 11 by electromagnetic interference.It is understood that by the matrix of shielded layer 122
Setting conductive powder makes shielded layer 122 have anti-electromagnetic interference effect, to make the nothing during manufacturing of soft arranging wire 11
Metal foil need to be pasted again, reduce the thickness and Material Cost of soft arranging wire 11；Moreover, by replacing metal with shielded layer 122
Paillon also reduces the process that metal foil is pasted during manufacturing soft arranging wire 11, to reach simplified soft arranging wire
11 processing technology, improves the processing efficiency of soft arranging wire 11, and reduces the purpose of the manufacturing cost of soft arranging wire 11.
In one embodiment, the matrix of the first insulating layer 121 and shielded layer 122 can be made to be integrally formed setting.As a result, can
Enough make the processing of insulating coating 12 more convenient, and the bonding strength between the first insulating layer 121 and shielded layer 122 is higher, mentions
The high stability of insulating coating 12.
Wherein it is possible to keep the material of the first insulating layer 121 identical as the basic material of shielded layer 122, by exhausted in processing
During edge epithelium 12, it is mixed into conductive powder in the basic material of molten condition, to form the shielding with conductive powder
Layer 122, and the first insulating layer 121 without conductive powder, to keep the processing of insulating coating 12 more convenient.
Specifically, the density of conductive powder can be made to be greater than the density of basic material, by the way that conductive powder is mixed into melting
In the basic material of state, make conductive powder during mixing under be sunken to the bottom of basic material, there is conduction to be formed
The shielded layer 122 of powder, and the first insulating layer 121 without conductive powder.It is understood that conductive powder sinks down into base
Behind the bottom of body material, conductive bisque can be formed in the bottom of basic material, to form the shielding with effectiveness
Layer 122；The top of basic material does not include conductive powder or only includes micro conductive powder, so that being formed has insulation effect
The first insulating layer 121.
It should be noted that by making conductive powder sink in the basic material in molten condition, to form first absolutely
The method of edge layer 121 and shielded layer 122, it is not only easy to process, but also the thinner thickness of insulating coating 12 can be made, it is soft to reduce
The integral thickness of winding displacement 11 is thinned the product for being equipped with the soft arranging wire 11 more, improves the competitiveness of product.Especially when
When the soft arranging wire 11 is in liquid crystal display device, the thickness of liquid crystal display device can be further reduced, the liquid crystal is improved
The competitive advantage of display device.
It is of course also possible to make the density of conductive powder less than the density of matrix, by the way that conductive powder is mixed into molten condition
Basic material in, make conductive powder during mixing on float on the top of basic material, there is conductive powder to be formed
Shielded layer 122, and the first insulating layer 121 without conductive powder.It is understood that conductive powder floats up to matrix material
Behind the top of matter, conductive bisque can be formed on the top of basic material, to form the shielded layer with effectiveness
122；The lower part of basic material does not include conductive powder or only includes micro conductive powder, so that being formed has insulation effect
First insulating layer 121.
Furthermore it is also possible to make conductive powder that there is magnetism, by the way that conductive powder is mixed into the basic material of molten condition,
And the basic material of molten condition is placed in magnetic field, make conductive powder under the influence of a magnetic field on float on the upper of basic material
Portion has the shielding of conductive powder with formation alternatively, conductive powder is made to be sunken to the bottom of basic material down under the influence of a magnetic field
Layer 122, and the first insulating layer 121 without conductive powder, details are not described herein again.
It should be noted that making the density of conductive powder be greater than matrix material while conductive powder can be made to have magnetic
The density of matter, so as to be sunken to the bottom of basic material under conductive powder is quick under the action of gravity and magnetic field；It can also make to lead
While electro-powder has magnetic, the density of conductive powder is set to be less than the density of basic material, so that conductive powder floating upward quickly
In the top of basic material.
In addition it is also possible to by any one in the modes such as welding, stickup, quadric injection mould by 121 and of the first insulating layer
Shielded layer 122 connects.Such as: by 121 secondary injection molding of the first insulating layer on the side of shielded layer 122, insulated with being formed
Epithelium 11；Alternatively, 122 secondary injection molding of shielded layer of conductive powder will be accommodated on 121 side side of the first insulating layer, with
Form insulating coating 11.
In one embodiment, it can be blended with conductive powder, and be formed with the first insulating layer 121 and shielded layer 122
Basic material carries out extrusion process, to form thinner insulating coating 12.
In one embodiment, can make conductive powder includes metal powder and/or carbon dust, so that shielded layer 122 has preferably
Effectiveness while, reduce the cost of conductive powder.Wherein, conductive powder can be one in metal powder and carbon dust
Kind, or the mixture of metal powder and carbon dust, it specifically can be depending on the material of insulating coating 12.
It should be noted that above-mentioned metal powder can be the powder such as iron powder, aluminium powder, copper powder, silver powder, or iron powder,
At least two in the powder such as aluminium powder, copper powder, silver powder mix mixture.In addition, metal powder can also for various metals or
Person's metal and nonmetallic manufactured alloy powder or metal oxide powder etc..
When the density of conductive powder is less than the density of matrix, can make conductive powder includes magnesium lithium alloy, conductive as a result,
The density of powder is lower, can on float on molten condition basic material top.Certainly, conductive powder may be other close
Lower powder is spent, herein with no restriction.
In one embodiment, the matrix of insulating coating 12 can be made to be made of plastic material, so that conductive powder can be more
Good is mixed into basic material, and reduces the cost of insulating coating 12.
In the application, in shielded layer 122 content of conductive powder specifically can depending on environment used in soft arranging wire 11,
When the place stronger for electromagnetic radiation of soft arranging wire 11, the conductive powder content in shielded layer 122 can be made higher, as soft row
When line 11 is used for electromagnetic radiation weaker place, the conductive powder content in shielded layer 122 can be made lower.
It should be noted that the content of conductive powder refers to that the total volume of conductive powder accounts for shielding in above-mentioned shielded layer 122
The ratio of 122 total volume of layer.The ratio that the total volume of conductive powder accounts for 122 total volume of shielded layer is higher, the shielding effect of shielded layer
Fruit is better, and when conductive powder fills full entire shielded layer 122, the shield effectiveness of shielded layer is best.
In one embodiment, the ratio that the total volume of conductive powder can be made to account for 122 total volume of shielded layer is greater than or equal to
70%, so that the effectiveness of the shielded layer 122 with conductive powder is preferable.Wherein it is possible to further make conductive powder
Total volume account for the ratio of 122 total volume of shielded layer and reach 80% or 90% etc., herein with no restriction.
In one embodiment, the thickness of shielded layer 122 can be made to be greater than or equal to 0.005mm, to improve shielded layer 122
Intensity, and make the shielded layer 122 for being provided with conductive powder that there is preferable effectiveness.Furthermore it is also possible to make shielded layer
122 thickness, which is less than or equal to 0.02mm, reduces cost to improve the utilization rate of conductive powder.Wherein, the tool of shielded layer 122
Body thickness can be 0.008mm, 0.01mm, 0.012mm, 0.015mm etc., and the present embodiment is with no restriction.
It should be noted that the specific thickness of shielded layer 122 can be depending on environment used in soft arranging wire 11, as soft row
When line 11 is stronger local for electromagnetic radiation, the thickness of shielded layer 122 can be increased, improve anti-electromagnetic interference capability；When soft
When winding displacement 11 is used for electromagnetic radiation weaker place, the thickness in shielded layer 122 can be suitably reduced, is reducing insulating coating 12
Thickness and while cost, make the shielded layer 122 for being provided with conductive powder that there is certain shield effectiveness.
It should be noted that the total volume of conductive powder can be made to account for the ratio of 122 total volume of shielded layer, with shielded layer
122 thickness meets above-mentioned requirements simultaneously, and one of them can also be made to meet above-mentioned requirements, certainly, when the two meets simultaneously
It states when requiring, the shield effectiveness of insulating coating 11 is more preferable.
In one embodiment, the thickness h of insulating coating 12 can be made to be less than or equal to 0.12mm, so that insulating coating 12 has
While having preferable insulation and anti-electromagnetic interference effect, the cost of insulating coating 12 is reduced.Furthermore it is also possible to make insulating coating
12 thickness h is greater than or equal to 0.01mm, so that the processing of insulating coating 12 is more convenient.It is alternatively possible to make insulating coating
12 thickness h meets: 0.01mm≤h≤0.1mm, so that the processing of insulating coating 12 is more convenient.
The application also proposes a kind of soft arranging wire 11, which includes in conductor layer 111 and above-mentioned any one embodiment
Insulating coating 12.Wherein, the first insulating layer 121 of insulating coating 12 is connect with the side of conductor layer 111, and insulating coating 12
The first insulating layer 121 be bonded with conductor layer 111, the shielded layer 122 of insulating coating 12 is located at the first insulating layer 121 away from conducting wire
The side of layer 111 prevents the conduction in shielded layer 122 so that the first insulating layer 121 separates shielded layer 122 and conductor layer 111
Powder connect with the multiple conducting wires in conductor layer 111 and causes the problem of short circuit.
It should be noted that can be by pasting, welding between conductor layer 111 and the first insulating layer 121 of insulating coating 12
It the modes such as connects to link together, herein with no restriction.In addition, soft arranging wire 11 is displayed for the transmission of the signal in device and plate
Plate connection can be used for signal transmission or the connection of plate plate etc. in the electronic products such as printer, speaker.
In one embodiment, as shown in figure 3, above-mentioned insulating coating 12 can be arranged in the side of conductor layer 111, in conducting wire
The other side of layer 111 sets second insulating layer 112, while the conductor layer 111 for making soft arranging wire 11 not will receive electromagnetic interference, drop
The cost of low soft arranging wire 11, and reduce the thickness of soft arranging wire 11.At this point it is possible to make the company on the end and circuit board of soft arranging wire 11
When connecing device electrical connection, insulating coating 12 is set to be located at the side that conductor layer 111 deviates from circuit board 14, so that insulating coating 12 is to conducting wire
Layer 111 has better effectiveness.
It is of course also possible to insulating coating 12 be arranged simultaneously in the two sides of conductor layer 111, so that soft arranging wire 11 has more preferably
Electromagnetism interference effect.It should be noted that when insulating coating 12 is arranged in the two sides of conductor layer 111, two insulation
First insulating layer 121 of epithelium 12 is respectively with the two sides of conductor layer 111 towards being bonded, by conductor layer 111 and two insulating coatings
12 shielded layer separates.
The application also proposes a kind of display device, which includes the soft arranging wire 11 in above-mentioned any one embodiment.
Wherein, the specific component connected by soft arranging wire 11 in display device is with no restriction.It, can such as shown in Fig. 1 and Fig. 2
So that display device includes display panel 13, and make to connect between at least two circuit boards in the display device by soft arranging wire 11
It connects, two circuit boards can be in the circuit boards such as sequential control circuit plate, system board, backlight drive board or source electrode drive circuit plate
Any two need circuit board interconnected.Certainly, above-mentioned soft row can also be passed through between other components in display device
Line 11 is attached, herein with no restriction.
It is alternatively possible to make that connector 15 is arranged on the component connecting in display device with soft arranging wire 11, soft arranging wire 11
The connector 15 is inserted into end, so that soft arranging wire 11 is electrically connected with the component.By taking the circuit board 14 in display device as an example, such as scheme
It, can be in the circuit board 14 in display device when soft arranging wire 11 is connect with the circuit board 14 in display device shown in 1 and Fig. 2
Upper setting connector 15, and it is electrically connected soft arranging wire 11 with circuit board 14 by connector 15, to make circuit board 14 and soft row
Connection between line 11 is more convenient.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of insulating coating is used for soft arranging wire, which is characterized in that the insulating coating includes the first insulating layer and screen of overlapping
Layer is covered, first insulating layer and the shielded layer are connected with each other, and the shielded layer includes matrix, is provided with and leads in described matrix
Electro-powder.
2. insulating coating as described in claim 1, which is characterized in that first insulating layer and described matrix integrated molding are set
It sets.
3. insulating coating as claimed in claim 2, which is characterized in that the material of first insulating layer and the material of described matrix
Matter is identical, and the density of the conductive powder is greater than the density of described matrix material, matrix of the conductive powder in molten condition
Sink in material, to form the shielded layer with the conductive powder, and the first insulating layer without the conductive powder.
4. insulating coating as claimed in claim 2, which is characterized in that the material of first insulating layer and the material of described matrix
Matter is identical, and the density of the conductive powder is less than the density of described matrix material, matrix of the conductive powder in molten condition
It floats in material, to form the shielded layer with the conductive powder, and the first insulating layer without the conductive powder.
5. the insulating coating as described in any one of Claims 1-4, which is characterized in that the conductive powder includes metal
Powder and/or carbon dust.
6. the insulating coating as described in any one of Claims 1-4, which is characterized in that the thickness h of the insulating coating is full
Foot: 0.01mm≤h≤0.1mm.
7. a kind of soft arranging wire, which is characterized in that the soft arranging wire includes:
Conductor layer；
And the insulating coating as described in any one of claim 1 to 6, the side company of the insulating coating and the conductor layer
It connects, the first insulating layer of the insulating coating is bonded with conductor layer.
8. soft arranging wire as claimed in claim 7, which is characterized in that the two sides of the conductor layer are equipped with the insulating coating.
9. soft arranging wire as claimed in claim 7, which is characterized in that the side of the conductor layer is provided with the insulating coating,
The other side of the conductor layer is equipped with second insulating layer.
10. a kind of display device, which is characterized in that the display device includes as described in any one of claim 7 to 9
Soft arranging wire.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821503780.1U CN208570149U (en) | 2018-09-13 | 2018-09-13 | Insulating film, flexible flat cable and display device |
| PCT/CN2018/116672 WO2020052075A1 (en) | 2018-09-13 | 2018-11-21 | Insulating film, flexible flat cable, and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821503780.1U CN208570149U (en) | 2018-09-13 | 2018-09-13 | Insulating film, flexible flat cable and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208570149U true CN208570149U (en) | 2019-03-01 |
Family
ID=65451731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821503780.1U Active CN208570149U (en) | 2018-09-13 | 2018-09-13 | Insulating film, flexible flat cable and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208570149U (en) |
| WO (1) | WO2020052075A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133476A (en) * | 2020-08-12 | 2020-12-25 | 番禺得意精密电子工业有限公司 | Conductive substrate and method for manufacturing the same |
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| CN2377798Y (en) * | 1999-05-19 | 2000-05-10 | 伽太实业有限公司 | Soft bank preventing interference of electromagnetic wave |
| JP5726048B2 (en) * | 2011-11-14 | 2015-05-27 | 藤森工業株式会社 | Electromagnetic wave shielding material for FPC |
| CN102867577A (en) * | 2012-09-05 | 2013-01-09 | 江苏讯为电子器材有限公司 | Anti-electromagnetic interference flexible flat cable |
| CN203366793U (en) * | 2013-05-23 | 2013-12-25 | 天瑞电子科技发展(昆山)有限公司 | Wire arrangement structure |
| CN105101622B (en) * | 2015-08-24 | 2017-10-03 | 浙江展邦电子科技有限公司 | A kind of wiring board with shielding construction and preparation method thereof |
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2018
- 2018-09-13 CN CN201821503780.1U patent/CN208570149U/en active Active
- 2018-11-21 WO PCT/CN2018/116672 patent/WO2020052075A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133476A (en) * | 2020-08-12 | 2020-12-25 | 番禺得意精密电子工业有限公司 | Conductive substrate and method for manufacturing the same |
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| WO2020052075A1 (en) | 2020-03-19 |
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