CN115036717B - Electric connection unit, manufacturing method and electronic equipment - Google Patents

Electric connection unit, manufacturing method and electronic equipment Download PDF

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Publication number
CN115036717B
CN115036717B CN202210953514.3A CN202210953514A CN115036717B CN 115036717 B CN115036717 B CN 115036717B CN 202210953514 A CN202210953514 A CN 202210953514A CN 115036717 B CN115036717 B CN 115036717B
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conductive layer
layer
structural member
plane
electrical connection
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CN115036717A (en
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孟胤
江成
秦昌
高静
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Honor Device Co Ltd
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Honor Device Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The embodiment of the application provides an electric connection unit, a manufacturing method and electronic equipment, wherein the electric connection unit comprises a first assembly and a second assembly, the first assembly comprises a first structural member and an adhesive conducting layer, the first structural member comprises a structural body and a protective layer, the structural body comprises a metal piece, the surface of the metal piece is provided with an electric connection area, and the electric connection area is exposed outside the first structural member; the protective layer is positioned on the periphery of the electric connection area and is coated on the surface of the metal piece; the adhesive conducting layer covers the electric connection area and the protective layer on the periphery of the electric connection area; the second assembly comprises a second structural part, the second structural part is conducted with the electric connection region through the viscous conducting layer, and the electric connection unit has good reliability and can improve the medium-term and long-term performance of the electronic equipment.

Description

Electric connection unit, manufacturing method and electronic equipment
Technical Field
The present disclosure relates to electronic technologies, and in particular, to an electrical connection unit, a manufacturing method thereof, and an electronic device.
Background
The elastic sheet electricity connecting piece plays an important role in electronic equipment as a main component for connecting and conducting two metal pieces.
Currently, a reed is used as a common way to improve the electrical contact interface on the middle frame of an electronic device. The spring plate is usually fixed on an electrical contact interface of the middle frame by welding, and other parts of the electronic device, such as the circuit board, which need to be electrically connected with the middle frame abut against the spring plate through the spring plate, so that the circuit board is conducted with the middle frame. The middle frame is usually made of light metal such as aluminum material, aluminum alloy and magnesium alloy, and when the light metal welding reed is connected with the circuit board through the elastic sheet, although the electric contact interface of the middle frame can be improved in a manner of welding the reed, the requirements on the thickness of the middle frame and the area of the reed are high. In the related art, silver paste is printed on the electric contact interface of the middle frame, and the thickness of the middle frame and the area requirement of the silver paste can be reduced while the electric contact interface of the middle frame is improved by replacing a reed with the silver paste.
However, the test finds that galvanic corrosion still exists on the middle frame at the electrical contact interface, which easily causes silver paste to be debonded, and further affects the reliability of the connection between the middle frame and other components in the electronic device, such as a circuit board, and the middle-long term performance of the electronic device.
Disclosure of Invention
The application provides an electric connection unit, a manufacturing method and electronic equipment, so that the electric connection unit not only has better reliability, but also can improve the medium-term and long-term performance of the electronic equipment.
The first aspect of the embodiments of the present application provides an electrical connection unit, which includes a first component and a second component, where the first component includes a first structural member and an adhesive conductive layer, the first structural member includes a structural body and a protective layer, the structural body includes a metal piece, a surface of the metal piece has an electrical connection region, and the electrical connection region is exposed outside the first structural member; the protective layer is positioned on the periphery of the electric connection area and is coated on the surface of the metal piece; the adhesive conducting layer covers the electric connection area and the protective layer on the periphery of the electric connection area;
the second assembly comprises a second structural member which is conducted with the electric connection region through the adhesive conductive layer.
According to the embodiment of the application, through arrangement of the first assembly and the second assembly in the electric connection unit, the first assembly comprises the first structural member and the viscous conducting layer, the viscous conducting layer covers the electric connection area of the first structural member, so that the second structural member is conducted with the electric connection area of the first structural member through the viscous conducting layer, the first structural member is electrically connected with the second structural member, electric signals can be conveniently transmitted between the first structural member and the second structural member, meanwhile, the contact effect of the surface of the electric connection area can be improved by replacing a reed with the viscous conducting layer, and compared with a mode that the electric contact interface of the middle frame is improved through the reed, the thickness of the first structural member and the occupied area of the viscous conducting layer on the first structural member can be reduced. On the basis, through the arrangement of covering the viscous conducting layer on the electric connection area and the protective layer on the peripheral side of the electric connection area, the situation that electrolyte enters the electric connection area through a gap between the viscous conducting layer and the protective layer can be avoided, galvanic corrosion of the first structural member in the electric connection area is avoided, the viscous conducting layer stably covers the electric connection area, the reliability of connection of the second structural member and the first structural member is ensured, the medium-and-long-term performance of the electronic equipment is improved, and the electronic equipment has good benefits in the weight and the thickness of the whole machine.
In an alternative embodiment, the area of the adhesive conductive layer is larger than the area of the electrical connection region, and the peripheral side edge of the adhesive conductive layer overlies the protective layer on the peripheral side of the electrical connection region.
By limiting the area of the adhesive conductive layer and the position of the peripheral side edge relative to the protective layer, the adhesive conductive layer can be connected with the protective layer while completely covering the adhesive conductive layer, so as to block the path of the electrolyte entering the electric connection area, and avoid galvanic corrosion of the first structural member in the electric connection area.
In an optional embodiment, the structural body further includes a plastic part connected to the metal part, and the adhesive conductive layer is located between the metal part and the plastic part and covers the electrical connection area, the protective layer around the electrical connection area, and a connection portion between the metal part and the plastic part.
Because the sticky conducting layer is positioned between the metal piece and the plastic piece and covers the electric connection area, the protective layer on the peripheral side of the electric connection area and the joint of the metal piece and the plastic piece, the sticky conducting layer can cover the electric connection area, the protective layer and the plastic piece simultaneously, and the path of electrolyte entering the electric connection area is completely sealed, so that the occurrence of galvanic corrosion of the electric connection area is avoided.
In an alternative embodiment, the structural body has a first plane and a second plane in a direction towards the second structural part, the first plane and the second plane being two planes intersecting on the structural body; the second structural member is provided with a conduction surface which is conducted with the first structural member, and the first plane is parallel to the conduction surface;
the adhesive conducting layer at least covers the first plane, and the second structural member is positioned at the corner of the first plane and the second plane and is conducted with the first structural member through the conducting surface and the adhesive conducting layer.
Through the setting that the second structure is located the corner of first plane and second plane like this, realize the second structure and assemble in first structure for when the structural style of electricity connection unit is more diversified, because the setting of viscidity conducting layer at least cover first plane, can be convenient for according to the difference of the position of setting of electric connection district, select the viscidity conducting layer of different length, so that the second structure switches on with first structure through switching on the face and viscidity conducting layer, thereby strengthen the reliability of being connected electrically between second structure and the first structure, reach the purpose of improving the medium and long term performance of electronic equipment.
In an alternative embodiment, the first plane has a plastic surface of a plastic part, the plastic surface is opposite to the conducting surface, and the electrical connection region is exposed to the second plane;
the adhesive conductive layer comprises a first conductive layer and a second conductive layer, wherein the first conductive layer is respectively positioned on the first plane and the second plane to cover the electric connection region; the second conducting layer is positioned at the corner to connect the adjacent first conducting layers, so that the second structural member is conducted with the electric connection region.
Through the arrangement of the first conducting layer and the second conducting layer, the first conducting layers on the first plane and the second plane can be connected through the second conducting layer, so that the viscous conducting layer is continued to the plastic surface, the second structural member is ensured to be electrically connected with the first structural member, meanwhile, the viscous conducting layer can be printed at different positions of the structural body respectively, and therefore the first conducting layer and the second conducting layer are formed by selecting viscous conducting materials with different materials according to different positions of the first conducting layer and the second conducting layer on the structural body.
In an optional embodiment, the joint is located in the middle of the second plane, the adhesive conductive layer further includes a third conductive layer located at the joint to connect the metal member and the plastic member with the adjacent first conductive layer, wherein the elongation at break of the third conductive layer is greater than the elongation at break of the first conductive layer.
Through the setting of third conducting layer like this, two adjacent first conducting layers in connecting the first plane to when realizing that second structure and first structure are connected electrically, because the fracture elongation of third conducting layer is greater than the fracture elongation of first conducting layer, make the third conducting layer have certain ductility, can also effectively reduce the structure body when receiving the impact, because the sticky conducting layer function failure's that metal part and plastic part separation lead to problem.
In an alternative embodiment, the first conductive layer is a pad printing adhesive conductive layer, the corners and the joints are dispensing areas, and the second conductive layer and the third conductive layer are conductive layers formed in the dispensing areas by dispensing.
Like this through the setting in bat printing viscidity conducting layer and some gluey district, when realizing the viscidity conducting layer in the printing respectively of structure body different positions department, can also be according to the demand of structure body in different positions department to viscidity conducting layer performance, select the viscidity conducting material of adaptation, through the printing respectively of structure body different positions department, form the viscidity conducting layer, on the basis to viscidity conducting layer performance demand in the different positions department of satisfying the structure body, can also reduce the structure size of second conducting layer and viscidity conducting layer.
In an alternative embodiment, the thickness of the first conductive layer on the first plane is greater than the thickness of the first conductive layer on the second plane, or the hardness of the first conductive layer on the first plane is greater than the hardness of the first conductive layer on the second plane.
Therefore, the thickness and hardness of the first conducting layer on the first plane and the second plane are limited, so that the first conducting layer on the first plane has better wear resistance, waste of viscous conducting materials forming the first conducting layer on the second plane is reduced, the area of a region with larger resistivity in the viscous conducting layer can be reduced, and the performance of the electronic equipment is improved.
In an optional implementation manner, the first structural member is a middle frame of the electronic device, and when the metal piece of the first structural member is located on a side of the second structural member, the metal piece is an antenna radiator of the electronic device, and the second structural member is a circuit board of the electronic device.
Therefore, the circuit board can be reliably and electrically connected with the antenna radiator, so that signal transmission between the circuit board and the antenna radiator is realized, and due to the arrangement of the first conducting layer and the second conducting layer, the viscous conducting layers can be printed at different positions of the structure body respectively, so that the structural size of the viscous conducting layers is reduced, the influence of one-time printing of the viscous conducting layers on the performance of the antenna radiator is avoided, and meanwhile, the electronic equipment can have better benefits in the weight and the thickness of the whole machine.
In an alternative embodiment, the second component includes an electrical connector in electrical communication with the second structural member, the electrical connector is located between the second structural member and the adhesive conductive layer to electrically connect the second structural member with the first structural member, and a side of the second structural member connected to the electrical connector is a conductive side.
Therefore, the second structural member and the first structural member can be conducted through the arrangement of the electric connector, so that the first structural member and the second structural member are reliably electrically connected.
In an alternative embodiment, the second assembly further comprises an insulating dielectric layer between the second structural member and the electrical connector such that the electrical connector and the second structural member form a coupling feed assembly configured to conduct the second structural member with the first structural member through the adhesive conductive layer.
Through the arrangement of the insulating medium layer, a certain distance can be formed between the electrical connector and the second structural member so as to form a coupling feed assembly, so that the second structural member can transmit an electrical signal to the first structural member through a coupling feed mode.
In an alternative embodiment, the adhesive conductive layer is a silver paste layer.
By means of the arrangement of the silver paste layer, the second structural member and the first structural member are reliably electrically connected, and meanwhile the electric connection area can be covered by the silver paste layer, so that the contact effect of the surface of the electric connection area is improved.
A second aspect of embodiments of the present application provides a manufacturing method of an electrical connection unit, the manufacturing method being applied to the electrical connection unit as defined in any one of the above, the manufacturing method including:
forming an adhesive conductive pattern on a surface of the first structural member so that the adhesive conductive pattern covers the electric connection region of the first structural member and the protective layer on the periphery side of the electric connection region; the first structural member comprises a structural body and a protective layer, the structural body comprises a metal piece, and the electric connection region is arranged on the metal piece and exposed outside the first structural member; the protective layer is coated on the surface of the metal piece and is positioned on the periphery of the electric connection area;
curing the adhesive conductive pattern to form an adhesive conductive layer;
and conducting the second assembly with the adhesive conductive layer so as to conduct a second structural member in the second assembly with the first structural member.
Compared with a mode that the reed improves an electric contact interface of the middle frame, the embodiment of the application replaces the reed with the adhesive conductive layer to improve the contact effect of the electric connection area, so that the thickness of the first structural member and the area occupied by the adhesive conductive layer on the first structural member can be reduced while the second structural member is electrically connected with the first structural member. In addition, through the arrangement of the viscous conducting layer, electrolyte can be prevented from entering the electric connection area, so that galvanic corrosion of the first structural member in the electric connection area is avoided, the viscous conducting layer stably covers the electric connection area, the reliability of connection between the second structural member and the first structural member is ensured, and the medium-and-long-term performance of the electronic equipment is improved.
In an alternative embodiment, the first plane of the structural body includes a plastic surface, the plastic surface is disposed opposite to the conducting surface of the second structural member, and the electrical connection region is exposed to a second plane of the structural body intersecting the first plane,
forming an adhesive conductive pattern on a surface of the first structural member so that the adhesive conductive pattern covers the electric connection region of the first structural member and the protective layer on the periphery side of the electric connection region, specifically comprising:
respectively forming first conductive patterns on the first plane and the second plane so that the first conductive patterns cover the electric connection area and the protective layer on the peripheral side of the electric connection area, and reserving a first adhesive dispensing area at the corner of the first plane and the second plane;
and forming a second conductive pattern by dispensing in the first dispensing area so that the second conductive pattern is connected with two adjacent first conductive patterns, wherein the first conductive pattern is solidified to form a first conductive layer, the second conductive pattern is solidified to form a second conductive layer, and the viscous conductive layer comprises a first conductive layer and a second conductive layer.
Through the setting of reserving first point gum district like this, can be convenient for form the second conducting layer in first point gum district through the mode of some glue to realize the printing respectively of first conducting layer and second conducting layer in different positions of structure body department, so that according to the difference of the position that first conducting layer and second conducting layer are located on the structure body, select the viscidity conducting material that has different materials and form first conducting layer and second conducting layer. Compared with the existing one-time printing mode of the silver paste layer, the manufacturing cost of the electric connection unit and the electronic equipment can be reduced, the structural sizes of the second conducting layer and the viscous conducting layer are reduced, and the influence of one-time printing of the existing silver paste layer on the performance of the electronic equipment is avoided.
In an alternative embodiment, when the structural body includes a plastic part connected to the metal part, and a joint of the metal part and the plastic part is located in a middle of the second plane, the adhesive conductive pattern is formed on a surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area, specifically including:
forming a first conductive pattern on the second plane, and reserving a second dispensing area at the connection position;
and dispensing in the second dispensing area to form a third conductive pattern so that the third conductive pattern is connected with two adjacent first conductive patterns, the first dispensing area and the second dispensing area form a dispensing area of the structure body, the viscous conductive layer further comprises a third conductive layer formed by curing the third conductive pattern, and the fracture elongation of the third conductive layer is greater than that of the first conductive layer.
Through the setting of reserving the second point and gluing the district like this, can be convenient for form the third conducting layer through the mode of gluing in the junction, because the fracture elongation of third conducting layer is greater than the fracture elongation of first conducting layer, make the third conducting layer have certain ductility like this, help reducing structure body when receiving the impact, because the problem of the viscous conducting layer function failure that metal part and plastic part separation lead to.
A third aspect of embodiments of the present application provides an electronic device including the electrical connection unit as defined in any one of the above.
Therefore, the second structural member in the electronic equipment can be reliably and electrically connected with the second structural member through the arrangement of the electric connection unit, so that the long-term performance of the electronic equipment is improved, and the electronic equipment has better benefits in the whole weight and the whole thickness.
In an optional implementation manner, the electronic device includes a middle frame, a display screen, a battery cover, and a circuit board, where the display screen and the battery cover are located on two opposite sides of the middle frame, the circuit board is located on one side of the middle frame facing the battery cover, a first structural member in the electrical connection unit is the middle frame, and a second structural member in the electrical connection unit is the circuit board and the display screen that can be conducted with the middle frame.
Through the setting of electricity linkage element, can realize the reliable electricity of circuit board and display screen and center like this to when the transmission of signal of telecommunication between circuit board and display screen and the center, help improving electronic equipment's long-term performance and antenna performance, make electronic equipment all have better income in complete machine weight and complete machine thickness.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
fig. 2 is an exploded view of an electronic device according to an embodiment of the present disclosure;
FIG. 3a is a first schematic structural diagram of a reed provided in the related art;
FIG. 3b is a schematic view showing a first structure of a reed provided in the related art;
FIG. 4a is a first schematic view of the connection of a reed provided in the related art;
FIG. 4b is a second schematic view of the connection of reeds provided in the related art;
FIG. 4c is a third schematic view of the connection of a reed provided in the related art;
FIG. 5a is a first schematic view of the connection of a silver paste layer on a middle frame provided in the related art;
fig. 5b is a schematic structural view of a silver paste layer provided in the related art;
FIG. 6 is a second schematic view showing the connection of a silver paste layer on a middle frame according to the related art;
fig. 7 is a first schematic structural diagram of an electrical connection unit according to an embodiment of the present disclosure;
FIG. 8 is a first block diagram illustrating a first component according to an embodiment of the present disclosure;
FIG. 9 is a second block diagram illustrating a first block diagram according to an embodiment of the present disclosure;
FIG. 10 is a schematic structural diagram of an electrical connection unit including the first element of FIG. 8;
fig. 11 is a second schematic structural diagram of an electrical connection unit according to an embodiment of the present application;
fig. 12 is a schematic structural diagram of a third electrical connection unit according to an embodiment of the present application;
fig. 13 is a fourth schematic structural diagram of an electrical connection unit according to an embodiment of the present application;
fig. 14 is a schematic structural diagram of an electrical connection unit according to an embodiment of the present application;
fig. 15 is a sixth schematic structural diagram of an electrical connection unit according to an embodiment of the present application;
fig. 16 is a schematic structural view of a silver paste layer at a corner of a middle frame in the related art;
fig. 17 is a seventh schematic structural diagram of an electrical connection unit according to an embodiment of the present application;
fig. 18 is a schematic structural diagram eight of an electrical connection unit according to an embodiment of the present application;
FIG. 19 is a schematic diagram illustrating a position of an adhered conductive layer on a middle frame according to an embodiment of the present application;
FIG. 20 is a schematic view showing the position of a reed in a middle frame according to the related art;
fig. 21 is a first test chart of antenna performance of an electronic device according to an embodiment of the present disclosure;
FIG. 22 is a schematic view showing the dimensions of a reed on a middle frame in the related art;
FIG. 23 is a schematic diagram illustrating dimensions of an adhered conductive layer on a middle frame according to an embodiment of the present application;
fig. 24 is a second test chart of the antenna performance of the electronic device according to the embodiment of the present application;
fig. 25 is a third test chart of the antenna performance of the electronic device according to the embodiment of the present application;
fig. 26 is a partial schematic view of an electronic apparatus in the related art;
fig. 27 is a fourth test chart of the antenna performance of the electronic device according to the embodiment of the present application;
fig. 28 is a fifth test chart of antenna performance of an electronic device according to an embodiment of the present application;
fig. 29 is a micro-motion test chart of the convex hull elastic sheet according to the embodiment of the present disclosure;
fig. 30 is a micro-motion test chart of the ball-end spring provided in the embodiment of the present application;
fig. 31 is a first flowchart of a manufacturing process of the electrical connection unit according to an embodiment of the present disclosure;
fig. 32 is a second flowchart of a manufacturing process of the electrical connection unit according to the embodiment of the present disclosure;
fig. 33 is a third flowchart of a manufacturing process of the electrical connection unit according to the embodiment of the present application.
Description of reference numerals:
100-an electrical connection unit; 1-a first component; 11-a first structural member; 111-structural body; 1111-metal piece; 1112-plastic parts; 1113-electrical connection region; 1114 — a first plane; 1115-a second plane; 1116-a corner; 1117-junction; 1118-a first glue application area; 112-a protective layer;
12-an adhesive conductive layer; 121-a first conductive layer; 122-a second conductive layer; 123-a third conductive layer; 124-a contact zone; 125-non-contact area;
2-a second component; 21-a second structural member; 22-electrical connections; 23-insulating dielectric layer; 24-an air layer;
200-mobile phone; 210-a display screen; 220-middle frame; 221-middle plate; 222-a border; 223-laser carving surface; 224-a clearance zone; 225-non-headroom region; 230-battery cover; 240-a circuit board; 250-a battery;
300-reed; 310-a weld zone; 320-welding points; 400-a silver paste layer; 410-rounding off; 500-a steel plate; 510-a trough body; 600-a pad; 700-an adhesive conductive pattern; 710-a first conductive pattern; 720-second conductive pattern.
Detailed Description
The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.
Contact resistance: when the two conductors are in contact, the surfaces of the two conductors are completely and closely contacted because the surfaces cannot be completely smooth, and impedance is generated in two conducted electric connection areas.
Galvanic corrosion: also known as contact corrosion, refers generally to galvanic corrosion that occurs when two different metals come into contact with each other while in the electrolyte. Since they constitute spontaneous cells, it is the more reactive and anodic metal that is subject to corrosion.
Standard electrode potential: i.e., the standard electrode potential, refers to the equilibrium potential measured at a temperature of 25 deg.c and an effective concentration of 1mol/L of metal ions (i.e., an activity of 1).
Equilibrium potential: the electrode potential at which the metal is immersed in an electrolytic solution containing only the metal salt and reaches equilibrium is called the equilibrium electrode potential of the metal.
n is the beginning of the frequency band number of the NR system, x is the frequency band number, and nx represents the frequency band corresponding to the NR frequency band number x. The n78 band can be regarded as a band of 5G standard. The n78 band generally refers to the 3400MHz-3600MHz band.
A clean-out area: mainly refers to a blank area around an antenna radiator of the electronic device, and in order to ensure that the antenna radiator obtains a larger bandwidth, a sufficient blank area needs to be reserved for the antenna radiator.
Non-headroom region: mainly refers to the area of a structural part of the electronic device, such as a center frame, provided with an antenna radiator, except for the clearance area.
The embodiment of the present application provides an electronic device, which may include, but is not limited to, a mobile phone, a tablet computer (i.e., a pad), a Virtual Reality (VR) device, a notebook computer, a Personal Computer (PC), an ultra-mobile personal computer (UMPC), a handheld computer, an intelligent wearable device, a Point of Sales (POS), and the like, and the two structural members need to be electrically connected to the electronic device through a spring plate and the like.
The structure of the electronic device according to the embodiment of the present application is further described below by taking a mobile phone as an example.
Fig. 1 illustrates an overall view of an electronic device, and fig. 2 illustrates a partial exploded view of the electronic device. Fig. 1 and fig. 2 illustrate a structure of an electronic device, taking a mobile phone as an example.
Referring to fig. 1 and 2, the electronic device may include a middle frame 220, a display screen 210, a battery cover 230, and a circuit board 240, wherein the display screen 210 and the battery cover 230 are located at two opposite sides of the middle frame 220, and the circuit board 240 is located at a side of the middle frame 220 facing the battery cover 230, so as to implement assembly of the circuit board 240 in the electronic device, such as the mobile phone 200. The circuit board 240 may be understood as a main board in the mobile phone 200. The main board usually carries electronic devices such as a processor module, various controller modules, a storage module, a communication module, a radio frequency module, a power management module and the like.
The display screen 210 may be disposed on one side of the middle frame 220 by means of bonding or the like, so as to fix the display screen 210 on the middle frame 220, and the side where the display screen 210 is located constitutes the front side of the electronic device. As can be seen from fig. 2, the electronic device may further include a battery 250, and the battery 250 and the circuit board 240 are disposed together in the middle frame 220 on a side facing the battery cover 230. The battery cover 230 may be fixed to the side of the middle frame 220 opposite to the display screen 210 by bonding, clipping, or other methods, so that the battery cover 230 can cover the battery 250 and the circuit board 240 while the battery cover 230 is fixed to the middle frame 220. The side on which the battery cover 230 is located constitutes the back side of the electronic device.
Referring to fig. 2, the middle frame 220 may include a frame 222 and a middle plate 221, wherein the frame 222 surrounds a peripheral edge of the middle plate 221 and forms the middle frame 220 together with the middle plate 221. The frame 222 is a square ring structure formed by connecting a plurality of side frames 222 end to end. The middle frame 220 may be a metal middle frame, and a part of the structure of the metal middle frame, such as the side frame 222, may be used as an antenna radiator to implement a communication function of an electronic device, such as the mobile phone 200.
In some embodiments, the middle frame 220 may further include a metal component 1111 and a plastic component 1112 that are integrally connected. Specifically, the metal component 1111 and the plastic component 1112 can be integrally connected through an injection molding manner. Metal 1111 may be located at the rim 222 of the middle frame 220 and may be used as an antenna radiator to implement a communication function of an electronic device, such as the mobile phone 200. The surface of the metal bezel or the surface of the metal 1111 may serve as an electrical contact interface for electrically connecting the bezel 220 to other components in the electronic device, such as the circuit board 240, the display screen 210, etc.
Since the frame 222 of the middle frame 220 serves as a housing of the electronic device, and the frame 222 can serve as an antenna, there is a need for reliable electrical connection between the frame 222 of the middle frame 220 and other devices in the electronic device, such as the circuit board 240 and the display screen 210.
In some embodiments, when the battery cover 230 is a metal battery cover, the antenna radiator may be further formed on the battery cover 230 and electrically connected to the circuit board 240.
The structure of the electronic device of the present application will be further described below by taking the antenna radiator located on the middle frame 220 as an example.
The electronic device may further include components such as a camera, a microphone, a speaker, and a decoration, and the setting positions of the components such as the camera, the microphone, and the speaker in the electronic device, such as the mobile phone 200, may refer to descriptions in the related art, and in this embodiment, the structure of the electronic device is not further limited.
Figures 3a and 3b illustrate different configurations of the spring, respectively. As shown in figures 3a and 3b, leaf spring 300 is typically a metal plate made of metal, and welding leaf spring 300 to improve the electrical contact interface of the middle frame is a common practice in the art due to the superior wear resistance of leaf spring 300. To facilitate welding of reed 300 to the middle frame, reed 300 generally includes a welding region 310 and a contact region 124a that are independent of each other, as shown in figures 3a and 3 b.
Fig. 4a to 4c are schematic diagrams respectively illustrating different welding modes of the reed on the middle frame. Referring to figure 4a, reed 300 is typically spot welded or ultrasonically welded to center frame 220a and overlies the electrical contact interface of center frame 220a, the area of reed 300 where weld 320 is located constitutes a land 310 of reed 300, and land 310 can also be a molten pool area. Other components in the electronic device, such as the circuit board 240a and the like, can abut against the contact area 124a of the reed 300 through the electrical connector 22a, such as an elastic sheet and the like, so that while the electrical connection between the circuit board 240a and the middle frame 220a is realized, as the reed 300 has good wear resistance, the medium-long term wear of the electrical contact interface of the middle frame 220a can be improved through the reed 300, and the loss of the electrical signal when the electrical contact interface is electrically connected with the circuit board 240a is reduced by reducing the rise of the contact resistance caused by the medium-long term wear of the electrical contact interface. It should be noted that the medium-long term wear may be understood as wear occurring after the electronic device is used for a period of time (such as half a year or more), and the medium-long term wear may be used as a measure of the mechanical reliability of the middle frame 220 a.
As shown in fig. 4c, when the circuit board 240a is electrically connected to the middle frame 220a through the electrical connector 22a and the spring plate 300, the contact of the electrical connector 22a, such as a spring plate, is only moved within the contact area 124a, and a certain safety distance (e.g., more than 0.2 mm) is reserved between the outermost edge of the contact area 124a and the outermost edge of the land 310, so that the influence of the spring plate on the solder 320 of the land 310, and further the influence on the transmission of the electrical signal between the circuit board 240a and the middle frame 220a, can be avoided.
Referring to FIGS. 4 a-4 c, in the related art, reed 300 can be welded to middle frame 220a by horizontal welding or side welding, etc. to fix reed 300 to middle frame 220 a. In the related art, by adjusting the number of bonding pads 320 in bonding area 310, it is possible to provide a drawing force and a resistance guarantee between spring sheet 300 and middle frame 220a, so as to reduce the loss of electrical signals when middle frame 220a is electrically connected to circuit board 240a at the electrical contact interface. Thus, to reduce the loss of electrical signals when middle frame 220a is electrically connected to circuit board 240a at an electrical contact interface, reed 300 needs to be soldered to middle frame 220a by a plurality of solder pads 320, which can make the area of solder pads 310 and thus reed 300 very large.
In addition, in order to satisfy the welding strength between reed 300 and middle frame 220a and the structural strength of middle frame 220a at the welding position, there is a certain requirement for the thickness of middle frame 220a in the related art. Specifically, when spring leaf 300 is fixed to middle frame 220a by spot welding, middle frame 220a is generally required to have a thickness of 0.5mm or more at the welded portion. When spring leaf 300 is attached to middle frame 220a by ultrasonic welding, it is generally desirable that the thickness of middle frame 220a at the weld be greater than or equal to 0.4mm.
The metal member in the middle frame 220a is mostly made of light metal such as aluminum material, aluminum alloy, and magnesium alloy. However, such metals are very susceptible to galvanic corrosion at the electrical contact interface due to their low potential difference (difference from zero). Wherein the standard electrode potential of magnesium is-2.37V, and the standard electrode potential of aluminum is-1.67V. The equilibrium potential of magnesium and aluminum is very small in metals, about 2V lower than that of iron. Due to the low potential of magnesium and aluminum, magnesium or aluminum suffers galvanic corrosion as an anode in electrical connection systems composed of different metallic materials. Magnesium is subject to galvanic corrosion to a greater extent than aluminum.
Generally, for the middle frame 220a made of magnesium alloy, it is necessary to add Al, mn, cu, fe, co, ni, and other elements to the magnesium alloy to increase the toughness and hardness of the middle frame 220a, so as to meet the requirements of electronic devices for the middle frame 220a, and at the same time, to make magnesium easily form Mg 4 Al 3 、Mg 2 Ni、FeAl 3 、MgCu 2 And the like, the potential difference between such intermetallic compounds and magnesium varies from 0.43 to 1.39, and in addition to corrosive environments such as salt fog, high temperature and high humidity, or electrolyte environments, even if the content of the alloy element is low, galvanic corrosion still occurs at the electrical contact interface of the middle frame 220a in the high temperature and high humidity or salt fog environments due to the low potential of magnesium.
Conventional hand perspiration, as well as water vapor in the air, is generally acidic. In such an environment, both the conventional magnesium alloy material and the magnesium alloy material added with the elements cannot pass a middle-long term performance test (such as a salt spray test for a certain period of time), although the reed 300 covers the electric contact interface of the middle frame 220a, galvanic corrosion still occurs on the radium carved surface formed by the middle frame 220a on the electric contact interface and the welding point 320, so that the reed 300 is easy to detach, and the reed 300 fails. The medium-and-long-term performance test can be understood as that a metal material such as a magnesium alloy material and the like is placed in a salt spray environment and subjected to a salt spray test for a preset time to reflect the environmental reliability of the metal material.
Therefore, although the mechanical reliability of the electrical contact interface of middle frame 220a can be improved by the above-mentioned manner of welding reed 300, it is not guaranteed that the improvement effect of the environmental reliability at the electrical contact interface of middle frame 220a by the active metal such as magnesium or heptad aluminum, etc. for preparing middle frame 220a after the middle and long term performance test. Meanwhile, since the reed 300 can improve the mechanical reliability of the electrical contact interface of the middle frame 220a, but there is a certain requirement for the thickness of the middle frame 220a at the welding position, the way of improving the electrical contact interface of the middle frame 220a by the reed 300 cannot be realized in some electronic devices with curved architectures, and the contact area 124a and the welding area 310 result in a larger area of the reed 300.
For this reason, referring to fig. 5a, in the related art, it is proposed to cover a silver paste, such as a conductive silver paste, on the electrical contact interface of the middle frame 220a by a process of metal melt-blowing or the like to form a silver paste layer 400 on the electrical contact interface of the middle frame 220a, so as to cover the electrical contact interface of the middle frame 220a by the silver paste layer 400 instead of the reed 300 to improve the electrical contact interface of the middle frame 220a, and satisfy the mechanical reliability of the middle frame 220a at the electrical contact interface.
Meanwhile, referring to fig. 5b in conjunction with fig. 3a, it can be seen that since the solder land 310 does not need to be provided on the silver paste layer 400 and the soldering with the middle frame 220a is not needed, the metal thickness of the middle frame 220a at the electrical contact interface and the area of the silver paste layer 400 can also be reduced. With diameter D of contact area 124a on reed 300 illustrated in FIG. 3a 0 1.4mm, reed 300 is square in configuration, and the side length of reed 300 is 2.4mm as an example, diameter D of contact area 124b on silver paste layer 400, shown schematically in FIG. 5b, on which electrical connector 22a is disposed 1 May be 1.2mm to 1.6mm, the structure of the silver paste layer 400 is square, and the side length of the silver paste layer 400 may be greater than or equal to 1.2mm and less than or equal to 2.6mm. It can be seen that silver paste layer 400 has a smaller area than reed 300, as contact area 124a is closer to or the same as contact area 124 b.
However, by improving the electrical contact interface of the middle frame 220a through the silver paste layer 400, after the middle frame 220a is subjected to a middle-long term performance test, galvanic corrosion still occurs at the electrical contact interface of the middle frame 220a, the silver paste layer 400 is not sticky, and the problem of environmental reliability at the electrical contact interface of the middle frame 220a still cannot be solved.
The research shows that the generating conditions of the galvanic corrosion generally comprise the following three points:
1) Potential difference: the cathode and anode must have a certain potential difference. For example, iron, ni, etc. having a positive potential are in contact with Mg or Al having a negative potential, and the galvanic corrosion tends to be greater as the potential difference is larger. The potential difference is the driving force for galvanic corrosion.
2) An electronic channel: galvanic corrosion requires the formation of an electronic channel via wire connection or direct contact. The lost electrons of the iron in the shrapnel reach the surface of the magnesium-aluminum alloy and are absorbed by the corrosive agent.
3) Electrolyte: galvanic corrosion requires electrolyte coverage or immersion at the contact interface of two metals. The electrons lost by the iron in the shrapnel form ions, and the electrons on the surfaces of Mg and Al are taken away by corrosive agents (such as oxygen in the air) in the electrolyte. The electrolyte becomes an ion channel.
The conductive silver paste consists of a silver powder conductive functional phase, a matrix resin bonding phase, a solvent and other auxiliary aids. The conductive silver paste is printed on a paste carrier such as the middle frame 220a, and is cured under the action of a certain temperature and time, so that the conductive silver paste can be firmly attached to the carrier, and the formed silver paste layer 400 has excellent properties of conductivity, hardness, adhesive force, bending resistance and the like. Silver has excellent normal-temperature electrical conductivity and thermal conductivity and volume resistivity of
Figure 920629DEST_PATH_IMAGE001
The silver powder has excellent conductivity and chemical stability, is slowly oxidized in air, and is hardly oxidized in a glue layer. The matrix resin material is a structural framework of the conductive paste, is a carrier of the conductive functional phase silver powder, and has the functions of providing basic rheological property and adhesive force of the paste for the conductive silver paste and providing basic mechanical properties of the paste. The matrix resin bonding phase is usually selected from polyurethane, polyester, acrylic resin, alkyd resin, epoxy resin and the like.
Referring to fig. 6, in order to enhance the corrosion resistance of the middle frame 220a, the metal surface of the middle frame 220a is usually coated with a protective layer 112a, and the protective layer 112a is typically a film or an anodized layer. Since the protective layer 112a itself is corrosion resistant, the matrix resin binder phase in the conductive silver paste can isolate the electrolyte.
By further analysis, the researchers found that, as shown in fig. 6, in order to enhance the adhesion of the conductive silver paste, the conductive silver paste only prints the electrical contact interface of the middle frame 220a, and there is a gap between the edge of the protective layer 112a and the edge of the silver paste layer 400, which can form a liquid inlet path for galvanic corrosion. The electrical contact interface has a laser etched surface 223. When the salt spray test and the high-temperature high-humidity test are carried out, the electrolyte enters the electric contact interface through the liquid inlet path, so that active metals such as Mg and Al forming the electric contact interface generate galvanic corrosion, even further reaction is carried out in the middle frame 220a, the silver paste layer 400 on the laser carving surface 223 is not sticky, and the connection reliability between the middle frame 220a and other parts in the electronic equipment, such as the circuit board 240a, and the middle-long-term performance of the electronic equipment are affected.
The medium-and long-term performance of the electronic device may include, but is not limited to, mechanical reliability and environmental reliability of the electronic device. Taking the middle frame 220 as an example, the mechanical reliability may include, but is not limited to, middle and long term wear of the middle frame 220, and the environmental reliability may include, but is not limited to, the environmental reliability of the middle frame 220 at the electrical contact interface.
In view of this, embodiments of the present disclosure provide an electrical connection unit, which can ensure connection reliability of the electrical connection unit and improve long-term and medium-term performance of an electronic device.
The structure of the electrical connection unit of the present application will be further explained with reference to the drawings and the embodiments.
Referring to fig. 7, the electrical connection unit 100 includes a first assembly 1, the first assembly 1 includes a first structural member 11 and an adhesive conductive layer 12, and the first structural member 11 includes a structural body 111 and a protective layer 112. The structural body 111 includes a metal member 1111. For example, the metal piece 1111 may include, but is not limited to, aluminum, magnesium, aluminum alloy, or magnesium alloy. The surface of the metal 1111 has an electrical connection region 1113, and the electrical connection region 1113 is exposed outside the first structural component 11 so as to satisfy the electrical connection requirement between the first structural component 11 and other components in the electrical connection unit 100.
As can be seen from fig. 7, the protective layer 112 is located on the peripheral side of the electrical connection region 1113 and covers the surface of the metal component 1111, so that the electrical connection region 1113 can be exposed to the outside of the first structural member 11 while the protective performance of the metal component 1111 is achieved by the protective layer 112. The protective layer 112 may include, but is not limited to, a coating, an oxidation-preventing layer, an insulating layer, or other layered structures capable of protecting the metal component 1111. Illustratively, the oxidation preventing layer may be formed by anodizing, electrophoresis, spraying, or the like. In this embodiment, the structure and the formation manner of the protection layer 112 are not further limited.
Referring to fig. 7, adhesive conductive layer 12 covers electrical connection region 1113 and protective layer 112 around electrical connection region 1113. The second component 2 further comprises a second structure 21, the second structure 21 being in electrical communication with the electrical connection area 1113 via the adhesive conductive layer 12. Thus, the adhesive conductive layer 12 covers the electrical connection region 1113, so that the second structural component 21 is electrically connected to the electrical connection region 1113 through the adhesive conductive layer 12, and the first structural component 11 is electrically connected to the second structural component 21, so as to facilitate electrical signal transmission between the first structural component 11 and the second structural component 21.
Meanwhile, since adhesive conductive layer 12 covers electrical connection area 1113, adhesive conductive layer 12 can replace reed 300 to improve the contact effect on the surface of electrical connection area 1113 and improve the medium-long term wear of first structural member 11 in electrical connection area 1113, so that when electrical connection unit 100 is applied to an electronic device, the mechanical reliability of the electronic device with respect to first structural member 11 in electrical connection area 1113 can be satisfied.
Compared with the way of improving the electrical contact interface of the middle frame 220a by the reed 300, because the adhesive conductive layer 12 does not need to separately provide the welding area 310 and is welded with the first structural member 11 through the welding area 310, the embodiment of the present application can reduce the thickness of the first structural member 11 by providing the adhesive conductive layer 12, so as to form the electrical connection area 1113 at a preferred position on the first structural member 11, and realize the electrical connection with the second structural member 21 through the adhesive conductive layer 12, so that the electronic device has a good benefit on the thickness of the whole machine, and the structural size of the adhesive conductive layer 12 can be reduced, so that the occupied area of the adhesive conductive layer 12 on the first structural member 11 is reduced, and the electronic device also has a good benefit on the weight of the whole machine.
On this basis, by arranging the protective layer 112 in which the adhesive conductive layer 12 is covered on the electric connection region 1113 and the periphery of the electric connection region 1113, it is possible to prevent the electrolyte from entering the electric connection region 1113 through the gap between the adhesive conductive layer 12 and the protective layer 112, thereby avoiding the occurrence of galvanic corrosion in the electric connection region 1113 of the first structural member 11, so that the adhesive conductive layer 12 is stably covered on the electric connection region 1113, ensuring the reliability of the electric connection between the second structural member 21 and the first structural member 11, and improving the environmental reliability of the first structural member 11 in the electric connection region 1113, thereby satisfying the requirement of the electronic apparatus on the environmental reliability of the first structural member 11 in the electric connection region 1113 when the electric connection unit 100 is applied to the electronic apparatus.
Therefore, the embodiment of the application not only effectively improves the medium-and-long-term performance of the first structural member 11 and the electronic equipment, but also enables the electronic equipment to have better benefits in terms of the overall weight and the overall thickness through the arrangement of the adhesive conductive layer 12.
In order to test the long-term performance of the electrical connection unit 100, the embodiment of the present application performs environmental tests such as a salt spray test and a high temperature and high humidity test on the electrical connection unit 100, and as a result, the first structural member 11 in the electrical connection unit 100 of the present application is free from corrosion except for surface contamination. It can be shown that the present application can effectively improve the middle-and-long-term performance of the first structural member 11 by the adhesive conductive layer 12.
When the electrical connection unit 100 is applied to an electronic device, such as a mobile phone 200, referring to fig. 7, the first structural component 11 is a middle frame 220 of the electronic device, and the second structural component 21 is a circuit board 240, a display screen 210, or other components in the electronic device that have electrical connection requirements with the middle frame 220. Alternatively, when the first structural component 11 is a battery cover 230 of the electronic device, such as a metal battery cover, the second structural component 21 is a circuit board 240 or other components in the electronic device that have electrical connection requirements with the middle frame 220. Alternatively, the first structural member 11 and the second structural member 21 may also be structural members that are required for electrical connection between the other two electronic devices, according to the structure or the kind of the electronic devices. In the present embodiment, the types of the first structural member 11 and the second structural member 21 are not further limited.
It should be noted that the surface of the electrical connection region 1113 is a laser etched surface or a machined surface. The oxide layer of the metal member 1111 in the electrical connection region 1113 cannot be removed, so as to electrically connect the first structure member 11 and the second structure member 21, and the pattern can be formed on the laser etched surface by laser etching, so as to increase the adhesion of the adhesive conductive layer 12 on the electrical connection region 1113 and enhance the adhesion effect of the adhesive conductive layer 12 on the electrical connection region 1113 and the protection layer 112. When the first structure 11 is the middle frame 220, the surface of the electrical connection region 1113 can also be regarded as an electrical contact interface of the middle frame 220.
The structure of the electrical connection unit 100 of the present application will be further described below by taking the first structure member 11 as the middle frame 220 and the second structure member 21 as the circuit board 240 as an example.
Adhesive conductive layer 12 may include, but is not limited to, silver paste layer 400, or other conductive layer having better conductive properties. Illustratively, the silver paste forming the silver paste layer 400 may include, but is not limited to, a conductive silver paste. The adhesive conductive layer 12 of the present application employs the silver paste layer 400, so as to ensure that the second structural member 21 and the first structural member 11 are reliably electrically connected, and at the same time, the silver paste layer 400 can cover the electrical connection region 1113, so as to improve the contact effect on the surface of the electrical connection region 1113.
In the present embodiment, a conductive silver paste may be formed on the first structural member 11 by pad printing or the like to form the adhesive conductive layer 12. Thus, not only can the adhesive conductive layer 12 be fixed on the first structural member 11, but also the gap between the adhesive conductive layer 12 and the surface of the first structural member 11, such as the protective layer 112 and the electrical connection region 1113, can be reduced or avoided, the adhesion effect between the adhesive conductive layer 12 and the electrical connection region 1113 and the protective layer 112 can be enhanced, the connection between the first structural member 11 and the second structural member 21 can be ensured, and the possibility that electrolyte enters the electrical connection region 1113 from between the adhesive conductive layer 12 and the protective layer 112 and corrodes the electrical connection region 1113 can be avoided.
To ensure that adhesive conductive layer 12 completely blocks the gap between adhesive conductive layer 12 and protective layer 112, as shown in fig. 7, the area of adhesive conductive layer 12 is larger than the area of electrical connection region 1113, and the peripheral side edge of adhesive conductive layer 12 covers protective layer 112 on the peripheral side of electrical connection region 1113. That is, there is a first overlap area between the peripheral side edge of adhesive conductive layer 12 and protective layer 112. Thus, when the adhesive conductive layer 12 covers the electrical connection region 1113, the adhesive conductive layer 12 can completely cover the adhesive conductive layer 12, thereby improving the medium-and-long-term wear and mechanical reliability of the first structural member 11 in the electrical connection region 1113, and the adhesive conductive layer 12 can be connected with the protective layer 112 to block the path of the electrolyte entering the electrical connection region 1113, thereby avoiding galvanic corrosion of the first structural member 11 in the electrical connection region 1113, and improving the environmental reliability of the first structural member 11 in the electrical connection region 1113.
Note that the width W of the first overlap region is greater than the printing tolerance of adhesive conductive layer 12 to ensure that the peripheral side edges of adhesive conductive layer 12 are formed to cover protective layer 112. The larger the width W of the first overlapping area is, the better the sealing effect on the gap between the electrical connection region 1113 and the protection layer 112 is, but in practical applications, the width W of the first overlapping area needs to be limited to avoid that the width W of the first overlapping area is too large to affect the adjacent electrical connection unit 100 on the first structural member 11. In the present embodiment, the width W of the first overlapping area is not further limited.
In some embodiments, referring to fig. 8 and 9, the structural body 111 further includes a plastic part 1112 connected to the metal part 1111, and the adhesive conductive layer 12 is located between the metal part 1111 and the plastic part 1112 and covers the electrical connection region 1113, the passivation layer 112 around the electrical connection region 1113, and the connection part 1117 between the metal part 1111 and the plastic part 1112. That is, the peripheral edge of adhesive conductive layer 12 also has a second overlapping area with the part of plastic part 1112. For the definition of the width of the second overlapping area, reference may be made to the above description of the first overlapping area, which is not further described herein. By arranging the plastic part 1112, the structure of the structure body 111 can be diversified, so that the weight of the first structural member 11 can be reduced and the cost of the first structural member 11 can be reduced while the structural requirements of the electronic device on the first structural member 11 at different positions are met.
Meanwhile, by covering the joint 1117 between the metal member 1111 and the plastic member 1112 with the adhesive conductive layer 12, the adhesive conductive layer 12 can be covered on the electrical connection region 1113, the protective layer 112 and the plastic member 1112 at the same time, thereby preventing the electrolyte from entering the electrical connection region 1113 from the joint 1117, completely closing the path of the electrolyte entering the electrical connection region 1113, avoiding the occurrence of galvanic corrosion of the electrical connection region 1113, ensuring the mechanical reliability and environmental reliability of the adhesive conductive layer 12 on the electrical connection region 1113 of the first structural member 11, and achieving the purpose of improving the medium and long term performance of the electrical connection unit 100 and the electronic device.
Referring to fig. 10, by covering the plastic part 1112 with the adhesive conductive layer 12, the surface of the plastic part 1112 covered with the adhesive conductive layer 12 can also have a conductive function, so that the second component 2 can be offset toward one side of the plastic part 1112 relative to the metal part 1111, and the range in which the second component 2 can be arranged relative to the first component 1 can be increased while the second structural part 21 is electrically connected with the first structural part 11, thereby enhancing the diversity of the arrangement positions of the second component 2 on the first component 1.
It should be noted that, when the structural body 111 includes the metal component 1111 and the plastic component 1112, in some embodiments, as shown in fig. 8, after the metal component 1111 and the plastic component 1112 are injection molded to form the structural body 111, the protective layer 112 is formed on the outer surface of the metal component 1111 to form the first structural component 11, at this time, the surface of the metal component 1111 adjacent to the plastic component 1112 does not have the protective layer 112.
Alternatively, in other embodiments, as shown in fig. 9, the protective layer 112 may be formed on the outer surface of the metal component 1111, and then the metal component 1111 and the plastic component 1112 are injection molded to form the first structural component 11, where one surface of the metal component 1111 adjacent to the plastic component 1112 has the protective layer 112. When the first structural member 11 is the middle frame 220, the selection of injection molding or the preparation of the protective layer 112 can be made according to the manufacturing process of the middle frame 220, which can make the manufacturing process of the middle frame 220 more flexible. In the present embodiment, the formation manner of the first structural member 11 is not further limited.
Referring to fig. 10, the second assembly 2 further includes an electrical connector 22 in electrical communication with the second structural member 21, the electrical connector 22 is located between the second structural member 21 and the adhesive conductive layer 12 to electrically connect the second structural member 21 and the first structural member 11, the second structural member 21 has an electrical communication surface (not shown) in electrical communication with the first structural member 11, and the electrical communication surface is the surface where the second structural member 21 is connected to the electrical connector 22. The conductive surface may include, but is not limited to, a metal surface. The electrical connection 22 may be attached to the conductive surface. By providing the electrical connector 22, the second structure 21 and the first structure 11 can be electrically connected to each other, so that the first structure 11 and the second structure 21 can be electrically connected reliably.
In some embodiments, electrical connection 22 may be a resilient electrical connector. The elastic electrical connector may include, but is not limited to, spring, conductive silicone, and foam. Alternatively, in some embodiments, the electrical connector 22 may be a non-elastic electrical connector. The non-elastic electrical connector may include, but is not limited to, a convex hull, a spacer, and a conductive cloth.
Specifically, the electrical connection unit 100 of the present application may select different electrical connectors 22 according to the second structural member 21, so as to satisfy the requirements of the second structural member 21 on the elasticity and pressure of the electrical connectors 22. Alternatively, when the distance between the second structural member 21 and the first structural member 11 is limited, a non-elastic electrical connector may be selected to conduct the second structural member 21 and the first structural member 11. In the present embodiment, the kind of the electrical connector 22 is not further limited.
Referring to fig. 11 and 12, in some embodiments, the second assembly 2 may further include an insulating dielectric layer 23, the insulating dielectric layer 23 being located between the second structure 21 and the electrical connector 22 to form the electrical connector 22 and the second structure 21 into a coupling feed assembly configured to electrically conduct the second structure 21 to the first structure 11 through the adhesive conductive layer 12. Illustratively, the insulating dielectric layer 23 may include, but is not limited to, an insulating dielectric film that is a high dielectric. The high dielectric insulating dielectric film can be prepared by using a high DK (dielectric constant) material in the related art. Wherein the high DK material may include, but is not limited to, an insulating dielectric material having a DK value greater than or equal to 400.
Thus, by the arrangement of the insulating medium layer 23, a certain distance can be formed between the electrical connector 22 and the second structural member 21, so as to form a coupling feed assembly, so that the second structural member 21 can transmit an electrical signal, such as a high frequency signal, to the first structural member 11 in a coupling feed manner, and simultaneously can achieve the effects of passing an alternating current signal and blocking a direct current signal through the coupling feed assembly, thereby achieving the effect of suppressing Radiation Stray (RSE) when the electrical connection unit 100 is applied to an electronic device, such as a mobile phone 200, and being beneficial to achieving the purpose of rectifying the electromagnetic compatibility of the mobile phone 200, so as to meet the requirement of the mobile phone 200 on the electromagnetic compatibility.
It should be noted that when the second component 2 includes the insulating medium layer 23, the forming manner of the structure body 111 may also adopt a manner of first injection molding or first forming the protective layer 112, which is not further described herein.
Referring to fig. 13, in some embodiments, the second assembly 2 may further include an insulating layer disposed between the electrical connector 22 and the second structural member 21, where the insulating layer may be an air layer 24, so that when a signal, such as a high voltage signal, is transmitted from the second structural member 21 to the second structural member 21, the signal can break through the air layer 24, and the second structural member 21 is conducted with the first structural member 11 through an air discharge, so as to achieve transmission of the high voltage signal on the second structural member 21 to the first structural member 11, and at the same time, avoid signal loss of other devices in the electronic device.
Taking the first structural member 11 as the middle frame 220 and the second structural member 21 as the battery cover 230, when the second structural member 21 is installed on the first structural member 11, and the second structural member 21 is fixed to the first structural member 11 by adhesion or the like, a gap is formed between the first structural member 11 and the gap, and air in the gap can be used as the air layer 24. In the process of transmitting the high-voltage signal from the second structural member 21 to the first structural member 11, the air layer 24 is firstly punctured, and due to the arrangement of the adhesive conductive layer 12, the high-voltage signal can be transmitted to the first structural member 11, so that the high-voltage signal is prevented from directly reaching the circuit board 240 through the gap between the second structural member 21 and the first structural member 11, and the circuit board 240 is prevented from being damaged.
On the basis of the above, referring to fig. 14 and 15, the structural body 111 has a first plane 1114 and a second plane 1115 in a direction toward the second structural member 21, and the first plane 1114 and the second plane 1115 are two planes that intersect on the structural body 111. The first plane 1114 is parallel to the conducting surface of the second structure 21. The first plane 1114 can be regarded as a horizontal plane of the structure body 111, and the second plane 1115 can be regarded as a side elevation of the structure body 111 perpendicular to the first plane 1114. The first and second planes 1114, 1115 are both interior sides of the construct body 111.
The adhesive conductive layer 12 covers at least the first plane 1114 (as shown in fig. 14 and 15), the second structure 21 is located at the corner 1116 of the first plane 1114 and the second plane 1115, and is electrically connected to the first structure 11 through the conductive plane and the adhesive conductive layer 12, so that when the second structure 21 is assembled in the first structure 11, the structural form of the electrical connection unit 100 is more diversified, and due to the arrangement of the adhesive conductive layer 12 covering the first plane 1114 or the first plane 1114 and the second plane 1115, it is convenient to select the adhesive conductive layers 12 with different lengths according to the arrangement position of the electrical connection region 1113, so that the second structure 21 is electrically connected to the first structure 11 through the conductive plane and the adhesive conductive layer 12, thereby enhancing the reliability of the electrical connection between the second structure 21 and the first structure 11, and achieving the purpose of improving the medium-long-term performance of the electronic device.
It should be noted that, as shown in fig. 14, when the first structural member 11 is the middle frame 220, the metal component 1111 on the second plane 1115 may constitute an antenna radiator, and the first plane 1114 has a clearance area 224 on a side close to the antenna radiator, and the first plane 1114 has a non-clearance area 225 on a side far from the antenna radiator.
As shown in fig. 14 and 15, when the first plane 1114 has at least one electrical connection area 1113 exposed thereon, and the first plane 1114 further has at least one plastic surface of a plastic part 1112 on a side of the electrical connection area 1113, the adhesive conductive layer 12 may cover the electrical connection area 1113 on the first plane 1114, and simultaneously cover the plastic surface on the side of the electrical connection area 1113 and the protective layer 112, so that the plastic surface covered with the adhesive conductive layer 12 also has an electrical conduction function, so that the second structural member 21 is electrically connected to the first structural member 11 on the plastic surface through the adhesive conductive layer 12, and the middle-and long-term performance of the first structural member 11 and the electronic device can be improved.
The first plane 1114 has a plastic surface of the plastic 1112, the plastic surface is opposite to the conducting surface, and the electrical connection region 1113 is exposed to the second plane 1115. In order to realize the conduction between the second structure 21 and the electrical connection region 1113 of the first structure 11 through the adhesive conductive layer 12 at the corner 1116 of the first plane 1114 and the second plane 1115 of the second structure 21, as shown in fig. 16, it is common in the related art to simultaneously print the first plane 1114a and the second plane 1115a of the middle frame 220a so as to form the silver paste layer 400 on the first plane 1114a and the second plane 1115a by one-time printing, and during the printing process, a rounded corner 410 with a radius of 0.5mm needs to be reserved at the corner 1116a, otherwise the silver paste layer 400 is broken.
The one-time printing method of the silver paste layer 400 may have the following effects:
1) Due to the provision of the rounded corner 410, the silver paste layer 400 may be lengthened in the longitudinal direction (for example, in the X direction in fig. 16), and when the silver paste layer 400 is disposed on the middle frame 220a, referring to fig. 16 in combination with fig. 14, due to the lengthening of the silver paste layer 400 in the longitudinal direction, the portion of the silver paste layer 400 entering the non-clearance area 225a on the middle frame 220a may be lengthened, which may result in deterioration of the performance of the antenna radiator on the middle frame 220a, and may easily encroach on the mounting space of the circuit board 240 on the middle frame 220 a.
2) Since the middle frame 220a only needs a thicker thickness in the silver paste area of the horizontal plane to meet the requirement of abrasion resistance of the middle frame 220a, and the same thickness is required for printing, this way may cause waste of the silver paste on the side vertical surface of the middle frame 220 a.
3) And the same conductive silver paste material is required for simultaneous printing. In order to improve the abrasion problem, the thickness of the film is generally increased, or powder with higher hardness, such as Ni powder, is added into silver paste. However, the addition of the powder material results in a decrease in the filler ratio of silver, while the resistivity of the Ni powder is greater than that of silver, which results in an increase in the resistivity of the conductive silver paste. Illustratively, the resistivity of the Ni-containing powder is in
Figure 453242DEST_PATH_IMAGE002
Pure silver powder
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. From the viewpoint of radiator performance, it is desirable that the area of the region of the silver paste layer 400 having a large resistivity be as small as possible, so that the region of the silver paste layer 400 having a large resistivity becomes large by the addition of Ni powder, thereby affecting the radiator performance.
4) Because two different interfaces of the electric connection region 1113 and the plastic surface formed in the metal component 1111 are printed, the same conductive silver paste is required to achieve the same adhesive force on the two different interfaces, which is difficult and leads to cost increase.
5) When the conductive silver paste is printed at the joint 1117 between the metal component 1111 and the plastic component 1112, the conductive silver paste itself does not have strong ductility after being printed and cured by baking. During impact, the metal component 1111 and the plastic component 1112 are strongly deformed at the joint 1117, which may seriously cause the metal component 1111 and the plastic component 1112 to separate, and the silver paste layer 400 formed after baking has no strong ductility and may completely break due to the separation of the metal component 1111 and the plastic component 1112.
To this end, when the first plane 1114 has a plastic surface of the plastic 1112 and the electrical connection area 1113 is exposed to the second plane 1115, referring to fig. 17, the adhesive conductive layer 12 includes a first conductive layer 121 and a second conductive layer 122, and the first conductive layer 121 is respectively located on the first plane 1114 and the second plane 1115 to cover the electrical connection area 1113. The second conductive layer 122 is located at the corner 1116 to connect the adjacent first conductive layers 121, so that the second structure 21 is electrically connected to the electrical connection region 1113. By arranging the first conductive layer 121 and the second conductive layer 122, the first conductive layer 121 on the first plane 1114 and the second plane 1115 can be connected by the second conductive layer 122, and the adhesive conductive layer 12 is continued to the plastic surface of the first plane 1114, so that the plastic surface has a conductive function, so as to ensure that the second structural component 21 is electrically connected with the first structural component 11.
Meanwhile, through the arrangement of the first conductive layer 121 and the second conductive layer 122, the adhesive conductive layer 12 can be printed at different positions of the structure body 111, so that according to the difference of the positions of the first conductive layer 121 and the second conductive layer 122 on the structure body 111, the adhesive conductive materials with different materials are selected to form the two first conductive layers 121 and the second conductive layer 122 through a respective printing mode, a conductive layer with a thicker thickness or a conductive silver paste containing Ni powder is formed at a position needing wear resistance, and a conductive layer with a thinner thickness and a full silver conductive silver paste with better conductivity are selected at a non-contact area 125 of the adhesive conductive layer 12. Compared with the way of printing the silver paste layer 400 once, on the basis of improving the mechanical reliability and the environmental reliability of the electrical connection region 1113 of the first structural member 11 through the adhesive conductive layer 12, the waste of conductive silver paste can be avoided, the manufacturing cost of the electrical connection unit 100 and the electronic device can be reduced, the fillet 410 does not need to be reserved at the corner 1116, the length of the adhesive conductive layer 12 entering the non-clearance region 225 of the middle frame 220 can be avoided from being too long, the structural sizes of the second conductive layer 122 and the adhesive conductive layer 12 are reduced, and meanwhile, the area of the region with larger resistivity in the adhesive conductive layer 12 can be controlled in a smaller range, so that the influence of one-time printing on the performance of the antenna radiator is avoided, and the performance of the antenna radiator is improved.
It should be noted that the movable area of the contact of the electrical connector 22, such as a spring, on the adhesive conductive layer 12 is a contact area 124 of the adhesive conductive layer 12, and the area of the adhesive conductive layer 12 except the contact area 124 is a non-contact area 125. Taking fig. 17 as an example, the area of the first conductive layer 121 on the first plane 1114 is the contact area 124 of the adhesive conductive layer 12, and the areas of the second conductive layer 122 and the first conductive layer 121 on the first plane 1114 are the non-contact areas 125 of the adhesive conductive layer 12.
In addition, because this application can realize viscidity conducting layer 12 in the printing respectively of structure body 111 different positions department, can select the electrically conductive silver thick liquid of different resin materials to different interfaces like this, not only can be directed against the printing degree of difficulty that reduces viscidity conducting layer 12 on different interfaces like this, further reduce the manufacturing cost of electric connection unit 100 and electronic equipment, but also can improve the problem of the adhesive force of the silver thick liquid layer 400 that the while printing formed on different interfaces.
Referring to fig. 17, when the connection 1117 is located in the middle of the second plane 1115, the adhesive conductive layer 12 further includes a third conductive layer 123, and the third conductive layer 123 is located at the connection 1117 to connect the metal member 1111 with the plastic member 1112 and the adjacent first conductive layer 121. The fracture elongation of the third conductive layer 123 is greater than the fracture elongation of the first conductive layer 121. Two adjacent first conductive layers 121 in the first plane 1114 are connected through the third conductive layer 123, so that the first conductive layer 121 on the first plane 1114 is conducted with the first conductive layer 121 covering the electrical connection region 1113 through the first conductive layer 121 and the third conductive layer 123 between the second conductive layer 122, the second conductive layer 122 and the connection part 1117 in sequence, so that the second structural member 21 is electrically connected with the first structural member 11 through the electrical connector 22, and electrical signals can be transmitted between the second structural member 21 and the first structural member 11.
Meanwhile, the fracture elongation of the third conductive layer 123 is greater than that of the first conductive layer 121, so that the third conductive layer 123 has certain ductility, and when the structure body 111 is impacted, the third conductive layer 123 can deform along with the deformation of the metal piece 1111 and the plastic piece 1112 at the connection part 1117, thereby avoiding the fracture of the viscous conductive layer 12 at the third conductive layer 123, and effectively reducing the problem of the function failure of the viscous conductive layer 12 caused by the separation of the metal piece 1111 and the plastic piece 1112.
It should be noted that the elongation at break of the silver paste forming the first conductive layer 121 is not high, and the elongation at break of the silver paste forming the third conductive layer 123 is 100% to 300%, so that the elongation at break of the third conductive layer 123 is greater than the elongation at break of the first conductive layer 121, and the third conductive layer 123 has certain ductility.
With continued reference to fig. 18, when the connection 1117 is located at the corner 1116, the third conductive layer 123 may be replaced by the second conductive layer 122 to connect the metal member 1111 with the plastic member 1112 and the adjacent first conductive layer 121. At this time, the fracture elongation of the second conductive layer 122 is greater than the fracture elongation of the first conductive layer 121, so that the second conductive layer 122 has a certain ductility, thereby effectively reducing the problem of the function failure of the adhesive conductive layer 12 caused by the separation of the metal component 1111 and the plastic component 1112, and simplifying the structures of the adhesive conductive layer 12, the first component 1 and the electrical connection unit 100. The breaking elongation of the silver paste in the second conductive layer 122 can refer to the description of the third conductive layer 123, and is not further described herein.
As shown in fig. 17, the first conductive layer 121 is a pad printing adhesive conductive layer, the corner 1116 and the connection part 1117 are dispensing areas, and the second conductive layer 122 and the third conductive layer 123 are conductive layers formed in the dispensing areas by dispensing. Form pad printing viscidity conducting layer like this through the mode of pad printing, form second conducting layer 122 and third conducting layer 123 through the mode of dispensing in the dispensing area, so that when realizing the printing respectively of viscidity conducting layer 12 in different positions of structure body 111, can also be according to structure body 111 to the demand of viscidity conducting layer 12 performance in different positions, select the viscidity conducting material of adaptation such as silver thick liquid, through the printing respectively in different positions of structure body 111, form first conducting layer 121, second conducting layer 122 and third conducting layer 123, on the basis of satisfying structure body 111 different positions to viscidity conducting layer 12 performance demand, through forming second conducting layer 122 and third conducting layer 123 in the dispensing area, need not to reserve fillet 410, can also reduce the structure size of second conducting layer 122 and viscidity conducting layer 12.
It should be noted that the second conductive layer 122 and the third conductive layer 123 can be formed by dispensing in a dispensing area by a dispensing device such as a dispensing device having a piezoelectric valve. Because the minimum line diameter of the conducting layer formed by glue dispensing of the existing glue spraying equipment can be 0.8mm, the second conducting layer 122 is formed in a glue dispensing mode of the glue spraying equipment on the basis that the fillet 410 does not need to be reserved, and the size requirement of the second conducting layer 122 at the corner 1116 can be further reduced.
When the structure body 111 has the corner 1116, the first structure member 11 may be electrically connected to any one of the second components 2 through the adhesive conductive layer 12.
Referring to fig. 18, the thickness of the first conductive layer 121 on the first plane 1114 is greater than the thickness of the first conductive layer 121 on the second plane 1115. At this moment, the silver paste of the same material can be adopted to first conducting layer 121 on first plane 1114 and first conducting layer 121 on second plane 1115 to through the mode of thickening first conducting layer 121, when satisfying the wear resistance of first structure 11 to first plane 1114, can also reduce the waste of the viscidity conducting material that forms first conducting layer 121 on the second plane 1115 such as silver paste, thereby reduce the manufacturing cost of first subassembly 1.
Alternatively, in some embodiments, the hardness of the first conductive layer 121 on the first plane 1114 is greater than the hardness of the first conductive layer 121 on the second plane 1115. Specifically, the powder with higher hardness such as Ni powder can be added into the silver paste to satisfy the wear resistance of the first structural member 11 to the first plane 1114, and the addition of the Ni powder can result in the increase of the resistivity of the first conductive layer 121 on the first plane 1114, and because the Ni powder is only added into the first conductive layer 121 on the first plane 1114, compared with the mode that the first plane 1114 and the second plane 1115 both adopt the same type of silver paste printing, the embodiment of the present application can control the region with higher resistivity in the viscous conductive layer 12 in the first plane 1114, so as to reduce the area of the region with higher resistivity in the viscous conductive layer 12, thereby being beneficial to improving the performance of an antenna radiator in electronic equipment.
Referring to fig. 17 and 18, when the structural body 111 has a corner 1116, the first structural component 11 may be a middle frame 220 of an electronic device, and when the metal component 1111 of the first structural component 11 is located at a side of the second structural component 21, the metal component 1111 is an antenna radiator of the electronic device, such as a mobile phone 200, and the second structural component 21 is a circuit board 240 of the electronic device. In this way, the circuit board 240 can be reliably electrically connected to the antenna radiator to realize signal transmission between the circuit board 240 and the antenna radiator, and due to the arrangement of the first conductive layer 121 and the second conductive layer 122, the adhesive conductive layer 12 can be printed at different positions of the structure body 111, so as to reduce the structural size of the adhesive conductive layer 12, thereby avoiding the influence of one-time printing of the adhesive conductive layer 12 on the performance of the antenna radiator, and enabling the electronic device to have better benefits in the overall weight and the overall thickness.
In order to verify the improvement of the performance of the antenna radiator due to the arrangement of the adhesive conductive layer 12, the performance of the antenna radiator is simulated by taking the first structural member 11 as the middle frame 220 and the second structural member 21 as the circuit board 240.
Simulation one:
referring to fig. 19, since the adhesive conductive layer 12 is disposed without a requirement on the thickness of the metal component 1111 of the first structural member 11, an electrical connection region 1113 may be formed at an optimal position on the metal component 1111 of the middle frame 220 in terms of the structure of the middle frame 220, so that the performance of the antenna radiator on the middle frame 220 may be improved by disposing the adhesive conductive layer 12 on the electrical connection region 1113 to electrically connect the adhesive conductive layer 12 with the circuit board 240.
As shown in FIG. 20, electrical connector 22a, such as foam, which contacts leaf spring 300, is limited by the requirement of spot-bonding thickness on middle frame 220, and can only be placed on middle frame 220a at the position shown in FIG. 20. Since the thickness of the middle frame 220 is not limited when the adhesive conductive layer 12 of the present application is disposed, when the middle frame 220 is the electrical connection unit 100 of the present application, the position of the adhesive conductive layer 12 can be moved upward compared to fig. 20, so that the electrical connection position between the middle frame 220 and the circuit board 240 is also moved upward, and the electrical connection region 1113 is located at the position shown in fig. 19, compared to the spring 300 of fig. 20, the adhesive conductive layer 12 is closer to the frame 222 of the middle frame 220, and since the antenna radiator is generally disposed on the frame 222, the electrical connection position can be closer to the antenna radiator, so as to reduce the loss during signal transmission on the antenna radiator.
As shown in fig. 21, curve S 0 Is a simulated curve of the antenna radiator performance of reed 300 in the position shown in FIG. 19, curve S 1 A simulated curve of the antenna radiator performance for the location of the adhesive conductive layer 12 shown in fig. 20. As can be seen from fig. 21, taking the n78 band as an example, the performance of the n78 band can be improved by 1dB.
Simulation II:
figure 22 is a size schematic diagram of reed 300 on middle frame 220a in the related art, figure 23 is a size schematic diagram of an adhered conductive layer on middle frame 220, and at least part of the structure of the elastic sheet is illustrated in figures 22 and 23 for easy understanding.
Referring to FIG. 22, spring sheet 300 is covered on middle frame 220a, and the side of the spring sheet abuts against spring sheet 300. For example, the width a of spring sheet 300 can be 3.6mm. Referring to fig. 23, adhesive conductive layer 12 is covered on middle frame 220, the side of the spring plate is abutted on adhesive conductive layer 12, and width b of adhesive conductive layer 12 can be 2mm while ensuring that contact area 124 of the spring plate on adhesive conductive layer 12 is the same as spring plate 300. Therefore, compared with a scheme that the reed 300 improves the electrical contact interface of the middle frame 220a, the area of the viscous conductive layer 12 can be reduced through the arrangement of the viscous conductive layer 12, the structural size of the viscous conductive layer 12 is reduced, the width of the viscous conductive layer 12 is reduced, so that more antenna radiators are arranged on the middle frame 220, and the performance of the antenna radiators is improved.
The results of performance testing on multiple frequency bands are as follows:
Figure 183005DEST_PATH_IMAGE004
as shown in fig. 24 and 25, curve S 2 Is a simulated curve, curve S, of the antenna radiator performance for reed 300 in the position shown in FIG. 22 3 A simulated curve of the antenna radiator performance for the adhesive conductive layer 12 at the position shown in fig. 23. Referring to figures 24, 25 and from table 1, it can be seen that the present application, by the arrangement of the adhesive conductive layer 12, yields at least 0.1dB in performance of the antenna radiator in the 2.4Ghz-2.5Ghz, 3.3Ghz-3.8Ghz and 5.1Ghz-5.9Ghz bands, compared to the arrangement of the reed 300.
And (3) simulation:
after the electrical connection unit 100 of the present application, the benefit of the electronic device such as the mobile phone 200 in terms of the thickness of the whole device will reach 0.2mm to 0.7mm. The benefit of the present application in terms of overall thickness will be described in detail below with reference to reed 300.
Fig. 26 illustrates a partial schematic view of an electronic apparatus in the related art. As shown in fig. 26, at the position of electrical connection between the middle frame 220a and the circuit board 240, the spring plate 300 is fixed to the middle frame 220a by caulking. Taking the thickness c of middle frame 220a as 1mm as an example, the minimum thickness d of the portion where reed 300 covers middle frame 220a and overlaps with middle frame 220a is 0.2mm, so that the total thickness of the portion where reed 300 overlaps with middle frame 220a is 1.2mm. After the electrical connection unit 100 of the present application is used, the thickness of the middle frame 220 can be reduced to 0.5mm and the thickness of the adhesive conductive layer 12 can reach 0.04mm at the electrical connection position of the middle frame 220 and the circuit board 240. The thickness of the middle frame 220 at the location of the electrical removal connection may remain unchanged.
Since the thickness of the middle frame 220 at the electrical connection position is reduced, the distance between the middle frame 220 and the display screen 210 can be increased by 0.66mm, which helps to improve the performance of the antenna radiator. The results of performance testing on multiple frequency bands are as follows:
table 2 shows another income statement of a plurality of frequency bands after the viscous conducting layer is arranged
Frequency band (Ghz) 2.4-2.5 3.3-3.8 5.1-5.9
Income (dB) 0.3 0.6 0.3
As shown in fig. 27 and 28, curve S 4 Is reed 300 in the position shown in figure 26Curve S, a simulation curve of the performance of the antenna radiator 5 A simulation curve of the antenna radiator performance after replacing the reed 300 with the adhesive conductive layer 12. Referring to figures 27, 28 and from table 1, it can be seen that the present application, by the arrangement of the adhesive conductive layer 12, yields at least 0.3dB in performance of the antenna radiator in the 2.4Ghz-2.5Ghz, 3.3Ghz-3.8Ghz and 5.1Ghz-5.9Ghz bands compared to the arrangement of the reed 300.
It should be noted that, after replacing spring 300 with adhesive conductive layer 12, the density of the conductive silver paste forming first conductive layer 121, second conductive layer 122, and third conductive layer 123 is half of the density of spring 300, and when the areas of contact area 124 of adhesive conductive layer 12 and contact area 124 of spring 300 are the same, the volume of adhesive conductive layer 12 is one fourth of the volume of spring 300, and thus the mass of adhesive conductive layer 12 is one eighth of the mass of spring 300. Since a plurality of (e.g., 6-40) electrical connection units 100 are generally disposed in an electronic device, the overall weight and thickness of the electronic device are greatly benefited by replacing the spring 300 with the adhesive conductive layer 12. Note that the above gains have not calculated the weight gain due to the thinning of the first structural member 11.
To verify the improvement of the middle-and long-term wear resistance of the first component 1, the embodiment of the present application was subjected to a wear resistance test. Specifically, the first assembly 1 with the thickness of 35um of the adhesive conductive layer 12 was subjected to a micro-motion test 14400 times using a convex hull elastic sheet and a ball head elastic sheet. In the micro-motion test, a certain contact force is applied to the convex hull elastic sheet or the ball head elastic sheet, reciprocating motion is performed on the viscous conducting layer 12 within a certain stroke range and at a preset test speed, the micro-drop condition of the first structural member 11 and the electronic equipment can be simulated through the micro-motion test, and the medium-and-long-term wear resistance of the first assembly 1 can be reflected through multiple micro-motion tests. Wherein, the silver paste in the viscous conductive layer 12 is full silver paste (i.e. powder such as nickel powder is not added).
The test results of the 3750 th micro-motion test of the convex hull elastic sheet and the ball head elastic sheet under different contact forces are taken as an example for explanation.
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Fig. 29 shows a micromotion test chart of the convex hull shrapnel on the first assembly 1, and fig. 30 shows a micromotion test chart of the ball head shrapnel on the first assembly 1. Referring to fig. 29 and 30, and combining table 3 and table 4, it can be seen that the impedance of the adhesive conductive layer 12 is relatively stable and low when the convex hull elastic sheet or the convex hull elastic sheet reciprocates on the adhesive conductive layer 12, so as to avoid the phenomenon of relatively high impedance when the adhesive conductive layer 12 is worn.
And (4) after 3750 times of micro-motion test, carrying out microscope observation on the first assembly 1, the convex hull elastic sheet and the ball head elastic sheet. The observation of a microscope shows that the adhesive conductive layer 12 still covers the first structural member 11, the limitation that the plastic surface covered by the adhesive conductive layer 12 on the first structural member 11 is exposed does not occur, and the upper surface metal of the convex hull elastic sheet and the upper surface metal of the ball head elastic sheet slightly fall off, but the performance of the convex hull elastic sheet and the ball head elastic sheet does not deteriorate. Therefore, the arrangement of the adhesive conductive layer 12 can improve the medium-and-long-term wear resistance of the electrical connection unit 100 and the electronic device, so that the electrical connection unit 100 and the electronic device have better mechanical reliability. The wear resistance of the adhesive conductive layer 12 formed by silver paste added with nickel powder is better than that of the adhesive conductive layer 12 of full silver paste, and the adhesive conductive layer 12 can be made thinner.
It should be noted that, if the influence of the reserved rounding 410 on the performance of the antenna radiator is neglected, the design of the reserved rounding 410 may also be adopted at the corner 1116, and the dispensing is performed only in the reserved dispensing area at the connection 1117, so as to overcome the problem that the adhesive conductive layer 12 is broken due to the separation of the metal 1111 and the plastic 1112.
On the basis of the above, the present embodiment also provides a manufacturing method of an electrical connection unit, which is applied to the electrical connection unit 100 as described in any one of the above. Referring to fig. 31, the manufacturing method includes:
step S100: forming an adhesive conductive pattern on a surface of the first structural member so that the adhesive conductive pattern covers the electric connection region of the first structural member and the protective layer on the periphery side of the electric connection region; the first structural member comprises a structural body and a protective layer, the structural body comprises a metal piece, and the electric connection region is arranged on the metal piece and exposed outside the first structural member; the protective layer is coated on the surface of the metal piece and is positioned on the periphery of the electric connection area;
step S200: curing the adhesive conductive pattern to form an adhesive conductive layer;
step S300: and conducting the second assembly with the viscous conducting layer so as to conduct a second structural member in the second assembly with the first structural member.
It should be noted that, the structure of the first structural member 11 can refer to the description in the above, and further description is not repeated here. The adhesive conductive pattern 700 may be coated on the electrical connection region 1113 and the protective layer 112 by pad printing. Compared with the way of improving the electrical contact interface of the middle frame 220 by the reed 300, the embodiment of the present application replaces the reed 300 by the adhesive conductive layer 12 to improve the contact effect of the electrical connection region 1113, so as to realize the electrical connection between the second structural member 21 and the first structural member 11, and simultaneously reduce the thickness of the first structural member 11 and the area occupied by the adhesive conductive layer 12 on the first structural member 11.
In addition, by the arrangement of the adhesive conductive layer 12, the electrolyte can be prevented from entering the electrical connection region 1113, so that galvanic corrosion of the first structural member 11 in the electrical connection region 1113 is prevented, the adhesive conductive layer 12 stably covers the electrical connection region 1113, the reliability of connection between the second structural member 21 and the first structural member 11 is ensured, and the medium-and-long-term performance of the electrical connection unit 100 and the electronic device is improved.
Before step S100, as shown with reference to fig. 32, the manufacturing method further includes:
firstly, a slot 510 is opened on a steel plate 500, the depth of the slot is adapted to the thickness of the adhesive conductive layer 12, the shape of the slot is adapted to the shape of the adhesive conductive pattern 700, then the adhesive conductive pattern 700 is formed on a pad 600, then after step S100 is executed to form the adhesive conductive pattern 700 on the surface of the first structural member 11 so that the adhesive conductive pattern 700 covers the electric connection region 1113 of the first structural member 11 and the protective layer 112 around the electric connection region 1113, step S200 is executed to cure the adhesive conductive pattern 700 by baking or the like to form the adhesive conductive layer 12, and finally step S300 is executed to conduct the second structural member 2 with the adhesive conductive layer 12 so that the second structural member 21 in the second structural member 2 is conducted with the first structural member 11, thereby forming the electric connection unit 100.
It should be noted that, before the step S100 is performed to form the adhesive conductive pattern 700 on the surface of the first structural member 11, for example, the middle frame 220 meeting the design requirement, needs to be preprocessed. The pre-treatment generally includes a laser etching or machining of the metal surface of the middle frame 220 exposed to the passivation layer 112, followed by a surface cleaning to remove dust and the like, to form the electrical connection region 1113. This can improve the adhesion of adhesive conductive layer 12 to middle frame 220.
The pad printing process, the design requirement of the middle frame 220, and the curing process of the adhesive conductive pattern 700 may refer to descriptions in related arts, which are not further described herein. When the structural body 111 may further include the plastic component 1112, the electrical connection region 1113 is located on the surface of the metal component 1111 and is in the same plane as the plastic surface of the plastic component 1112, and the adhesive conductive pattern 700 may be simultaneously covered on the electrical connection region 1113, the protective layer 112 and the plastic component 1112 on the periphery of the electrical connection region 1113 by pad printing, so that the adhesive conductive layer 12 formed after curing the adhesive conductive pattern 700 can simultaneously electrically connect the electrical connection region 1113, the protective layer 112 and the plastic component 1112 on the periphery of the electrical connection region 1113, thereby improving the middle and long term performance of the electrical connection unit 100 and the electronic device.
The first plane 1114 of the structure body 111 includes a plastic surface, the plastic surface is disposed opposite to the conducting surface of the second structure 21, and when the electrical connection region 1113 is exposed to the second plane 1115 of the structure body 111 intersecting the first plane 1114,
referring to fig. 33, the step S100 of forming the adhesive conductive pattern 700 on the surface of the first structural member 11 so that the adhesive conductive pattern 700 covers the electrical connection region 1113 of the first structural member 11 and the protective layer 112 on the peripheral side of the electrical connection region 1113 specifically includes:
step S110: forming first conductive patterns on the first plane and the second plane respectively so that the first conductive patterns cover the electric connection area and the protective layer on the peripheral side of the electric connection area, and reserving first dispensing areas at corners of the first plane and the second plane;
step S120: and forming a second conductive pattern by dispensing in the first dispensing area so that the second conductive pattern is connected with two adjacent first conductive patterns, wherein the first conductive pattern is solidified to form a first conductive layer, the second conductive pattern is solidified to form a second conductive layer, and the viscous conductive layer comprises a first conductive layer and a second conductive layer.
It should be noted that, by reserving the first dispensing area 1118, the second conductive layer 122 can be formed in the first dispensing area 1118 by a dispensing manner, so as to implement separate printing of the first conductive layer 121 and the second conductive layer 122 at different positions of the structure body 111, and thus, according to the difference in positions of the first conductive layer 121 and the second conductive layer 122 on the structure body 111, the first conductive layer 121 and the second conductive layer 122 are formed by selecting viscous conductive materials having different materials. Compared with the way of printing the silver paste layer 400 once, the embodiment of the present application can reduce the manufacturing cost of the electrical connection unit 100 and the electronic device, and reduce the structural size of the second conductive layer 122 and the adhesive conductive layer 12, so as to avoid the influence of printing the silver paste layer 400 once on the performance of the electronic device.
The first conductive pattern 710 is typically printed on the first plane 1114 and the second plane 1115 by the pad printing head 600, and the pad printing head 600 is typically a soft rubber head, so that after the first conductive pattern 710 is formed on the pad printing head 600, the pad printing head 600 cannot pad-print the first conductive pattern 710 at the corner 1116 during the process of pad printing head 600 transferring the first conductive pattern 710 to the first plane 1114 and the second plane 1115 due to the right-angled arrangement of the corner 1116 of the first plane 1114 and the second plane 1115, so that the first conductive pattern 710 can be broken at the corner 1116 without masking the corner 1116, and the first dispensing region 1118 is formed at the position where the broken line occurs at the corner 1116, so as to facilitate the formation of the subsequent second conductive layer 122.
Alternatively, in some embodiments, a mask can be used to mask the corner 1116 so that after the pad print head 600 has pad printed the first conductive pattern 710 onto the first plane 1114 and the second plane 1115, the mask can be removed to form the first dispensing region 1118. In this embodiment, the forming manner of the first dispensing region 1118 is not further limited.
In order to meet different requirements of the first plane 1114 and the second plane 1115 for the first conductive layer 121, the first plane 1114 and the second plane 1115 can be printed by the pad 600 in several times, so that the thickness of the first conductive layer 121 on the first plane 1114 is greater than that of the first conductive layer 121 on the second plane 1115, and thus the requirement of the first structural member 11 as the middle frame 220 on the wear resistance of the first plane 1114 is met.
Alternatively, in some embodiments, the first plane 1114 and the second plane 1115 may be printed in several times by the pad printing head 600, and different silver pastes are selected to meet the requirement of the middle frame 220 for the wear resistance of the first plane 1114 when the first structural component 11 is used as the middle frame 220. Specifically, when the pad printing head 600 prints on the first plane 1114, a silver paste with a powder material, such as a nickel powder, may be selected, so that after the pad printing head 600 prints the first conductive pattern 710 on the first plane 1114, the first conductive layer 121 formed on the first plane 1114 may have a better hardness, so as to meet the requirements of the first structural member 11 as the middle frame 220 on the hardness and the wear resistance of the first plane 1114. When the pad printing head 600 prints on the second plane 1115, a full silver paste may be selected, so that after the pad printing head 600 prints the first conductive pattern 710 on the second plane 1115, the first conductive layer 121 formed on the second plane 1115 has a smaller resistivity, so as to meet the requirement that when the first structural member 11 is used as the middle frame 220, the influence on the performance of an antenna radiator caused by an excessively large resistivity area in the adhesive conductive layer 12 is reduced.
It should be noted that, when the first plane 1114 and the second plane 1115 are printed by the pad 600 in a plurality of times, the structure of the pad 600 may be changed, for example, the size of the pad 600 may be reduced, so that the pad 600 may not print on one of the first plane 1114 and the second plane 1115 when printing the other.
Referring to fig. 32, the second conductive pattern 720 may be formed by dispensing at the first dispensing region 1118 by a dispensing apparatus such as a dispensing apparatus having a piezoelectric valve. The minimum line diameter of the second conductive pattern 720 formed by dispensing by the existing glue spraying equipment can be 0.8mm, so that when the first conductive layer 121 on the first plane 1114 and the second plane 1115 is connected through the second conductive layer 122, the size of the second conductive layer 122 at the corner 1116 can be reduced and the performance of the antenna radiator can be improved because the fillet 410 does not need to be reserved at the corner 1116.
The structure body 111 includes a plastic component 1112 connected to the metal component 1111, and when a connection point 1117 between the metal component 1111 and the plastic component 1112 is located in a middle of the second plane 1115, the adhesive conductive pattern 700 is formed on the surface of the first structure 11, so that the protective layer 112 covering the electric connection region 1113 and the electric connection region 1113 of the first structure 11 on the periphery side includes:
forming a first conductive pattern 710 on the second plane 1115, and reserving a second dispensing region at a connection 1117;
a third conductive pattern is formed by dispensing in the second dispensing region, so that the third conductive pattern connects two adjacent first conductive patterns 710, the first dispensing region 1118 and the second dispensing region form a dispensing region of the structure body 111, the adhesive conductive layer 12 further includes a third conductive layer 123 formed by curing the third conductive pattern, and the fracture elongation of the third conductive layer 123 is greater than that of the first conductive layer 121.
It should be noted that, by reserving the second dispensing region, the third conductive layer 123 can be formed at the connection 1117 by a dispensing method, and the fracture elongation of the third conductive layer 123 is greater than the fracture elongation of the first conductive layer 121, so that the third conductive layer 123 has certain ductility, which is helpful for reducing the problem of the function failure of the sticky conductive layer 12 caused by the separation of the metal component 1111 and the plastic component 1112 when the structure body 111 is impacted.
The reserved manner of the second dispensing area may be the first dispensing area 1118 formed by a manner of shielding by a shielding object mentioned in the first dispensing area 1118. Alternatively, the structure of the pad 600 may be modified, such as forming a recess in the pad 600 opposite the connection 1117, so that the second dispensing area can be formed when the pad 600 is printing the second plane 1115. In this embodiment, the reservation mode of the second dispensing region and the formation of the third conductive pattern are not further limited.
It should be noted that when the joint 1117 of the metal component 1111 and the plastic component 1112 is located at the corner 1116, the second conductive layer 122 may be replaced by the third conductive layer 123 to achieve the function of the third conductive layer 123.
After the silver paste is cured, the first component 1 needs to be correspondingly detected, such as appearance detection, adhesion detection, resistance detection, REE monomer test, mechanical reliability and environmental reliability test, so as to ensure that the first component 1 can meet the design requirements.
It should be noted that, because the electronic device of the present application includes the electrical connection unit 100 as described above, on the basis that the electrical connection unit 100 satisfies the electrical connection between two components in the electronic device, the long-term performance and the antenna radiator performance of the electronic device can also be improved, so that the electronic device has better benefits in terms of the overall weight and the overall thickness.
In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
The terms "first," "second," "third," "fourth," and the like in the description and claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Claims (15)

1. An electrical connection unit, comprising a first component and a second component, wherein the first component comprises a first structural member and an adhesive conductive layer, the first structural member comprises a structural body and a protective layer, the structural body comprises a metal piece, the surface of the metal piece is provided with an electrical connection area, and the electrical connection area is exposed to the outside of the first structural member; the protective layer is positioned on the peripheral side of the electric connection area and covers the surface of the metal piece; the adhesive conductive layer covers the electric connection area and the protective layer on the periphery of the electric connection area;
the second assembly comprises a second structural part which is conducted with the electric connection region through the viscous conducting layer;
the structure body further comprises a plastic part connected with the metal part, and the viscous conducting layer is positioned between the metal part and the plastic part and covers the electric connection area, the protective layer on the periphery of the electric connection area and the connection part of the metal part and the plastic part;
the structural body is provided with a first plane and a second plane in the direction facing the second structural part, and the first plane and the second plane are two intersecting planes on the structural body; the adhesive conductive layer comprises a first conductive layer and a second conductive layer, the first conductive layer is respectively positioned on the first plane and the second plane to cover the electric connection region;
the joint is located in the middle of the second plane; the adhesive conducting layer further comprises a third conducting layer, the third conducting layer is located at the connecting position to connect the metal piece, the plastic piece and the adjacent first conducting layer, and the fracture elongation of the second conducting layer and the third conducting layer is larger than that of the first conducting layer.
2. The electrical connection unit of claim 1, wherein the adhesive conductive layer has an area greater than the area of the electrical connection region, and wherein a peripheral side edge of the adhesive conductive layer overlies the protective layer on a peripheral side of the electrical connection region.
3. The electrical connection unit of claim 1, wherein the second structure member has a conductive surface in conductive communication with the first structure member, and the first plane is parallel to the conductive surface;
the adhesive conducting layer at least covers the first plane, the second structural member is located at the corner of the first plane and the second plane, and the second structural member is conducted with the first structural member through the conducting surface and the adhesive conducting layer.
4. The electrical connection unit of claim 3, wherein the first plane has a plastic surface of the plastic member, the plastic surface is disposed opposite to the conducting surface, and the electrical connection region is exposed to the second plane;
the second conducting layer is located at the corner to connect the adjacent first conducting layers, so that the second structural member is conducted with the electric connection region.
5. The electrical connection unit of claim 4, wherein the first conductive layer is a pad printing adhesive conductive layer, the corner and the joint are dispensing areas, and the second conductive layer and the third conductive layer are conductive layers formed in the dispensing areas by dispensing.
6. The electrical connection unit of claim 5, wherein the thickness of the first conductive layer on the first plane is greater than the thickness of the first conductive layer on the second plane, or wherein the stiffness of the first conductive layer on the first plane is greater than the stiffness of the first conductive layer on the second plane.
7. The electrical connection unit according to any one of claims 4 to 6, wherein the first structural member is a middle frame of an electronic device, and when the metal piece of the first structural member is located on a side of the second structural member, the metal piece is an antenna radiator of the electronic device, and the second structural member is a circuit board of the electronic device.
8. The electrical connection unit according to any one of claims 1 to 6, wherein the second component comprises an electrical connector in electrical communication with the second structure, the electrical connector is located between the second structure and the adhesive conductive layer to electrically connect the second structure with the first structure, and a surface of the second structure connected to the electrical connector is a conductive surface.
9. The electrical connection unit of claim 8, wherein the second assembly further comprises a dielectric layer between the second structure and the electrical connector such that the electrical connector and the second structure form a coupling feed assembly configured to conduct the second structure with the first structure through the adhesive conductive layer.
10. The electrical connection unit according to any of claims 1-6, wherein the adhesive conductive layer is a silver paste layer.
11. A manufacturing method of an electrical connection unit, which is applied to the electrical connection unit according to any one of claims 1 to 10, the manufacturing method comprising:
forming an adhesive conductive pattern on a surface of a first structural member so that the adhesive conductive pattern covers an electrical connection region of the first structural member and a protective layer on a peripheral side of the electrical connection region; the first structural member comprises a structural body and the protective layer, the structural body comprises a metal piece, and the electric connection region is arranged on the metal piece and is exposed to the outside of the first structural member; the protective layer is coated on the surface of the metal piece and is positioned on the periphery side of the electric connection area;
curing the adhesive conductive pattern to form an adhesive conductive layer;
and conducting a second assembly with the adhesive conducting layer so as to conduct a second structural member in the second assembly with the first structural member.
12. The method of manufacturing of claim 11, wherein the first plane of the structural body includes a plastic face disposed opposite the conductive face of the second structural member, and wherein the electrical connection region is exposed to a second plane of the structural body intersecting the first plane,
the forming of the sticky conductive pattern on the surface of the first structural member so that the sticky conductive pattern covers the electric connection area of the first structural member and the protective layer on the periphery side of the electric connection area specifically includes:
forming first conductive patterns on the first plane and the second plane respectively so that the first conductive patterns cover the electric connection area and the protective layer on the periphery side of the electric connection area, and reserving first dispensing areas at corners of the first plane and the second plane;
and forming a second conductive pattern in the first dispensing area by dispensing so as to enable the second conductive pattern to be connected with two adjacent first conductive patterns, wherein the first conductive patterns form a first conductive layer after being cured, the second conductive patterns form a second conductive layer after being cured, and the viscous conductive layer comprises the first conductive layer and the second conductive layer.
13. The manufacturing method according to claim 12, wherein the structural body further includes a plastic member connected to the metal member, and when a connection point of the metal member and the plastic member is located in a middle portion of the second plane, the forming of the adhesive conductive pattern on the surface of the first structural member so that the adhesive conductive pattern covers the electrical connection area of the first structural member and a protective layer around the electrical connection area specifically includes:
forming the first conductive pattern on the second plane, and reserving a second dispensing area at the connection position;
and dispensing in the second dispensing area to form a third conductive pattern so that the third conductive pattern is connected with two adjacent first conductive patterns, wherein the first dispensing area and the second dispensing area form a dispensing area of the structure body, the viscous conductive layer further comprises a third conductive layer formed by curing the third conductive pattern, and the fracture elongation of the third conductive layer is greater than that of the first conductive layer.
14. An electronic device characterized by comprising an electrical connection unit according to any one of claims 1-10.
15. The electronic device according to claim 14, comprising a middle frame, a display screen, a battery cover, and a circuit board, wherein the display screen and the battery cover are located on two opposite sides of the middle frame, the circuit board is located on one side of the middle frame facing the battery cover, the first structural member of the electrical connection unit is the middle frame, and the second structural member of the electrical connection unit is the circuit board and the display screen that can be conducted with the middle frame.
CN202210953514.3A 2022-08-10 2022-08-10 Electric connection unit, manufacturing method and electronic equipment Active CN115036717B (en)

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