CN213241181U - Fingerprint module and electronic equipment - Google Patents

Fingerprint module and electronic equipment Download PDF

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Publication number
CN213241181U
CN213241181U CN202021743299.7U CN202021743299U CN213241181U CN 213241181 U CN213241181 U CN 213241181U CN 202021743299 U CN202021743299 U CN 202021743299U CN 213241181 U CN213241181 U CN 213241181U
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China
Prior art keywords
circuit board
fingerprint module
edge
extension
fingerprint
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CN202021743299.7U
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Chinese (zh)
Inventor
洪厚碧
杨毓横
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Jiangxi Oumaisi Microelectronics Co Ltd
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OFilm Microelectronics Technology Co Ltd
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Priority to CN202021743299.7U priority Critical patent/CN213241181U/en
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Abstract

The utility model provides a fingerprint module and electronic equipment, this fingerprint module include the circuit board, be formed at the fingerprint chip on the circuit board and be formed at the stiffening plate of one side that the fingerprint chip was kept away from to the circuit board, and the stiffening plate is used for playing the fixed stay effect to the circuit board. Specifically, seen in the direction perpendicular to the circuit board, the outline of the circuit board in the width direction protrudes out of the outline of the reinforcing plate, so that the circuit board can be partially exposed out of the reinforcing plate, the exposed area of the circuit board relative to the reinforcing plate is indirectly increased, the assembly equipment can conveniently grab the circuit board with a larger area for attaching, and the attaching capability of the circuit board is improved. Further, this electronic equipment's side edge has fingerprint module with discernment user fingerprint information, and this fingerprint module's laminating ability is stronger thereby makes the electronic equipment who installs this fingerprint module respond very fast to user's biological identification.

Description

Fingerprint module and electronic equipment
Technical Field
The utility model relates to a biological identification field especially relates to a fingerprint module and electronic equipment.
Background
With the idea of saving reduction, the current edge fingerprint customers are gradually introducing a structural scheme of matching a 2D reinforcing plate with a longer TPU because the cost is greatly different from 2D due to the complex processing technology of the 3D reinforcing plate relative to the 2D reinforcing plate, in the scheme, the corresponding 2D reinforcing plate needs to be larger than a fingerprint chip to be matched with a whole machine clamping key due to the fact that the structure of the 3D reinforcing plate hand-mounted clamping key is cancelled, the TPU (Thermoplastic Urethane, polyether plastic is used for grabbing part of a circuit board for laminating when a user presses a Dome (or Dome array or Dome sheet) to assemble equipment for operation, the template precision is not high, the laminating difficulty of the processing technology is improved by multiple times (the fingerprint chip is shielded by the reinforcing plate, the size of the customer is controlled and the size of the circuit board is controlled by taking the center of the circuit board to the edge of the circuit board, the complete circuit board shape fitting cannot be completely grasped by the assembling equipment), so the design needs to be carried out from the matching structure of the reinforcing plate and the circuit board, and the circuit board fitting capacity is improved.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application discloses fingerprint module and electronic equipment can effectively promote circuit board laminating ability.
The embodiment of the application discloses fingerprint module, include:
a circuit board;
the fingerprint chip is arranged on the circuit board; and
the reinforcing plate is arranged on the surface of the circuit board, which deviates from the fingerprint chip, and the circuit board is provided with a length direction and a width direction perpendicular to the length direction when viewed along the direction perpendicular to the circuit board, and the outline of the circuit board in the width direction protrudes out of the outline of the reinforcing plate.
Specifically, in this embodiment, when viewed in a direction perpendicular to the circuit board, the outline of the circuit board in the width direction protrudes beyond the outline of the reinforcing plate, so that the circuit board can be partially exposed outside the reinforcing plate, and the exposed area of the circuit board relative to the reinforcing plate is indirectly increased, thereby facilitating the assembly equipment to grab a larger area of the circuit board for attaching, and improving the attaching capability of the circuit board.
Further, in the length direction, at least one of two ends of the reinforcing plate protrudes out of the outline of the circuit board;
the circuit board is a strip-shaped body when viewed in a direction perpendicular to the circuit board, the circuit board has a length direction, and the first direction is the length direction of the circuit board.
Specifically, at least one end of the reinforcing plate of the fingerprint module protrudes out of the circuit board, so that at least one end of the reinforcing plate protrudes out of the circuit board, and the reinforcing plate is conveniently connected to the edge of the shell frame of the electronic equipment in a lap joint mode to fix the shell frame.
Further, the circuit board comprises a main body part and a connecting part connected to one of two ends of the main body part, the fingerprint chip is arranged on the main body part, and the connecting part is used for electrically connecting an external element;
the reinforcing plate comprises a supporting part and an extending part located at least one end of the supporting part, the supporting part is arranged on the surface of the main body part far away from the fingerprint chip, and the extending part protrudes out of the outline of the circuit board.
Specifically, the extension portion is formed at one end of the supporting portion and protrudes out of the outline of the circuit board, so that the assembling equipment can conveniently grab the end portion of the reinforcing plate without being interfered by the circuit board, and the reinforcing plate is fixed by being lapped on the frame of the shell.
Furthermore, the extension portion includes a first extension portion and a second extension portion, and the first extension portion and the second extension portion are respectively connected to two ends of the support portion and both protrude from the outline of the circuit board along the first direction.
Specifically, the first extension part and the second extension part protrude out of the outline of the circuit board, so that the assembling equipment can conveniently grab the end parts at two ends of the reinforcing plate without being interfered by the circuit board, and the reinforcing plate is lapped on the frame of the shell to be fixed.
Furthermore, the circuit board further comprises an extending end connected with one end, far away from the connecting portion, of the main body portion, the extending end is at least partially overlapped with the first extending portion, and the connecting portion is at least partially overlapped with the second extending portion.
Specifically, the extending end is overlapped with the first extending portion, and the connecting portion is overlapped with the second extending portion, so that the circuit board can be partially exposed out of the first extending portion and the second extending portion, the exposed area of the circuit board relative to the reinforcing plate is increased, the assembling equipment can grab the circuit board with a large area for fitting, and the fitting capacity is improved.
Furthermore, the stiffening plate is also provided with a notch, the notch is positioned between the first extending part and the supporting part and corresponds to at least part of the contour line of the circuit board, and the notch is used for exposing part of the circuit board.
Specifically, the reinforcing plate is provided with the notch, so that the circuit board can be exposed in a larger area, and the attaching capability is enhanced.
Further, a dimension of at least one of the first extension portion and the second extension portion in a second direction of the width direction is larger than a dimension of the main body portion in the width direction.
Specifically, the width of the first extension part and/or the second extension part is larger than that of the main body part, so that the reinforcing plate can be conveniently lapped on the frame of the shell to realize fixation.
Further, the first extension part or the second extension part is provided with an extension part main body, and the extension part main body is provided with a first edge, a second edge and a third edge which are connected in sequence; wherein the first edge is in smooth transition with the contour line of the supporting part; the joint of the first edge and the second edge and the joint of the second edge and the third edge are in smooth transition; and the third edge is in smooth transition with the contour line of the supporting part.
Specifically, the connecting positions of the first edge, the second edge and the third edge of the extension part main body are in smooth transition so as to protrude out of two ends of the circuit board, so that the extension part main body can be conveniently lapped on the edge of the shell to realize fixation.
Further, in the first direction, the length of the first edge or the third edge is defined as a preset length; wherein:
the ratio of the size of the overlapped part of the connecting part and the second extending part and/or the overlapped part of the extending end and the first extending part in the first direction to the preset length is between 0.4 and 0.6.
Specifically, the ratio of the size of the overlapping portion of the connecting portion and the second extending portion, and/or the overlapping portion of the extending end and the first extending portion in the first direction to the preset length is between 0.41 and 0.51, that is, the connecting portion of the circuit board is not completely shielded by the second extending portion, that is, the connecting portion may be partially exposed relative to the second extending portion, so as to enhance the attaching capability.
The embodiment of the application further discloses electronic equipment, the electronic equipment comprises the fingerprint module.
Specifically, the fingerprint identification operation response speed of the electronic equipment is high.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the embodiment of the application provides a fingerprint module, this fingerprint module includes the circuit board, forms the fingerprint chip on the circuit board and forms the stiffening plate of keeping away from one side of fingerprint chip in the circuit board, and the stiffening plate is used for playing the fixed stay effect to the circuit board. Specifically, seen in the direction perpendicular to the circuit board, the outline of the circuit board in the width direction protrudes out of the outline of the reinforcing plate, so that the circuit board can be partially exposed out of the reinforcing plate, the exposed area of the circuit board relative to the reinforcing plate is indirectly increased, the assembly equipment can conveniently grab the circuit board with a larger area for attaching, and the attaching capability of the circuit board is improved.
Further, this application embodiment still includes electronic equipment, and electronic equipment includes the casing, has the groove of accomodating the fingerprint module wherein on the side frame of casing for this electronic equipment's side edge has fingerprint module in order to discern user's fingerprint information, and thereby this fingerprint module's laminating ability is stronger makes the electronic equipment who installs this fingerprint module respond very fast to user's biological identification.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a fingerprint module according to an embodiment of the present invention;
fig. 2 is a schematic partial structural view illustrating a first reinforcing plate of a fingerprint module according to an embodiment of the present invention and a circuit board combined together;
fig. 3 is a schematic partial structural view illustrating a second reinforcing plate of a fingerprint module according to an embodiment of the present invention and a circuit board combined together;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Description of reference numerals:
1-fingerprint module;
11-a circuit board; 111-a body portion; 112-a connecting portion; 113-an extension end;
12-a fingerprint chip;
13-a stiffening plate; 131-a support portion; 132-an extension; 1321-a first extension; 1322-a second extension; 133-notch;
14-a connector;
2-an electronic device;
21-a receiving cavity; 22-a housing; 23-frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present application will be further described with reference to the following embodiments and accompanying drawings.
As shown in fig. 1 to 4, the embodiment of the present application discloses a fingerprint module 1 and electronic equipment 2, and fingerprint module 1 is an identification component that is assembled in electronic equipment 2 in order to discern user identity information and thereby prevent user identity information from revealing, and in this embodiment, fingerprint module 1 includes: a circuit board 11, a fingerprint chip 12 and a reinforcing plate 13; the fingerprint chip 12 is disposed on the circuit board 11 and configured to identify a fingerprint touch operation of a user, so as to perform a subsequent response operation to meet a user requirement. The electronic device 2 may be a mobile phone, a tablet computer, an ATM machine, a vehicle-mounted touch screen, a fingerprint door lock, etc. The embodiment is described by taking the electronic device 2 as a mobile phone as an example, the mobile phone includes the fingerprint module 1 defined above, and the structure, function and effect of the fingerprint module 1 are consistent with the structure and function of the fingerprint module 1 defined above.
Specifically, as shown in fig. 1 to 3, in the embodiment of the fingerprint module 1 disclosed in this embodiment, viewed in the direction perpendicular to the circuit board 11, the outline of the circuit board 11 in its width direction (i.e., the up-down direction in fig. 1) protrudes beyond the outline of the reinforcing plate 13, namely, part of the outline of the circuit board 11 protrudes out of the outline of the reinforcing plate 13 to increase the exposed area of the circuit board 11 relative to the reinforcing plate 13, that is, the projection of the circuit board 11 on the reinforcing plate 13 is overlapped with the outline of the reinforcing plate 13, so that part of the outline of the circuit board 11 is exposed relative to the reinforcing plate 13, thereby being convenient to grab a larger area of the circuit board 11 for attaching, because the assembling equipment must grab the appearance of the circuit board 11 for fitting, the more the circuit board 11 is exposed, the more the contour of the circuit board 11 grabbed by the assembling equipment is, the higher the fitting precision is, and the fitting capability can be improved.
Specifically, in this embodiment, the whole stiffening plate 13 is "i-shaped" or "bone-shaped", so that the two ends of the stiffening plate 13 protrude out of the circuit board 11, and the two ends of the stiffening plate 13 are only partially overlapped with the circuit board 11 due to the design of the special structure, that is, the circuit board 11 can be exposed at the two end portions of the stiffening plate 13, so as to achieve the attaching capability.
In the embodiment disclosed in this embodiment, the stiffening plate 13 is disposed on a side of the circuit board 11 away from the fingerprint chip 12, and is used for supporting the circuit board 11, and the stiffening plate 13 is used for overlapping the edge of the frame of the casing of the whole device to realize a fixing effect. In addition, in order to better achieve the overlapping and fixing function of the reinforcing plate 13 and the frame of the whole casing, in this embodiment, the circuit board 11 is a strip-shaped structure, which has a length direction, and when viewed along a direction perpendicular to the circuit board 11, at least one of two ends of the reinforcing plate 13 protrudes out of the outline of the circuit board 11 in the length direction of the circuit board 11 (i.e., the left and right direction shown in fig. 1), so that at least one of two ends of the reinforcing plate 13 protruding out of the circuit board 11 can be overlapped on the frame of the whole casing without being interfered by the circuit board 11, so as to achieve the fixing function of the fingerprint module 1 on the frame of the whole casing. Specifically, the above object can be achieved by protruding either end of the reinforcing plate 13 from the contour of the circuit board 11, or protruding both ends of the reinforcing plate 13 from the contour of the circuit board 11.
It should be noted that, the fingerprint chip 12 needs to be packaged by a package component, the package component may specifically be a Land Grid Array (LGA), a pad of the LGA is soldered to the circuit board 11, the package component may be, for example, a Land Grid Array (LGA), but is not limited thereto, and may also be a package component of another chip package structure, such as a ball Grid Array (bga) package, which is specifically selected according to actual needs, and this embodiment is not specifically limited thereto.
In addition, the fingerprint chip 12 may be attached to the circuit board 11 by glue. In particular, the fingerprint chip 12 may be an optical fingerprint identification chip. Fingerprint chip 12 is used for gathering light, and fingerprint pattern when parts such as the touch-sensitive screen of intensity detection electronic equipment according to gathering light are touched, specifically, when the finger is pressed to the touch-sensitive screen surface, the light that touch panel sent upwards launches to the finger, incident light hits the epidermis layer of finger after reflection to fingerprint chip 12, because the existence of the line on the finger, the light intensity of different position reflections is different, can reflect the fingerprint pattern on the finger according to the light of different intensities, realize the fingerprint identification function. It is understood that the fingerprint chip 12 can also be a capacitive fingerprint identification chip or an infrared fingerprint identification chip, which is not limited herein.
In an implementation manner of the present embodiment, as shown in fig. 1 to 3, the circuit board 11 includes a main body portion 111 and a connection portion 112 connected to one of two ends of the main body portion 111, the fingerprint chip 12 is disposed on the main body portion 111, and the connection portion 112 is used for electrically connecting an external element; specifically, the circuit board 11 may be in a racetrack shape as shown in fig. 2, the circuit board 11 includes a main body portion 111 located in a middle region of the racetrack structure and a connection portion 112 located at either end of the main body portion 111, the connection portion 112 may be located at a left end of the main body portion 111 in fig. 2, or may be located at a right end of the main body portion 111 in fig. 2, in this embodiment, the connection portion 112 is set to be located at the left end of the main body portion 111, and the connection portion 112 is used for electrically connecting the fingerprint chip 12 and other external circuit elements.
The circuit board 11 is a flexible circuit board, and has the characteristics of high wiring density, light weight, thin thickness, good bendability, and the like. Specifically, the substrate of the circuit board 11 may be made of Polyimide film (PI film); further, the substrate of the circuit board 11 may be formed by two layers of Polyimide resin (PI resin), or may be formed by combining a layer of Polyimide substrate with a layer of protective layer resin made of other materials, which is not specifically limited in this embodiment.
It is specific, stiffening plate 13 is connected to the earthing terminal electricity of circuit board 11, thereby make to form the conductive region on the circuit board 11, because be equipped with the electrically connected conductive region in stiffening plate 13 on the circuit board 11, therefore, in this fingerprint module 1 use, the static of beating on fingerprint module 1 can release the conductive region from the air gap around fingerprint chip 12, then lead to stiffening plate 13 through the conductive region, and then on the leading-in electronic equipment complete machine of installing this fingerprint module 1 through stiffening plate 13, consequently can reach antistatic effect under the condition that need not to set up parts such as antistatic becket, thereby the structure of this fingerprint module 1 has been simplified, the volume of fingerprint module 1 has been reduced, the manufacturing cost of fingerprint module 1 has been practiced thrift, be favorable to being equipped with the frivolous development of the electronic equipment of this fingerprint module 1.
It is understood that the reinforcing plate 13 may enhance the strength of the circuit board 11 due to the flexible characteristic of the circuit board 11, which may cause the flexible circuit board 11 to be easily cracked when being stressed, i.e., difficult to connect the fingerprint chip 12. In addition, the connecting portion 112 may be soldered on the circuit board 11, specifically, when the connecting portion 112 is soldered on the circuit board 11 by a Surface Mount Technology (SMT), in this process, the reinforcing plate 13 may be first disposed on the lower Surface of the circuit board 11, so that the circuit board 11 is not easily deformed during the soldering process, and the connecting effect is ensured. Further, a layer of solder paste may be disposed between the fingerprint chip 12 and the circuit board 11, and the solder paste may fix the fingerprint chip 12 and the circuit board 11 during SMT soldering.
Specifically, the reinforcing plate 13 is disposed on a side of the circuit board 11 away from the fingerprint chip 12 by curing the heat conductive adhesive to enhance the structural strength of the circuit board 11. In this embodiment, the thickness of the reinforcing plate 11 may be set to 1.39mm ± 0.08mm, and the thickness of the cured thermal conductive adhesive is preferably 0.03 mm. It can be understood that the thickness of the stiffening plate 11 and the cured thermal conductive adhesive is not limited thereto, and can be increased as required to improve the structural strength of the fingerprint module 1. And the gap between the fingerprint chip 12 and the circuit board 11 can be greater than or equal to 0.01mm and less than or equal to 0.07 mm. The total thickness of the fingerprint chip 12 and the circuit board 11 may be 1.02 ± 0.01 mm.
In the present embodiment, the reinforcing plate 13 includes a supporting portion 131 and an extending portion 132 located at least one end of the supporting portion 131, that is, in the present embodiment, the extending portion 132 may be one extending portion 132 disposed at an end of either end of the supporting portion 131, or may be two extending portions 132 disposed at both ends of the supporting portion 131 as shown in fig. 2, specifically, the disposed position and the disposed number of the extending portions 132 are set according to actual needs, and the present embodiment is not particularly limited thereto.
More specifically, the supporting portion 131 is disposed on a surface of the main body portion 111 away from the fingerprint chip 12, and is used for supporting the main body portion 111 in the middle area of the circuit board 11. Since the circuit board 11 is usually a flexible circuit board 11, the strength thereof is weak, and the reinforcing plate 13 is provided to fix and support the circuit board 11 in order to prevent the circuit board 11 from deforming and the like. In addition, in the present embodiment, the extension portion 132 protrudes from the outline of the circuit board 11, that is, the extension portion 132 is longer than the circuit board 11 in the left-right direction shown in fig. 2, so that the assembling device can conveniently grab the end of the reinforcing plate 13 without being interfered by the circuit board 11, so as to be lapped on the frame of the housing to achieve fixing. Specifically, the length of the extension portion 132 protruding from the outline of the circuit board 11 is set according to actual needs, as long as the requirement that the assembly equipment can quickly and accurately grasp the extension portion 132 is met, and the embodiment does not specifically limit the extension portion.
It should be added that, as for the forming manner of the supporting portion 131 and the extending portion 132, the reinforcing plate 13 may be integrally formed into a whole, and a complete reinforcing plate 13 may be divided into the supporting portion 131 and the extending portion 132 according to the area, so as to save the processing technology and reduce the processing time cost; or the supporting portion 131 and the extending portion 132 may be formed separately, and then the supporting portion 131 and the extending portion 132 are spliced into a complete reinforcing plate 13 by using a splicing manner, in short, the forming manner of the reinforcing plate 13 may be selected according to actual needs, which is not specifically limited in this embodiment.
In addition, since the reinforcing plate 13 is used for supporting the circuit board 11, the stiffness or strength of the reinforcing plate 13 should be at least greater than the stiffness or strength of the circuit board 11, and the circuit board 11 is usually made of a PCB material, so the stiffness or strength of the reinforcing plate 13 is at least greater than the strength or strength of the PCB material, specifically, in this embodiment, the reinforcing plate 13 is made of steel, and has a greater structural strength, so as to support the circuit board 11.
Further, in the present embodiment, as shown in fig. 1 to 2, the extension portion 132 includes two first extension portions 1321 and two second extension portions 1322 respectively located at the left and right ends of the supporting portion 131, and the first extension portion 1321 and the second extension portion 1322 are respectively located at the left and right ends of the supporting portion 131, and in the present embodiment, as shown in fig. 2, it is set that the first extension portion 1321 is located at the right end of the supporting portion 131, and the second extension portion 1322 is located at the left end of the supporting portion 131. Moreover, in the present embodiment, the first extending portion 1321 and the second extending portion 1322 protrude from the contour of the circuit board 11 along the left-right direction in fig. 2, so that the assembling device can conveniently grab the end portions of the two ends of the reinforcing plate 13 without being interfered by the circuit board 11, so as to be lapped on the frame of the housing for fixing.
It should be noted that, the lengths of the first extending portion 1321 and the second extending portion 1322 protruding from the circuit board 11 are set according to actual requirements, which is not specifically limited in this embodiment, and the lengths of the first extending portion 1321 and the second extending portion 1322 protruding from the circuit board 11 may be equal or unequal.
Further, as shown in fig. 1 to fig. 3, the circuit board 11 further includes an extending end 113 connected to one end of the main body 111 away from the connecting portion 112, the extending end 113 is at least partially overlapped with the first extending portion 1321, and the connecting portion 112 is at least partially overlapped with the second extending portion 1322 to increase an exposed area of the circuit board 11 relative to the reinforcing plate 13, so that the assembling apparatus can grasp a larger area of the circuit board 11 for bonding, thereby improving a bonding capability. It should be noted that the overlapping area of the extending end 113 and the first extending portion 1321 and the overlapping area of the connecting portion 112 and the second extending portion 1322 may be uniform or non-uniform, and the specific overlapping area is set according to actual needs, which is not specifically limited in this embodiment.
In addition, in the embodiment, as shown in fig. 2, the extending end 113 is located at the right end of the main body 111, the connecting portion 112 is located at the left end of the main body 111, and the extending end 113, the connecting portion 112 and the main body 111 can be integrally formed to form a complete circuit board 11, so as to save the processing process.
Further, in another embodiment of the present embodiment, as shown in fig. 3, a notch 133 may be formed on the extending portion 132 of the reinforcing plate 13, for example, the notch 133 is formed between the first extending portion 1321 and the supporting portion 131, or the notch 133 is formed between the second extending portion 1322 and the supporting portion 131, and the notch 133 corresponds to the circuit board 11, so that at least a part of a contour line of the circuit board 11 is exposed at the notch 133, so that a part of the circuit board 11 is exposed and not covered by the reinforcing plate 13, and thus, a larger area of the circuit board 11 may be conveniently grasped for attaching, so that the attaching capability may be improved.
It should be noted that, as for the shape of the notch 133, a rectangular notch or other irregular or regular shaped notches may be specifically used, and the purpose is to increase the exposed area of the circuit board 11 relative to the reinforcing plate 13 to improve the attaching capability of the circuit board 11, and in this embodiment, the specific shape and size of the notch 133 are not limited. In addition, the notch 133 may be formed by integrally stamping, cutting or cutting, and the forming method is not limited in this embodiment.
Further, as shown in fig. 2, in the present embodiment, a dimension of at least one of the first extending portion 1321 and the second extending portion 1322 in the width direction (the up-down direction shown in fig. 2) is larger than a dimension of the main body portion 111 in the second direction. Specifically, the width of the first extending portion 1321 and/or the second extending portion 1322 is greater than the width of the main body portion 111, so that the reinforcing plate 13 can be conveniently overlapped on the frame of the housing to be fixed, and the specific difference of the widths is set according to actual needs, which is not specifically limited in this embodiment.
Specifically, the width dimension (i.e., the dimension in the up-down direction shown in fig. 2) of each of the first extending portion 1321 and the second extending portion 1322 may be larger than the dimension of the main body portion 111, or the width dimension (i.e., the dimension in the up-down direction shown in fig. 2) of one of the first extending portion 1321 and the second extending portion 1322 may be larger than the dimension of the main body portion 111, and the width dimension of the other may be equal to the dimension of the main body portion 111.
Further, as shown in fig. 1 to 3, in addition to the above-described overlapping of the extending portion 132 and the end portion of the circuit board 11 to expose the circuit board 11 with a larger area, the main body portion 111 may also be exposed relative to the supporting portion 131 to increase the exposed area of the circuit board 11 to improve the attaching capability, and therefore, in the present embodiment, along the second direction (i.e., the up-down direction shown in fig. 2), the size of the main body portion 111 is larger than the size of the supporting portion 131, i.e., the width of the main body portion 111 is larger than the width of the supporting portion 131, so that in the up-down direction, the exposed area of the main body portion 111 relative to the supporting portion 131 is increased to.
Further, as shown in fig. 2, in the present embodiment, the stiffening plate 13 may be configured to have an "i-shaped" structure, and specifically, in the present embodiment, the first extending portion 1321 or the second extending portion 1322 may be configured to have a curved structure as shown in fig. 2, specifically, the implementation manner is as follows: the first extension part 1321 or the second extension part 1322 has an extension part main body, which has a first edge a, a second edge b and a third edge c connected in sequence, wherein the first edge a is opposite to the third edge c, and the second edge b is connected with the first edge a and the third edge c; as shown in fig. 2, the first edge a is an upper edge of the second extending portion 1322 or an upper edge of the first extending portion 1321 in the left-right direction, the second edge b is a left edge of the first extending portion 1321 or a right edge of the second extending portion 1322 in the left-right direction, the third edge c is an edge of the first extending portion 1321 or a lower edge of the second extending portion 1322 in the up-down direction, and the first edge a is in transition with a smooth contour line of the supporting portion; the joint of the first edge a and the second edge b and the joint of the second edge b and the third edge c are in smooth transition; the third edge c is smoothly transited to the contour line of the supporting portion to expose a larger area of the circuit board 11.
In this embodiment, two fingerprint modules with different sizes are specifically illustrated, fig. 1 of this embodiment illustrates a fingerprint module 1 with a first size, and fig. 1 and fig. 2 can be referred to for the first size. Specifically, in the first direction (i.e., the left-right direction shown in fig. 1 or fig. 2), the length of the first edge a or the third edge c is defined as a preset length; the ratio of the size of the overlapped portion of the connecting portion 112 and the second extending portion 1322, and/or the overlapped portion of the extending end 113 and the first extending portion 1321 in the first direction to the preset length is between 0.4 and 0.6, and it is sufficient to set the specific value of the overlapped portion of the connecting portion 112 and the second extending portion 1322, and/or the specific value of the size of the overlapped portion of the extending end 113 and the first extending portion 1321 in the first direction and the specific value of the preset length according to actual needs, so that the ratio is within the above ratio range of the embodiment.
For example, the first size is: the preset length is 1.23mm, and the maximum value of the size of the overlapped part of the connecting part 112 and the second extension 1322 and/or the overlapped part of the extending end 113 and the first extension 1321 in the first direction is 0.63 mm; or the second size is: the predetermined length is 1.03mm, and the maximum value of the size of the overlapped portion of the connecting portion 112 and the second extension 1322, and/or the overlapped portion of the extending end 113 and the first extension 1321 in the first direction is 0.43 mm. Specifically, the maximum width of the overlapped portion of the connecting portion 112 and the second extending portion 1322 is 0.63mm or 0.43mm, that is, the second extending portion 1322 does not completely shield the connecting portion 112 of the circuit board 11, that is, the connecting portion 112 may be partially exposed with respect to the second extending portion 1322, so as to enhance the attaching capability; likewise, the maximum width of the overlapping portion of the extended end 113 and the first extended portion 1321 is 0.63mm or 0.43mm to enhance the fitting ability. In addition, the size of the overlapping portion of the connecting portion 112 and the second extending portion 1322 and/or the overlapping portion of the extending end 113 and the first extending portion 1321 in the first direction may refer to the two size examples, and may also be specifically set according to actual needs, which is not specifically limited in this embodiment.
In addition, the CPK curve graph obtained by detection when the fingerprint modules with the two different sizes are processed can show that the CPK values of the two fingerprint modules in the processing process are respectively 0.79 and 1.88, and the CPK values are small in total, so that the manufacturing process capability of manufacturing the fingerprint module 1 is stable. Additionally, CPK is a process capability, also called a process capability, and refers to a capability of satisfying processing quality in the process processing aspect, and a smaller CPK value indicates that the whole process is more stable.
Further, as shown in fig. 2, a side edge a of the extension end 113 away from the main body 111 protrudes away from the main body 111, that is, a right side edge of the extension end 113 shown in fig. 2, so that the extension end 113 forms a fan-shaped structure, and an overlapping area of the reinforcing plate 13 and the extension end 113 is appropriately reduced, so as to increase an exposed area of the circuit board 11, and improve the attaching capability.
In some embodiments, as shown in FIG. 1, one end of the circuit board 11 is provided with a connector 14. Thus, the circuit board 11 of the fingerprint module 1 can be connected to an external component (e.g., a motherboard of an electronic device) via the connector 14. Specifically, the connector 14 includes a solder joint, a wire, a plug, a socket, and the like, which are used for connection, and is not particularly limited herein. In the present embodiment, the model of the connector 14: ACON BB2P4-10K6J 01. Further, a processor (not shown) is disposed on the circuit board 11, and the processor can be used for processing the electrical signal output by the fingerprint chip 12. In particular, the circuit board 11 may be provided with circuit structures associated with a processor that processes electrical signals containing fingerprint information to create a model of the fingerprint.
It should be noted that the fingerprint module 1 of this embodiment may be applied to electronic devices such as a mobile phone, a tablet computer, a notebook computer, a media player, and the like, and may also be applied to financial terminal devices such as an Automated Teller Machine (ATM), and a specific application scenario of the fingerprint module is set according to actual needs, which is not specifically limited in this embodiment.
As shown in fig. 4, in an implementation of the electronic device 2 disclosed in this embodiment of the present application, reference may be specifically made to fig. 1 to 3, and the electronic device 2 may be a mobile phone, a tablet computer, an ATM, a vehicle-mounted touch screen, a fingerprint door lock, and the like. In this embodiment, the electronic device 2 is taken as a mobile phone for illustration, the mobile phone includes the fingerprint module 1 defined above, and the structure, function and effect of the fingerprint module 1 are consistent with the structure and function of the fingerprint module 1 defined above, which is not described herein again.
Further, the electronic device 2 includes a housing 22 having a storage cavity 21 and a device main body (not shown) fixed in the storage cavity 21, the device main body refers to a mobile phone terminal performing touch operation and the like, a main body control structure of a tablet terminal and the like, the housing 22 has a frame 23 located at a side of the device main body, the frame 23 is provided with a mounting notch 21, the fingerprint module 1 is mounted on the frame 23 corresponding to the mounting notch 21, the thickness of the whole electronic device 2 on which the fingerprint module 1 is mounted can be further reduced, so that the size of the electronic device 2 is reduced to realize the lightness and thinness of the electronic device, and the requirements of users are met.
The fingerprint module and the electronic device disclosed in the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the description of the above embodiments is only used to help understand the fingerprint module and the electronic device and their core ideas of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.

Claims (10)

1. The utility model provides a fingerprint module which characterized in that includes:
a circuit board;
the fingerprint chip is arranged on the circuit board; and
the reinforcing plate is arranged on the surface of the circuit board, which deviates from the fingerprint chip, and the circuit board is provided with a length direction and a width direction perpendicular to the length direction when viewed along the direction perpendicular to the circuit board, and the outline of the circuit board in the width direction protrudes out of the outline of the reinforcing plate.
2. The fingerprint module of claim 1, wherein at least one of the two ends of the stiffener protrudes beyond the outline of the circuit board along the length direction.
3. The fingerprint module of claim 2,
the circuit board comprises a main body part and a connecting part connected to one end of two ends of the main body part, the fingerprint chip is arranged on the main body part, and the connecting part is used for electrically connecting an external element;
the reinforcing plate comprises a supporting part and an extending part located at least one end of the supporting part, the supporting part is arranged on the surface of the main body part far away from the fingerprint chip, and the extending part protrudes out of the outline of the circuit board.
4. The fingerprint module of claim 3, wherein the extension portion comprises a first extension portion and a second extension portion, and the first extension portion and the second extension portion are respectively connected to two ends of the supporting portion and both protrude from the contour of the circuit board along the first direction.
5. The fingerprint module of claim 4, wherein the circuit board further includes an extension end connected to an end of the main body portion away from the connection portion, the extension end at least partially overlaps the first extension portion, and the connection portion at least partially overlaps the second extension portion.
6. The fingerprint module of claim 5, wherein the stiffener further has a gap between the first extending portion and the supporting portion and corresponding to at least a portion of a contour of the circuit board, and the gap is configured to expose a portion of the circuit board.
7. The fingerprint module of claim 5, wherein at least one of the first extension and the second extension has a dimension in the width direction that is greater than a dimension of the main body portion in the width direction.
8. The fingerprint module of any one of claims 5 to 7, wherein the first extension or the second extension has an extension body having a first edge, a second edge, and a third edge connected in series; wherein the first edge is in smooth transition with the contour line of the supporting part; the joint of the first edge and the second edge and the joint of the second edge and the third edge are in smooth transition; and the third edge is in smooth transition with the contour line of the supporting part.
9. The fingerprint module of claim 8, wherein a length of the first edge or the third edge in the first direction is defined as a preset length; wherein:
the ratio of the size of the overlapped part of the connecting part and the second extending part and/or the overlapped part of the extending end and the first extending part in the first direction to the preset length is between 0.4 and 0.6.
10. An electronic device, characterized in that the electronic device comprises a fingerprint module according to any one of claims 1 to 9.
CN202021743299.7U 2020-08-19 2020-08-19 Fingerprint module and electronic equipment Active CN213241181U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021743299.7U CN213241181U (en) 2020-08-19 2020-08-19 Fingerprint module and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021743299.7U CN213241181U (en) 2020-08-19 2020-08-19 Fingerprint module and electronic equipment

Publications (1)

Publication Number Publication Date
CN213241181U true CN213241181U (en) 2021-05-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021743299.7U Active CN213241181U (en) 2020-08-19 2020-08-19 Fingerprint module and electronic equipment

Country Status (1)

Country Link
CN (1) CN213241181U (en)

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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi oumaisi Microelectronics Co., Ltd

Address before: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee before: Oufei Microelectronics Technology Co.,Ltd.