KR20160013015A - Sensor substrate - Google Patents

Abstract

The sensor substrate includes a base insulating layer and a wiring circuit substrate having a conductor pattern to be electrically connected to the integrated circuit. The base insulating layer has a wiring formation region and a terminal formation region. The conductor pattern is formed on one side of the base insulating layer in the thickness direction of the base insulating layer in the wiring formation region and is formed on the other side in the thickness direction of the base insulating layer in the wiring formation region, A second wiring extending in a second direction intersecting with the first direction and intersecting with the first wiring when projected in the thickness direction, and a second wiring formed in the terminal formation region, the first wiring, and the integrated circuit mounted on the terminal formation region And a second terminal formed in the terminal formation region and electrically connected to the second wiring and the integrated circuit.

Description

Sensor substrate {SENSOR SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor substrate used in a sensor substrate, and more particularly, a position detecting device.

A position detecting device such as a coordinate input device that detects a position by moving a pen-type position indicator on a position detection plane is spread as a computer input device such as a portable terminal (tablet PC, smart phone) or a digitizer. The position detecting device includes a position detecting flat plate, and a sensor substrate (sense portion) disposed below the position detecting flat plate and having a loop coil formed on a surface of the substrate. Then, the position of the position indicator is detected by using the electromagnetic induction generated by the position indicator and the loop coil (see, for example, Patent Document 1).

In the following Patent Document 1, a terminal unit in which terminals of a plurality of loop coil wirings are integrated on a part of a board is formed, and in a state where the control circuit board and the flat cable are bent, a coordinate input device connected to the terminal unit is proposed .

In the coordinate input device described in Patent Document 1, the connection between the control line substrate and the terminal portions of the loop coil wiring is facilitated, and miniaturization is achieved.

Japanese Patent Application Laid-Open No. 2005-165432

[0004] However, there is a demand for a position detection device to be thin, and in recent years, there is a strong demand particularly for the position detection device.

However, in the coordinate input device of Patent Document 1, the control line substrate and the flat cable are folded back on the back surface of the sense portion. Particularly, in the control line substrate, an integrated circuit is mounted on the rigid substrate. Therefore, there is a problem that the thickness of the folded back portion increases.

On the other hand, in the coordinate input device of Patent Document 1, it is also possible to mount the flat cable and the control circuit board on the end portion of the sense portion without folding back.

However, in this case, since the flat cable and the control circuit board project significantly from the end of the sense unit, there arises a problem that miniaturization can not be achieved.

An object of the present invention is to provide a sensor substrate which can be thinned and miniaturized.

The sensor substrate of the present invention includes a wiring circuit substrate having a base insulating layer and a conductor pattern to be electrically connected to the integrated circuit, wherein the base insulating layer has a wiring formation region and a terminal formation region, A first wiring formed on one side in the thickness direction of the base insulating layer in the wiring formation region and extending in a first direction and a second wiring formed on the other side in the thickness direction of the base insulation layer in the wiring formation region, A second wiring extending in a second direction intersecting with the first direction and intersecting with the first wiring when projected in the thickness direction; and a second wiring formed in the terminal formation region, A first terminal electrically connected to the integrated circuit mounted in the region, and a second terminal formed in the terminal formation region, And it characterized by a second terminal to be electrically connected.

In this sensor substrate, a first terminal electrically connected to the first wiring and the integrated circuit connected to the terminal formation region, and a second terminal electrically connected to the second wiring and the integrated circuit are formed in the terminal formation region of the base insulation layer Respectively. Therefore, the rigid substrate for forming the flat cable and the integrated circuit becomes unnecessary, and miniaturization can be achieved. In addition, since it is not necessary to fold the flat cable or the integrated circuit back to one side in the thickness direction of the sensor substrate, the thin film can be achieved.

In the sensor substrate of the present invention, it is preferable that the wiring circuit substrate further includes a magnetic layer disposed on one side in the thickness direction of the base insulating layer.

In this sensor substrate, the magnetic layer can converge the magnetic fluxes generated in the first wiring and the second wiring of the wiring circuit substrate into the magnetic layer, and the sensing by the first wiring and the second wiring can be performed efficiently.

In the sensor substrate of the present invention, it is preferable that the wiring circuit substrate further includes a metal layer disposed on one side in the thickness direction of the magnetic layer.

In this sensor substrate, the metal layer can eliminate the magnetic flux leaking from the magnetic layer to a small extent, and the position detecting device can be enhanced.

In the sensor substrate of the present invention, it is preferable that the wiring circuit substrate further includes an insulating layer disposed between the base insulating layer and the magnetic layer.

In this sensor substrate, it is possible to prevent a short-circuit of the first wiring caused by the magnetic layer while suppressing an increase in the thickness of the sensor substrate.

In the sensor substrate of the present invention, thinning and miniaturization are promoted.

1 is a schematic plan view showing an embodiment of a sensor substrate of the present invention.
2 is a cross-sectional view of the sensor substrate along the line AA shown in Fig.
Fig. 3A is a partial cross-sectional view along the line AA in the manufacturing process of the sensor substrate shown in Fig. 1, which shows a step of preparing a base resin substrate, Fig. 3B is a partial cross-sectional view along the line AA in the process of manufacturing the sensor substrate shown in Fig. 3A is a partial cross-sectional view taken along the line AA in the process of manufacturing the sensor substrate shown in FIG. 1, and FIG. 3C is a cross- FIG. 3D is a partial cross-sectional view along the line AA in the manufacturing process of the sensor substrate shown in FIG. 1, and FIG. 3D shows a step of forming a conductor pattern on the upper surface of the base resin substrate Fig. 3E is a partial cross-sectional view along the line AA in the manufacturing process of the sensor substrate shown in Fig. 1. Fig. 3F is a step of forming an adhesive layer on the upper surface of the base resin substrate, And FIG. 3E shows a step of laminating the cover layer on the upper surface of the adhesive layer.
FIG. 4G is a partial cross-sectional view along the line AA in the manufacturing process of the sensor substrate shown in FIG. 1, and FIG. 4H is a step of forming a second insulating layer on the lower surface of the base resin substrate, FIG. 4I is a view showing a step of stacking a magnetic layer on the lower surface of the second insulating layer, and FIG. 4I is a view showing a step of stacking the magnetic layers on the AA line FIG. 4J is a partial cross-sectional view along the line AA in the manufacturing process of the sensor substrate shown in FIG. 1, and FIG. 4C is a cross- Fig. 3 shows a process for mounting an integrated circuit. Fig.
Fig. 5 shows another embodiment of the sensor substrate of the present invention (the terminal formation region is substantially L-shaped in plan view).

1 (the first side in the first direction), the lower side in the figure is the "rear side" (the other side in the first direction), the left side in the drawing is the "left side" (The one side in the third direction or one side in the thickness direction of the base resin substrate 4, which will be described later), while the right side in the drawing is the "right side" (the second side in the second direction) (The other side in the third direction or the other side in the thickness direction of the base resin substrate 4, which will be described later), and concretely, it corresponds to the directional arrow described in Fig. 1, the direction of Fig. 1 is referred to. 1, the cover layer 6 and the adhesive layer 25 are omitted in order to clarify the arrangement of the conductor pattern 5. As shown in Fig.

1, this sensor substrate 1 is provided with a wiring circuit substrate 2 and an integrated circuit 3. [

1 and 2, the wiring circuit substrate 2 includes a base resin substrate 4 as a base insulating layer, a conductor pattern 5 formed in contact with the base resin substrate 4, A cover layer 6 formed on the substrate 4 so as to cover the conductor pattern 5 and a magnetic layer 5 formed on the base resin substrate 4 so as to cover the conductor pattern 5, (7), and a metal layer (8) disposed below the magnetic layer (7).

The base resin substrate 4 is formed in an outer shape of the sensor substrate 1 in a plan view, is formed in a substantially rectangular shape, and is formed such that a central portion of the front end portion thereof protrudes in a convex shape.

The base resin substrate 4 is formed of, for example, a resin film such as a polyimide film, a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, or a polycarbonate film.

The base resin substrate 4 has a wiring formation region 9 and a terminal formation region 10.

As shown in Fig. 1, the wiring formation region 9 is divided into a substantially rectangular shape when seen in plan view.

The length in the front-rear direction and the length in the left-right direction of the wiring formation region 9 are appropriately determined according to the purpose, application, and the like of the sensor substrate 1. [

2) corresponding to the first loop coil conducting portion 28 and the second loop coil conducting portion 27 corresponding to the second loop coil conducting portion are formed in the wiring forming region 9, Through holes (not shown) for loop coils are formed so as to pass through the thickness direction of the base resin substrate 4.

The terminal formation region 10 is divided into a front end portion of the wiring formation region 9 in the base resin substrate 4 and formed in a substantially rectangular shape as seen from a plane extending in the left and right direction. That is, the terminal forming region 10 corresponds to a convex portion protruding from the center in the lateral direction of the front end portion of the base resin substrate 4 when viewed in plan.

The terminal formation region 10 is formed so as to be continuous with the wiring formation region 9. The terminal formation region 10 is formed so as not to overlap with the wiring formation region 9 when projected in the thickness direction of the base resin substrate 4. [ The terminal formation region 10 is on the same plane as the wiring formation region 9. More specifically, the terminal formation region 10 and the wiring formation region 9 are formed in a straight line, that is, the base resin substrate 4 is formed in the wiring formation region 9, And the terminal forming region 10, as shown in Fig.

The terminal forming region 10 is provided with a first terminal through hole 19 (refer to FIG. 2) corresponding to the first conducting portion 17 and a second terminal through hole 19 corresponding to the second conducting portion 22 (See Fig. 2) is formed so as to penetrate through the thickness direction of the base resin substrate 4. As shown in Fig.

The length in the left-right direction and the length in the forward-rearward direction of the terminal forming region 10 are each formed to be shorter than the length in the left-right direction and the length in the forward-backward direction of the wiring formation region 9, respectively. Specifically, the length in the longitudinal direction and the length in the left-right direction of the terminal forming region 10 are appropriately determined according to the type, size, and the like of the mounted integrated circuit 3. For example, Is not less than 5%, preferably not less than 10%, and is, for example, not more than 50%, preferably not more than 30% when the length and the lateral length are taken as 100%.

The thickness of the base resin substrate 4 is, for example, not less than 6 占 퐉, preferably not less than 12 占 퐉, and is, for example, not more than 50 占 퐉, preferably not more than 35 占 퐉.

The conductor pattern 5 includes a first loop coil 11 extending in a plurality of (four) first directions (forward and backward directions), a plurality of pairs (four pairs) of first terminals 12, A second loop coil 13 extending in a second direction (left and right direction) of the first loop coil 13 and a plurality of pairs (three pairs) of second terminals 14.

The plurality of first loop coils 11 are arranged at a central portion of the wiring formation region 9 so as to be spaced apart from each other in the left-right direction.

Each of the plurality of first loop coils 11 includes a pair of first long wiring 15 as a first wiring extending in the front-rear direction and spaced apart from each other in the left-right direction, And a pair of first short wirings 16 for connecting both ends of the first wiring 15 in the front and rear direction.

The first wiring 15 is formed directly on the surface (lower surface) on one side in the thickness direction of the base resin substrate 4 in the wiring formation region 9, as shown in Fig.

As shown in Fig. 1, the first-stage wiring 16 extends in the left-right direction and is disposed at an interval from each other. The length (lateral length) of the first- As shown in Fig. As shown in Fig. 2, the first-stage wiring 16 is formed directly on the surface (upper surface) on the other side in the thickness direction of the base resin substrate 4 in the wiring formation region 9. [ As shown in Fig. 2, the first end wiring 16 on the front side is connected to the front end portion of the pair of first wiring 15 via a pair of first loop coil conducting portions 28, And the first end wirings 16 on the rear side are connected to the rear ends of the pair of first long wirings 15 via the pair of first rectangular loop coil conducting portions 28. [

Each of the plurality of pairs of first terminals 12 is formed in the terminal forming region 10 so as to correspond to each of the plurality of first loop coils 11. The first terminal 12 is formed so as to overlap with the integrated circuit 3 in the thickness direction in the terminal formation region 10. That is, the pair of first terminals 12 are arranged opposite to each other in the back-and-forth direction in the terminal forming region 10, and the plurality of pairs of first terminals 12 are arranged in the terminal forming region 10 ) Are arranged in parallel in the left-right direction with an interval therebetween.

As shown in Figs. 1 and 2, each of the plurality of first terminals 12 is formed on the upper surface of the base resin substrate 4 to have a substantially rectangular shape in a plan view. The first terminal 12 is electrically connected to the first loop coil 11 through the first conductive portion 17 and the first connection wiring 18 (not shown in Fig. 1).

The first conductive portion 17 is formed to be filled in the first terminal through hole 19. As a result, the first conductive portion 17 conducts the first terminal 12 and the first connection wiring 18.

The first connection wiring 18 is formed directly on the lower surface of the base resin substrate 4 across the wiring formation region 9 and the terminal formation region 10. [ One end (rear end) of the first connection wiring 18 is electrically connected to the first loop coil 11 and the other end (front end) is connected to the pair of first terminals 12, respectively. 1, the first connection wiring 18 is omitted, but the first loop coil 11 and the first terminal 12 can be electrically connected by a known pattern.

The plurality of second loop coils 13 are arranged at a distance from each other in the front-rear direction at the central portion of the wiring formation region 9.

Each of the plurality of second loop coils 13 includes a pair of second long wirings 20 as a second wiring extending in the left and right direction and spaced apart from each other in the back and forth direction, And a pair of second end wirings 21 for connecting both end portions in the left and right direction of the long wirings 20 are integrally provided.

The second wiring 20 is formed directly on the upper surface of the base resin substrate 4 in the wiring formation area 9. [

The second wiring 20 intersects with the first wiring 15 when projected in the thickness direction of the base resin substrate 4. More specifically, all of the plurality of second wirings 20 intersect with all of the plurality of first wirings 15 when projected in the thickness direction of the base resin substrate 4. The angle formed between the first wiring 15 and the second wiring 20 is, for example, 45 to 135 degrees, preferably 75 to 105 degrees, more preferably, a right angle.

The second end wirings 21 are formed so as to extend in the front and rear direction and to be spaced apart from each other and to have a length (longitudinal length) shorter than the length (lateral length) of the second longwiring 20, Is directly formed on the lower surface of the base resin substrate 4 in the wiring formation region 9. [ The second end wiring 21 on the left side is connected to the left end portion of the pair of second long wirings 20 via a pair of second loop coil conducting portions (not shown) The second end wiring 21 is connected to the right end portion of the pair of second long wirings 20 via a pair of second loop coil conducting portions.

Each of the plurality of pairs of second terminals 14 is formed in the terminal forming region 10 so as to correspond to each of the plurality of second loop coils 13. [ The second terminal 14 is formed in the terminal formation region 10 so as to overlap with the integrated circuit 3 in the thickness direction. That is, the pair of second terminals 14 are opposed to each other in the lateral direction in the terminal forming region 10, and the plurality of pairs of second terminals 14 are arranged in the terminal forming region 10 ) Are arranged in parallel in the front-rear direction with an interval therebetween.

As shown in Fig. 2, each of the plurality of second terminals 14 is formed on the upper surface of the base resin substrate 4 to have a substantially rectangular shape in plan view. The second terminal 14 is electrically connected to the second loop coil 13 through the second conductive portion 22 and the second connection wiring 23 (not shown in Fig. 1).

The second conducting portion 22 is formed to be filled in the second terminal through hole 24. As a result, the second conducting portion 22 conducts the second terminal 14 and the second connecting wiring 23 to each other.

The second connection wiring 23 is formed directly on the lower surface of the base resin substrate 4 across the wiring formation region 9 and the terminal formation region 10. One end (rear end) of the second connection wiring 23 is electrically connected to the second loop coil 13 and the other end (front end) is connected to the pair of second terminals 14, respectively. Although the second connection wiring 23 is omitted in Fig. 1, the second loop coil 13 and the second terminal 14 can be electrically connected by a known pattern.

Each member of the conductor pattern 5 is formed of the same conductor material. Specifically, the first loop coil 11, the first terminal 12, the first conductive portion 17, the first connection wiring 18, the first loop coil conductive portion 28, The first terminal 13, the second terminal 14, the second conductive portion 22, the second connection wiring 23 and the second loop coil conductive portion are formed of the same conductive material. Examples of the conductor material include copper, nickel, gold, solder, alloys thereof, and the like.

The thickness of the first loop coil 11 and the second loop coil 13 is, for example, not less than 6 占 퐉, preferably not less than 9 占 퐉, and is, for example, not more than 50 占 퐉, and preferably not more than 35 占 퐉. The interval between the pair of first wirings 15 of the first loop coil 11 and the interval between the pair of second wirings 20 of the second loop coil 13 are set to be, Preferably 80 mu m or more, for example, 3 mm or less, preferably 2 mm or less. The width of the wiring of the first loop coil 11 and the second loop coil 13 is, for example, 6 mu m or more, preferably 9 mu m or more, and for example, 100 mu m or less, preferably 75 mu m or less to be.

The widths of the first terminal 12 and the second terminal 14 are 0.25 mm or more, preferably 0.5 mm or more, for example, 3.0 mm or less, and preferably 2.0 mm or less. The thickness of the first terminal 12 and the second terminal 14 is, for example, 0.25 占 퐉 or larger, preferably 0.5 占 퐉 or larger, and is 3.0 占 퐉 or smaller, preferably 2.0 占 퐉 or smaller, for example.

The cover layer 6 is disposed so as to cover the upper surface of the base resin substrate 4 in the wiring formation region 9 via an adhesive layer 25 made of a known adhesive. More specifically, the cover layer 6 covers the upper surface, the front surface and the rear surface of the second wiring 20 of the second loop coil 13, the upper surface of the first-end wiring 16 of the first loop coil, The rear surface, and the upper surface of the base resin substrate 4. The cover layer 6 is laminated so as to overlap with the wiring formation region 9 when projected in the thickness direction of the base resin substrate 4. [

The cover layer 6 is formed of the same resin film as the base resin substrate 4. [ The thickness of the cover layer 6 is, for example, not less than 6 占 퐉, preferably not less than 9 占 퐉, for example, not more than 25 占 퐉, preferably not more than 20 占 퐉.

The thickness of the adhesive layer 25, specifically, the distance from the upper surface of the base resin substrate 4 to the lower surface of the cover layer 6 (maximum thickness of the adhesive layer 25) is, for example, Preferably 35 mu m or more, and for example 70 mu m or less, preferably 50 mu m or less.

The magnetic layer 7 is disposed on one side (lower side) in the thickness direction of the integrated circuit 3 with respect to the base resin substrate 4. More specifically, the magnetic layer 7 is formed so as to cover the bottom surface of the base resin substrate 4 in the entire region of the wiring formation region 9 and the terminal formation region 10 via the second insulating layer 26 Respectively. The lower surface of the first wiring 15 of the first loop coil 11 is connected to the lower surface of the lower surface of the second loop coil 21, The second connection wiring 23, and the bottom surface of the base resin substrate 4, respectively. The magnetic layer 7 is formed so as to overlap with the wiring formation region 9 and the terminal formation region 10 when projected in the thickness direction of the base resin substrate 4. [ In other words, the magnetic layer 7 is formed so as to have the same shape as the base resin substrate 4 in plan view.

The magnetic layer 7 is formed of a magnetic composition containing magnetic particles and a resin component.

Examples of the magnetic material for forming the magnetic material particles include a ferromagnetic material, a semi-magnetic material and the like, preferably a ferromagnetic material.

The ferromagnetic substance is a magnetic substance which is strongly magnetized in the direction by the magnetic field and remains in the residual magnetization even when the magnetic field is removed. Examples of such a ferromagnetic substance include a soft magnetic substance and a hard magnetic substance. A soft magnetic material is preferably used.

Examples of the soft magnetic material include magnetic stainless steel (Fe-Cr-Al-Si alloy), Sendust (Fe-Si-Al alloy), Parmeroy (Fe-Ni alloy) Fe-Si-Cr alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy, Fe-Si alloy . Of these, in terms of magnetic properties, a sensor (Fe-Si-Al alloy) is preferably used.

The shape of the magnetic body particles may be, for example, a flat shape (plate shape).

Examples of the resin component include polyolefin (e.g., polyethylene, polypropylene, ethylene-propylene copolymer and the like), acrylic resin, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl chloride, polystyrene, Polyether sulfone, polyether ether ketone, polyaryl sulfone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, Polyimide, thermoplastic urethane resin, polyamino bismaleimide, polyamideimide, polyetherimide, bismaleimide triazine resin, polymethylpentene, fluorinated resin, liquid crystal polymer, olefin-vinyl alcohol copolymer, ionomer, Acrylonitrile-ethylene-styrene copolymer, acrylonitrile-butadiene-styrene And thermoplastic resins such as acrylonitrile-styrene copolymer. Examples of the resin include an epoxy resin, a thermosetting polyimide, a phenol resin, a urea resin, a melamine resin, an unsaturated polyester resin, a diallyl phthalate resin, a silicone resin, and a thermosetting urethane resin.

And a thermosetting resin component composed of an acrylic resin, an epoxy resin and a phenol resin is preferable.

In addition, the magnetic composition may contain additives such as a heat curing catalyst, an inorganic additive, and a cross-linking agent, if necessary.

The magnetic layer 7 is obtained by applying a magnetic composition solution obtained by dissolving or dispersing a magnetic composition in a solvent to a substrate and drying (heating if necessary). The magnetic layer 7 is bonded to the lower surface of the base resin substrate 4 with the second insulating layer 26 therebetween.

The thickness of the magnetic layer 7 is, for example, not less than 5 占 퐉, preferably not less than 50 占 퐉, for example, not more than 500 占 퐉, preferably not more than 250 占 퐉.

The second insulating layer 26 is formed so as to have the same shape as that of the base resin substrate 4 in plan view.

The second insulating layer is formed of a layer having insulating properties and adhesiveness for bonding the base resin substrate 4 and the magnetic layer 7.

As the material of the second insulating layer 26, a composition containing a resin component and containing no magnetic material particles can be mentioned. Examples of the resin component include the resin component exemplified in the magnetic layer (7), and preferably a thermosetting resin component, more specifically, a thermosetting resin component composed of an acrylic resin, an epoxy resin and a phenol resin.

The thickness of the second insulating layer 26, specifically, the distance from the lower surface of the base resin substrate 4 to the upper surface of the magnetic layer 7 (maximum thickness of the second insulating layer) is, for example, Preferably 11 mu m or more, and for example, 55 mu m or less, preferably 40 mu m or less.

The metal layer 8 is disposed on one side (lower side) in the thickness direction of the magnetic layer 7. More specifically, the metal layer 8 is formed so as to cover the lower surface of the magnetic layer 7 in the entire region of the wiring formation region 9 and the terminal formation region 10. The metal layer 8 is formed on the entire lower surface of the magnetic layer 7. The metal layer 8 is formed so as to overlap the wiring formation region 9 and the terminal formation region 10 of the base resin substrate 4 when projected in the thickness direction. In other words, the metal layer 8 is formed so as to have the same shape as that of the base resin substrate 4 in plan view.

The metal layer 8 is made of a metal material such as stainless steel, 42 alloy, aluminum, copper-beryllium, phosphorous copper or the like. The thickness of the metal layer 8 is, for example, 10 占 퐉 or more, preferably 30 占 퐉 or more, for example, 100 占 퐉 or less, and preferably 50 占 퐉 or less.

The integrated circuit 3 performs power feeding and signal transmission to the first loop coil 11 and the second loop coil 13 so that the signals from the first loop coil 11 and the second loop coil 13 As shown in Fig. The integrated circuit 3 is formed in a substantially rectangular shape in plan view, and includes terminals (not shown), a semiconductor layer, and a flexible insulating layer. On the other hand, the integrated circuit 3 does not have a rigid rigid substrate formed of a material such as glass epoxy.

The integrated circuit 3 is mounted in the terminal formation region 10. [ More specifically, the integrated circuit 3 is connected to the terminals (integrated circuit terminals, not shown) formed on the lower surface of the integrated circuit 3 and the upper surfaces of the first terminal 12 and the second terminal 14 In the terminal forming region 10, as shown in Fig. The longitudinal direction length and the lateral length of the integrated circuit 3 are each made shorter than the longitudinal length and lateral length of the terminal forming region 10, Rear direction of the vehicle body 10 and substantially at the center of the front and rear direction.

Next, a manufacturing method of the sensor substrate 1 will be described with reference to Figs. 3A to 3F and Figs. 4G to 4J.

First, in this method, as shown in Fig. 3A, a base resin substrate 4 is prepared. The base resin substrate 4 is contoured so that the wiring formation region 9 and the terminal formation region 10 are defined.

Subsequently, as shown in Fig. 3B, a lower side pattern (lower side conductor pattern) of the conductor pattern 5 is formed on the lower surface of the base resin substrate 4. [ More specifically, the first wiring 15, the second wiring 21, the first connection wiring 18 and the second connection wiring 23 are formed on the lower surface of the base resin substrate 4.

The conductor pattern 5 is formed as a pattern as described above by a well-known patterning method such as the additive method or the subtractive method, preferably the additive method.

In the additive method, first, a conductor thin film (seed film) is formed on the lower surface of the base resin substrate 4. The conductor thin film is formed by successively depositing a chromium thin film and a copper thin film by sputtering, preferably chromium sputtering and copper sputtering.

Subsequently, a plating resist is formed on the lower surface of the conductor thin film in a pattern reverse to the pattern of the lower side conductor pattern, and then a lower side conductor pattern is formed on the lower surface of the conductor thin film exposed from the plating resist by electrolytic plating. Thereafter, the plating resist film and the conductor thin film in the portion where the plating resist is laminated are removed.

Then, as shown in Fig. 3C, a through hole is formed in the base resin substrate 4. Then, as shown in Fig. That is, the first terminal through-hole 19, the second terminal through-hole 24, the first loop coil through-hole 27, the second loop coil through- Thereby forming a hole (not shown).

The formation of the through hole can be carried out, for example, by etching. The etching may be a known etching method such as an etching solution or a laser.

Next, as shown in Fig. 3D, a conductor portion (upper surface side conductor pattern) on the upper surface side of the conductor pattern 5 is formed on the upper surface of the base resin substrate 4 while charging the conductive portion in the through hole. More specifically, each of the through holes for the first terminal 19, the second terminal through hole 24, the first loop coil through hole 27 and the second loop coil through hole (Not shown) for the first loop coil and the conductive portion 17, the second conductive portion 22, the first loop coil conductive portion 28 and the second loop coil conductive portion (not shown) The first end wiring 16, the second long wiring 20, the first terminal 12, and the second terminal 14 are formed on the upper surface of the first wiring 16,

The filling of the conduction portion and the formation of the upper surface side conductor pattern are carried out in the same manner as the formation of the pattern in Fig. 3B.

3E, an adhesive layer 25 is formed on the upper surface of the base resin substrate 4 in the wiring formation region 9. Then, as shown in Fig. More specifically, the adhesive layer 25 is formed so as to cover the first end wiring 16 and the second long wiring 20.

The adhesive layer 25 may be formed on the base resin substrate 4 by a known coating method such as a roll coating method, a gravure coating method, a spin coating method or a bar coating method, for example, As shown in Fig.

Subsequently, as shown in FIG. 3F, the cover layer 6 is disposed on the upper surface of the adhesive layer 25. More specifically, the cover layer 6 is directly laminated so as to cover the upper surface and the side surface of the adhesive layer 25.

4G, the second insulating layer 26 is formed on the lower surface of the base resin substrate 4 in the wiring formation region 9 and the terminal formation region 10. Then, as shown in Fig. More specifically, the first wiring 15, the second wiring 21 (see Fig. 1), the first connecting wiring 18 and the second connecting wiring 23 on the bottom surface of the base resin substrate 4 The second insulating layer 26 is formed.

The second insulating layer 26 is prepared by preparing a composition solution in which the composition containing the resin component is dissolved or dispersed in a solvent and applying the composition solution onto the lower surface of the base resin substrate 4 by, , A gravure coating method, a spin coating method, a bar coating method, and the like, and then the second insulating layer 26 is formed. When the resin component is a thermosetting resin component, the second insulating layer 26 in a semi-cured (B-stage) state is formed.

Then, as shown in Fig. 4H, the magnetic layer 7 is disposed on the lower surface of the second insulating layer 26. Next, as shown in Fig. More specifically, the magnetic layer 7 is directly laminated so as to cover the entire lower surface of the second insulating layer 26. [

In the case where the resin component of the second insulating layer 26 is a thermosetting resin component, the second insulating layer 26 in a semi-cured state in which the magnetic layer 7 is laminated is heated to form a cured (C-stage) 2 insulating layer 26 is formed and the magnetic layer 7 is securely fixed to the lower side of the base resin substrate 4. [

When the resin component of the magnetic layer 7 is a thermosetting resin component, the cured magnetic layer 7 may be laminated on the second insulating layer 26 and the semi-cured magnetic layer 7 may be laminated on the second insulating layer 26. [ (26). When the semi-cured magnetic layer 7 is laminated on the second insulating layer 26, for example, the semi-cured magnetic layer 7 is laminated to the semi-cured second insulating layer 26 And the magnetic layer 7 and the second insulating layer 26 are cured.

Then, as shown in Fig. 4I, the metal layer 8 is disposed on the lower surface of the magnetic layer 7. [ More specifically, the metal layer 8 is directly laminated so as to cover the entire lower surface of the magnetic layer 7.

Thereby, the sensor substrate 1 before the integrated circuit 3 is mounted is obtained.

After that, as shown in Fig. 4J, the integrated circuit 3 is mounted in the terminal formation region 10. More specifically, a terminal (not shown) of the integrated circuit 3 is brought into contact with and fixed to the first terminal 12 and the second terminal 14. As a result, the integrated circuit 3 is electrically connected to the first terminal 12 and the second terminal 14.

The sensor substrate 1 can be preferably used as a sensor substrate for a position detecting device, for example. Examples of the use of the position detecting device include a portable terminal such as a smart phone or a tablet PC, for example, a digitizer.

The sensor substrate 1 is provided with a base resin substrate 4 and a wiring circuit substrate 2 having a conductor pattern 5 to be electrically connected to the integrated circuit 3, (4) has a wiring formation region (9) and a terminal formation region (10). The conductor pattern 5 is formed on the lower surface of the base resin substrate 4 in the wiring formation region 9 and has a first long wiring 15 extending in the front and back direction and a second long wiring 15 extending in the wiring formation region 9 , And a second long wiring (20) formed on the upper surface of the base resin substrate (4), extending in the left and right direction, and intersecting the first long wiring (15) when projected in the thickness direction. The first terminal 12 formed in the terminal formation region 10 and electrically connected to the first wiring 15 and the integrated circuit 3 and the second terminal 12 formed in the terminal formation region 10, And a second terminal 14 electrically connected to the long wiring 20 and the integrated circuit 3. [

In this sensor substrate 1, the first wiring 15 and the second wiring 20 are formed in the wiring formation area 9 and electrically connected to the first wiring 15 and the integrated circuit 3 The first terminal 12 to be connected and the second terminal 14 to be electrically connected to the second wiring 20 and the integrated circuit 3 are connected to the terminal forming region 10 of the base resin substrate 4 Respectively. Therefore, the rigid substrate for forming the flat cable and the integrated circuit 3 becomes unnecessary, and miniaturization can be achieved. In particular, the terminal formation region 10 around the wiring formation region 9 can be downsized. Therefore, the sensor substrate 1 is accommodated in the position detecting device casing having the opening and the opening portion so that the wiring forming region 9 is exposed from the opening portion so that the terminal forming region 10 is covered with the frame The area of the frame can be reduced and the width of the frame can be narrowed.

Further, when mounting the integrated circuit 3 on the wiring circuit substrate 2, a connecting member such as a flat cable and a rigid substrate is not required. The terminal formation region 10 is not required to be folded back on the lower surface of the sensor substrate 1, that is, the terminal formation region 10 is formed to overlap with the wiring formation region 9 in the thickness direction. ) Need not be folded small. Therefore, the thickness of the sensor substrate 1 can be made thinner, and further, the thickness of the position detecting device including the sensor substrate 1 can be reduced.

In the sensor substrate 1, the wiring circuit substrate 2 further includes a magnetic layer 7 disposed on the lower surface of the base resin substrate 4. [

Therefore, in the sensor substrate, the magnetic layer 7 converges the magnetic flux generated in the first wiring 15 and the second wiring 20 of the wiring circuit substrate 2 into the magnetic layer 7 , The first wiring (15) and the second wiring (20) can be efficiently performed.

In the sensor substrate 1, the wiring circuit substrate 2 further includes a metal layer 8 disposed on the lower surface of the magnetic layer 7. [

Therefore, in the sensor substrate 1, the metal layer 8 can eliminate the magnetic flux leaking from the magnetic layer 7 to a small extent, and the device for detecting the position can be increased.

In the sensor substrate 1, the wiring circuit substrate 2 further includes a second insulating layer 26 disposed between the base resin substrate 4 and the magnetic layer 7.

The embodiment in which the adhesive layer is disposed between the base resin substrate 4 and the magnetic layer 7 is preferable from the viewpoint of securely fixing the magnetic layer 7 to the lower surface of the base resin substrate 4 and the first wiring 15 I think. In this configuration, there is a risk that shorting of the first wiring 15 due to direct placement of the magnetic layer 7 on the lower surface of the base resin substrate 4 and the first wiring 15 may occur. In order to overcome this shortcoming, a configuration in which an adhesive cover layer composed of a cover layer and an adhesive layer adhered to both surfaces thereof is disposed between the base resin substrate 4 and the magnetic layer 7 is conceivable. In this embodiment, a two-layer adhesive layer is required, and the thickness of the sensor substrate 1 is increased. On the other hand, according to the embodiment further comprising the second insulating layer 26 disposed between the base resin substrate 4 and the magnetic layer 7, the second insulating layer 26 is formed on the base resin substrate 4, And the magnetic layer 7, and fix them. Therefore, it is possible to reduce the thickness of the member without requiring a double-layered adhesive layer while preventing short-circuiting of the first wiring 15. As a result, increase in the thickness of the sensor substrate 1 can be suppressed.

In the embodiment of Fig. 2, the terminal formation region 10 is formed in a substantially rectangular shape in a plan view and is disposed at the center of the front end portion of the wiring formation region 9 in the right and left direction. However, 5, it may be formed in a substantially L shape in plan view, and may be disposed at the front end portion and the left end portion of the wiring formation region 9.

In the embodiment of Fig. 5, the base resin substrate 4, which is composed of the wiring formation region 9 and the terminal formation region 10, is formed in a substantially rectangular shape having no convex portion when seen from the plane. In addition, the integrated circuit 3 is formed in a substantially L shape when viewed in plan. The first terminal 12 is formed on the upper surface of the base resin substrate 4 in the terminal formation region 10 so as to overlap with the rear end of the right side of the integrated circuit 3 when projected in the thickness direction, The two terminals 14 are formed on the upper surface of the base resin substrate 4 in the terminal formation region 10 so as to overlap the lower right end portion of the integrated circuit 3 when projected in the thickness direction.

Preferably, as in the embodiment of Fig. 1, the terminal formation region 10 is formed in a substantially rectangular shape in plan view, and is disposed at the center of the front end portion of the wiring formation region 9 in the right and left direction. Therefore, the frame of the casing for housing the sensor substrate can be further downsized.

2, the metal layer 8 is disposed on the lower surface of the base resin substrate 4. For example, although not shown, the metal layer 8 is disposed on the lower surface of the base resin substrate 4 The magnetic layer 7 can be exposed.

1 and 2, the cover layer 6 is exposed from the upper surface. For example, although not shown, the image display device may be disposed on the upper surface of the cover layer 6. [

The above-mentioned invention is provided as an exemplary embodiment of the present invention, but this is merely an example, and should not be construed as limiting. Modifications of the invention that are apparent to those skilled in the art are intended to be within the scope of the following claims.

Industrial availability

The sensor substrate of the present invention can be applied to various industrial products, and specifically, it can be preferably used for a sensor substrate for a position detecting device. Examples of the position detecting device include a portable terminal such as a smart phone or a tablet PC, for example, a digitizer.

1: Sensor substrate
2: Wiring circuit board
3: Integrated circuit
4: base resin substrate
5: Conductor pattern
7:
8: metal layer
9: wiring formation area
10: Terminal forming area
12: First terminal
14: second terminal
15: Chapter 1 Wiring
20: Chapter 2 Wiring

Claims (4)

A base insulating layer, and a wiring circuit substrate having a conductor pattern to be electrically connected to the integrated circuit,
Wherein the base insulating layer has a wiring formation region and a terminal formation region,
In the conductor pattern,
A first wiring formed on one side in a thickness direction of the base insulating layer in the wiring formation region and extending in a first direction,
A second wiring formed on the other side in the thickness direction of the base insulating layer in the wiring formation region and extending in a second direction intersecting with the first direction and intersecting with the first wiring when projected in the thickness direction; and,
A first terminal formed in the terminal formation region and electrically connected to the first wiring and the integrated circuit mounted on the terminal formation region,
And a second terminal formed in the terminal formation region and electrically connected to the second wiring and the integrated circuit. The method according to claim 1,
Wherein the wiring circuit substrate further comprises a magnetic layer disposed on one side in the thickness direction of the base insulating layer. 3. The method of claim 2,
Wherein the wiring circuit substrate further comprises a metal layer disposed on one side in the thickness direction of the magnetic layer. The method of claim 3,
Wherein the wiring circuit substrate further comprises an insulating layer disposed between the base insulating layer and the magnetic layer.

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