CN108601215B - Rigid-flex board and terminal - Google Patents

Abstract

The invention discloses a rigid-flex board and a terminal, wherein the rigid-flex board comprises a base material layer, a rigid circuit substrate, an electronic component and a shielding film, the base material layer comprises a first area, the rigid circuit substrate is attached to the first area, an orthographic projection area of the rigid circuit substrate on the base material layer is overlapped with the first area, the rigid circuit substrate is provided with a shielding area, the electronic component is welded in the shielding area, the shielding film is fixed on the rigid circuit substrate, the shielding film is overlapped with the shielding area in the orthographic projection area of the rigid circuit substrate, and the shielding film is laminated and covers the electronic component. Electronic components in the shielding area are pressed by the shielding film and are stable on the rigid circuit substrate, so that the electronic components are not easy to fall off from the rigid circuit substrate, and the stability of the rigid-flexible printed circuit board is enhanced.

Description

Rigid-flex board and terminal

technical field

The invention relates to the field of electronic equipment, in particular to a flexible-rigid combination board and a terminal.

Background technique

At present, the application of flex-rigid boards is more and more extensive, and most of the flex-rigid boards are equipped with multiple electronic components in the rigid area to realize the function of the printed circuit board. However, since the rigidity of most flex-rigid boards in the rigid area is not as good as that of conventional printed circuit boards, the load-bearing stress of the flex-rigid board in the rigid area is not good, resulting in the multiple electronic components of the flex-rigid board in the rigid area. Vibration stress acts, so that electronic components are easily damaged or loosened, resulting in low structural stability of the rigid-flex board.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a rigid-flex board and a terminal for improving structural stability.

The present invention provides a rigid-flex board, wherein the rigid-flex board includes a base material layer, a rigid circuit substrate, an electronic component and a shielding film, the base material layer includes a first region, and the rigid circuit substrate is attached In the first area, the orthographic projection area of the rigid circuit substrate on the base material layer coincides with the first area, the rigid circuit substrate is provided with a shielding area, and the electronic components are soldered to the first area. In the shielding area, the shielding film is fixed on the rigid circuit substrate, the shielding film overlaps the shielding area in the orthographic projection area of the rigid circuit substrate, and the shielding film is pressed and covers the electronic components.

Wherein, the electronic component includes a plurality of first electronic components and a second electronic component, the internal stress of the plurality of first electronic components is greater than the internal stress of the second electronic components, and the first electronic components are arranged around the second electronic component.

Wherein, the rigid-flex board includes two rigid circuit substrates, which are a first rigid circuit substrate and a second rigid circuit substrate, respectively, and the first rigid circuit substrate and the second rigid circuit substrate are respectively attached to both sides of the substrate layer.

The electronic component includes a third electronic component and a fourth electronic component, the internal stress of the third electronic component is greater than the internal stress of the fourth electronic component, and the third electronic component is welded to the first rigid component On the circuit substrate, the fourth electronic element is soldered on the second rigid circuit substrate and is located at a position opposite to the third electronic element.

Wherein, the rigid circuit substrate includes a rigid insulating layer, a circuit layer and a solder resist ink layer, the rigid insulating layer is attached to the first area, and the orthographic projection area on the base material layer is the same as the The first area is overlapped, the circuit layer is attached to the hard insulating layer, and is located on the side opposite to the base material layer, and the solder resist ink layer is coated on the circuit layer, Covering the circuit layer, the electronic component passes through the solder resist ink layer and is welded on the circuit layer.

Wherein, the base material layer further includes a second area connected to the edge of the first area, the rigid-flex board further includes a copper foil layer, and the copper foil layer is arranged on the first area and the The second region is laminated between the base material layer and the rigid wiring substrate.

Wherein, the rigid-flex board includes two layers of the copper foil, which are a first copper foil layer and a second copper foil layer respectively, and the first copper foil layer and the second copper foil layer are respectively laminated on the On both sides of the base material layer, the first copper foil layer is provided with through holes penetrating through the second copper foil layer, and the through holes are provided to connect the first copper foil layer and the second copper foil layer conductor.

Wherein, the rigid-flex board further includes a first cover film and a second cover film, which are respectively a first cover film attached to the first copper foil layer and a first cover film attached to the second copper foil layer. Two cover films, and the orthographic projection area of the first cover film and the second cover film on the base material layer coincides with the second area.

Wherein, the first copper foil layer is provided with a ground trace, the second copper foil layer is provided with a signal trace, and the conductor is connected to the signal trace and the ground trace.

The present invention also provides a terminal, wherein the terminal includes a main body, a main board arranged inside the main body, and a flexible-rigid combination board according to any one of the above, the flexible-rigid combination board is arranged inside the main body, and is electrically connected to the main board.

In the rigid-flex board and the terminal of the present invention, by soldering the electronic component in the shielding area, the shielding film is used to press and cover the electronic component, and the shielding film is on the rigid circuit substrate The orthographic projection area of the shielding area coincides with the shielding area, so that the electronic components in the shielding area are stabilized on the rigid circuit substrate by the pressing force of the shielding film, so that the electronic components are not easily removed from the rigid circuit board. The circuit substrate falls off, which enhances the stability of the rigid-flex board.

Description of drawings

In order to illustrate the technical solutions of the present invention more clearly, the following will briefly introduce the accompanying drawings used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, which are common in the art. As far as technical personnel are concerned, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic cross-sectional view of a rigid-flex board provided by the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to FIG. 1, the present invention provides a rigid-flex board 100, the rigid-flex board 100 includes a base material layer 10, a rigid circuit substrate 20, an electronic component and a shielding film 40, and the base material layer 10 includes a first One area 10a, the rigid circuit substrate 20 is correspondingly attached to the first area 10a, the rigid circuit substrate 20 is provided with a shielding area 20a, and the electronic components are soldered in the shielding area 20a of the rigid circuit substrate 20 , and focus on the geometric center of the shielding area 20a, the shielding film 40 is fixed on the rigid circuit substrate 20, presses and covers the electronic components, the shielding film 40 is on the rigid circuit substrate 20 The orthographic projection area coincides with the shielding area.

By soldering the electronic components in the shielding area 20a, the shielding film 40 is used to press and cover the electronic components, and the orthographic projection area of the shielding film 40 on the rigid wiring substrate 20 is the same as that of the shielding film 40. The shielding areas are overlapped, so that the electronic components in the shielding area 20a are fixed on the rigid wiring substrate 20 by the pressing force of the shielding film 40 , so that the electronic components are not easily removed from the rigid wiring substrate 20 . The upper part falls off, which enhances the stability of the rigid-flex board 100 .

In this embodiment, the base material layer 10 can be made of materials such as polyimide or polyethylene terephthalate (PET), so that copper foil circuits can be arranged on the base material layer 10 , and The base material layer 10 can provide an insulating environment for the copper foil circuit. Preferably, the thickness of the base material layer 10 may be 20 μm. The base material layer 10 may be provided with a first area 10a and a second area 10b, and the second area 10b is used to exhibit flexibility, which is convenient for the flexible bonding board 100 to deform, thereby facilitating the connection of the flexible and rigid bonding board 100. External devices, the first area 10a fixes the rigid wiring substrate 20, thereby improving the rigidity of the flexible bonding board 100, using the rigid wiring substrate 20 to fix the electronic components, and using the hard wiring The rigidity of the base plate 20 facilitates the assembly of the flexible bonding board 100 in the terminal.

In this embodiment, the rigid circuit substrate 20 is formed by a rigid circuit board manufacturing process, the rigid circuit substrate 20 carries the electronic components, and the rigid circuit substrate 20 has signal lines electrically connected to the electronic components. Thereby, electrical signals are provided to the electronic components so that the electronic components operate. Specifically, the rigid circuit substrate 20 is in the shape of a plate, the rigid circuit substrate 20 is adhered to the first area 10 a of the base material layer 10 , and the rigid circuit layer 20 faces away from a portion of the base material layer 10 . The electronic components are welded side by side, and the shielding film 40 is bonded. The geometric center of the shielding area 20a of the rigid wiring substrate 20 coincides with the geometric center of the first area 10a, and the periphery of the shielding area 20a is equidistant from the periphery of the first area 10a. Therefore, the stress of the electronic components in the shielding area 20a to the hard wiring layer 20 is concentrated around the geometric center of the first area 10a, so that the hard wiring layer 20 can effectively support the electronic components.

In this embodiment, the electronic component is composed of a plurality of electronic components, and the electronic components may be components such as capacitors, resistors, diodes, or triodes. The electronic components are connected with the lines of the rigid circuit substrate 20, so that the flex-rigid board 100 provides a circuit structure, and the flex-rigid board 100 is applied to the terminal, so that the flex-rigid board 100 can realize electronic Information processing. The electronic component is soldered on the rigid circuit substrate 20, and the electronic component is supported by the rigid circuit substrate 20, so that the electronic component has welding stress on the rigid circuit substrate 20, so that the electronic component has a welding stress on the rigid circuit substrate 20. When there is a welding gap with the rigid circuit substrate 20 , the electronic components are easily caused to fall off, so the electronic components are more stable on the rigid circuit substrate 20 under the pressing action of the shielding film 40 .

In this embodiment, the peripheral edge of the shielding film 40 may be adhered to the peripheral edge of the shielding region 20a, and the shielding film 40 electromagnetically shields the electronic components, thereby protecting the electronic components and preventing the The electronic components can receive electromagnetic interference, thereby improving the anti-interference performance of the flex-rigid board 100, so that the flex-rigid board 100 can be applied to a scene with a harsh electromagnetic environment. In other embodiments, the peripheral edge of the shielding film 40 may also be welded to the peripheral edge of the shielding region 20a.

Further, the electronic assembly includes a plurality of first electronic components 31 and a second electronic component 32, the internal stress of the plurality of first electronic components 31 is greater than the internal stress of the second electronic component 32, the An electronic element 31 is arranged around the second electronic element 32 .

In this embodiment, the first electronic component 31 may be a resistor, and the second electronic component 32 may be a capacitor. Obviously, the internal stress of the resistance is greater than that of the capacitor, that is, the strength of the resistance is greater than that of the capacitor, so the first electronic component 32 may be a capacitor. The electronic element 31 is easier to stabilize on the rigid circuit substrate 20 than the second electronic element 32 . The first electronic components 31 are arranged around the second electronic components 32, so that the first electronic components 31 strengthen the stability of the rigid circuit substrate 20 around the second electronic components 32, so that the The rigid circuit substrate 20 around the second electronic component 32 is not easily deformed, so that the second electronic component 32 is stabilized, and the overall structure of the rigid-flex board 100 is stabilized. In other embodiments, the first electronic component 31 may also be an electronic chip, and the second electronic component 32 may also be a diode.

Further, the flex-rigid board 100 includes two rigid circuit substrates 20 , which are a first rigid circuit substrate 21 and a second rigid circuit substrate 22 , the first rigid circuit substrate 21 and the second rigid circuit substrate 22 , respectively. The circuit substrates 22 are respectively attached to both sides of the base material layer 10 . The circuits of the first rigid circuit substrate 21 and the circuits of the second rigid circuit substrate 22 may be different, so that the flex-rigid board 100 presents a variety of different circuit structures, making the flex-rigid board 100 diverse , and can match a variety of different terminals. The electronic components may be soldered only to the first rigid circuit substrate 21 , or may be soldered only to the second rigid circuit substrate 22 , or two of the electronic components may be soldered to the first rigid circuit substrates respectively. The rigid wiring substrate 21 and the second rigid wiring substrate 22 , or the electronic components are soldered to the first rigid wiring substrate 21 and the second rigid wiring substrate 22 at the same time. In other embodiments, if the flex-rigid board 100 is provided with two layers of the base material layers 10 stacked, the flex-rigid board 100 can also be provided with three sets of the rigid circuit substrates 20 .

Further, the electronic component includes a third electronic component 33 and a fourth electronic component 34, the internal stress of the third electronic component 33 is greater than the internal stress of the fourth electronic component 34, the third electronic component 33 Soldered on the first rigid circuit substrate 21 , the fourth electronic element 34 is welded on the second rigid circuit substrate 22 and located at a position opposite to the third electronic element 33 .

In this embodiment, the third electronic component 33 may be a chip, and the fourth electronic component 34 may be a capacitor. Obviously, the internal stress of the chip is greater than the internal stress of the capacitor, that is, the strength of the chip is greater than that of the capacitor. Therefore, the third electronic component 34 may be a capacitor. The bonding strength between the electronic element 33 and the first rigid wiring substrate 21 is greater than the bonding strength between the fourth electronic element 34 and the second rigid wiring substrate 22 . The fourth electronic component 34 is disposed opposite to the third electronic component 33, so that the third electronic component 33 supports the fourth electronic component 34, so that the fourth electronic component 34 is more stable in the on the second rigid circuit substrate 22 , so that the overall structure of the rigid-flex board 100 is stable. In other embodiments, a plurality of the fourth electronic components 34 may also be arranged at positions opposite to the third electronic components 33 , that is, a plurality of the fourth electronic components 34 are located on the base material layer 10 . The orthographic projection area is located in the orthographic projection area of the third electronic component 33 on the base material layer 33 .

Further, the rigid circuit substrate 20 includes a rigid insulating layer 201, a circuit layer 202 and a solder resist ink layer 203, the rigid insulating layer 201 is attached to the first area 10a, and is on the base material layer The orthographic projection area on 10 coincides with the first area 10a. The circuit layer 202 is attached to the hard insulating layer 201 and is located on the side opposite to the base material layer 10 , and the solder resist ink layer 203 is coated on the circuit layer 202 to cover the In the circuit layer 202 , the electronic components 20 pass through the solder resist ink layer 203 and are soldered on the circuit layer 202 . Specifically, the hard insulating layer 201 is made of polyethylene, and the hard insulating layer 201 has insulating properties, so that the circuit layer can be etched on the hard insulating dirt 201 . The rigidity of the rigid insulating layer 201 increases the strength of the rigid-flex board 100 in the first region 10a, so that the rigid-flex board 100 is not easily bent in the first region 10a. The circuit layer 202 may be formed of copper foil through an etching process. The circuit layer 202 may be provided with signal traces or ground traces. The solder resist ink layer 203 protects the circuits on the circuit layer 202 to prevent the circuits on the circuit layer 202 from being short-circuited. Soldering holes are arranged on the solder resist ink layer 203 , and soldering tin is arranged in the soldering holes, and the soldering tin solders the electronic components to the circuit layer 202 .

Further, the base material layer 10 further includes a second region 10b connected to the edge of the first region 10a, and the rigid-flex board 100 further includes a copper foil layer 50, which is laminated on the The rigid circuit layer group 20 and the base material layer 10 are arranged on the first area 10a and the second area 10b side by side.

In this embodiment, the copper foil layer 50 is a board with copper foil on the film, and the ground traces and signal traces on the copper foil layer 50 are formed by etching the copper foil according to the predetermined wiring structure. . The ground traces and signal traces on the copper foil layer 50 may be integrally arranged, the signal traces on the copper foil layer 50 realize electrical conduction between electrical components, and the ground traces on the copper foil layer 50 ground. The copper foil layer 50 is arranged on the base material layer 100 to diversify the circuit structure of the rigid-flex board 100 , and the copper foil layer 50 can be used to bend with the second region 10 b of the base material layer 10 , so as to facilitate the flexible and rigid board 100 to connect to the functional components of the terminal, and to exhibit the characteristics of the flexible circuit board.

Further, the rigid-flex board 100 includes two layers of the copper foil layers 50 , which are a first copper foil layer 51 and a second copper foil layer 52 respectively, and the first copper foil layer 51 and the second copper foil layer 51 The foil layers 52 are respectively stacked on both sides of the base material layer 10 , the first copper foil layer 51 is provided with through holes 53 penetrating through the second copper foil layer 52 , and the through holes 53 are provided to connect the The conductors 54 of the first copper foil layer 51 and the second copper foil layer 52 .

In this embodiment, the first copper foil layer 51 and the second copper foil layer 52 are respectively provided with different circuits, so as to increase the circuit layout space of the flex-rigid board 100 and improve the flexibility of the flex-rigid board. 100 conductivity. The through hole 53 is opened at one end of the line of the first copper foil layer 51 and extends toward the line of the second copper foil layer 52 . Specifically, the through hole 52 also penetrates the base material layer 10 , and the conductor 54 is a copper column passing through the through hole 52 . The conductor 54 realizes the conduction between the first copper foil layer 51 and the second copper foil layer 52 , thereby ensuring the multi-circuit routing requirement of the rigid-flex board 100 . The through holes 53 are opened in the second area 10b of the copper foil layer 50 opposite to the base material layer 10, so as to reduce the stress of the copper foil layer 50 in the second area 10b, so that the rigid-flex board 100 is in the second area 10b. The strength of the second region 10b is weakened, and the flexibility of the rigid-flex board 100 in the second region 10b is improved. In other implementation manners, the number of the through holes 53 may be multiple, and the conductors 54 may realize ground conduction or signal conduction.

Further, the flex-rigid board 100 further includes a first cover film 61 and a second cover film 62, which are respectively the first cover film 61 adhered to the first copper foil layer 51 and the first cover film 61 adhered to the second cover film 61. For the second cover film 62 of the two copper foil layers 52 , the orthographic projection area of the first cover film 61 and the second cover film 62 on the base material layer 10 coincides with the second area 10b.

In this embodiment, the first cover film 61 can be thermoformed by using polyester material. The first cover film 61 is pasted on the first copper foil layer 51 by adhesive. Specifically, the first cover film 61 is completely attached to the first copper foil layer 51, and partially covers the signal traces and ground traces on the first copper foil layer 51, that is, the first The cover film 61 corresponds to the second area 10b of the base material layer 10 to protect the signal traces and ground traces on the first copper foil layer 51 from being broken or damaged. , it can also make the connection between the first cover film 61 and the first copper foil layer 51 tighter, and prevent the first cover film 61 from being displaced and unable to route the part of the exposed first cover film 61 to protect. The structure of the second cover film 62 is the same as that of the first cover film 61 , and details are not repeated here.

Further, the first copper foil layer 51 is provided with ground traces (not shown), the second copper foil layer 52 is provided with signal traces (not shown), and the conductors 54 are connected to the first The ground wiring of the copper foil layer 51 and the signal wiring of the second copper foil layer 52 .

In this embodiment, the first copper foil layer 51 is only provided with ground traces, that is, the first copper foil layer 51 is a common electrode. The signal traces on the second copper foil layer 52 realize circuit arrangement, the conductors 54 are connected to the ground traces and the signal traces, and the conductors 54 are circuits on the second copper foil layer 52 The ground electrode is provided to increase the use function of the rigid-flex board 100 . In other embodiments, the second copper foil layer 52 may also be provided with ground traces, the first copper foil layer 51 may be provided with signal traces, and the conductors 54 provide the first copper foil layer 51 ground electrode.

The present invention also provides a terminal (not shown), the terminal includes a main body (not shown), a main board (not shown) arranged inside the main body, and the flexible-rigid combination board 100, the flexible-rigid The combination board 100 is arranged inside the main body and is electrically connected to the main board. The terminal may be a mobile phone, a computer, a tablet, a handheld game console, a media player, or the like.

The rigid-flex board and the terminal of the present invention are reinforced and fixed on the side of the cover film away from the copper foil layer by the steel reinforcement, and are close to the empty window on the cover film, and at the same time, the ground conductor is used to pass through all the The air window is connected between the copper foil layer and the steel reinforcement, so as to realize the connection between the steel reinforcement and the copper foil layer, so as to realize the grounding of the steel reinforcement, thereby improving the soft-hard bond grounding performance of the board.

The above are the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, some improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications are also regarded as the present invention. the scope of protection of the invention.

Claims (9)

1. The rigid-flex board is characterized by comprising a base material layer, a rigid circuit substrate, an electronic component and a shielding film, wherein the base material layer comprises a first area, the rigid circuit substrate is attached to the first area, an orthographic projection area of the rigid circuit substrate on the base material layer coincides with the first area, the rigid circuit substrate is provided with a shielding area, the electronic component is welded in the shielding area, the shielding film is fixed on the rigid circuit substrate, an orthographic projection area of the rigid circuit substrate coincides with the shielding area, the shielding film is laminated and covers the electronic component, the rigid circuit substrate comprises a rigid insulating layer, a circuit layer and an anti-welding ink layer, the rigid insulating layer is attached to the first area, and the orthographic projection area on the base material layer coincides with the first area, the circuit layer laminate in on the stereoplasm insulating layer, and be located with substrate layer mutually carries on the back one side mutually, prevent welding printing ink layer coat in on the circuit layer, cover the circuit layer, electronic component passes prevent welding printing ink layer, weld in on the circuit layer, the holding recess has been seted up to the lower surface of barrier film, prevent welding printing ink layer be formed with the holding clearance that the holding recess set up relatively and communicate, the holding clearance with the holding recess forms the accommodation space jointly, the shape and the size of accommodation space with electronic component matches, electronic component wears to establish the accommodation clearance and the card is established in the accommodation recess.

2. The board according to claim 1, wherein the electronic components include a plurality of first electronic components and a second electronic component, each of the first electronic components has an internal stress greater than an internal stress of the second electronic component, and the first electronic components are arranged around the second electronic component.

3. The rigid-flex board according to claim 1 or 2, wherein the rigid-flex board comprises two rigid circuit substrates, namely a first rigid circuit substrate and a second rigid circuit substrate, and the first rigid circuit substrate and the second rigid circuit substrate are respectively attached to two opposite sides of the base material layer.

4. The board according to claim 3, wherein the electronic components include a third electronic component and a fourth electronic component, the internal stress of the third electronic component is greater than the internal stress of the fourth electronic component, the third electronic component is soldered on the first rigid wiring substrate, and the fourth electronic component is soldered on the second rigid wiring substrate and located opposite to the third electronic component.

5. The board of claim 1, wherein the substrate layer further includes a second region connected to the first region, and the board further includes a copper foil layer disposed between the first region and the second region and stacked between the substrate layer and the hard circuit substrate.

6. The board of claim 5, wherein the board comprises two copper foil layers, namely a first copper foil layer and a second copper foil layer, the first copper foil layer and the second copper foil layer are respectively stacked on two opposite sides of the substrate layer, the first copper foil layer is provided with a through hole penetrating to the second copper foil layer, and a conductor connecting the first copper foil layer and the second copper foil layer is arranged in the through hole.

7. The board according to claim 6, further comprising a first cover film and a second cover film, wherein the first cover film is attached to the first copper foil layer and the second cover film is attached to the second copper foil layer, and the orthographic projection areas of the first cover film and the second cover film on the substrate layer coincide with the second areas.

8. The board according to claim 6, wherein the first copper foil layer is provided with a ground trace, the second copper foil layer is provided with a signal trace, and the electrical conductor is connected to the signal trace and the ground trace.

9. A terminal, comprising a body, a main board disposed inside the body, and the rigid-flex board according to any one of claims 1 to 8, wherein the rigid-flex board is disposed inside the body and electrically connected to the main board.

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