JP2006222370A - Circuit board combining different material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board combining different materials with a rigid substrate and flexible substrate, bearing wiring patterns in multilayers, being pasted together which achieves a highly functional/high-density thin circuit board module and semiconductor package, having a good electric characteristics coping with high speed digital signal and high frequency signal to assure operation. <P>SOLUTION: A rigid substrate 4 of two layer and a both-sided flexible substrate 1 are pasted together to form a circuit board combining different materials. Wiring patterns 6a and 6b of the rigid substrate 4 are connected together through a via 7, and the wiring pattern 6b of the rigid substrate 4 and a wiring pattern 3b of the flexible substrate 1 are connected together through a conductive bump 9. An insulating substrate 10 on which an electromagnetic shield wiring pattern 13 is formed almost over the entier surface is pasted to the tip part of the flexible substrate 1 extending from the pasted part. The wiring pattern of a flexible part 16 connecting a component mounting part 19 and a connector 12 part has a micro strip line structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a circuit board made of a combination of different materials obtained by bonding a rigid board and a flexible board. Specifically, the rigid board having a build-up structure of any layer and a flexible board are bonded together to provide an electromagnetic shielding effect. In addition, the present invention relates to a circuit board made of a combination of different materials capable of impedance matching with an external circuit.

  Examples of the circuit board made of a combination of different materials in a state where the flexible board and the rigid board are bonded together and the flexible board is pulled out from the bonded portion include the following. As shown in FIG. 15, a rigid substrate 52 is bonded to both surfaces of a flexible substrate 50 via an adhesive sheet or prepreg 51 to form a multilayer portion 53, and each conductor pattern 54, 55, 56 of the multilayer portion 53 is formed. Are electrically connected to each other through a through hole 57. A flexible portion 58 of the flexible substrate 50 constituting the multilayer portion 53 extends from the multilayer portion 53, and a rigid reinforcing plate 60 is provided on the back side surface of the conductor terminal pattern 59 formed at the tip portion of the flexible portion 58. Is affixed so that the connection with the external terminal is ensured (see, for example, Patent Document 1).

In addition, for example, the following is one in which a flexible substrate and a rigid substrate are bonded together and a hole is provided in a part of the bonded portion. As shown in FIG. 16, a rigid portion 71 having a multilayer structure is formed on both surfaces of a double-sided flexible substrate 70, and the conductor patterns (72 to 81) are electrically connected to each other through a through hole 82. And the hole 84 which reaches the flexible part 85 of the double-sided flexible board 70 from each outside of the rigid part 83 sandwiching the double-sided flexible board 70 is provided, and the flexible part 85 is exposed on the bottom surface of the hole 84 (for example, (See Patent Document 2).
JP-A-5-235552 Japanese Patent Laid-Open No. 2002-158445

  However, in the conventional circuit board made of a combination of different materials obtained by bonding a rigid substrate and a flexible substrate, the former is a flexible portion and a flexible portion of a flexible substrate extended from a bonding portion of the flexible substrate and the rigid substrate. The portion connected to the external terminal at the front end of the wire is used only for electrical connection, and a circuit such as an electromagnetic shield for noise removal or impedance matching has not been formed. Therefore, it has been difficult to transmit high-speed digital signals and high-frequency signals.

  In addition, in the latter case, the rigid part is provided with a hole (cavity) so that the flexible substrate is exposed on the bottom surface. In this structure, the mounted semiconductor element is sealed with a sealing resin.

  Therefore, the present invention was devised in view of the above problems, and the object of the present invention is to combine a dissimilar material in which a rigid substrate having a multilayer wiring pattern and a flexible substrate having a wiring pattern are bonded together. In the circuit board according to the above, it has good electrical characteristics corresponding to high-speed digital signals and high-frequency signals, ensures reliable operation, and realizes thin high-performance, high-density circuit board modules and semiconductor packages The object is to provide a circuit board made of a combination of different materials.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention has at least two wiring pattern layers in which insulating layers and wiring pattern layers made of a conductive material are alternately laminated. A circuit board made of a combination of dissimilar materials in which a flexible substrate is bonded to and integrated with either or both surfaces of a rigid substrate having an any layer build-up structure, The circuit board is composed of a rigid part and a flexible part by selectively and partially forming a rigid board having the build-up structure of the any layer and the flexible board, respectively. Low noise in the external terminal connection where the circuit board made of a combination of these different materials is connected to the external terminal Means is characterized in that is applied.

  The invention described in claim 2 of the present invention is characterized in that, in claim 1, the noise reducing means is provided with an electromagnetic shield.

  The invention described in claim 3 of the present invention is characterized in that, in claim 1, the noise reduction means is mounted with an electronic component such as a resistor, a capacitor, a noise filter or the like. .

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the at least flexible portion is impedance matched with an external circuit connected to a circuit board made of a combination of the different materials. Therefore, it is characterized by a two-layer microstrip line structure or a three-layer strip line structure.

  Further, in the invention described in claim 5 of the present invention, in any one of claims 1 to 4, a hole reaching the flexible substrate is provided in a part of the rigid portion, and is exposed to a bottom surface of the hole. An electronic component and / or a semiconductor element is mounted on the flexible substrate.

  Further, the invention described in claim 6 of the present invention is the dissimilar material of the circuit board according to any one of claims 1 to 5, wherein the flexible part is folded to combine the rigid part and the dissimilar material. An external terminal connection portion where a circuit board by the combination is connected to an external terminal is overlapped.

  Further, in the invention described in claim 7 of the present invention, in any one of claims 1 to 6, the connection between the circuit board and the external terminal by the combination of the different materials is a connector, solder, anisotropic conductive It is performed by means selected from the group consisting of resins.

  The circuit board made of a combination of different materials according to the present invention is a circuit board made of a combination of different materials obtained by laminating a rigid board having an any layer build-up structure and a flexible board, and the circuit board made of the combination of different materials is electromagnetically coupled. It incorporates a shield structure and a microstrip line structure. Therefore, by preventing the influence of noise, high-quality high-speed digital signals and high-frequency signals can be transmitted and received, and impedance matching with an external circuit can be achieved, resulting in excellent electrical characteristics such as frequency characteristics. There is an advantage that a circuit can be configured.

  An electromagnetic shield structure on the circuit board made of a combination of dissimilar materials with a rigid board having an any-layer build-up structure and a flexible board for the purpose of improving noise resistance and impedance matching with external circuits And a microstrip line structure.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 14 (the same parts are denoted by the same reference numerals). In addition, since the Example described below is a suitable specific example of this invention, various technically preferable restrictions are attached | subjected, The range of this invention limits this invention especially in the following description. As long as there is no description of that, it is not restricted to these Examples.

  1 to 3 show Embodiment 1 of a circuit board module using a circuit board made of a combination of different materials according to the present invention, FIG. 1 is a plan view, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along the line BB in FIG. This embodiment is generally composed of a rigid substrate having a build-up structure of a flexible substrate and an any layer.

  As shown in FIG. 1, the present embodiment is composed of a component mounting part 19, a flexible part 16, and a connector 12 part.

  2 and 3, the cross-sectional view of the flexible substrate 1 includes wiring patterns 3 a and 3 b made of a conductive material on both sides of an insulating film 2 made of an insulating material such as polyimide resin. This is a double-sided flexible substrate 1. A rigid substrate having an any-layer build-up structure (hereinafter abbreviated as “rigid substrate 4”) is provided on both sides of an insulating layer 5 made of an insulating material such as a fiber-reinforced epoxy resin in which a glass fiber is impregnated with an epoxy resin. This is a multilayer wiring board on which wiring patterns 6a and 6b are formed. The wiring patterns of both wiring patterns 6a and 6b sandwiching the insulating layer 5 are connected to each other by vias 7 so as to be electrically connected.

  Then, one surface of the flexible substrate 1 and one surface of the rigid substrate 4 are selectively and partially bonded via an insulating adhesive 8, and the flexible substrate 1 and the rigid substrate 4 are opposed to each other. The wiring patterns of the patterns 3b and 6b are connected by the conductive bumps 9 so that the flexible substrate 1 and the rigid substrate 4 are electrically connected.

  A part of the flexible substrate 1 extends from a bonding portion with the rigid substrate 4, and a rigid insulating substrate 10 that also serves as a reinforcing plate is bonded to the tip portion via an adhesive 11 having an insulating property. The connector 12 having a plurality of external terminals is fitted and fixed.

  At this time, as shown in FIG. 2, a wiring pattern (electromagnetic shield wiring pattern 13) is formed on the surface of the insulating substrate 10 facing the flexible substrate 1 so as to cover substantially the entire surface of the insulating substrate 10. The shield wiring pattern 13 is connected to the GND wiring pattern 15 of the flexible substrate 1 connected to the GND terminal 14 of the connector 12 by the conductive bumps 9 so as to be electrically connected. Furthermore, the GND wiring pattern 15 of the flexible substrate 1 reaches the bonding portion with the rigid substrate 4 via the flexible portion 16 of the flexible substrate 1 and supplies the GND potential to the rigid substrate 4 side by the conductive bumps 9.

  On the other hand, as shown in FIG. 3, the signal wiring pattern 18 of the flexible substrate 1 connected to the signal terminal 17 of the connector 12 that controls the input / output of an electrical signal is connected to the rigid substrate 4 via the flexible portion 16 of the flexible substrate 1. The bonding portion is reached, and electrical signals are exchanged with the rigid substrate 4 side by the conductive bumps 9.

  An insulating wiring protective film 20 is formed on both surfaces of the flexible portion 16 except for a portion where the flexible substrate 1 is bonded to the rigid substrate 4 and a portion where the tip portion is bonded to the insulating substrate 10. Measures are taken to prevent corrosion and disconnection of the wiring pattern and to prevent a short circuit with an external circuit.

  An insulating layer 21 is formed on the surface of the rigid substrate 4 opposite to the bonding surface of the rigid substrate 4 to the flexible substrate 1, and partially covers the wiring pattern 6 a on the outermost layer of the rigid substrate 4.

  When the electronic component 22 or the semiconductor element 23 is mounted on the circuit board made of the combination of the different materials described above, the exposed portion of the wiring pattern 6a located on the outermost layer of the rigid substrate 4 and the electrode of the electronic component 22 or the semiconductor element 23 are connected. They are connected and fixed by a connecting member 24 such as solder, gold, conductive adhesive, etc. to achieve electrical continuity between them. In this way, the circuit board module 25 on which electronic components and semiconductor elements are mounted is realized.

  In this case, the electromagnetic shield wiring pattern 13 is formed on the rigid insulating substrate 10 affixed to the distal end portion of the flexible substrate 1 that fits with the signal terminal 17 and the GND terminal 14 of the connector 12 and is kept at the GND potential. . Therefore, input / output signals passing through the connector 12 are blocked from spatial noise, and high-quality high-speed digital signals and high-frequency signals can be input / output.

  The second embodiment is the same as the first embodiment except for the configuration of the wiring pattern of the flexible portion, which is different from the first embodiment. Therefore, description other than a flexible part is abbreviate | omitted. FIG. 4 shows a cross-sectional view of the flexible portion of the second embodiment. The GND wiring pattern 15 is formed on almost the entire surface of the flexible portion 16 and the signal wiring pattern 18 is formed on the opposite surface with the insulating film 2 sandwiched therebetween to form a two-layer microstrip line structure. Thereby, impedance matching with an external circuit can be achieved, and a circuit having good electrical characteristics such as frequency characteristics can be configured.

  Similar to the second embodiment, the third embodiment is the same as the first embodiment except for the configuration of the wiring pattern of the flexible portion, which is different from the first embodiment. Therefore, description other than a flexible part is abbreviate | omitted. FIG. 5 shows a cross-sectional view of the flexible portion of the second embodiment. The GND wiring pattern 15 is formed on almost the entire surface of the flexible portion 16, and the signal wiring pattern 18 is formed on the opposite surface with the insulating film 2 interposed therebetween. Further, a wiring protective film 20 made of an insulating material is formed on the insulating film 2 so as to embed the signal wiring pattern 18 on the signal wiring pattern 18 side, and a second GND wiring pattern 32 is provided on almost the entire surface. A three-layer stripline structure. Of course, the two GND wiring patterns 15 and 32 are kept at the GND potential.

  In other words, the path of the signal line is sandwiched between two GND potentials via the insulating layer, thereby matching the impedance with an external circuit and providing a circuit with good electrical characteristics such as frequency characteristics. Can be configured. The second GND wiring pattern 32 is formed of a metal thin film such as copper or a conductive paste.

  6 to 8 show Embodiment 4 of a circuit board module using a circuit board made of a combination of different materials according to the present invention, FIG. 6 is a plan view, and FIG. 7 is a cross-sectional view taken along the line CC in FIG. 8 is a cross-sectional view taken along the line DD of FIG. This embodiment is also composed of a rigid board having a build-up structure of a flexible board and an any layer, as in the first to third embodiments. As shown in FIG. It consists of a part 16 and a connector 12 part.

  The present embodiment is the same as the first embodiment except that the configuration of the connector 12 is different from that of the first embodiment. Therefore, descriptions other than the connector 12 portion are omitted.

  A rigid insulating substrate 10 is attached to an end portion of the flexible substrate 1 fitted with the signal terminal 17 and the GND terminal 14 of the connector 12 via an adhesive 11 having an insulating property. A signal wiring pattern 18 and a GND wiring pattern 15 are formed on both surfaces of the insulating substrate 10, and the signal wiring patterns 18 and the GND wiring patterns 15 sandwiching the insulating substrate 10 are connected via vias 7. Electrical continuity is achieved.

  Further, the signal wiring patterns 18 and the GND wiring patterns 15 formed on the surface where the insulating substrate 10 and the flexible substrate 1 face each other are connected by the conductive bumps 9 so as to be electrically connected.

  Then, the signal wiring pattern 18 at the distal end portion of the flexible substrate 1 and the signal terminal 17 of the connector 12, and the GND wiring pattern 15 at the distal end portion of the flexible substrate 1 and the GND terminal 14 of the connector are in contact with each other, so that electrical conduction is achieved. It has been.

  Further, an electronic component 22 such as a capacitor (bypass capacitor), a resistor (damping resistor), a noise filter, or the like is mounted between the signal wiring pattern 18 formed on the outermost surface of the insulating substrate 10 and the GND wiring pattern 15, and the circuit board. Module 25 is realized.

  In such a circuit board module 25, when a noise component is included in the electrical signal input from the signal terminal 17 of the connector 12, it is input from the signal terminal 17 of the connector 12 as shown in FIG. 8. The noise component of the electric signal reaches the one electrode of the electronic component 22 from the signal wiring pattern 18 of the flexible substrate 1 through the conductive bump 9 and the via 7, and from the other electrode of the electronic component 22 to the via 7 as shown in FIG. 7. Through the conductive bump 9, it reaches the GND wiring pattern 15 of the flexible substrate 1, and can escape from the GND terminal 14 of the connector 12 to the outside.

  That is, the noise of the electric signal including the noise input to the circuit board module can be removed by the connector portion that is the entrance of the circuit module, and the noise can be prevented from entering the circuit board module. As a result, reliable operation of the circuit board module is ensured, and a highly reliable circuit board module can be realized.

  In addition, the wiring pattern structure of the flexible part that connects the bonding part of the flexible board and the rigid board of the circuit board made of a combination of different materials and the connector part is such that each of the signal wiring pattern 18 and the GND wiring pattern 15 has the width of the flexible part 16. On the other hand, a two-layer structure formed with a small width, as shown in FIG. 4, a GND wiring pattern 15 is formed on almost the entire surface of the flexible portion 16, and a signal wiring pattern 18 is formed on the opposite surface across the insulating film 2. As shown in FIG. 5, a GND wiring pattern 15 is formed on almost the entire surface of the flexible portion 16, and a signal wiring pattern 18 is formed on the opposite surface with the insulating film 2 interposed therebetween. Further, a wiring protective film 20 made of an insulating material is formed on the insulating film 2 so as to embed the signal wiring pattern 18 on the signal wiring pattern 18 side, and a second GND wiring pattern 32 is provided on almost the entire surface. A three-layer stripline structure is possible.

  The wiring pattern structure of the flexible part in all the embodiments according to the present invention can target the wiring pattern structure of each of the flexible parts described above, and can select and employ it.

  Up to this point, the connection method using a connector has been described as means for electrically connecting a circuit board made of a combination of different materials of the present invention and an external circuit. As another connection method, as shown in FIG. A method of connecting the electrode terminal of the external substrate 26 of the circuit and the wiring pattern 27 of the flexible substrate 1 to which the rigid insulating substrate 10 is attached by solder 28 or, as shown in FIG. 10, the electrode terminal of the external substrate 26 A method of connecting the wiring pattern 27 of the flexible substrate 1 to which the rigid insulating substrate 10 is attached with an anisotropic conductive resin 29 is possible. Also in this case, the means for electrically connecting the circuit board made of a combination of different materials and the external circuit in all the embodiments according to the present invention can be applied to the connection method with each of the above external boards. Can be selected and employed.

  FIG. 11 is a cross-sectional view showing the fifth embodiment. In this embodiment, an electronic component or a semiconductor element 23 is mounted on both the flexible substrate side and the rigid substrate side of the bonded portion of the flexible substrate 1 and the rigid substrate 4, and the component mounting portion is extended from the bonded portion. A circuit board module 25 having a configuration in which the flexible portion 16 of the substrate 1 is bent into a substantially U shape and is bonded and fixed to the distal end portion of the flexible substrate 1 to which the rigid insulating substrate 10 is attached via an adhesive 8 having insulating properties. It is. The electrical connection with the external circuit is made through the connector 12 arranged on the external board 26.

  Such a circuit board module has a structure in which the entire module is stacked above the connector, and has an optimum configuration for placement in a place where a planar space is scarce. Note that the bonding and electrical connection between the flexible substrate and the rigid substrate, the bonding between the leading end portion of the flexible substrate and the rigid insulating substrate and the electrical connection, and the like are the same as those in the first embodiment, and the description thereof is omitted. To do.

  FIG. 12 is a cross-sectional view showing the sixth embodiment. This is because a hole reaching the flexible substrate 1 is provided in a part of the rigid substrate 4 in the bonded portion of the flexible substrate 1 and the rigid substrate 4 of Example 1, and the wiring pattern on the flexible substrate 1 exposed at the bottom surface of the hole. 27 is a circuit board module 25 in which an electrode of a semiconductor bare chip 30 such as an LSI is connected and mounted, and sealed with a sealing resin 31. In addition, electronic components and semiconductor elements can be mounted via a wiring pattern 27 formed on the outermost layer of the rigid substrate 4.

  In this case, the mounting of the semiconductor bare chip and the resin sealing thereof can be formed without protruding from the ridged substrate. Therefore, a thin circuit board module can be realized. This can also be used as a semiconductor package.

  FIG. 13 is a cross-sectional view showing the seventh embodiment. In the seventh embodiment, the electronic component 22 and the semiconductor element 23 can be mounted through the wiring pattern 27 formed in the outermost layer of the flexible substrate 1 in the sixth embodiment. That is, an electronic component or a semiconductor element can be mounted on both outer surfaces on which the rigid substrate 4 and the flexible substrate 1 are bonded.

  In this case, the mounting of the semiconductor bare chip and the resin sealing thereof can be formed without protruding from the ridged substrate, and many components can be mounted, so that a thin circuit board module substrate having a high mounting density is realized. Can do.

  FIG. 14 is a perspective view showing an electromagnetic shield structure of the connector portion of FIG. A terminal electrode connected to the GND line and the signal line of the external circuit is formed on one conductor pattern layer of the front end portion of the double-sided flexible substrate on which the wiring pattern layers are formed on both sides of the insulating film, and the signal terminal electrode among them is formed. Is connected to the other wiring pattern layer of the double-sided flexible substrate through a through hole and reaches the component mounting portion as a signal wiring pattern.

  On the other hand, the GND terminal electrode of the double-sided flexible board is connected to the other wiring pattern layer of the double-sided flexible board through a through hole to form a GND wiring pattern that covers the substantially entire surface of the tip. Then, the GND wiring pattern of the double-sided flexible substrate is connected to a wiring pattern formed so as to cover substantially the entire surface of the insulating substrate with an adhesive interposed therebetween, and this wiring pattern is connected to the electromagnetic shield wiring. It becomes a pattern.

  Here, the effect of the present invention will be described again. First, a rigid board with an any layer build-up structure, in which a multilayer three-dimensional wiring circuit is configured by alternately laminating insulating layers and wiring pattern layers and connecting via wiring via opposing wiring patterns across the insulating layer, Since no holes are used, it is not necessary to provide a land pattern for through holes on the wiring pattern layer that is not related to the circuit function, and the rigid board can be made smaller, thinner, and lighter, and high-density mounting of electronic components is possible. A circuit excellent in noise can be realized.

  In addition, since the wiring patterns facing each other with the insulating layer interposed therebetween are connected by vias, both wiring patterns can be connected with the shortest distance. Therefore, the wiring pattern routing distance is shortened and the signal transmission distance is shortened, thereby reducing the influence of external noise and contributing to the realization of a highly reliable device having excellent noise resistance.

  In addition, by not providing a through hole, the rigid substrate does not leak light, and is optimal as a substrate for a mounting circuit for an optical system component that dislikes stray light.

  In addition, when the rigid substrate and the double-sided flexible substrate are bonded together, the electrodes of both substrates are connected via conductive bumps. Therefore, it is possible to realize a circuit board module substrate that is small and capable of high-density mounting of electronic components.

  In addition, an insulating substrate having a wiring pattern formed on a substantially entire surface was attached to the tip of the flexible substrate extending from the bonded portion of the rigid substrate and the flexible substrate to form an electrical junction with an external circuit. Then, the function of the electromagnetic shield is provided by keeping the wiring pattern of the insulating substrate at the GND potential. As a result, the input / output signals passing through the connection with the external circuit are blocked from the spatial noise, and high-quality high-speed digital signals and high-frequency signals can be input / output.

  In addition, by mounting a bypass capacitor, damping resistor, noise filter, etc. on the insulating substrate that is attached to the tip of the flexible substrate, the noise of the electric signal including the noise input to the circuit board module is the entrance of the circuit module It can be removed at the connector portion to prevent noise from entering the circuit board module. Therefore, reliable operation of the circuit board module is ensured, and a highly reliable circuit board module can be realized.

  Further, the flexible portion of the flexible substrate extended from the bonded portion of the rigid substrate and the flexible substrate has a two-layer microstrip line structure or a three-layer strip line structure. Therefore, impedance matching with an external circuit can be achieved, and a circuit with good electrical characteristics such as frequency characteristics can be configured.

It is a top view which shows Example 1 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a fragmentary sectional view which shows Example 2 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is a fragmentary sectional view which shows Example 3 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is a top view which shows Example 4 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is a fragmentary sectional view which shows the connection method with the external board | substrate of the circuit board by the combination of the dissimilar material concerning this invention. It is a fragmentary sectional view which shows the other connection method with the external board | substrate of the circuit board by the combination of the dissimilar material concerning this invention. It is sectional drawing which shows Example 5 of the circuit board module using the circuit board by the combination of the dissimilar material concerning this invention. It is a fragmentary sectional view which shows Example 6 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is a fragmentary sectional view which shows Example 7 of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is the perspective view which showed the electromagnetic shielding structure of the connector part of the circuit board module which uses the circuit board by the combination of the dissimilar material concerning this invention. It is sectional drawing which shows the circuit board by the combination of the conventional different material. It is sectional drawing which shows the circuit board by the combination of the other different different material conventionally.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible board 2 Insulating film 3a, 3b Wiring pattern 4 Rigid board 5 Insulating layer 6a, 6b Wiring pattern 7 Via 8 Adhesive 9 Conductive bump 10 Insulating board 11 Adhesive 12 Connector 13 Electromagnetic shield wiring pattern 14 GND terminal 15 GND wiring Pattern 16 Flexible portion 17 Signal terminal 18 Signal wiring pattern 19 Component mounting portion 20 Wiring protective film 21 Insulating layer 22 Electronic component 23 Semiconductor element 24 Connection member 25 Circuit board module 26 External substrate 27 Wiring pattern 28 Solder 29 Anisotropic conductive resin 30 Semiconductor bare chip 31 Sealing resin 32 Second GND wiring pattern

Claims (7)

  Insulating layers and wiring pattern layers made of a conductive material are alternately laminated, and either or both of the surfaces of a rigid substrate having an any layer build-up structure having at least two wiring pattern layers. A circuit board made of a combination of dissimilar materials integrated with a flexible substrate bonded to the surface, wherein the circuit board made of a combination of dissimilar materials is bonded to the rigid substrate having the build-up structure of the any layer and the flexible substrate Each of the substrates is selectively and partially made up of a rigid portion and a flexible portion, and the circuit board made of a combination of the different materials is connected to an external terminal connection portion connected to an external terminal. Due to the combination of different materials characterized by noise reduction means Road board.   2. The circuit board according to claim 1, wherein the noise reduction means is provided with an electromagnetic shield.   2. The circuit board using a combination of different materials according to claim 1, wherein the noise reduction means is implemented by mounting electronic parts such as a resistor, a capacitor, and a noise filter.   The at least flexible part has a two-layer microstrip line structure or a three-layer strip line structure in order to achieve impedance matching with an external circuit connected to a circuit board made of a combination of different materials. The circuit board by the combination of the dissimilar material of any one of claim | item 1-3.   2. A hole reaching the flexible board is provided in a part of the rigid portion, and an electronic component and / or a semiconductor element is mounted on the flexible board exposed on a bottom surface of the hole. The circuit board by the combination of the dissimilar material of any one of -4.   The flexible terminal is folded back so that an external terminal connection portion where a circuit board made of a combination of the different materials is connected to an external terminal is overlapped with the rigid portion. Item 6. A circuit board comprising a combination of different materials according to any one of items 1 to 5.   The connection between the circuit board and the external terminal by the combination of the different materials is performed by means selected from the group consisting of a connector, solder, and anisotropic conductive resin. A circuit board made of a combination of different materials described in 1.

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