JP7005111B2 - Electronic component mounting product - Google Patents

Description

The present invention relates to an electronic component mounted product.

As a conventional electronic component mounting product, for example, Patent Document 1 discloses a light emitting module including a light emitting element, a chip component, a package, and a chip component mounting member. The chip component is electrically connected to the light emitting element. The package contains a light emitting element and a chip component, and has a ground wiring along the inner surface. The chip component mounting member is placed on the inner surface of the package. In this chip component mounting member, the first and second electrodes of the chip component are conductively bonded on the first and second pads, respectively, and the bonding wire is conductively bonded to the first and second pads, respectively. There is.

Japanese Unexamined Patent Publication No. 2012-0285115

By the way, even when the light emitting module described in Patent Document 1 described above is mounted in a signal transmission circuit of GHz class or higher (for example, 3 GHz to 30 GHz) such as the SHF band (Super High Frequency). It is desired that signal transmission can be performed properly.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounted product capable of realizing appropriate signal transmission.

In order to achieve the above object, the electronic component mounted product according to the present invention includes an insulator having an insulating property, a transmission path pattern provided in the insulating body having electrical conductivity and having a pattern minimum width of 200 [μm]. A transmission line having conductivity and built in the insulator and facing the transmission line pattern along the first direction with the insulator interposed therebetween, and designing the transmission line pattern with an impedance value of 50 [Ω]. The circuit component includes a circuit component including an inner layer pattern, an electronic component mounted on the circuit component, and a wiring material for electrically connecting the transmission path pattern and the electronic component, and the circuit component is the transmission. The inner layer pattern has a mounting recess provided in a concave shape adjacent to the path pattern and on the bottom surface on which the electronic component is mounted, and the inner layer pattern includes an exposed portion exposed on the inner wall surface of the mounting recess on the transmission path pattern side and an exposed portion. , Which is provided adjacent to the exposed portion at a position facing the electronic component along the second direction intersecting the first direction, and is larger than 0 along the second direction from the inner wall surface of the mounting recess 150. [Μm] It is characterized by having a retracted portion retracted within the following range.

Further, in the electronic component mounting product, a conductive adhesive which has conductivity and is interposed between the bottom surface of the mounting recess and the electronic component to bond the bottom surface and the electronic component, and the second direction. One of the conductive adhesives, which is provided as a gap formed between the inner wall surface of the mounting recess and the electronic component in the second direction at a position facing the retracted portion along the above. It may be provided with a pool portion capable of storing the portion.

Further, in the electronic component mounted product, the circuit component has conductivity and is provided on the bottom surface side of the electronic component with respect to the first direction, and is spaced from the retracted portion along the second direction. It is possible to include a bottom side pattern in which 200 [μm] or more is secured.

Further, in the electronic component mounted product, the circuit component has a through hole portion provided around the electronic component mounted on the bottom surface of the mounting recess and penetrating the circuit component along the first direction. Can be.

By providing the above-mentioned configuration, the electronic component mounted product according to the present invention can appropriately suppress the parasitic inductance of the wiring material. As a result, the electronic component mounted product has the effect that proper signal transmission can be realized.

FIG. 1 is a schematic partial perspective view showing a schematic configuration of an electronic component mounted product according to the first embodiment. FIG. 2 is a schematic partial cross-sectional view showing a schematic configuration of an electronic component mounted product according to the first embodiment. FIG. 3 is a schematic partial perspective view showing a schematic configuration of an electronic component mounted product according to the second embodiment. FIG. 4 is a schematic partial cross-sectional view showing a schematic configuration of an electronic component mounted product according to the second embodiment. FIG. 5 is a schematic partial perspective view showing a schematic configuration of an electronic component mounted product according to the third embodiment. FIG. 6 is a schematic partial perspective view showing a schematic configuration of an electronic component mounted product according to a modified example.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. The present invention is not limited to this embodiment. In addition, the components in the following embodiments include those that can be easily replaced by those skilled in the art, or those that are substantially the same.

[Embodiment 1]
In the electronic component mounted product 1 shown in FIGS. 1 and 2, the electronic component 2 is mounted on the circuit component 3 to form an electronic circuit. The electronic component mounting product 1 of the present embodiment constitutes, for example, a part of a signal transmission circuit in the SHF band. The electronic component mounted product 1 of the present embodiment realizes more appropriate signal transmission by adding a predetermined structure to the circuit component 3. Hereinafter, each configuration of the electronic component mounted product 1 will be described in detail with reference to each figure.

In the following description, of the first direction, the second direction, and the third direction that intersect each other, the first direction is referred to as "thickness direction X", and the second direction is referred to as "first width direction Y". The third direction is called "second width direction Z". Here, the thickness direction X, the first width direction Y, and the second width direction Z are orthogonal to each other. The thickness direction X typically corresponds to the direction in which the layers of the circuit component 3 are laminated, and corresponds to the normal direction of the mounting surface on which the electronic component 2 is mounted in the circuit component 3. The thickness direction X of the present embodiment corresponds to the direction in which the transmission line pattern 32A and the inner layer pattern 32B face each other in the circuit component 3. The first width direction Y and the second width direction Z typically correspond to the extending direction of the mounting surface on which the electronic component 2 is mounted in the circuit component 3. The first width direction Y of the present embodiment corresponds to the direction in which the electronic component 2 and the retracted portion 32Bb of the inner layer pattern 32B face each other. Unless otherwise specified, each direction used in the following description shall represent a direction in which each part is assembled to each other.

Specifically, the electronic component mounting product 1 includes an electronic component 2, a circuit component 3, a conductive adhesive 4, a pool portion 5, and a wiring material 6.

The electronic component 2 is an element mounted on the circuit component 3 and exerting various functions. The electronic component 2 of the present embodiment is typically a semiconductor device for transmitting a high frequency optical signal in the SHF band. Here, the electronic component 2 is, for example, a light emitting element that outputs an optical signal, an IC (Integrated Circuit) chip that is driven by the light emitting element, a high frequency signal, or the like.

The circuit component 3 constitutes an electronic circuit in which the electronic component 2 is mounted and the electronic component 2 is electrically connected. The circuit component 3 is formed in a substantially rectangular plate shape in which the plate thickness direction is along the thickness direction X, and is formed so as to extend along the first width direction Y and the second width direction Z. The circuit component 3 includes an insulator 31 having an insulating property and a conductive pattern 32 provided on the insulating body 31 having a conductive property. The circuit component 3 of the present embodiment is a so-called printed circuit board (Printed Circuit Board). That is, in the circuit component 3, the conductive pattern 32 (print pattern) is printed on the insulator 31 formed in layers, and the circuit is formed by the conductive pattern 32. The insulator 31 is a dielectric whose dielectric property is superior to that of conductivity. The insulator 31 is formed of an insulating resin material such as an epoxy resin, a glass epoxy resin, a paper epoxy resin, or a ceramic. The conductive pattern 32 is formed of a conductive metal material such as copper. The conductive pattern 32 constitutes a circuit system according to the required function.

The circuit component 3 of the present embodiment is provided with a plurality of conductive patterns 32 laminated along the thickness direction X via an insulator (insulating layer) 31. That is, the circuit component 3 is configured by laminating a plurality of insulators 31 on which the conductive pattern 32 is printed along the thickness direction X. With this configuration, the circuit component 3 constitutes a so-called multilayer substrate in which a plurality of insulators 31 and a plurality of conductive patterns 32 are alternately laminated to form a multilayer. The plurality of conductive patterns 32 of the present embodiment are configured to include the transmission line pattern 32A and the inner layer pattern 32B.

The transmission line pattern 32A constitutes a transmission line having a design impedance value of 50 [Ω] in cooperation with the inner layer pattern 32B. Here, the design impedance value is an impedance value of a transmission line that is set in advance by design. Since the transmission line pattern 32A constituting the transmission line is provided at a high density, it is possible to suppress the increase in size of the entire electronic component mounting product 1 and to support finer component mounting. A plurality of transmission line patterns 32A of the present embodiment are provided so that the pattern minimum width W1 and the pattern minimum interval P1 are each about 200 [μm]. Here, the pattern minimum width W1 is the minimum width in the direction orthogonal to the direction extending as the transmission line. Further, the pattern minimum spacing P1 is the minimum spacing between two transmission line patterns 32A adjacent to each other along the first width direction Y or the second width direction Z. The pattern minimum width W1 and the pattern minimum interval P1 are typically determined according to a value that can be printed while ensuring the necessary dimensional accuracy in terms of the printing accuracy of the conductive pattern 32. Here, each transmission line pattern 32A is formed as a surface layer pattern provided on the outermost layer of a plurality of laminated insulators 31.

The inner layer pattern 32B constitutes the ground surface of the transmission line pattern 32A. The inner layer pattern 32B is built in between the laminated insulators 31 and is formed at a position facing the transmission path pattern 32A along the thickness direction X with the insulator 31 interposed therebetween. With this configuration, the inner layer pattern 32B constitutes the ground surface of the transmission line pattern 32A, and the transmission line pattern 32A is configured as a transmission line having a design impedance value of 50 [Ω]. Here, as an example, the circuit component 3 has a relative permittivity of about 3 of the insulator 31, which is a dielectric interposed between the transmission path pattern 32A and the inner layer pattern 32B, along the thickness direction X of the insulator 31. The thickness T1 is about 120 [μm]. With this configuration, the inner layer pattern 32B is configured as a ground surface for allowing the transmission line pattern 32A to function as a transmission line having a design impedance value of 50 [Ω]. The transmission line composed of the transmission line pattern 32A and the inner layer pattern 32B typically constitutes a so-called microstrip line.

The circuit component 3 of the present embodiment has a mounting recess 33 on which the electronic component 2 is mounted in the above configuration. The mounting recess 33 is provided in the circuit component 3 in a recess shape adjacent to the transmission path pattern 32A. The mounting recess 33 is formed in the circuit component 3 so as to be recessed along the thickness direction X from the outermost layer provided with the transmission path pattern 32A. Here, the mounting recess 33 is formed at a position adjacent to the transmission path pattern 32A along the first width direction Y. Further, here, the mounting recess 33 is formed in a concave shape having a substantially rectangular cross-sectional shape orthogonal to the thickness direction X. The mounting recess 33 has a depth along the thickness direction X so that the connection position on the transmission path pattern 32A side and the connection position on the electronic component 2 side of the wiring material 6 described later are as close as possible to the thickness direction X. The D1 is formed so as to have a depth expected to be a height H1 along the thickness direction X of the electronic component 2. Here, the height H1 along the thickness direction X of the electronic component 2 is expected to be, for example, about 150 [μm] at the maximum. Then, in the mounting recess 33, the electronic component 2 is mounted on the bottom surface 33a in the thickness direction X. That is, the bottom surface 33a of the mounting recess 33 constitutes a mounting surface on which the electronic component 2 is mounted. The bottom surface 33a is formed as a surface substantially orthogonal to the thickness direction X and extending along the first width direction Y and the second width direction Z. The electronic component 2 of the present embodiment is mounted on the bottom surface 33a of the mounting recess 33 via the conductive adhesive 4. In the example of FIG. 2, the mounting recess 33 is the surface of the electronic component 2 mounted on the bottom surface 33a via the conductive adhesive 4 in the thickness direction X (the surface opposite to the bottom surface 33a side) and the transmission path pattern 32A. The surface of the thickness direction X (the surface opposite to the insulator 31 side) is formed at a depth substantially aligned with the thickness direction X.

The conductive adhesive 4 has conductivity and is interposed between the bottom surface 33a of the mounting recess 33 and the electronic component 2 to bond and fix the bottom surface 33a and the electronic component 2. As the conductive adhesive 4, for example, an organic binder such as an epoxy resin in which a conductive material such as silver or gold is uniformly dispersed can be used.

In the circuit component 3 of the present embodiment, the mounting recess 33 is provided adjacent to the transmission path pattern 32A as described above, so that a part of the end portion of the inner layer pattern 32B is formed on the inner wall surface 33b of the mounting recess 33. Be exposed. Here, the inner wall surface 33b is an inner wall surface forming the mounting recess 33 and is located on the transmission path pattern 32A side. Here, the inner wall surface 33b is formed as a surface extending along the thickness direction X and the second width direction Z. That is, the inner layer pattern 32B of the present embodiment has an exposed portion 32Ba exposed on the inner wall surface 33b on the transmission path pattern 32A side of the mounting recess 33. In the inner layer pattern 32B, the end surface on the mounting recess 33 side is exposed to the inner wall surface 33b to form the exposed portion 32Ba, and the end surface constituting the exposed portion 32Ba extends along the second width direction Z. Here, a part of the inner layer pattern 32B is exposed on the inner wall surface other than the inner wall surface 33b of the mounting recess 33.

Further, the circuit component 3 of the present embodiment has a retracted portion 32Bb adjacent to the exposed portion 32Ba. The retracted portion 32Bb is a portion of the inner layer pattern 32B retracted from the inner wall surface 33b along the first width direction Y. In other words, the retracted portion 32Bb is a setback portion set back from the inner wall surface 33b along the first width direction Y in the inner layer pattern 32B. The retracted portion 32Bb is configured as a notch portion formed in a substantially rectangular shape in the inner layer pattern 32B. The retracting portion 32Bb is provided adjacent to the exposed portion 32Ba at a position facing the electronic component 2 along the first width direction Y. In other words, the electronic component 2 is mounted on the bottom surface 33a at a position facing the retracted portion 32Bb along the first width direction Y. Here, the retracted portion 32Bb is provided on the inner wall surface 33b so as to be sandwiched between the pair of exposed portions 32Ba in the second width direction Z. The retracting portion 32Bb is formed so that the width W2 along the second width direction Z is wider than the width W3 along the second width direction Z of the electronic component 2. More specifically, the retracting portion 32Bb is formed so that the width W2 along the second width direction Z is wider than the width W4 along the second width direction Z of the conductive adhesive 4. The retracted portion 32Bb of the present embodiment is formed as a portion retracted from the inner wall surface 33b along the first width direction Y in a range larger than 0 and 150 [μm] or less. That is, the retracted portion 32Bb is formed so that the retracted amount (setback amount) L1 from the inner wall surface 33b along the first width direction Y is larger than 0 and is in the range of 150 [μm] or less. The amount of evacuation L1 from the inner wall surface 33b of the evacuation portion 32Bb along the first width direction Y corresponds to, in other words, the amount of notch of the inner layer pattern 32B along the first width direction Y. The electronic component mounted product 1 of the present embodiment is provided with a pool portion 5 at a position facing the retracted portion 32Bb along the first width direction Y.

The pool portion 5 is a portion capable of storing a part of the conductive adhesive 4 for adhesively fixing the electronic component 2 to the bottom surface 33a of the mounting recess 33. A part of the above-mentioned conductive adhesive 4 tends to protrude from the outer shape of the electronic component 2 and spread around the electronic component 2 on the bottom surface 33a in the process of adhering and fixing the electronic component 2 to the bottom surface 33a. It is preferable that the width W5 of the conductive adhesive 4 spread from the electronic component 2 is typically at least about half the height H1 of the electronic component 2. For example, when the height H1 of the electronic component 2 is about 150 [μm], it is preferable that the spread width W5 is expected to be about 75 [μm]. Here, the pool portion 5 is provided as a gap portion formed between the inner wall surface 33b and the electronic component 2 in the first width direction Y. With this configuration, the pool portion 5 is configured to be able to store a part of the conductive adhesive 4 that protrudes from the outer shape of the electronic component 2 and spreads toward the inner wall surface 33b. The pool portion 5 is provided between the inner wall surface 33b and the electronic component 2 with respect to the first width direction Y, in other words, as described above, faces the retracted portion 32Bb along the first width direction Y. It will be provided at the position where it is evacuated. Here, the pool portion 5 is formed so that the width W6 along the first width direction Y is, for example, about 50 [μm].

The wiring material 6 electrically connects the transmission line pattern 32A and the electronic component 2. The wiring material 6 is typically a bonding wire formed of a conductive metal material such as gold, aluminum, or copper. The wiring material 6 is on the surface of the transmission path pattern 32A in the thickness direction X (the surface opposite to the insulator 31 side) and the surface of the electronic component 2 in the thickness direction X (the surface opposite to the bottom surface 33a side). Electrically connect to the electrodes. The wiring material 6 is provided by various methods such as ball bonding and wedge bonding.

Since the electronic component mounted product 1 described above is provided with the above configuration, the parasitic inductance of the wiring material 6 can be appropriately suppressed, so that appropriate signal transmission can be realized.

That is, the electronic component mounting product 1 includes the circuit component 3 including the insulator 31, the transmission path pattern 32A, and the inner layer pattern 32B. With this configuration, the electronic component mounting product 1 can configure the transmission line pattern 32A as a transmission line having a pattern minimum width W1 of 200 [μm] and a design impedance value of 50 [Ω]. Then, in the electronic component mounted product 1, the electronic component 2 mounted on the circuit component 3 and the transmission path pattern 32A are electrically connected via the wiring material 6.

In this configuration, in the electronic component mounting product 1, the electronic component 2 is mounted on the bottom surface 33a of the mounting recess 33 provided adjacent to the transmission path pattern 32A in the circuit component 3. With this configuration, the electronic component mounted product 1 has a connection position between the wiring material 6 and the transmission path pattern 32A and a connection position between the wiring material 6 and the electronic component 2 in the thickness direction X without providing a separate component. Can be relatively close to each other. As a result, the electronic component mounting product 1 can suppress the length of the wiring material 6 to be relatively short, so that the parasitic inductance of the wiring material 6 which may adversely affect the transmission characteristics of the transmission line is suppressed. be able to.

As described above, the electronic component mounting product 1 has a configuration in which the performance of the transmission line pattern 32A as the transmission line is ensured by the inner layer pattern 32B, and the mounting recess 33 is provided adjacent to the transmission line pattern 32A. It is said that. With this configuration, the electronic component mounting product 1 has a configuration in which a part of the end portion of the inner layer pattern 32B is exposed as an exposed portion 32Ba on the inner wall surface 33b on the transmission path pattern 32A side of the mounting recess 33. In this configuration, the electronic component mounting product 1 is provided with a retracted portion 32Bb of the inner layer pattern 32B on the inner wall surface 33b where the exposed portion 32Ba is exposed. The retracted portion 32Bb is provided adjacent to the exposed portion 32Ba at a position facing the electronic component 2 along the first width direction Y, and is formed so as to retract from the inner wall surface 33b along the first width direction Y. Will be done. With this configuration, the electronic component mounting product 1 is provided with the electronic component 2 as close as possible to the inner wall surface 33b, and can prevent a short circuit from occurring between the electronic component 2 and the inner layer pattern 32B. can. With this configuration, the electronic component mounted product 1 has the connection position between the wiring material 6 and the transmission path pattern 32A and the wiring material 6 and the electronic component 2 in the first width direction Y without providing a separate component. It can be relatively close to the connection position. Therefore, also in this respect, the electronic component mounting product 1 can suppress the length of the wiring material 6 to be relatively short, so that the parasitic inductance of the wiring material 6 can be suppressed.

In this way, the electronic component mounted product 1 can suppress the length of the wiring material 6 to be relatively short and suppress the parasitic inductance of the wiring material 6, so that, for example, the cutoff frequency of the transmission signal is lowered. This can be suppressed, and it is possible to cope with the increase in the frequency of the transmission signal.

The electronic component mounting product 1 is provided so that the retracting portion 32Bb of the inner layer pattern 32B retracts from the inner wall surface 33b of the mounting recess 33 along the first width direction Y in a range larger than 0 and 150 [μm] or less. ing. With this configuration, the electronic component mounted product 1 has a range in which the deterioration of the transmission characteristics of the transmission line due to the retracted portion 32Bb provided in the inner layer pattern 32B for making the transmission line pattern 32A function as the transmission line is not affected. Can be suppressed. For example, the electronic component mounted product according to the comparative example in which the retractable portion 32Bb is not provided in the inner layer pattern 32B has transmission characteristics (transmission path pattern 32A and wiring material 6) including the transmission path pattern 32A and the wiring material 6 in the signal transmission of 28 GHz which is a part of the SHF band. The so-called S21 parameter) is about −0.73 dB. On the other hand, in the electronic component mounted product 1, for example, when the retracted amount L1 of the retracted portion 32Bb is about 150 [μm], the transmission path pattern 32A and the wiring are used in the signal transmission of 28 GHz, which is a part of the SHF band. The transmission characteristic including the material 6 is about −0.54 dB, and the deterioration of the transmission characteristic of the transmission line can be suppressed within a range that does not affect it.

As described above, the electronic component mounting product 1 can realize proper signal transmission by providing the above configuration. For example, the electronic component mounted product 1 is based on a general-purpose circuit board that does not require additional components and can be expected to reduce costs even when a part of a signal transmission circuit in the SHF band is configured. In addition, it is possible to effectively suppress the parasitic inductance that may cause the adverse effect on the transmission characteristics to become more apparent as the frequency increases. As a result, the electronic component mounted product 1 enables good signal transmission. Further, in the electronic component mounted product 1, for example, the wiring width and spacing of a general conductive pattern 32 (L / S (about 0.2 mm / 0.2 mm in the case of a large size, 0.15 mm / 0 in the example of the actual value). It can be carried out while maintaining (about 15 mm))), and thereby, for example, an increase in cost can be suppressed. Further, the electronic component mounted product 1 can reduce the use of a waveform shaping circuit such as an equalizer, and can reduce power consumption and the like.

Further, the electronic component mounting product 1 described above includes the conductive adhesive 4 and the pool portion 5. With this configuration, the electronic component mounting product 1 has a structure in which the electronic component 2 is adhered and fixed to the bottom surface 33a of the mounting recess 33 by the conductive adhesive 4, and a part of the conductive adhesive 4 spread toward the inner wall surface 33b is removed. It can be stored in the reservoir 5. At this time, since the pooled portion 5 is provided at a position facing the retracted portion 32Bb, the electronic component mounted product 1 is stored in the pooled portion 5 in a state where the conductive adhesive 4 is in contact with the inner wall surface 33b. Also, it is possible to prevent a short circuit from occurring between the conductive adhesive 4 and the inner layer pattern 32B. That is, with this configuration, the electronic component mounting product 1 adheres and fixes the electronic component 2 to the bottom surface 33a with the conductive adhesive 4 without expecting a margin for insulation between the conductive adhesive 4 and the inner wall surface 33b. can do. As a result, the electronic component mounting product 1 can be provided with the conductive adhesive 4 and the electronic component 2 as close as possible to the inner wall surface 33b. Also in this respect, in the electronic component mounting product 1, the connection position between the wiring material 6 and the transmission path pattern 32A and the connection position between the wiring material 6 and the electronic component 2 are relatively relative to the first width direction Y. Can be brought close. As a result, in the electronic component mounted product 1, the electronic component 2 is adhered and fixed to the bottom surface 33a with the conductive adhesive 4, and then the length of the wiring material 6 is suppressed to be relatively short, and the parasitic inductance of the wiring material 6 is suppressed. It is possible to realize proper signal transmission.

[Embodiment 2]
The electronic component mounted product according to the second embodiment is different from the first embodiment in that the bottom side pattern is included as the conductive pattern. In the following, the same components as those in the above-described embodiment are designated by a common reference numeral, and the common configurations, actions, and effects will be omitted as much as possible (the same applies hereinafter).

The electronic component mounted product 201 according to the present embodiment shown in FIGS. 3 and 4 is different from the above-mentioned electronic component mounted product 1 in that the circuit component 203 is provided instead of the circuit component 3. The other configurations of the electronic component mounted product 201 are substantially the same as those of the electronic component mounted product 1. The circuit component 203 is different from the circuit component 3 described above in that the circuit component 203 is configured to include the conductive pattern 232 instead of the conductive pattern 32. The other configurations of the circuit component 203 are substantially the same as those of the circuit component 3. The conductive pattern 232 is different from the conductive pattern 32 in that it further includes a bottom surface side pattern 232C in addition to the transmission line pattern 32A and the inner layer pattern 32B. The other configurations of the conductive pattern 232 are substantially the same as those of the conductive pattern 32.

The bottom surface side pattern 232C of the present embodiment has conductivity and is provided on the bottom surface 33a side of the electronic component 2 with respect to the thickness direction X. The bottom surface side pattern 232C is provided on the bottom surface 33a in a substantially rectangular island shape. The electronic component 2 is mounted on the bottom surface 33a of the mounting recess 33 via the conductive adhesive 4 and the bottom surface side pattern 232C. The bottom surface side pattern 232C functions as, for example, a ground surface of the electronic component 2 or a heat radiating surface that transfers and dissipates heat generated by the electronic component 2. The bottom surface side pattern 232C is provided at a position where a space L2 is secured between the bottom surface side pattern 232C and the retracting portion 32Bb in the first width direction Y. Here, the interval L2 corresponds to a value obtained by adding the evacuation amount L1 of the evacuation portion 32Bb and the width W6 of the accumulator portion 5 (L2 = L1 + W6). It is preferable that the interval L2 is as narrow as possible within the range of the printable interval while ensuring the necessary dimensional accuracy in terms of the printing accuracy of the conductive pattern 32. Here, in the bottom surface side pattern 232C, a distance L2 from the retracted portion 32Bb along the first width direction Y is secured to be 200 [μm] or more.

Since the electronic component mounted product 201 described above is provided with the above configuration, the parasitic inductance of the wiring material 6 can be appropriately suppressed, so that appropriate signal transmission can be realized.

In addition, the electronic component mounted product 201 described above is provided with the bottom surface side pattern 232C to improve the certainty of adhesive fixing of the electronic component 2 by the conductive adhesive 4, secure the flatness, and provide the electronic component. It is possible to improve the heat dissipation of 2 and the like. Then, the electronic component mounting product 201 can carry out this configuration while maintaining the wiring width and spacing (L / S) of the general conductive pattern 32, whereby, for example, cost increase can be suppressed. ..

[Embodiment 3]
The electronic component mounted product according to the third embodiment is different from the first embodiment in that the circuit component has a through hole portion.

The electronic component mounted product 301 according to the present embodiment shown in FIG. 5 is different from the electronic component mounted product 1 described above in that the circuit component 303 is provided instead of the circuit component 3. The other configurations of the electronic component mounted product 301 are substantially the same as those of the electronic component mounted product 1. The circuit component 303 is different from the circuit component 3 described above in that it has a through hole portion 334. The other configurations of the circuit component 303 are substantially the same as those of the circuit component 3.

The through hole portion 334 of the present embodiment is provided around the electronic component 2 mounted on the bottom surface 33a of the mounting recess 33, and is formed so as to penetrate the circuit component 303 along the thickness direction X. Here, the through-hole portions 334 are formed in pairs with the electronic component 2 interposed therebetween in the second width direction Z. Each through hole portion 334 has a substantially rectangular cross-sectional shape orthogonal to the thickness direction X. Each through hole portion 334 is formed at a position adjacent to each transmission path pattern 32A along the first width direction Y. Each through hole portion 334 is formed so that the inner wall surface on the transmission path pattern 32A side is continuous with the inner wall surface 33b of the mounting recess 33. Each through-hole portion 334 is filled with air having a relative permittivity smaller than that of the circuit component 303 and relatively less likely to generate a parasitic capacitance, thereby forming an air layer.

By providing the above configuration, the electronic component mounted product 301 described above can appropriately suppress the parasitic inductance of the wiring material 6, so that appropriate signal transmission can be realized.

Further, in the electronic component mounted product 301 described above, the through hole portion 334 is provided around the electronic component 2 of the circuit component 303, so that an air layer is interposed between the circuit component 303 and the electronic component 2. Therefore, the so-called parasitic capacitance can be reduced. As a result, the electronic component mounted product 301 can realize more appropriate signal transmission. For example, the electronic component mounted product 301 has a transmission characteristic of about −0.51 dB including the transmission path pattern 32A and the wiring material 6 in the signal transmission of 28 GHz, which is a part of the SHF band.

The through hole portion 334 is not limited to the shape described above. The electronic component mounted product 301A according to the modified example shown in FIG. 6 includes a through hole portion 334A instead of the through hole portion 334. The through-hole portion 334A is provided between the inner wall surface 33b of the mounting recess 33 and the electronic component 2 in addition to the positions of the pair of through-hole portions 334 described above. Therefore, the through hole portion 334A is formed in a row so as to surround three sides of the electronic component 2, including a portion located between the inner wall surface 33b and the electronic component 2. Even in this case, since the electronic component mounted product 301A is provided with the through hole portion 334A around the electronic component 2 of the circuit component 303, the parasitic capacitance can be reduced and more appropriate signal transmission can be realized. Can be done.

The electronic component mounted product according to the above-described embodiment of the present invention is not limited to the above-mentioned embodiment, and various modifications can be made within the scope described in the claims. The electronic component mounted product according to the present embodiment may be configured by appropriately combining the components of each of the embodiments and modifications described above.

In the above description, the electronic component mounted products 1, 201, 301, and 301A have been described as constituting a part of the signal transmission circuit in the SHF band, but the present invention is not limited to this. Further, the electronic component 2 has been described as being a semiconductor element such as a light emitting element or an IC chip, but the present invention is not limited to this. Further, the electronic component mounting products 1, 201, 301 and 301A are not limited to the component mounting on the surface layer of the circuit components 3, 203 and 303, and if processing is possible, for example, the mounting recess 33 in the inner layer of the component built-in board. , And the electronic component 2 may be provided.

In the above description, the circuit components 3, 203, and 303 are described as being printed circuit boards, but the present invention is not limited to this. The circuit component may be a molded resin circuit component (MID: Molded Interconnect Device) or the like as long as it is configured to include an insulator, a transmission path pattern, an inner layer pattern, or the like and has a mounting recess or the like.

In the above description, the electronic component mounting products 1, 201, 301, and 301A have been described as having the conductive adhesive 4 and the pool portion 5, but the present invention is not limited to this. The electronic component mounting products 1, 201, 301, and 301A may not be provided with the conductive adhesive 4 and the pool portion 5 as long as the electronic component 2 can be fixed to the bottom surface 33a by another fixing method.

1, 201, 301, 301A Electronic component mounting product 2 Electronic component 3, 203, 303 Circuit component 4 Conductive adhesive 5 Reservoir 6 Wiring material 31 Insulator 32, 232 Conductive pattern 32A Transmission path pattern 32B Inner layer pattern 32Ba Exposed section 32Bb Retracting part 33 Mounting recess 33a Bottom surface 33b Inner wall surface 232C Bottom side pattern 334 334A Through hole part X Thickness direction (first direction)
Y 1st width direction (2nd direction)
Z 2nd width direction

Claims (4)

An insulator having insulation, a transmission line pattern having conductivity and having a pattern minimum width of 200 [μm], and being built in the insulator having conductivity and interposing the insulator. A circuit component including an inner layer pattern that faces the transmission line pattern along the first direction and constitutes the transmission line pattern as a transmission line having a design impedance value of 50 [Ω].
Electronic components mounted on the circuit components and
A wiring material for electrically connecting the transmission line pattern and the electronic component is provided.
The circuit component has a mounting recess provided in a concave shape adjacent to the transmission path pattern and on the bottom surface on which the electronic component is mounted.
The inner layer pattern has an exposed portion exposed on the inner wall surface of the mounting recess on the transmission path pattern side, and the exposed portion at a position facing the electronic component along a second direction intersecting the first direction. It is characterized by having a retracting portion provided adjacently and retracted from the inner wall surface of the mounting recess in a range of more than 0 and 150 [μm] or less along the second direction.
Electronic component mounting product. A conductive adhesive that has conductivity and is interposed between the bottom surface of the mounting recess and the electronic component to adhere the bottom surface and the electronic component.
The conductive portion is provided at a position facing the retracted portion along the second direction as a gap portion formed between the inner wall surface of the mounting recess and the electronic component in the second direction. It is provided with a pool that can store a part of the adhesive.
The electronic component mounted product according to claim 1. The circuit component has conductivity and is provided on the bottom surface side of the electronic component with respect to the first direction, and a distance of 200 [μm] or more from the retracted portion along the second direction is secured. Including bottom side pattern,
The electronic component mounted product according to claim 1 or 2. The circuit component has a through hole portion provided around the electronic component mounted on the bottom surface of the mounting recess and penetrating the circuit component along the first direction.
The electronic component mounting product according to any one of claims 1 to 3.

Images