CN101668382A - Flexible printed circuit board and terminal - Google Patents
Flexible printed circuit board and terminal Download PDFInfo
- Publication number
- CN101668382A CN101668382A CN200910174589A CN200910174589A CN101668382A CN 101668382 A CN101668382 A CN 101668382A CN 200910174589 A CN200910174589 A CN 200910174589A CN 200910174589 A CN200910174589 A CN 200910174589A CN 101668382 A CN101668382 A CN 101668382A
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- printed circuit
- flexible printed
- hole
- circuit board
- reflow soldering
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Abstract
The invention discloses a flexible printed circuit board and a terminal and relates to the technical field of the flexible printed circuit boards; the problem that the welding of a reflow soldering device of a through hole on the flexible printed circuit board has low reliability in the prior art is solved. The flexible printed circuit board comprises a flexible circuit board layer, one side of the flexible circuit board layer is provided with a stiffening plate, and a through hole is arranged on the flexible printed circuit board for welding a welding end on the reflow soldering device of thethrough hole, and the through hole penetrates through the flexible printed circuit board and the stiffening plate. The invention is mainly applied to the flexible printed circuit board.
Description
Technical field
The present invention relates to the flexible printed circuit board technical field, relate in particular to a kind of flexible printed circuit board and terminal.
Background technology
That flexible printed circuit board has is bent, advantage such as little takes up room, be widely used in the consumption electronic product of bending deflection and ultra-thin requirement, such as the rotating shaft of folding cell phone, notebook computer, slide phone, the connection of sliding area, the ultra-thin keyboard plate, Liquid Crystal Module, number is shot with video-corder camera etc.
Adopt flexible printed circuit board to realize the electronic product of specific function, the electronic device that needs usually to possess corresponding function is assembled on the flexible printed circuit board.At present, there have been some devices to adopt surface mounting technologies to realize assembling on flexible printed circuit board, for example: most Chip device, surface array device and board to board connector class device.
, it must be inserted into lead to the hole site corresponding on the circuit board and just can finish assembling because but through hole Reflow Soldering device is a kind of perforation device of reflow soldering.And such device may be subjected to the effect of external force, need plug and action such as push-and-pull as: interface device, so the weld strength of its through hole weldering end is had relatively high expectations.And the thinner thickness of flexible printed circuit board own, has certain bending flexibility again, Copper Foil on the flexible printed circuit board and base material adhesion are also lower, therefore, after through hole Reflow Soldering device directly is assembled on the flexible printed circuit board, when being subjected to minimum external force, just can cause flexible printed circuit board to be torn, thereby cause the assembling reliability of through hole Reflow Soldering device on flexible printed circuit board to reduce.
Summary of the invention
Embodiments of the invention provide a kind of flexible printed circuit board and terminal, have improved the reliability that through hole Reflow Soldering device is assembled on flexible printed circuit board.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of flexible printed circuit board, comprise the flexible circuit flaggy, described flexible circuit flaggy one side is provided with stiffening plate, and described flexible printed circuit board is provided with the through hole for weldering end welding on the through hole Reflow Soldering device, and this through hole passes described flexible circuit flaggy and stiffening plate.
A kind of terminal, comprise flexible printed circuit board, described flexible circuit flaggy one side is provided with stiffening plate, and described flexible printed circuit board is provided with the through hole that welds for the weldering end on the through hole Reflow Soldering device, and this through hole passes described flexible circuit flaggy and stiffening plate.
Flexible printed circuit board provided by the invention comprises flexible circuit flaggy and stiffening plate, and described stiffening plate is fixed on a side of flexible circuit flaggy, can guarantee the intensity and the evenness of flexible circuit flaggy; And the weldering end parts of corresponding through hole Reflow Soldering device is provided with through hole on the described flexible printed circuit board, and this through hole passes flexible circuit flaggy and stiffening plate.Because this through hole is provided with stiffening plate, make stiffening plate can participate in welding, thereby can increase the weld strength of the through hole Reflow Soldering device weldering end that is welded to described through hole, improved the reliability that through hole Reflow Soldering device is assembled on flexible printed circuit board.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the welding schematic diagram of flexible printed circuit board and through hole Reflow Soldering device among the embodiment 1;
Fig. 2 is the welding schematic diagram of flexible printed circuit board and through hole Reflow Soldering device among the embodiment 2.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Embodiment 1:
Present embodiment provides a kind of flexible printed circuit board, as shown in Figure 1: comprise flexible circuit flaggy 1, described flexible circuit flaggy one side is provided with stiffening plate 2, and the position of welding end 5 on the described flexible printed circuit board on the corresponding through hole Reflow Soldering device 4 is provided with through hole 3, and this through hole 3 passes described flexible circuit flaggy 1 and stiffening plate 2.
Because a side of described flexible circuit flaggy 1 is provided with stiffening plate 2, thereby can guarantee the intensity and the evenness of flexible circuit flaggy 1.The weldering end 5 of corresponding through hole Reflow Soldering device 4 is provided with through hole 3 on the described flexible printed circuit board, and this through hole 3 passes flexible circuit flaggy 1 and stiffening plate 2, when through hole Reflow Soldering device 4 is welded to described through hole 3, because these through hole 3 positions are provided with stiffening plate, so just increased the weld strength of the through hole Reflow Soldering device 4 weldering ends 5 that are welded to described through hole 3, thereby improved the reliability that through hole reflow soldering device is assembled on flexible printed circuit board.
A kind of Rigid Flex is provided in the prior art, partly realizes and being electrically connected of flexible printed circuit board by through hole Reflow Soldering set of devices being contained in its hardboard.But this Rigid Flex cost is higher, and through hole Reflow Soldering device directly can not be assembled on the flexible printed circuit board.And adopt described flexible printed circuit board, through hole Reflow Soldering device directly can be assembled in flexible printed circuit board, and then also reduce cost.
Among Fig. 1 of present embodiment, the weldering end of described through hole Reflow Soldering device is positioned on the flexible printed circuit board, and this device some to be positioned at flexible printed circuit board outer.Yet in through hole Reflow Soldering device, when also having some devices to assemble on flexible printed circuit board, entire device all is positioned on the flexible printed circuit board, and its concrete condition can be referring to the implementation among Fig. 2.
Embodiment 2:
Present embodiment provides a kind of flexible printed circuit board, and as shown in Figure 2, this flexible printed circuit board comprises flexible circuit flaggy 6, and a side of described flexible circuit flaggy 6 is provided with stiffening plate 7 in the part corresponding to whole through hole Reflow Soldering device 9.Weldering end 10 corresponding to through hole Reflow Soldering device 9 on the described flexible printed circuit board is provided with through hole 8, and this through hole 8 passes flexible circuit flaggy 6 and stiffening plate 7.Described stiffening plate 7 must adopt the solderability material, as: foreign copper-nickel alloy, ormolu, the iron-nickel alloy of electroplating surfaces with tin or the stainless steel of plating nickel on surface tin of tinplate, electroplating surfaces with tin and the zinc-plated thickness 5um of brass, electroplating surfaces with tin and zinc-plated thickness 105um that electroplating surfaces with tin and zinc-plated thickness 5um are above.
When being assembled in through hole Reflow Soldering device 9 on the described flexible printed circuit board, the weldering end 10 of through hole Reflow Soldering device 9 is inserted on the through hole 8 of flexible printed circuit board correspondence from the opposite side of flexible circuit flaggy 6, adopt SMT (Surface Mounted Technology then, surface mounting technology) welds, perhaps finish the SMT welding and afterwards the weldering end 10 of through hole Reflow Soldering device 9 is carried out repair welding.Described welding to through hole Reflow Soldering device weldering end can be adopted Reflow Soldering, manual welding, also can be the hybrid technique of Reflow Soldering and local wave-soldering.Described through hole Reflow Soldering device 9 can be realized being electrically connected through welding with described flexible circuit flaggy 6, and its weldering end 10 can be welded on the described stiffening plate 7.Because what described stiffening plate 7 adopted is the solderability material, not only can increase the intensity and the evenness of flexible circuit flaggy 6, can also participate in simultaneously the welding of through hole Reflow Soldering device 9 weldering ends 10, the weldering end that has so just increased through hole Reflow Soldering device is welded to the intensity on the flexible printed circuit board, has improved the reliability that such device is assembled on flexible printed circuit board.
Among Fig. 2 of present embodiment, whole through hole Reflow Soldering device all is positioned on the flexible printed circuit board, but in fact also exist the weldering end of some through hole Reflow Soldering devices to be positioned on the flexible printed circuit board, and this device some to be positioned at flexible printed circuit board outer, its concrete condition can be referring to the implementation among Fig. 1.
Embodiment 3:
The embodiment of the invention provides a kind of terminal, described terminal comprises flexible printed circuit board, described flexible circuit flaggy one side is provided with stiffening plate, and described flexible printed circuit board is provided with the through hole that welds for the weldering end on the through hole Reflow Soldering device, and this through hole passes described flexible circuit flaggy and stiffening plate.Described terminal adopts described flexible printed circuit board to realize function corresponding, and described terminal can be mobile phone, MP3, notebook computer, LCD etc.
When being contained in through hole Reflow Soldering set of devices on the flexible printed circuit board, the weldering end of through hole Reflow Soldering device is welded on the through hole of described flexible printed circuit board.Described through hole Reflow Soldering device is electrically connected with the flexible circuit flaggy by described through hole, and described through hole Reflow Soldering device is welded to described stiffening plate by described through hole.The weldering end of described through hole Reflow Soldering device is positioned on the flexible printed circuit board, and described through hole Reflow Soldering device can some be positioned at outside the flexible printed circuit board, and its concrete condition can be referring to the implementation of flexible printed circuit board among Fig. 1.
In the time of on the flexible printed circuit board that through hole Reflow Soldering set of devices is contained in described terminal, also can be that entire device all is positioned on the flexible printed circuit board, its concrete condition can be referring to the implementation of flexible printed circuit board among Fig. 2.
The present invention is mainly used in flexible printed circuit board that needs assembling through hole Reflow Soldering device and the terminal that comprises described flexible printed circuit board, can realize that through hole Reflow Soldering device directly is welded on the flexible printed circuit board, improved the reliability that such device is assembled on flexible printed circuit board.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by described protection range with claim.
Claims (10)
1, a kind of flexible printed circuit board, it is characterized in that, comprise the flexible circuit flaggy, described flexible circuit flaggy one side is provided with stiffening plate, and described flexible printed circuit board is provided with the through hole that welds for the weldering end on the through hole Reflow Soldering device, and this through hole passes described flexible circuit flaggy and stiffening plate.
2, flexible printed circuit board according to claim 1 is characterized in that, the material of described stiffening plate is the solderability material.
3, flexible printed circuit board according to claim 2, it is characterized in that described solderability material comprises: ormolu, the iron-nickel alloy of electroplating surfaces with tin or the stainless steel of plating nickel on surface tin of tinplate, electroplating surfaces with tin and the zinc-plated thickness 5um of brass, electroplating surfaces with tin and zinc-plated thickness 105um that foreign copper-nickel alloy, electroplating surfaces with tin and zinc-plated thickness 5um are above.
According to claim 1,2 or 3 described flexible printed circuit boards, it is characterized in that 4, described flexible circuit flaggy one side is provided with stiffening plate corresponding to the part of whole through hole Reflow Soldering device.
According to claim 1,2 or 3 described flexible printed circuit boards, it is characterized in that 5, described flexible circuit flaggy one side is provided with stiffening plate corresponding to the part of through hole Reflow Soldering device weldering end.
According to claim 1,2 or 3 described flexible printed circuit boards, it is characterized in that 6, described through hole Reflow Soldering device is electrically connected with the flexible circuit flaggy by described through hole.
According to claim 1,2 or 3 described flexible printed circuit boards, it is characterized in that 7, described through hole Reflow Soldering device is welded to described stiffening plate by described through hole.
8, a kind of terminal, it is characterized in that, described terminal comprises flexible printed circuit board, described flexible circuit flaggy one side is provided with stiffening plate, and described flexible printed circuit board is provided with the through hole that welds for the weldering end on the through hole Reflow Soldering device, and this through hole passes described flexible circuit flaggy and stiffening plate.
9, terminal according to claim 8 is characterized in that, described through hole Reflow Soldering device is electrically connected with the flexible circuit flaggy by described through hole.
10, according to Claim 8 or 9 described terminals, it is characterized in that described through hole Reflow Soldering device is welded to described stiffening plate by described through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101745896A CN101668382B (en) | 2009-09-30 | 2009-09-30 | Flexible printed circuit board and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101745896A CN101668382B (en) | 2009-09-30 | 2009-09-30 | Flexible printed circuit board and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101668382A true CN101668382A (en) | 2010-03-10 |
| CN101668382B CN101668382B (en) | 2012-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101745896A Active CN101668382B (en) | 2009-09-30 | 2009-09-30 | Flexible printed circuit board and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101668382B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098869A (en) * | 2011-01-10 | 2011-06-15 | 惠州Tcl移动通信有限公司 | Flexible circuit board of one-layered connector, and slider phone thereof |
| CN102933024A (en) * | 2011-08-11 | 2013-02-13 | 大自达电线股份有限公司 | Printed wiring board and method of manufacturing same |
| CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
| CN105684559A (en) * | 2014-09-04 | 2016-06-15 | 东洋油墨Sc控股株式会社 | Printed wiring board, printed wiring board manufacturing method, and electronic apparatus |
| CN105744737A (en) * | 2014-12-12 | 2016-07-06 | 华为终端（东莞）有限公司 | Circuit board processing method and circuit board |
| CN106254773A (en) * | 2016-07-29 | 2016-12-21 | 广东欧珀移动通信有限公司 | Optical image stabilizing system, imaging device and electronic installation |
| CN106297685A (en) * | 2015-06-03 | 2017-01-04 | 南京瀚宇彩欣科技有限责任公司 | Has the display module of integrated circuit |
| CN110290636A (en) * | 2019-07-29 | 2019-09-27 | Oppo（重庆）智能科技有限公司 | FPC component and electronic equipment with it |
| CN110996551A (en) * | 2019-11-22 | 2020-04-10 | 珠海景旺柔性电路有限公司 | Processing method of thick reinforcing groove internal-pasting device |
-
2009
- 2009-09-30 CN CN2009101745896A patent/CN101668382B/en active Active
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098869A (en) * | 2011-01-10 | 2011-06-15 | 惠州Tcl移动通信有限公司 | Flexible circuit board of one-layered connector, and slider phone thereof |
| CN102933024A (en) * | 2011-08-11 | 2013-02-13 | 大自达电线股份有限公司 | Printed wiring board and method of manufacturing same |
| CN105684559B (en) * | 2014-09-04 | 2017-07-14 | 东洋油墨Sc控股株式会社 | Printing distributing board, the manufacture method of printing distributing board and electronic installation |
| CN105684559A (en) * | 2014-09-04 | 2016-06-15 | 东洋油墨Sc控股株式会社 | Printed wiring board, printed wiring board manufacturing method, and electronic apparatus |
| CN105744737A (en) * | 2014-12-12 | 2016-07-06 | 华为终端（东莞）有限公司 | Circuit board processing method and circuit board |
| CN106297685A (en) * | 2015-06-03 | 2017-01-04 | 南京瀚宇彩欣科技有限责任公司 | Has the display module of integrated circuit |
| CN106297685B (en) * | 2015-06-03 | 2018-12-25 | 南京瀚宇彩欣科技有限责任公司 | Has the display module of integrated circuit |
| CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
| CN105142332B (en) * | 2015-09-18 | 2018-03-13 | 刘炜 | A kind of FPC and its processing technology with conductive reinforced structure |
| CN106254773A (en) * | 2016-07-29 | 2016-12-21 | 广东欧珀移动通信有限公司 | Optical image stabilizing system, imaging device and electronic installation |
| US10582128B2 (en) | 2016-07-29 | 2020-03-03 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Optical image stabilization system, imaging device, and electronic device |
| US10721402B2 (en) | 2016-07-29 | 2020-07-21 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Optical image stabilization system, imaging device, and electronic device |
| CN110290636A (en) * | 2019-07-29 | 2019-09-27 | Oppo（重庆）智能科技有限公司 | FPC component and electronic equipment with it |
| CN110996551A (en) * | 2019-11-22 | 2020-04-10 | 珠海景旺柔性电路有限公司 | Processing method of thick reinforcing groove internal-pasting device |
| CN110996551B (en) * | 2019-11-22 | 2021-03-05 | 珠海景旺柔性电路有限公司 | Processing method of thick reinforcing groove internal-pasting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101668382B (en) | 2012-04-18 |
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Effective date of registration: 20171107 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI terminal (Dongguan) Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |