CN102364995A - Golden finger for flexible printed circuit board (FPC) - Google Patents
Golden finger for flexible printed circuit board (FPC) Download PDFInfo
- Publication number
- CN102364995A CN102364995A CN2011103525421A CN201110352542A CN102364995A CN 102364995 A CN102364995 A CN 102364995A CN 2011103525421 A CN2011103525421 A CN 2011103525421A CN 201110352542 A CN201110352542 A CN 201110352542A CN 102364995 A CN102364995 A CN 102364995A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- fpc
- welding
- weld face
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a golden finger for a flexible printed circuit board (FPC). The golden finger comprises a golden finger on a weld face and a golden finger on a non-weld face, the length of the golden finger on the weld face is not equal to that of the golden finger on the non-weld face; and preferably, the golden finger on the weld face is 0.3 to 1 mm longer than the golden finger on the non-weld face. Copper foils on both sides of the golden finger at an FPC welding end are dislocated, namely the copper foil on the weld face is 0.3 to 1 mm longer than that on the non-weld face, the machining difficulty in the welding process is reduced, the possibility that the golden finger is broken during welding is reduced, and the welding yield of products is improved; and the stress intensity of FPC welding positions is improved, the tension fracture, fracture, false solder and the like of the FPC welding positions in the production process are reduced, the quality of assembled products is improved, and the service life of the products is prolonged.
Description
Technical field
The present invention relates to a kind of structural design of FPC golden finger, more precisely, design a kind of internal stress that can strengthen the FPC solderability, reduce the weld of FPC, reduce FPC welding technology difficulty, improve the structure of the FPC golden finger of FPC welding yield.
Background technology
FPC is flexible print circuit board (Flexible Printed Circuit Board, be called for short FPC), and being to use PI (polyimides) film is base material, the wiring board sheet material of processing with the Copper Foil pressing.
With the rigid printed substrate of PCB relatively, the FPC wiring board possesses advantages such as free bend, folding, coiling.During completed knocked down products; FPC can at random arrange according to the layout of product inner space as lead; Thereby can in three dimensions, at random arrange components and parts, and can cancel interface unit between lead and the wiring board, therefore; FPC can make miniaturization of electronic products, precise treatment, and product reliability improves greatly.FPC has been widely used in fields such as mobile communication product, laptop computer, consumer electronics product, space flight, Military Electronic Equipment.
The key property of FPC can realize that exactly circuit connects; Existing connected mode mainly contains two kinds: a kind of connector that is to use connects; Though it is convenient to use connector to connect; It is big that but it installs required space, and the shortcomings such as instability, use cost height of pegging graft make it can only be used for the pcb board that some spaces are big, hardness is high.Common circuit connects the mode that also is to use welding; And will FPC be welded; Just must carry out PROCESS FOR TREATMENT to its golden finger; The FPC golden finger is that two-sided PI is removed an only zone of surplus Copper Foil, and its ultra-thin thickness extension performance of copper in addition is not again fine, just makes the fragility that the golden finger end of FPC becomes unusual; All can add pliability and the stretch-proof ability of PI layer so present PROCESS FOR TREATMENT technology is general, but the technology difficulty of the anti-shearing stress of FPC and welding all there is not very big raising with the welding yield in the blank space of golden finger with reinforcement golden finger end.FPC golden finger of the prior art also has following shortcoming: 1, the ability of the anti-stress in FPC welding position is very low, and problems such as be easy in production and transport process and production process, occur fractureing, golden finger breaks away from, the welding position comes off; 2, the technology difficulty of FPC welding process increases, and causes rosin joint to cause product failure easily; 3, a FPC welding limiting range of stress that can bear is very little, makes the quality and the life-span of assembling back product reduce.
Summary of the invention
The present invention provides the golden finger of a kind of FPC in order to solve the problem that exists in the prior art, effectively prevents the damage of FPC golden finger; Strengthened the solderability of FPC; Reduce the internal stress of the weld of FPC, also reduced the technology difficulty of FPC welding simultaneously, improved FPC welding yield.
Technical scheme of the present invention is: the golden finger of FPC comprises the golden finger of solder side and the golden finger of non-solder side, being uneven in length of the golden finger of said solder side and the golden finger of non-solder side.
Preferably: the golden finger of said solder side is than the long 0.3mm-1mm of the golden finger of non-solder side.
The present invention is with the processing that misplaces of the two sides Copper Foil of FPC welding ends golden finger; Be the length long 0.3mm～1.0mm of the Copper Foil of solder side than the Copper Foil of non-solder side; Reduced to weld the difficulty of processing of this procedure; The possibility that golden finger fractures when having reduced welding has improved product welding yield; Strengthen the anti-stress intensity of FPC welding position, reduced that the FPC welding position produces in process of production break, fracture, rosin joint etc., improved the quality and the life of product of assembled product.
Description of drawings
Fig. 1 shows the positive and negative structural representation of FPC plate of the present invention.
Fig. 2 shows the profile of FPC plate of the present invention.
Embodiment
Further specify below in conjunction with the accompanying drawing specific embodiments of the invention.
Like Fig. 1, shown in Figure 2; The FPC wiring board; Comprise solder side 1 and non-solder side 2, also can become the positive and negative of FPC, its exposed Copper Foil is called the golden finger 3 of solder side and the golden finger 4 of non-solder side; The Copper Foil on FPC golden finger two sides adopts dislocation to handle, and the length of the golden finger 3 of solder side is than the distance of the length 0.3～1mm of the golden finger 4 of non-solder side.Because the golden finger length on FPC two sides is different, make relatively weaker golden finger form two cascaded surfaces with the position that is connected of wiring board, reduced the concentrated stress that produces in the FPC bending process, the anti-stress intensity of enhancing FPC welding ends.The difficulty of processing that can reduce to weld this procedure is handled in such dislocation, and the possibility that golden finger fractures when having reduced welding has improved product welding yield.Simultaneously also strengthened the anti-stress intensity in FPC welding position, reduce that the FPC welding position produces in process of production break, fracture, bad phenomenon such as rosin joint, improved the quality and the life of product of assembled product.
The above is merely preferred implementation of the present invention, is not to be used for limiting practical range of the present invention, and the equivalence of in protection scope of the present invention, being done in every case changes and modifies, and all should think to have fallen in protection scope of the present invention.
Claims (2)
1.FPC golden finger, comprise the golden finger of solder side and the golden finger of non-solder side, it is characterized in that: being uneven in length of the golden finger of said solder side and the golden finger of non-solder side.
2. the golden finger of FPC according to claim 1, it is characterized in that: the golden finger of said solder side is than the long 0.3mm-1mm of the golden finger of non-solder side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103525421A CN102364995A (en) | 2011-11-09 | 2011-11-09 | Golden finger for flexible printed circuit board (FPC) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103525421A CN102364995A (en) | 2011-11-09 | 2011-11-09 | Golden finger for flexible printed circuit board (FPC) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102364995A true CN102364995A (en) | 2012-02-29 |
Family
ID=45691539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103525421A Pending CN102364995A (en) | 2011-11-09 | 2011-11-09 | Golden finger for flexible printed circuit board (FPC) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102364995A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104662655A (en) * | 2012-09-21 | 2015-05-27 | 日本特殊陶业株式会社 | Wiring board and method for manufacturing same |
| CN104717829A (en) * | 2015-02-02 | 2015-06-17 | 昆山意力电路世界有限公司 | High-density bubble-free golden finger pressing structural slab and processing method thereof |
| CN107422503A (en) * | 2017-08-10 | 2017-12-01 | 深圳市华星光电技术有限公司 | Display panel and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098873A (en) * | 2011-02-16 | 2011-06-15 | 珠海元盛电子科技股份有限公司 | Pad structure for preventing pad from fracturing |
-
2011
- 2011-11-09 CN CN2011103525421A patent/CN102364995A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098873A (en) * | 2011-02-16 | 2011-06-15 | 珠海元盛电子科技股份有限公司 | Pad structure for preventing pad from fracturing |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104662655A (en) * | 2012-09-21 | 2015-05-27 | 日本特殊陶业株式会社 | Wiring board and method for manufacturing same |
| CN104662655B (en) * | 2012-09-21 | 2017-07-11 | 日本特殊陶业株式会社 | Circuit board and its manufacture method |
| CN104717829A (en) * | 2015-02-02 | 2015-06-17 | 昆山意力电路世界有限公司 | High-density bubble-free golden finger pressing structural slab and processing method thereof |
| CN107422503A (en) * | 2017-08-10 | 2017-12-01 | 深圳市华星光电技术有限公司 | Display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204425813U (en) | Circuit substrate | |
| CN101668382A (en) | Flexible printed circuit board and terminal | |
| JP2006186136A (en) | Double-sided part mounting circuit board and its manufacturing method | |
| CN102364995A (en) | Golden finger for flexible printed circuit board (FPC) | |
| CN204810675U (en) | Liquid crystal display is with preventing FPC structure of splitting | |
| US9414490B2 (en) | Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability | |
| CN105516412A (en) | Flexible printed circuit equipped with double rows of golden fingers and mobile terminal | |
| CN202353934U (en) | Golden finger of FPC (Flexible Printed Circuit Board) | |
| CN205902199U (en) | FPC gold finger structure | |
| CN103188869A (en) | Flexible printed circuit board | |
| CN204836794U (en) | Golden finger circuit board | |
| US7393217B2 (en) | Surface mount connector and circuit board assembly with same | |
| CN103079342B (en) | A kind of flexible PCB and circuit connect equipment | |
| CN103326148A (en) | Plug-in type component, circuit board and preparation method for circuit board | |
| CN219068461U (en) | Flexible circuit board for reducing tearing force | |
| CN220674010U (en) | Circuit board, circuit board assembly and electronic equipment | |
| CN102905461A (en) | Flexible printed circuit board with independent plug and production technology of flexible printed circuit board | |
| CN206542628U (en) | A kind of anti-FPC fractureed | |
| CN202772291U (en) | Electrical connector structure | |
| CN216960318U (en) | NFC structure with reinforced anti-cracking bonding pad | |
| CN207603996U (en) | A kind of golden finger structure on FPC | |
| CN102025057A (en) | Electrical connector | |
| CN201789683U (en) | FPC for nonparallel assembly | |
| US11324125B2 (en) | Diversified assembly printed circuit board and method for making the same | |
| US11032908B2 (en) | Circuit board, assembly and method of assembling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120229 |