CN103326148A - Plug-in type component, circuit board and preparation method for circuit board - Google Patents
Plug-in type component, circuit board and preparation method for circuit board Download PDFInfo
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- CN103326148A CN103326148A CN2013101961980A CN201310196198A CN103326148A CN 103326148 A CN103326148 A CN 103326148A CN 2013101961980 A CN2013101961980 A CN 2013101961980A CN 201310196198 A CN201310196198 A CN 201310196198A CN 103326148 A CN103326148 A CN 103326148A
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Abstract
The invention provides a plug-in type component, a circuit board and a preparation method for the circuit board. The plug-in type component comprises a shell and pins which are arranged on the shell and electrically connected with a PCB. The pins are surface mount pins. On the basis, the invention further provides a circuit board prepared through the method that the plug-in type component is arranged on the circuit board through the surface mount pins in a surface mount mode. According to the preparation method for the circuit board, due to the fact that all components on the circuit board are surface mount components, the assembly technology of the circuit board is greatly simplified, processing and manufacturing cost is lower, and the production cycle of a product is shortened.
Description
Technical field
The present invention relates to the board design field, relate in particular to a kind of plug-in type components and parts, circuit board and circuit board preparation method.
Background technology
At present, the combined design of plug-in unit and SMD components and parts is generally adopted in television circuit board design.Surface-mounted device such as IC, MLCC, Chip-R, paster crystal oscillator and the connector major part that some are commonly used have reached the volume production of scale in the whole market; the many dog-eat-dogs of producer; price has all trended towards reduced levels; but some seldom materials, volume greatly or the opposite sex components and parts; because the restriction on material or technology or the BOM cost; continued to use the comparatively cheap plug-in unit material of some classical prices on the circuit board, these plug-in unit materials and products thereof specification is specially always:
Power connector: use 10~14 pin, and pin pin spacing is 2.5 plug-in unit wafer (wafer);
Earphone terminal: the plug-in unit material that adopts aperture 3.6mm, height 5.5mm;
VGA terminal: height 10.65mm, three rows or two row pin pin plug-in unit material;
USB2.0 plug-in unit material: height 8.65 mm;
USB3.0 plug-in unit material: height 8.65 mm;
RJ45 plug-in unit material: height 11.5 mm;
The Tuner terminal: in the industry mainly with the shielding shell of four jiaos of band pins, perhaps not with the RF plug-in unit terminal of radome;
Coaxial RCA terminal: height 11.5 mm, with the plug-in unit terminal of 3 signal pins.
Because the use of above plug-in unit material, although decrease at the BOM design cost, must be by Reflow Soldering and wave-soldering two procedures flow process on the circuit board assembling procedure afterwards that causes designing, owing to having used two procedures on the assembling procedure of circuit board, greatly having increased the cost of manpower and production cycle.Take double sided board as example, the assembling flow path of PCB roughly available following flow process represents:
Incoming Quality Control → A face silk-screen → A face mounts → and Reflow Soldering → cleaning → turnover panel → B face silk-screen → B face mounts → Reflow Soldering → cleaning → detection OK → pcb board is contained on the welding machine clamp → and artificial placing components → coatings scaling powder → preheating → immersed solder → cooling → cutting → brush cutting considers → sprays scaling powder → preheating → wave-soldering → cooling → cleaning pcb board disengaging welding machine → check → repair welding → cleaning → check OK → put into container to be transported into the complete machine assembly line to be worth doing.
More than for adopting old-fashioned plug-in unit material paster material to mix Reflow Soldering and the wave-soldering flow process of using Reflow Soldering and the required process of wave-soldering Hybrid assembling, wherein, each procedure flow process of Reflow Soldering is: and Incoming Quality Control → A face silk-screen → A face mounts → and Reflow Soldering → cleaning → turnover panel → B face silk-screen → B face mounts → Reflow Soldering → cleaning → detection OK; Each process flow of wave-soldering is: pcb board is contained on the welding machine clamp → artificial placing components → coatings scaling powder → preheating → immersed solder → cooling → cutting → brush cutting considers → sprays scaling powder → preheating → wave-soldering → cooling → cleaning pcb board disengaging welding machine → check → repair welding → cleaning → check OK to be worth doing.
Summary of the invention
Main purpose of the present invention is to provide a kind of plug-in type components and parts, be intended to the plug-in type components and parts on the pcb board are adjusted, and the plug-in type components and parts after adjusting all can be used for being mounted on the circuit board, make the simplification of the manufacturing process of circuit board, reach the purpose that reduces human cost.
Another object of the present invention is to provide the foregoing circuit plate.
A further object of the present invention is to provide the preparation method of foregoing circuit plate.
To achieve these goals, the invention provides a kind of plug-in type components and parts, comprise housing and be located on this housing and the pin that is electrically connected with pcb board, described pin is SMD pin.
Preferably, described housing adopts exotic material to make.
Preferably, described SMD pin is parallel with pcb board.
Preferably, described plug-in type components and parts also comprise to be located on the described housing and the pin that is not electrically connected with pcb board, wherein, the described pin that is not electrically connected with pcb board that is positioned at housing one side that is provided with described SMD pin is lower than SMD pin apart from the maximum vertical height of housing apart from the maximum vertical height of housing.
Preferably, described housing is provided with reference column, is used for and described plug-in type components and parts is fixed on pcb board after pcb board is connected.
Preferably, described pin comprises plug-in unit pin, signal pins and fixing feet.
The present invention further provides a kind of circuit board, comprised the plug-in type components and parts, these plug-in type components and parts comprise housing and are located on this housing and the pin that is electrically connected with pcb board, and described pin is SMD pin.
The present invention further provides a kind of preparation method of circuit board, may further comprise the steps:
Pcb board is tested and silk-screen;
SMD pin on the housing of plug-in type components and parts is mounted on the pcb board, fix by Reflow Soldering again, obtain circuit board, wherein, above-mentioned plug-in type components and parts comprise housing and are located on this housing and the pin that is electrically connected with pcb board, and described pin is SMD pin.
The present invention proposes a kind of circuit board and preparation method thereof and television set.Wherein, the components and parts on the circuit board of the present invention all are mounted on the pcb board, and take two-sided TV set circuit plate as example, its manufacturing process flow specifically comprises following concrete steps:
Incoming Quality Control → A face silk-screen → A face mounts → and Reflow Soldering → cleaning → turnover panel → B face silk-screen → B face mounts → Reflow Soldering → cleaning → detection OK → put into container to be transported into the complete machine assembly line.
Can find out from top step, compare with the manufacturing process of existing TV set circuit plate, in the circuit board of the present invention (being pcb board), the operation of former wave-soldering all is simplified, and pcb board of the present invention only need can flow to complete machine assembly line body through the process flow of Reflow Soldering.Because after wave-soldering is simplified, required manpower, machine (crest welder, anchor clamps), the material (scaling powder of former TV set circuit plate manufacturing process medium wave peak weldering flow process, cleaning agent) can be simplified, in addition, cycle production time also approximately can shorten 1/3rd.The preparation method of circuit board of the present invention, technological process is simple, has saved manufacturing cost and production cycle.Television set of the present invention after adopting above-mentioned circuit board, is manufactured for the research and development of whole TV, and production cost reduces, and the production cycle shortens, and the product market competition advantage is remarkable.
Description of drawings
Fig. 1 is the patch design structural representation of power connector of the present invention;
Fig. 2 is the patch design structural representation of earphone terminal of the present invention;
Fig. 3 is the patch design structural representation of VGA terminal of the present invention;
Fig. 4 is the patch design structural representation of USB2.0 terminal of the present invention;
Fig. 5 is the patch design structural representation of USB3.0 terminal of the present invention;
Fig. 6 is the patch design structural representation of coaxial RCA terminal of the present invention.
The realization of the object of the invention, functional characteristics and advantage are described further with reference to accompanying drawing in connection with embodiment.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Solution for embodiment of the invention mainly is: plug-in unit material original on the circuit board is all carried out being mounted on the circuit board after certain repacking, realize that the whole of components and parts mount on the circuit board, simplify circuit board in assembling required wave-soldering technological process during plug-in components with this, greatly simplify human and material resources consumption, shortened life cycle of the product.
Please in the lump referring to figs. 1 through shown in Figure 6, wherein, Fig. 1 is the patch design structural representation of power connector of the present invention; Fig. 2 is the patch design structural representation of earphone terminal of the present invention; Fig. 3 is the patch design structural representation of VGA terminal of the present invention; Fig. 4 is the patch design structural representation of USB2.0 terminal of the present invention; Fig. 5 is the patch design structural representation of USB3.0 terminal of the present invention; Fig. 6 is the patch design structural representation of coaxial RCA terminal of the present invention.
One embodiment of the invention proposes a kind of plug-in type components and parts, comprises housing and is located on this housing and the pin that is electrically connected with pcb board, and described pin is SMD pin.
In concrete application process of the present invention, can directly the part pin of existing various plug-in type components and parts be made amendment or adjust the functional SMD pin that rear formation can be mounted on pcb board.Because original all plug-in unit materials are through doing corresponding structural adjustment to its plug-in unit pin, signal pins or fixing feet, also be about to such plug-in unit material in plug-in unit pin, signal pins or the fixing feet etc. of pcb board splicing position do break off with the fingers and thumb accordingly flat, block, change straight etc. the processing after, can realize that plug-in unit pin, signal pins or the fixing feet of such plug-in unit material after processed by it is mounted on the pcb board.
Take the preparation technology of double-layer PCB board as example, after components and parts all on the pcb board are SMD components and parts, specifically comprise following concrete steps at the assembling flow path of its pcb board:
Incoming Quality Control → A face silk-screen → A face mounts → and Reflow Soldering → cleaning → turnover panel → B face silk-screen → B face mounts → Reflow Soldering → cleaning → detection OK → put into container to be transported into the complete machine assembly line.
Can find out from top step, compare with the manufacturing process of existing circuit board, in the circuit board of the present invention (being pcb board), the operation of former wave-soldering all is simplified, and pcb board of the present invention only need can flow to complete machine assembly line body through the process flow of Reflow Soldering.
The present invention abandons the lower material of general price, seek or the slightly high paster material of exploitation price, although increased part BOM cost, but realize automatically mounting comprehensively, reduce the assembling flow path of one circuit board, because after wave-soldering simplifies, required manpower, machine (crest welder, anchor clamps), the material (scaling powder of primary circuit plate manufacturing process medium wave peak weldering flow process, cleaning agent) can be simplified, in addition, cycle production time also approximately can shorten 1/3rd.
Should be noted that in the present embodiment, also be provided with the pin that is not connected with pcb board on the above-mentioned housing, this pin can be set to SMD pin or with it brachymemma or remove.
In further implementation process, the problem such as distortion thawing after in being applied to the techniques such as reflow soldering process in later stage, be subjected to high temperature after some plug-in type components and parts changes SMD components and parts into, in embodiments of the present invention, the housing of described plug-in type components and parts adopts exotic material to make.
In actual application of the present invention, for example power connector 1, and therefore the shell non-refractory of existing power connector 1, need to change the shell of power connector 1 into high-temperature resistance plastice.
In further implementation process, for SMD pin on the plug-in type components and parts of being more convenient for is mounted on the pcb board, in the embodiment of the invention, described SMD pin is parallel with pcb board.
In further implementation process, more convenient in mounting process for the ease of the plug-in type components and parts, in embodiments of the present invention, described plug-in type components and parts also comprise to be located on the described housing and the pin that is not electrically connected with pcb board, wherein, the described pin that is not electrically connected with pcb board that is positioned at housing one side that is provided with described SMD pin will be lower than SMD pin apart from the maximum vertical height of housing apart from the maximum vertical height of housing.
In the embodiment of the invention, other pins that are positioned at SMD pin homonymy are lower apart from the maximum vertical height of housing, therefore, can not affect SMD pin and mount operation on pcb board, use more convenient.Take the preparation technology of television set PCB as example, plug-in type components and parts on the TV set circuit plate comprise: power connector 1, earphone terminal 2, VGA terminal 3, USB2.0 terminal 4, USB3.0 terminal 5, Tuner terminal, RJ45, coaxial RCA terminal 6, wherein, each plug-in type components and parts processing method is specially:
(1) the plug-in unit pin 11 of power connector 1 is broken off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel.
(2) three plug-in unit pin 21 of earphone terminal 2 are shortened, and all the other plug-in unit pin are broken off with the fingers and thumb flat form paster pin 22 and be mounted on the pcb board after pcb board is parallel.
(3) three socket part pin 31 of VGA terminal 3 are changed break off with the fingers and thumb flat after in a row and be mounted on the pcb board after pcb board is parallel, and the VGA terminal is provided with plastics reference column 32, plastics reference column 32 can be connected with pcb board and the VGA terminal is fixed on the pcb board.
(4) the front end signal pin 41 of USB2.0 terminal 4 is dug break off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel, and described USB2.0 terminal 4 both sides fixing feet 42 are shortened, change straight.
(5) signal pins 51 of USB3.0 terminal 5 is shortened, and the fixing feet 52 of the both sides of described USB3.0 terminal 5 is broken off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel.
(6) signal pins of Tuner terminal is shortened, and the plug-in unit pin of described Tuner terminal is broken off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel.
(7) RJ45 is used instead level paster material.
(8) the plug-in unit pin 61 of coaxial RCA terminal 6 is dug break off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel, and described coaxial RCA terminal 6 is provided with reference column 62, described reference column 62 is connected on the pcb board and with coaxial RCA terminal and is fixed on the pcb board.
In further implementation process, for guarantee the plug-in type components and parts change into behind the SMD components and parts and be mounted on the pcb board after components and parts can occur unsteady problem is installed, in embodiments of the present invention, described housing is provided with reference column, is used for and described plug-in type components and parts is fixed on pcb board after pcb board is connected.
In actual application of the present invention, reference column can be by early stage the processing of plug-in type components and parts directly being welded at its shell afterwards, carrying but some reference column then is the plug-in type components and parts.In the embodiment of the invention, the VGA terminal 3 in the plug-in components for example, with three socket part pin 31 of VGA terminal 3 change break off with the fingers and thumb flat after in a row and be mounted on the pcb board after pcb board is parallel, and the VGA terminal is provided with plastics reference column 32, and plastics reference column 32 can be connected with pcb board and the VGA terminal is fixed on the pcb board.
For example, coaxial RCA terminal 6 in the plug-in type components and parts, the plug-in unit pin 61 of described coaxial RCA terminal 6 dig break off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel, and described coaxial RCA terminal 6 is provided with reference column 62, after described reference column 62 is connected on the pcb board coaxial RCA terminal is fixed on the pcb board.
The present invention further provides a kind of circuit board, comprises the plug-in type components and parts, and these plug-in type components and parts comprise housing and be located on this housing and the pin that is electrically connected with pcb board, and described pin is SMD pin.
The present invention further provides a kind of preparation method of circuit board, may further comprise the steps:
Pcb board is tested and silk-screen;
SMD pin on the housing of plug-in type components and parts is mounted on the pcb board, fix by Reflow Soldering again, obtain circuit board, wherein, above-mentioned plug-in type components and parts comprise housing and are located on this housing and the pin that is electrically connected with pcb board, and described pin is SMD pin.
In actual application of the present invention, take the TV set circuit plate as example, wherein, plug-in type components and parts on the TV set circuit plate comprise: power connector 1, earphone terminal 2, VGA terminal 3, USB2.0 terminal 4, USB3.0 terminal 5, Tuner terminal, RJ45, coaxial RCA terminal 6, wherein, each plug-in type components and parts processing method is specially:
(1) power connector 1 used preparation material is high-temperature resistance plastice for using instead, break off with the fingers and thumb the plug-in unit pin 11 of power connector 1 flat and be mounted on the pcb board after pcb board is parallel.
(2) three plug-in unit pin 21 of earphone terminal 2 are shortened, and all the other plug-in unit pin are broken off with the fingers and thumb flat form paster pin 22 and be mounted on the pcb board after pcb board is parallel.
(3) three socket part pin 31 of VGA terminal 3 are changed break off with the fingers and thumb flat after in a row and be mounted on the pcb board after pcb board is parallel, and the VGA terminal is provided with plastics reference column 32, plastics reference column 32 can be connected with pcb board and the VGA terminal is fixed on the pcb board.
(4) the front end signal pin 41 of USB2.0 terminal 4 is dug break off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel, and described USB2.0 terminal 4 both sides fixing feet 42 are shortened, change straight.
(5) signal pins 51 of USB3.0 terminal 5 is shortened, and the fixing feet 52 of the both sides of described USB3.0 terminal 5 is broken off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel.
(6) signal pins of Tuner terminal is shortened, and the plug-in unit pin of described Tuner terminal is broken off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel.
(7) RJ45 is used instead level paster material.
(8) the plug-in unit pin 61 of coaxial RCA terminal 6 is dug break off with the fingers and thumb flat and be mounted on the pcb board after pcb board is parallel, and described coaxial RCA terminal 6 is provided with reference column 62, described reference column 62 is connected on the pcb board and with coaxial RCA terminal and is fixed on the pcb board.
Because all components and parts are SMD components and parts on the television set pcb board, in the assembling flow path of pcb board, equally take doubling plate as example, its manufacturing process flow specifically comprises following concrete steps:
Incoming Quality Control → A face silk-screen → A face mounts → and Reflow Soldering → cleaning → turnover panel → B face silk-screen → B face mounts → Reflow Soldering → cleaning → detection OK → put into container to be transported into the complete machine assembly line.
Can find out from top step, compare with the manufacturing process of existing TV set circuit plate, in the circuit board of the present invention (being pcb board), the operation of former wave-soldering all is simplified, and pcb board of the present invention only need can flow to complete machine assembly line body through the process flow of Reflow Soldering.
The present invention abandons the lower material of general price, seek or the slightly high paster material of exploitation price, although increased part BOM cost, but realize automatically mounting comprehensively, reduce the assembling flow path of one circuit board, because after wave-soldering simplifies, required manpower, machine (crest welder, anchor clamps), the material (scaling powder of former TV set circuit plate manufacturing process medium wave peak weldering flow process, cleaning agent) can be simplified, in addition, cycle production time also approximately can shorten 1/3rd.
Compare existing shortcoming and defect, the present invention has the following advantages: the method that the plug-in unit material on the circuit board of the present invention changes SMD components and parts into is simple, easy and simple to handle; After all components and parts are SMD components and parts on the circuit board of the present invention, have reduced the assembly technology flow process of circuit board and greatly simplified, the processing and manufacturing cost is lower; The preparation method of circuit board of the present invention is simple, and manufacturing cost reduces, and the production cycle shortens; Television set low cost of manufacture of the present invention, life cycle of the product shortens.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. plug-in type components and parts comprise housing and are located on this housing and the pin that is electrically connected with pcb board, and it is characterized in that, described pin is SMD pin.
2. plug-in type components and parts as claimed in claim 1 is characterized in that, described housing adopts exotic material to make.
3. plug-in type components and parts as claimed in claim 2 is characterized in that, described SMD pin is parallel with pcb board.
4. plug-in type components and parts as claimed in claim 3, it is characterized in that, also comprise and be located on the described housing and the pin that is not electrically connected with pcb board, wherein, the described pin that is not electrically connected with pcb board that is positioned at housing one side that is provided with described SMD pin is lower than SMD pin apart from the maximum vertical height of housing apart from the maximum vertical height of housing.
5. plug-in type components and parts as claimed in claim 4 is characterized in that, described housing is provided with reference column, are used for and described plug-in type components and parts are fixed on pcb board after pcb board is connected.
6. such as each described plug-in type components and parts of above-mentioned claim 1 to 5, it is characterized in that, described pin comprises plug-in unit pin, signal pins and fixing feet.
7. a circuit board is characterized in that, comprises the claims 1 to 6 each described plug-in type components and parts.
8. the preparation method of a circuit board is characterized in that, may further comprise the steps:
Pcb board is tested and silk-screen;
SMD pin on the housing of the claims 1 to 6 each described plug-in type components and parts is mounted on the pcb board, fixes by Reflow Soldering again, obtain circuit board.
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CN2013101961980A CN103326148A (en) | 2013-05-23 | 2013-05-23 | Plug-in type component, circuit board and preparation method for circuit board |
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CN2013101961980A CN103326148A (en) | 2013-05-23 | 2013-05-23 | Plug-in type component, circuit board and preparation method for circuit board |
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CN104968161A (en) * | 2015-06-30 | 2015-10-07 | 深圳市志祥科技有限公司 | LED lamp lighting device circuit board production process |
CN107241861A (en) * | 2017-07-12 | 2017-10-10 | 重庆艾申特电子科技有限公司 | A kind of SMD PCB production technology of synergetic computer software |
CN107404810A (en) * | 2017-06-21 | 2017-11-28 | 广东长虹电子有限公司 | A kind of infinite reflux production technology of TV motherboard |
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CN104968161A (en) * | 2015-06-30 | 2015-10-07 | 深圳市志祥科技有限公司 | LED lamp lighting device circuit board production process |
CN107404810A (en) * | 2017-06-21 | 2017-11-28 | 广东长虹电子有限公司 | A kind of infinite reflux production technology of TV motherboard |
CN107241861A (en) * | 2017-07-12 | 2017-10-10 | 重庆艾申特电子科技有限公司 | A kind of SMD PCB production technology of synergetic computer software |
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Application publication date: 20130925 |