CN202772291U - Electrical connector structure - Google Patents

Electrical connector structure Download PDF

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Publication number
CN202772291U
CN202772291U CN 201220453903 CN201220453903U CN202772291U CN 202772291 U CN202772291 U CN 202772291U CN 201220453903 CN201220453903 CN 201220453903 CN 201220453903 U CN201220453903 U CN 201220453903U CN 202772291 U CN202772291 U CN 202772291U
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CN
China
Prior art keywords
soldering
area
tin layer
electric connector
connector body
Prior art date
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Expired - Fee Related
Application number
CN 201220453903
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Chinese (zh)
Inventor
陈炜钧
罗文捷
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Wistron Neweb Corp
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Wistron Neweb Corp
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Publication date
Application filed by Wistron Neweb Corp filed Critical Wistron Neweb Corp
Priority to CN 201220453903 priority Critical patent/CN202772291U/en
Application granted granted Critical
Publication of CN202772291U publication Critical patent/CN202772291U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Multi-Conductor Connections (AREA)

Abstract

The utility model relates to an electrical connector structure. The electrical connector structure comprises a connector body and a base plate, wherein the connector body has a plurality of pins, the base plate comprises a plurality of first connection areas and at least one second connection area, each first connection area has a plurality of first connection portions, each connection portion is covered with a first scolding tin layer, all the first connection portions are respectively pasted and in electrical connection with corresponding pins through all the first scolding tin layers, an area of each first scolding tin layer is greater than an area of each pin, each second connection area has a plurality of second connection portions, each second connection portion is covered with a second scolding tin layer, all the second connection portions are respectively pasted and in electrical connection with corresponding pins through all the second scolding tin layers, and an area of each second scolding tin layer is equal to an area of the pin. According to the electrical connector structure, drift phenomenon of the pins does not occur; shedding of the connector body and the base plate can be avoided; more space is available for use; and cost is reduced.

Description

Electric connector structure
Technical field
The utility model relates to a kind of electric connector structure, and is particularly a kind of for the electric connector structure of plate to plate (Board to Board) connector.
Background technology
At present, usually can use electric connector with the electric connection as two electronic building bricks (for example circuit board and another circuit board).Yet the characteristic of various electric connector is different, and its applicable situation is also different.
For instance, wish connects two circuit boards, can directly use Board-to-Board Electrical Connector (Board to Board connector), also be about to Board-to-Board Electrical Connector respectively with welding circuit board be electrically connected so that two circuit boards form.
Generally speaking, electric connector can pass through surface mount (Surface Mounted technology, SMT) technique and be welded on the circuit board, no matter is to take automatic piece or manually put part, and part structure dress shift phenomenon all is difficult to avoid.Moreover the assembling tolerance that increases between the circuit board module of two ends will be further tired out in the skew of part structure dress.Cause at present various electronic installation is taked the driving fit assembling design usually all towards the miniaturization development between casing and internal circuit board, the assembling tolerance of circuit board module will form adverse effect to product structure dress.If the offset error between two circuit board modules is excessive, will so will very easily cause printed circuit to damage so that circuit board extruding casing produces deformation, affect device performance.Even product did not lose efficacy during technique, deteriorated circuit is lost device useful life at last, affects consumers' rights and interests.
Therefore for addressing the above problem, traditional settling mode as shown in Figure 1, Fig. 1 illustrates a kind of vertical view of known electric connector structure.When the connector body 110 of electric connector 100 is fastened on the substrate 120 in the surface mount technology mode, because pin 112 and substrate 120 are that pin 112 is positioned on the bonding pad 122 of coating soldering-tin layer 124, utilize soldering-tin layer heat to melt cooling and fix and produce electric connection with mutual bonding.But when carrying out reflow process, soldering-tin layer 124 is in a liquid state under hot environment, so that pin 112 easily produces the skew of sliding, and produces the problem of part structure dress offset error.Therefore, utilize fixture 130 that connector body is fixed on the substrate 120 to solve the problem of aforementioned slip skew.
If but use the aforesaid settling mode that utilizes fixture 130 fixed connector bodies 110, meeting and then causes on the substrate and can reduce for the area of cabling so that substrate 120 spendable areas must be sacrificed a part plugs fixingly for fixture 130.In addition, increasing fixture 130 at electric connector also is an extra cost, so that the cost of electric connector 100 improves, and reduces competitiveness on its price.
Therefore, need to provide a kind of electric connector structure to solve the problems referred to above.
The utility model content
In view of the problem that prior art causes, the problem that the utility model provides a kind of electric connector structure to be caused to overcome prior art.
According to an execution mode of the present utility model, a kind of electric connector structure comprises connector body and substrate.Connector body has a plurality of pins.Substrate comprises a plurality of the first bonding pads and a plurality of the second bonding pad.Each first bonding pad has a plurality of the first connecting portions.Cover the first soldering-tin layer on each first connecting portion, the first connecting portion is electrically connected with corresponding pin respectively by the first soldering-tin layer, and wherein the area of each the first soldering-tin layer is greater than the area of each pin.Each second bonding pad has a plurality of the second connecting portions.Cover the second soldering-tin layer on each second connecting portion, the second connecting portion is electrically connected with corresponding pin respectively, and wherein the area of each the second soldering-tin layer equals the area of each pin.
The present invention also discloses a kind of electric connector structure, and this electric connector structure comprises: a connector body, and this connector body has a plurality of pins; An and substrate, this substrate comprises: a plurality of the first bonding pads, each this first bonding pad has a plurality of the first connecting portions, cover one first soldering-tin layer on each this first connecting portion, those first connecting portions bind with corresponding those pins respectively by those first soldering-tin layers and are electrically connected, and wherein the area of each this first soldering-tin layer is greater than the area of each this pin; And at least one the second bonding pad, each this second bonding pad has a plurality of the second connecting portions, cover one second soldering-tin layer on each this second connecting portion, those second connecting portions bind with corresponding those pins respectively by those second soldering-tin layers and are electrically connected, and wherein the area of each this second soldering-tin layer equals the area of each this pin.
In an execution mode of the present utility model, the area of each the first soldering-tin layer equals the area of each the first connecting portion.
In an execution mode of the present utility model, the area of each the second soldering-tin layer equals the area of each the second connecting portion.
In an execution mode of the present utility model, pin lays respectively at the two side of connector body.
In an execution mode of the present utility model, pin equally spaced is arranged in the two side of connector body.
In an execution mode of the present utility model, two two opposite ends that lay respectively at connector body wherein, the first bonding pad.
In an execution mode of the present utility model, substrate is printed circuit board (PCB).
In an execution mode of the present utility model, connector body is the board to board connector body.
In an execution mode of the present utility model, the end face of each the first connecting portion is goldleaf layer or tinfoil paper layer surface.
In an execution mode of the present utility model, the end face of each the second connecting portion is goldleaf layer or tinfoil paper layer surface.
Electric connector structure of the present utility model because of the second connecting portion with after pin is connected, can be so that connector body be connected and can not produces the phenomenon of pin pin position drift when reflow process with substrate.In addition, because of the area of the first soldering-tin layer of the first connecting portion greater than pin, therefore after the first soldering-tin layer and pin were connected and fixed, electric connector structure of the present utility model can keep certain plug intensity.Therefore connector body can not cause connector body and substrate to come off because carrying out Plug Action.
In addition, electric connector structure of the present utility model is not because using fixture fixed connector body, so do not need to reserve for the fixing space of fixture, so that substrate can have more usage space so that cabling to be provided at substrate.In addition, because electric connector structure of the present utility model does not need to use fixture, therefore the cost in the time of can reducing the electric connector structure making.
Description of drawings
For above and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 illustrates a kind of vertical view of known electric connector structure.
Fig. 2 illustrates the vertical view according to a kind of electric connector structure of an execution mode of the present utility model.
Fig. 3 illustrates the three-dimensional exploded view according to the electric connector structure of Fig. 2.
The primary clustering symbol description:
100 electric connectors, 212 pins
110 connector bodies 214 plug together mouth
112 pins, 220 substrates
120 substrate 221a the first bonding pad
122 bonding pad 221b the second bonding pad
124 soldering-tin layer 222a the first connecting portion
130 fixture 222b the second connecting portion
200 electric connector 224a the first soldering-tin layer
210 connector body 224b the second soldering-tin layer
Embodiment
Below will spirit of the present utility model clearly be described with accompanying drawing and detail specifications, those of ordinary skill under any in the technical field is after understanding preferred embodiment of the present utility model, should be by the technology of the utility model institute teaching, change and modification, it does not break away from spirit of the present utility model and scope.
Please refer to Fig. 2, it illustrates the vertical view according to a kind of electric connector 200 structures of an execution mode of the present utility model.As shown in Figure 2, electric connector 200 structures comprise connector body 210 and substrate 220.Connector body 210 forms an electric connector 200 structures in conjunction with substrate 220 and after being electrically connected, and this electric connector 200 can utilize plugging together of arranging on the connector body 210 214 to plug together fixing with other electronic building bricks and be electrically connected.
Connector body 210 has a plurality of pins 212, is electrically connected in order to connection substrate 220.Wherein, pin 212 lays respectively at the two side of connector body 210.Two side and pin 212 that further narration, pin 212 equally spaced are arranged in connector body 210 are positioned at the two side near the position of bottom surface.In the present embodiment, connector body 210 is a rectangular structure.Therefore, pin 212 is positioned at opposite side and the compartment of terrain arrangement on two long limits of connector body 210.In addition, the inside that each that arranges on the end face of connector body 210 plugs together mouth 214 has 212 electric connections of the wire pin adjacent with each.Therefore, outside electrical structure by with plug together mouthfuls 214 and can certainly plug together mouthfuls 214 after plugging together and transmit electrical signals to pin 212, and then by pin 212 electrical signals is passed on the substrate 220.
Substrate 220 comprises a plurality of the first bonding pad 221a and a plurality of the second bonding pad 221b.Yet each first bonding pad 221a has a plurality of the first connecting portion 222a.The upper first soldering-tin layer 224a that covers of each first connecting portion 222a, the first connecting portion 222a is electrically connected with corresponding pin 212 respectively by the first soldering-tin layer 224a.Wherein, the surface area of each the first soldering-tin layer 224a is greater than the surface area of each pin 212.Therefore, after the first soldering-tin layer 224a is connected with pin 212 and finishes reflow process, the first soldering-tin layer 224a and pin 212 can keep higher plug intensity, so that electric connector 200 can not cause separating of pin 212 and the first soldering-tin layer 224a when plugging.In the present embodiment, the area of the area of the first soldering-tin layer 224a and the first connecting portion 222a is roughly the same.And in other embodiments, the area of the first connecting portion 222a also can be designed to the area greater than the first soldering-tin layer 224a.
On the other hand, each second bonding pad 221b has a plurality of the second connecting portion 222b.The upper second soldering-tin layer 224b that covers of each second connecting portion 222b, the second connecting portion 222b is electrically connected with corresponding pin 212 respectively by the second soldering-tin layer 224b.Wherein, the area of each the second soldering-tin layer 224b equals the area of each pin 212 haply.In addition, respectively and electric connection fixing with corresponding pin 212 bondings of the second soldering-tin layer 224b.When pin 212 was connected via surface mount technology with the second soldering-tin layer 224b, the second soldering-tin layer 224b under hot environment was in a liquid state and engages with pin 212.The area of cause the second soldering-tin layer 224b and pin 212 is roughly the same, therefore pin 212 and the second soldering-tin layer 224b can not produce the state of drift, can be orientation and substrate 220 be connected and fixed accurately so that pin 212 can not produce offset error when being fixed on the substrate 220 via the second soldering-tin layer 224b.In the present embodiment, the area of the area of the second soldering-tin layer 224b and the second connecting portion 222b is roughly the same.And in other embodiments, the area of the second connecting portion 222b also can be designed to the area greater than the second soldering-tin layer 224b.
In the present embodiment, the opposite end on two long limits of connector body 210 is set to respectively the first bonding pad 221a, and the second bonding pad 221b is set between the two first bonding pad 221a.In other embodiments, a plurality of the first bonding pad 221a and the second bonding pad 221b also can be set simultaneously between the two first bonding pad 221a.Therefore, when the second soldering-tin layer 224b on the second connecting portion 222b of the second bonding pad 221b was connected with pin 212, connector body 210 can be connected with substrate 220 exactly and can not produce the phenomenon of pin 212 pin position drifts.The first soldering-tin layer 224a on the first connecting portion 222a of both sides the first bonding pad 221a is connected with pin 212, so that electric connector of the present utility model 200 structures have higher plug intensity.Therefore, electric connector 200 can not cause connector body 210 and substrate 220 to come off because carrying out Plug Action.
In the present embodiment, substrate 220 is that printed circuit board (PCB) and connector body 210 are the board to board connector body.In other embodiments, connector body 210 also can be the connector body of other types of attachment, for example the wire pair board connector body.
Please refer to Fig. 3, it illustrates the three-dimensional exploded view according to electric connector 200 structures of Fig. 2.As shown in Figure 3, substrate 220 has goldleaf layer or tinfoil paper layer surface so that the end face of the first connecting portion 222a and the second connecting portion 222b exposes after processing.And then when carrying out surface mount technology, the end face of the first connecting portion 222a and the second connecting portion 222b utilizes respectively screen-printing machine to spread the first soldering-tin layer 224a and the second soldering-tin layer 224b.In addition, it is upper and carry out the technique of piece that the pin 212 of connector body 210 is put into respectively the first soldering-tin layer 224a and the second soldering-tin layer 224b.Afterwards, substrate 220 and connector body 210 are put into the reflow stove to carry out reflow process.The reflow stove utilizes hot blast it to be melted the first soldering-tin layer 224a and the second soldering-tin layer 224b heating, and the first soldering-tin layer 224a after the fusing and the second soldering-tin layer 224b can present liquid state and mutually bind fixing with the goldleaf layer of the first connecting portion 222a and the second connecting portion 222b or tinfoil paper layer the pin 212 of connector body 210 respectively and so that pin 212 can pass through the first soldering-tin layer 224a and the second soldering-tin layer 224b and substrate 220 electric connections.
By above-mentioned the utility model execution mode as can be known, application the utlity model has following advantage:
(1) electric connector structure of the present utility model because of the second connecting portion with after pin is connected, can be so that connector body be connected and can not produces the phenomenon of pin pin position drift when reflow process with substrate.In addition, because of the area of the first soldering-tin layer of the first connecting portion greater than pin, therefore after the first soldering-tin layer and pin were connected and fixed, electric connector structure of the present utility model can keep certain plug intensity.Therefore connector body can not cause connector body and substrate to come off because carrying out Plug Action.
(2) electric connector structure of the present utility model is not because using fixture fixed connector body, so do not need to reserve for the fixing space of fixture, so that substrate can have more usage space so that cabling to be provided at substrate.In addition, because electric connector structure of the present utility model does not need to use fixture, therefore the cost in the time of can reducing the electric connector structure making.

Claims (10)

1. electric connector structure, this electric connector structure comprises:
A connector body, this connector body has a plurality of pins; And
One substrate is characterized in that, this substrate comprises:
A plurality of the first bonding pads, each this first bonding pad has a plurality of the first connecting portions, cover one first soldering-tin layer on each this first connecting portion, those first connecting portions bind with corresponding those pins respectively by those first soldering-tin layers and are electrically connected, and wherein the area of each this first soldering-tin layer is greater than the area of each this pin; And
At least one the second bonding pad, each this second bonding pad has a plurality of the second connecting portions, cover one second soldering-tin layer on each this second connecting portion, those second connecting portions bind with corresponding those pins respectively by those second soldering-tin layers and are electrically connected, and wherein the area of each this second soldering-tin layer equals the area of each this pin.
2. electric connector structure as claimed in claim 1 is characterized in that, the area of each this first soldering-tin layer equals the area of each this first connecting portion.
3. electric connector structure as claimed in claim 1 is characterized in that, the area of each this second soldering-tin layer equals the area of each this second connecting portion.
4. electric connector structure as claimed in claim 1 is characterized in that, those pins lay respectively at the two side of this connector body.
5. electric connector structure as claimed in claim 4 is characterized in that, those pins equally spaced are arranged in the two side of this connector body.
6. electric connector structure as claimed in claim 1 is characterized in that, two two opposite ends that lay respectively at this connector body wherein, those first bonding pads.
7. electric connector structure as claimed in claim 1 is characterized in that, this substrate is a printed circuit board (PCB).
8. electric connector structure as claimed in claim 1 is characterized in that, this connector body is a board to board connector body.
9. electric connector structure as claimed in claim 1 is characterized in that, the end face of each this first connecting portion is a goldleaf layer or tinfoil paper layer surface.
10. electric connector structure as claimed in claim 1 is characterized in that, the end face of each this second connecting portion is a goldleaf layer or tinfoil paper layer surface.
CN 201220453903 2012-09-06 2012-09-06 Electrical connector structure Expired - Fee Related CN202772291U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220453903 CN202772291U (en) 2012-09-06 2012-09-06 Electrical connector structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220453903 CN202772291U (en) 2012-09-06 2012-09-06 Electrical connector structure

Publications (1)

Publication Number Publication Date
CN202772291U true CN202772291U (en) 2013-03-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220453903 Expired - Fee Related CN202772291U (en) 2012-09-06 2012-09-06 Electrical connector structure

Country Status (1)

Country Link
CN (1) CN202772291U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105634401A (en) * 2015-08-30 2016-06-01 苏州快可光伏电子股份有限公司 Integrated photovoltaic power station combiner box control module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105634401A (en) * 2015-08-30 2016-06-01 苏州快可光伏电子股份有限公司 Integrated photovoltaic power station combiner box control module

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130306

Termination date: 20190906