CN114430611A - PCB (printed circuit board) and server for isolating crystal oscillator module - Google Patents
PCB (printed circuit board) and server for isolating crystal oscillator module Download PDFInfo
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- CN114430611A CN114430611A CN202111553489.1A CN202111553489A CN114430611A CN 114430611 A CN114430611 A CN 114430611A CN 202111553489 A CN202111553489 A CN 202111553489A CN 114430611 A CN114430611 A CN 114430611A
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- crystal oscillator
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- oscillator module
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- 239000013078 crystal Substances 0.000 title claims abstract description 122
- 238000002955 isolation Methods 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 238000013461 design Methods 0.000 abstract description 10
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
The invention provides a PCB and a server of an isolation crystal oscillator module, wherein the PCB comprises: the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device; the PCB daughter board and the PCB mother board have a preset distance in the vertical direction. By using the scheme of the invention, the longitudinal space utilization rate and the wiring efficiency of the board card can be improved, the design requirement of no wiring below the crystal oscillator model is met, the quality of crystal oscillator signals is ensured, the normal inner layer signal wiring is not influenced, and the product competitiveness is increased.
Description
Technical Field
The invention relates to the field of computers, in particular to a PCB board and a server of an isolation crystal oscillator module.
Background
With the development of electronic technology and the increase of signal rate, PCB boards are developing towards miniaturization, the Pin density of the boards is increasing, and due to the limitation of cost, PCB designers are required to maximally utilize the PCB space in the process of laying out and wiring, and meanwhile, the transmission quality of signals is ensured.
In the existing PCB design process, due to the importance and the particularity of crystal oscillator signals, a crystal oscillator module needs to be placed nearby close to a chip, a signal layer below the crystal oscillator does not allow a signal line, and the crystal oscillator module needs to be processed in a wrapped mode. The layout and wiring requirements of the existing crystal oscillator module do not allow wiring below the crystal oscillator, the wiring of an inner layer signal layer below the crystal oscillator is seriously affected by the design requirements, the space utilization rate of the board card is low, and when the board card is dense, the inner layer signal layer has the conditions of insufficient space and wiring tension. If the wiring is forced under the crystal oscillator, the interference to the crystal oscillator signal is large, and the quality of the crystal oscillator signal is not good. And the crystal oscillator is very close to BGA and radiator, and the accuracy of the crystal oscillator may be seriously influenced by the tiny deformation of the board card caused by stress during installation. When the temperature of the heat sink is too high, the normal operation of the crystal oscillator may be affected.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a PCB board and a server for isolating a crystal oscillator module, and by using the technical scheme of the present invention, the longitudinal space utilization rate and the wiring efficiency of a board card can be improved, so that the design requirement of no wiring below a crystal oscillator model is met, the quality of a crystal oscillator signal is ensured, normal inner layer signal wiring is not affected, and the product competitiveness is increased.
In view of the above object, an aspect of an embodiment of the present invention provides a PCB board for isolating a crystal oscillator module, including:
the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device;
the PCB daughter board and the PCB mother board have a preset distance in the vertical direction.
According to one embodiment of the invention, the shielding cavity is arranged around the crystal oscillator module 3mm from the crystal oscillator module with an opening at a predetermined position.
According to an embodiment of the invention, the shielding cavity is arranged on the back surface opposite to the top layer, and the shielding cavity corresponds to the shielding cavity in the vertical direction.
According to one embodiment of the invention, the first connecting device is a stud, the second connecting device is a screw hole, the stud comprises a first stud and a second stud, the first stud is arranged at a corner of the PCB daughter board, the second stud is connected with the crystal oscillator module, and the second stud is connected with the crystal oscillator signal on the PCB mother board in a state that the stud is installed on the screw hole.
According to an embodiment of the present invention, the first connecting means is a pin, the second connecting means is a socket, the pin is disposed at one side of the crystal oscillator module, one of the pins is connected with the crystal oscillator module, and the pin connected with the crystal oscillator module is connected with a crystal oscillator signal on the PCB motherboard in a state that the pin is mounted in the socket.
In another aspect of the embodiments of the present invention, there is also provided a server, where the server includes a PCB board isolating a crystal oscillator module, and the PCB board isolating the crystal oscillator module includes:
the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device;
the PCB daughter board and the PCB mother board have a preset distance in the vertical direction.
According to one embodiment of the invention, the shielding cavity is arranged around the crystal oscillator module 3mm from the crystal oscillator module with an opening at a predetermined position.
According to an embodiment of the invention, the shielding cavity is arranged on the back surface opposite to the top layer, and the shielding cavity corresponds to the shielding cavity in the vertical direction.
According to one embodiment of the invention, the first connecting device is a stud, the second connecting device is a screw hole, the stud comprises a first stud and a second stud, the first stud is arranged at a corner of the PCB daughter board, the second stud is connected with the crystal oscillator module, and the second stud is connected with the crystal oscillator signal on the PCB mother board in a state that the stud is installed on the screw hole.
According to an embodiment of the present invention, the first connecting means is a pin, the second connecting means is a socket, the pin is disposed at one side of the crystal oscillator module, one of the pins is connected with the crystal oscillator module, and the pin connected with the crystal oscillator module is connected with a crystal oscillator signal on the PCB motherboard in a state that the pin is mounted in the socket.
The invention has the following beneficial technical effects: according to the PCB for isolating the crystal oscillator module, the PCB daughter board is arranged, the GND copper sheet is laid on the top layer of the PCB daughter board, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device; the PCB mother board, the department is provided with the second connecting device who matches with first connecting device on the PCB mother board corresponding position, fix the PCB daughter board in PCB mother board top through first connecting device and second connecting device, PCB daughter board and PCB mother board have the technical scheme of default distance in vertical direction, can promote the vertical space utilization and the wiring efficiency of integrated circuit board, both satisfied the design requirement that does not walk the line below the crystal oscillator model, the quality of crystal oscillator signal has been guaranteed, normal inlayer signal wiring is not influenced again, increase product competitiveness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of a PCB board of an isolated crystal module according to one embodiment of the invention;
FIG. 2 is a schematic diagram of a PCB daughter board design according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of a PCB daughter board with a steel mesh on the back side according to one embodiment of the present invention;
FIG. 4 is a side view of a shielded chamber and an isolated chamber according to one embodiment of the invention;
FIG. 5 is a schematic diagram of a stud in place on a PCB daughter board, according to one embodiment of the present invention;
FIG. 6 is a schematic diagram of a pin connector on a PCB daughter board in accordance with one embodiment of the present invention;
fig. 7 is a schematic diagram of a PCB daughter board and a PCB template connected by pins according to an embodiment of the present invention.
Detailed Description
Embodiments of the present disclosure are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various and alternative forms. The figures are not necessarily to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. As one of ordinary skill in the art will appreciate, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desirable for certain specific applications or implementations.
In view of the above objects, a first aspect of embodiments of the present invention proposes an embodiment of a PCB board for isolating a crystal oscillator module. Fig. 1 shows a schematic view of the PCB board.
As shown in fig. 1, the PCB board may include:
PCB daughter board 1, the top layer of PCB daughter board 1 has been laid GND copper sheet, and crystal oscillator module 2 sets up in the top layer central authorities of PCB daughter board 1, and the edge of PCB daughter board 1 is provided with round GND hole, is provided with shielding chamber 3 outside crystal oscillator module 2, still is provided with first connecting device 4 at PCB daughter board 1. The laminated design of the PCB daughter board 1 is completely consistent with that of the PCB mother board 5, so that the daughter board does not need to be prepared separately, the processing and manufacturing process can be combined with the mother board, the cost is reduced to the maximum extent, and the manufacturing period is shortened. The crystal oscillator module of the original PCB is arranged on a single PCB daughter board 1, and the original PCB is called a PCB mother board 5. The independent overall arrangement of crystal oscillator module 2 is on the TOP layer of daughter board, and all inlayers all spread the GND copper sheet, provide clean and complete GND plane for the crystal oscillator signal, and the flange edge of PCB daughter board 1 adds the round GND hole, and the centre-to-centre spacing between hole is 60mils, and the type of hole is 10mil via holes commonly used to play fine isolation with external environment in the horizontal direction. As shown in fig. 2, S1 is a board edge GND hole of the PCB daughter board 1, S2 is the crystal module 2 on the daughter board, and S3 is a steel mesh with TOP surface opened. The TOP surface of the PCB daughter board 1 is arranged at the position 3mm away from the crystal oscillator module, steel mesh is opened, solder paste is brushed, and as shown in S3 of FIG. 2, a shielding cavity 3 is welded to shield the crystal oscillator module 2 from the external environment, so that the interference of external electromagnetic change to the normal work of the crystal oscillator is prevented. The back of the PCB daughter board 1 is provided with a circle of steel mesh, and is brushed with solder paste, as shown in S4 of fig. 3, an isolation cavity is welded by reflow soldering, so as to enhance the isolation between the PCB daughter board and the PCB motherboard 5, and prevent the mutual interference between the crystal oscillator signal and other signals on the PCB motherboard 5. The side view of the isolation cavity and the shielding cavity 3 is shown in fig. 4, C1 is the shielding cavity 3 above the PCB daughter board 1, C2 is the isolation cavity below the PCB daughter board 1, C3 is the PCB daughter board 1, C4 is the crystal oscillator module 2 on the PCB daughter board 1, the materials of the shielding cavity and the isolation cavity are both zinc-containing steel plates, and the thickness is 2 oz.
The PCB is characterized by further comprising a PCB mother board 5, a second connecting device 6 matched with the first connecting device 4 is arranged at a corresponding position on the PCB mother board 5, the PCB daughter board 1 is fixed above the PCB mother board 5 through the first connecting device 4 and the second connecting device 6, and the PCB daughter board 1 and the PCB mother board 5 are arranged at a preset distance in the vertical direction. Two connection modes of the PCB daughter board 1 and the PCB motherboard 5 are provided, the first mode is that the PCB daughter board is connected with the PCB motherboard 5 through a fixing stud, four corners of the stud are grounded, the other stud is connected with a crystal oscillator signal, as shown in fig. 5, the fixing studs F1, F2, F3 and F4 at the four corners are grounded, the middle signal stud F5 is connected with the crystal oscillator signal on the PCB motherboard 5, and the height of the stud is 2 cm. The second mode is that the PCB daughter board is connected with the motherboard through a pin connector, a slot of the connector is arranged on the PCB motherboard 5, and the pin connector is arranged on the PCB daughter board 1 and can be inserted together, so that the signal is transmitted and the fixing effect is achieved. The pin connector on the PCB daughter board 1 is shown as X1 in fig. 6, the side view is shown in fig. 7, M1 is the PCB daughter board 1, M2 is the PCB motherboard 5, M3 is the pin of the connector on the PCB daughter board 1, and M4 is the socket of the connector on the PCB motherboard 5.
Through the technical scheme of the invention, the longitudinal space utilization rate and the wiring efficiency of the board card can be improved, the design requirement of no wiring below the crystal oscillator model is met, the quality of crystal oscillator signals is ensured, the normal inner layer signal wiring is not influenced, and the product competitiveness is increased.
In a preferred embodiment of the present invention, the shield cavity is disposed around the crystal oscillator module 3mm from the crystal oscillator module with an opening at a predetermined position. The TOP surface of the PCB sub-board is arranged at the position 3mm away from the crystal oscillator module, a steel mesh is opened, solder paste is brushed, a shielding cavity is welded, the crystal oscillator module is shielded from the external environment, and the interference of external electromagnetic change on the normal work of the crystal oscillator is prevented.
In a preferred embodiment of the invention, further comprising an isolation cavity, the isolation cavity being arranged on the back side opposite to the top layer, the isolation cavity corresponding to the position of the shielding cavity in the vertical direction. A circle of steel mesh is formed on the BOTTOM surface of the PCB daughter board, solder paste is brushed, an isolation cavity is welded through reflow soldering, isolation between the isolation cavity and the mother board is enhanced, and mutual interference between crystal oscillator signals and other signals on the mother board is prevented.
In a preferred embodiment of the present invention, the first connecting device is a stud, the second connecting device is a screw hole, the stud includes a first stud and a second stud, the first stud is disposed at a corner of the PCB daughter board, the second stud is connected to the crystal oscillator module, and the second stud is connected to the crystal oscillator signal on the PCB motherboard in a state where the stud is mounted on the screw hole.
In a preferred embodiment of the present invention, the first connecting means is a pin, the second connecting means is a socket, the pin is disposed at one side of the crystal oscillator module, one of the pins is connected with the crystal oscillator module, and the pin connected with the crystal oscillator module is connected with a crystal oscillator signal on the PCB motherboard in a state that the pin is mounted in the socket.
This technical scheme has provided the design of PCB daughter board and mother board, has improved the overall arrangement sheet layer of crystal oscillator module, has added isolation chamber and shielding chamber for the crystal oscillator module, has optimized the problem of crystal oscillator signal with other signal mutual interferences, has promoted the vertical space utilization and the wiring efficiency of integrated circuit board, is the new development direction of PCB wiring design. The crystal oscillator module is arranged in the space above the PCB board card and isolated from the original PCB board in space, so that the utilization rate of the three-dimensional space is improved. The design requirement that the wires are not arranged below the crystal oscillator is met, the quality of crystal oscillator signals is guaranteed, normal inner-layer signal wiring is not affected, and the space utilization rate of the board card is improved.
In view of the above object, a second aspect of the embodiments of the present invention provides a server, where the server includes a PCB board for isolating a crystal oscillator module, and the PCB board for isolating the crystal oscillator module includes:
the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device;
the PCB daughter board and the PCB mother board have a preset distance in the vertical direction.
In a preferred embodiment of the present invention, the shield cavity is disposed around the crystal oscillator module 3mm from the crystal oscillator module with an opening at a predetermined position.
In a preferred embodiment of the invention, further comprising an isolation cavity, the isolation cavity being arranged on the back side opposite to the top layer, the isolation cavity corresponding to the position of the shielding cavity in the vertical direction.
In a preferred embodiment of the present invention, the first connecting device is a stud, the second connecting device is a screw hole, the stud includes a first stud and a second stud, the first stud is disposed at a corner of the PCB daughter board, the second stud is connected to the crystal oscillator module, and the second stud is connected to the crystal oscillator signal on the PCB motherboard in a state where the stud is mounted on the screw hole.
In a preferred embodiment of the present invention, the first connecting means is a pin, the second connecting means is a socket, the pin is disposed at one side of the crystal oscillator module, one of the pins is connected with the crystal oscillator module, and the pin connected with the crystal oscillator module is connected with a crystal oscillator signal on the PCB motherboard in a state that the pin is mounted in the socket.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The embodiments described above, particularly any "preferred" embodiments, are possible examples of implementations and are presented merely to clearly understand the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the technology described herein. All such modifications are intended to be included within the scope of this disclosure and protected by the following claims.
Claims (10)
1. A PCB board for isolating a crystal oscillator module, comprising:
the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device;
the PCB mother board is provided with a second connecting device matched with the first connecting device at a corresponding position on the PCB mother board, the PCB daughter board is fixed above the PCB mother board through the first connecting device and the second connecting device, and the PCB daughter board and the PCB mother board have a preset distance in the vertical direction.
2. The PCB board of claim 1, wherein the shielding cavity is disposed around the crystal oscillator module 3mm from the crystal oscillator module and has an opening at a predetermined position.
3. The PCB board of claim 2, further comprising an isolation cavity disposed on a back side opposite the top layer, the isolation cavity corresponding in vertical direction to a position of the shielding cavity.
4. The PCB of claim 1, wherein the first connecting means is a stud, the second connecting means is a screw hole, the stud comprises a first stud and a second stud, the first stud is disposed at a corner of the PCB daughter board, the second stud is connected with the crystal oscillator module, and the second stud is connected with the crystal oscillator signal on the PCB mother board in a state that the stud is mounted on the screw hole.
5. The PCB board of claim 1, wherein the first connecting means is a pin, the second connecting means is a socket, the pin is disposed at one side of the crystal oscillator module, one of the pins is connected with the crystal oscillator module, and the pin connected with the crystal oscillator module is connected with the crystal oscillator signal on the PCB motherboard in a state that the pin is mounted in the socket.
6. A server, comprising a PCB board that isolates a crystal oscillator module, the PCB board that isolates the crystal oscillator module comprising:
the PCB daughter board is provided with a GND copper sheet on the top layer, the crystal oscillator module is arranged in the center of the top layer of the PCB daughter board, a circle of GND holes are formed in the edge of the PCB daughter board, a shielding cavity is arranged outside the crystal oscillator module, and the PCB daughter board is further provided with a first connecting device;
the PCB mother board is provided with a second connecting device matched with the first connecting device at a corresponding position on the PCB mother board, the PCB daughter board is fixed above the PCB mother board through the first connecting device and the second connecting device, and the PCB daughter board and the PCB mother board have a preset distance in the vertical direction.
7. The server according to claim 6, wherein the shielding cavity is disposed around the crystal oscillator module 3mm from the crystal oscillator module and has an opening at a predetermined position.
8. The server of claim 7, further comprising an isolation cavity disposed on a back side opposite the top layer, the isolation cavity corresponding in vertical direction to a position of the shield cavity.
9. The server according to claim 6, wherein the first connecting means is a stud, the second connecting means is a screw hole, the stud includes a first stud and a second stud, the first stud is disposed at a corner of the PCB daughter board, the second stud is connected to the crystal oscillator module, and the second stud is connected to the crystal oscillator signal on the PCB motherboard in a state where the stud is mounted on the screw hole.
10. The server according to claim 6, wherein the first connecting means is a pin, the second connecting means is a socket, the pin is disposed on one side of the crystal oscillator module, one of the pins is connected to the crystal oscillator module, and the pin connected to the crystal oscillator module is connected to the crystal oscillator signal on the PCB motherboard in a state where the pin is mounted in the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111553489.1A CN114430611A (en) | 2021-12-17 | 2021-12-17 | PCB (printed circuit board) and server for isolating crystal oscillator module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111553489.1A CN114430611A (en) | 2021-12-17 | 2021-12-17 | PCB (printed circuit board) and server for isolating crystal oscillator module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114430611A true CN114430611A (en) | 2022-05-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111553489.1A Pending CN114430611A (en) | 2021-12-17 | 2021-12-17 | PCB (printed circuit board) and server for isolating crystal oscillator module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114430611A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201303485Y (en) * | 2008-10-27 | 2009-09-02 | 深圳华为通信技术有限公司 | Shield cover and component |
| CN201364516Y (en) * | 2008-12-17 | 2009-12-16 | 陕西海泰电子有限责任公司 | Arbitrary waveform generator |
| CN102111955A (en) * | 2010-12-22 | 2011-06-29 | 广东大普通信技术有限公司 | Connecting structure and connecting method for PCB |
| CN202443957U (en) * | 2012-02-17 | 2012-09-19 | 华为终端有限公司 | Chip package module and mother board |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
| CN212183813U (en) * | 2020-05-29 | 2020-12-18 | 成都博宇利华科技有限公司 | PCB circuit board structure for shielding electromagnetic interference of crystal oscillator |
-
2021
- 2021-12-17 CN CN202111553489.1A patent/CN114430611A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201303485Y (en) * | 2008-10-27 | 2009-09-02 | 深圳华为通信技术有限公司 | Shield cover and component |
| CN201364516Y (en) * | 2008-12-17 | 2009-12-16 | 陕西海泰电子有限责任公司 | Arbitrary waveform generator |
| CN102111955A (en) * | 2010-12-22 | 2011-06-29 | 广东大普通信技术有限公司 | Connecting structure and connecting method for PCB |
| CN202443957U (en) * | 2012-02-17 | 2012-09-19 | 华为终端有限公司 | Chip package module and mother board |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
| CN212183813U (en) * | 2020-05-29 | 2020-12-18 | 成都博宇利华科技有限公司 | PCB circuit board structure for shielding electromagnetic interference of crystal oscillator |
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