CN219780517U - Circuit board module and terminal equipment - Google Patents

Abstract

The embodiment of the utility model relates to the technical field of main board structures, and provides a circuit board module and terminal equipment. In space, besides forming welding spot connection in the Z direction, the welding materials in the first metallization conducting structure and the second metallization conducting structure can also increase the connection point in the X, Y direction, so that the welding connection strength between the main board and the installation object is improved.

Description

Circuit board module and terminal equipment

Technical Field

The present utility model relates to the technical field of motherboard structures, and in particular, to a circuit board module and a terminal device having the circuit board module.

Background

The light and thin design of the current terminal electronic products is more and more obvious, wherein the thin and thin requirements of the mobile phone terminal products are very strong, for example, in the scene of a folding machine, the competitiveness of the products is determined by the thickness update. The folding machine comprises a screen, a battery, a circuit board assembly, a front shell assembly and the like, wherein the circuit board assembly comprises a main board and a plurality of auxiliary board assemblies, each auxiliary board is laminated on the main board, and the thickness of an installation area on the main board directly influences the whole machine product.

At present, the main board and the auxiliary board are mainly welded through the welding terminals on two opposite sides, and the welding area, the layout density and the shape processing capacity of the avoidance board are considered, so that the connection reliability between the main board and the auxiliary board is low, and the welding device is difficult to adapt to extreme scenes such as collision, falling and the like.

Disclosure of Invention

The embodiment of the utility model provides a circuit board module and terminal equipment, which are used for the technical problem of low connection strength between a main board and an auxiliary board in the terminal equipment.

In order to achieve the above purpose, the embodiment of the present utility model adopts the following technical scheme:

in a first aspect, an embodiment of the present utility model provides a circuit board module, including a main board and a plurality of mounting objects, where the main board has a first end surface for connecting each mounting object, a first pad structure is disposed on the first end surface, a cavity is formed by recessing on the first end surface, the first pad structure is enclosed in the cavity, a first metallization conducting structure is formed on an inner wall of the cavity, the first metallization conducting structure is used for accommodating a solder material, the mounting object has a side surface and a second end surface corresponding to the first end surface, a second pad structure is disposed on the second end surface, a second metallization conducting structure is formed on the side surface, the second metallization conducting structure is used for accommodating the solder material, the first metallization conducting structure is connected with the second pad structure, and the second metallization conducting structure is connected with the first pad structure.

The technical scheme provided by the embodiment of the utility model has at least the following technical effects or advantages:

the circuit board module provided by the embodiment of the utility model comprises a main board and an installation object, wherein the installation object is connected with the main board in a welding connection mode. Specifically, a first pad structure is arranged on a first end face of the main board, a first metallization conducting structure is formed on the inner wall of the concave cavity, a second pad structure is arranged on a second end face of the installation object, and a second metallization conducting structure is formed on the side face of the installation object.

In some embodiments, the first metallization via structure includes a first metal film layer formed on an inner wall of the cavity.

Through adopting above-mentioned technical scheme, first metal rete satisfies the conduction demand between mainboard and the installation object, simultaneously, also provides the attached position for welding material.

In some embodiments, the first metal film layer covers at least a portion of an inner wall of the cavity.

By adopting the technical scheme, the first metal film layer can selectively cover part or all of the inner walls of the concave cavity, so that the number of connection points of the main board and the installation object, the connection strength and the consumption of welding materials are adjusted.

In some embodiments, the first metallization via structure includes a plurality of first metallization grooves, each of the first metallization grooves being distributed on an inner wall of the cavity.

Through adopting above-mentioned technical scheme, each first metallization groove satisfies the conduction demand between mainboard and the installation object, simultaneously, also provides the attached position for welding material.

In some embodiments, the first metallization groove extends in the same direction as the thickness direction of the motherboard.

By adopting the technical scheme, the processing difficulty is low, and each first metallization groove is easier to form on the inner wall of the concave cavity.

In some embodiments, the first metallization groove penetrates through the main board along the thickness direction of the main board.

By adopting the technical scheme, the volume of each first metallization groove is increased, and the total accommodating amount of welding materials is increased.

In some embodiments, the second metallization via structure includes a second metal film layer formed on the side.

Through adopting above-mentioned technical scheme, the second metal rete satisfies the conduction demand between mainboard and the installation object, simultaneously, also provides the attached position for welding material.

In some embodiments, the second metal film layer covers at least a portion of the side surface.

By adopting the technical scheme, the second metal film layer can selectively cover part or all of the side surfaces, so that the number of connection points of the main board and the installation object, the connection strength and the consumption of welding materials are adjusted.

In some embodiments, the second metallization groove extends in the same direction as the thickness direction of the mounting object.

By adopting the technical scheme, the processing difficulty is low, and each second metallization groove is easier to form on the side surface of the installation object.

In some embodiments, the second metallization groove penetrates the mounting object in a thickness direction of the mounting object.

By adopting the technical scheme, the volume of each second metallization groove is increased, and the total accommodating amount of welding materials is increased.

In some embodiments, the mounting object comprises a secondary panel.

By adopting the technical scheme, the auxiliary board is used as one of the objects welded with the main board, and of course, other installation objects exist.

In some embodiments, the sub-plate has a plurality of the sides, at least one of the sides being formed with the second metallization via.

By adopting the technical scheme, the number of the second metallization conducting structures can be increased or reduced according to the actual connection strength requirement.

In a second aspect, an embodiment of the present utility model further provides a terminal device, including the circuit board module described above.

The technical scheme provided by the embodiment of the utility model has at least the following technical effects or advantages:

on the basis of the circuit board module, the terminal equipment provided by the embodiment of the utility model has improved anti-seismic performance in the extreme condition.

Drawings

Fig. 1 is a schematic structural diagram of a main circuit board and components provided in the related art;

fig. 2 is a top view of a main circuit board and components provided in the related art;

fig. 3 is a schematic structural diagram of a terminal device according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a circuit board module according to an embodiment of the utility model;

fig. 5 is a top view of a circuit board module according to an embodiment of the utility model;

FIG. 6 is a cross-sectional view taken at A-A of FIG. 4;

FIG. 7 is a cross-sectional view taken at B-B of FIG. 4;

fig. 8 is a schematic structural diagram of a circuit board module according to a second embodiment of the present utility model;

fig. 9 is a top view of a circuit board module according to a second embodiment of the present utility model;

fig. 10 is a top view of a circuit board module according to a third embodiment of the present utility model.

Wherein, each reference sign in the figure:

1. a main circuit board; 2. a component; 3. welding spots;

100. a circuit board module;

10. a main board; 10a, a first end face; 11. a first pad structure; 10b, a concave cavity; 12. a first metallization via structure; 121. a first metal film layer; 122. a first metallization groove;

20. installing an object; 20a, a second end face; 20b, sides; 21. a second pad structure; 22. a second metallization via structure; 221. a second metal film layer; 222. a second metallization groove;

1000. and a terminal device.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "thickness," "top," "bottom," "inner," "outer," "upper," "lower," "left," "right," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

The terms "first," "second," "third," "fourth," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. For example, the first pushing portion and the second pushing portion are merely for distinguishing between the different pushing portions, and are not limited in their order, and the first pushing portion may also be named as the second pushing portion, and the second pushing portion may also be named as the first pushing portion, without departing from the scope of the various described embodiments. And the terms "first," "second," "third," "fourth," and the like are not intended to limit the scope of the indicated features to be necessarily different.

In the present utility model, unless explicitly specified and limited otherwise, the terms "connected," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally formed, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, "and/or" is merely one association relationship describing the association object, meaning that three relationships may exist; for example, a and/or B may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

It should be noted that, in the present utility model, words such as "in some embodiments," "illustratively," "for example," and the like are used to indicate examples, illustrations, or descriptions. Any embodiment or design described herein as "in some embodiments," "illustratively," "for example," should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "in some embodiments," "illustratively," "for example," and the like are intended to present related concepts in a concrete fashion.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

The anti-seismic performance of the terminal electronic product is limited by the physical connection strength of each component, and typically, each component 2 is connected to the main circuit board 1 by soldering. As shown in the drawings, fig. 1 is a schematic structural diagram of a related art component 2 soldered to a main circuit board 1, and fig. 2 is a top view of a related art component 2 soldered to a main circuit board 1. As can be seen from the figure, the solder joint 3 is disposed in the overlapping area of the component 2 and the main circuit board 1, that is, the solder joints 3 are disposed on the component 2 and the main circuit board 1, the solder joint 3 on the component 2 is located in the overlapping area, solder paste is coated at the solder joint 3, and after passing through the furnace, the solder paste is melted and then solidified, so that the component 2 and the main circuit board 1 are connected.

However, in the spatial position, in the Z direction (the direction in which the components 2 are stacked on the main circuit board 1) shown in fig. 1, the main bonding force direction formed between each component 2 and the main circuit board 1, that is, the connection strength in the Z direction is high, however, in the X, Y direction (the X, Y direction is a direction parallel to the mounting plane of the main circuit board 1) shown in fig. 1, the bonding force formed between each component 2 and the main circuit board 1 is small, which is related to the area of the solder joint 3 or the size of the coating area of the solder paste, so that in the plane in the X, Y direction, the structural force between each component 2 and the main circuit board 1 is weak, especially in extreme stress situations such as external force impact and drop of the terminal electronic product, the above-mentioned soldering method is difficult to adapt.

In view of this, the embodiment of the present utility model provides a circuit board module 100, wherein a first metallization conducting structure 12 is added on the inner wall of the cavity 10b of the motherboard 10, and a second metallization conducting structure 22 is added on the side 20b of the installation object 20, the first metallization conducting structure 12 is used for being correspondingly connected with a second pad structure 21 on the installation object 20, and the second metallization conducting structure 22 is used for being correspondingly connected with a first pad structure 11 on the motherboard 10, so that the number of connection points of the motherboard 10 and the installation object 20 in the X, Y direction is increased, and further the welding connection strength between the motherboard 10 and the installation object 20 is improved.

Specifically, referring to fig. 4, 5, 8 and 9, the circuit board module 100 provided in the embodiment of the utility model includes a main board 10 and a plurality of mounting objects 20, the main board 10 has a first end surface 10a for connecting each mounting object 20, a first pad structure 11 is disposed on the first end surface 10a, a cavity 10b is formed by recessing the first end surface 10a, the first pad structure 11 is enclosed in the cavity 10b, a first metallization conducting structure 12 is formed on an inner wall of the cavity 10b, the first metallization conducting structure 12 is used for accommodating soldering materials, the mounting object 20 has a side surface 20b and a second end surface 20a corresponding to the first end surface 10a, a second pad structure 21 is disposed on the second end surface 20a, a second metallization conducting structure 22 is formed on the side surface 20b, the second metallization conducting structure 22 is used for accommodating soldering materials, the first metallization conducting structure 12 is correspondingly connected with the second pad structure 21, and the second metallization conducting structure 22 is correspondingly connected with the first pad structure 11.

The main Board 10 is the most basic and important component in the terminal device, for example, a mobile phone is used as an example, and a BTB connector (Board-to-Board Connectors), an FPC connector (Flexible Printed Circuit Board) and the like are arranged on the main Board 10, and a camera, a display screen and the like are electrically and mechanically connected with the main Board 10 through the Connectors.

The main board 10 has a plate-like structure, and a first end surface 10a of the main board 10 is a structural surface perpendicular to the thickness direction of the main board 10, and the first end surface 10a is used for mounting and connecting the respective mounting objects 20.

The number of installation objects 20 may be one or more. The mounting object 20 may be a module board, a component unit, a component, or the like, and the second end surface 20a of the mounting object 20 is an end surface where the main board 10 is fixedly connected, that is, after the fixed connection is completed, the second end surface 20a is attached to the first end surface 10 a.

The first pad structure 11 is a soldering point on the motherboard 10, i.e. a metal portion on the motherboard 10, and the second pad structure 21 is a soldering point on the mounting object 20, i.e. a metal portion on the mounting object 20, and under the action of soldering material, the first pad structure 11 and the second pad structure 21 may be fixedly connected to achieve electrical and mechanical connection between the motherboard 10 and the mounting object 20.

Referring to fig. 6, the cavity 10b is a recess formed in the main board 10 by recessing the first end surface 10a inward, and alternatively, the cavity 10b may be a through groove penetrating through the main board 10 in the thickness direction of the main board 10, or may be a pit formed in the main board 10. It will be appreciated that the inner wall of the cavity 10b is connected to the first end surface 10a, and that the plane of the inner wall of the cavity 10b forms an angle a with the plane of the first end surface 10a, alternatively, the angle a is 90 degrees, i.e. the plane of the inner wall of the cavity 10b is perpendicular to the plane of the first end surface 10 a. Meanwhile, the installation area of the cavity 10b on the main board 10 is also an area covered by the installation object 20, that is, after the installation object 20 is fixed on the first end surface 10a of the main board 10, the cavity 10b is completely covered.

The first pad structures 11 are surrounded on the concave cavity 10b, that is, the number of the first pad structures 11 may be plural, and the first pad structures are surrounded on the edge of the concave cavity 10b to meet the requirements of the installation object 20 for covering the concave cavity 10b and realizing electrical connection and structural connection with the installation object 20.

A first metallized via structure 12 is formed in the inner wall of the cavity 10 b. It can be understood that the first metallization via structure 12 is a connection location where the motherboard 10 is electrically and structurally connected to the mounting object 20, and a metallization conductive structure is formed on the inner wall of the cavity 10b by plating, spraying, or the like, and a solder material may be accommodated on the first metallization via structure 12.

The first metallization via structure 12 is, for example, a metal layer provided on the inner wall of the cavity 10b, a solder material is coated on the metal layer, and a solder connection is performed with the second pad structure 21 during reflow by using the wettability of the metal layer and the solder material.

Alternatively, the first metallization via structure 12 may be a metallization slot, in which a solder material is received, and also soldered to the second pad structure 21 during reflow in an oven.

Referring to fig. 7, the side surface 20b of the installation object 20 is a structural surface connected to the second end surface 20a, and is located in the circumferential direction of the installation object 20, when the installation object 20 is fixedly connected to the first end surface 10a of the motherboard 10, an included angle b is formed between a plane of the side surface 20b of the installation object 20 and a plane of the first end surface 10a, and optionally, the included angle b is 90 degrees, i.e. the plane of the side surface 20b is perpendicular to the plane of the first end surface 10 a. A second metallization conductive structure 22 is formed on the side surface 20b of the installation object 20, the second metallization conductive structure 22 is a connection position where the motherboard 10 is electrically and structurally connected with the installation object 20, a metallization conductive structure is formed on the inner wall of the cavity 10b through plating, spraying and other processes, and a welding material can be contained on the second metallization conductive structure 22.

The second metallization via structure 22 is, for example, a metal layer provided on the side surface 20b of the mounting object 20, a solder material is coated on the metal layer, and solder connection is performed with the first pad structure 11 at the time of reflow in the furnace by utilizing wettability of the metal layer and the solder material.

Alternatively, the second metallization via structure 22 may be a metallization slot, in which a solder material is received, and also soldered to the first pad structure 11 during reflow.

When the second end surface 20a of the mounting object 20 is abutted against the first end surface 10a of the motherboard 10, the first metallized conductive structure 12 on the inner wall of the cavity 10b corresponds to the second pad structure 21 on the second end surface 20a, and the second metallized conductive structure 22 on the side surface 20b corresponds to the first pad structure 11 on the first end surface 10 a. After the solder material flows back through the furnace, a connection relationship is formed between the first metallization conductive structure 12 and the second pad structure 21, and a connection relationship is formed between the second metallization conductive structure 22 and the first pad structure 11, so that not only is a connection relationship in the Z direction of the space (the direction in which the motherboard 10 is attached to the mounting object 20), but also a connection relationship is formed in the X, Y direction of the space (the plane in which the X, Y direction is located and the plane in which the first end face 10a is located), and thus, the connection reliability of the mounting object 20 on the motherboard 10 is better, and the connection strength is higher.

As can be seen from the above, the circuit board module 100 provided in the embodiment of the utility model includes the motherboard 10 and the installation object 20, and the installation object 20 is connected with the motherboard 10 through a welding connection manner. Specifically, the first pad structure 11 is disposed on the first end surface 10a of the motherboard 10, the first metallization via structure 12 is formed on the inner wall of the cavity 10b, the second pad structure 21 is disposed on the second end surface 20a of the mounting object 20, and the second metallization via structure 22 is formed on the side surface 20b of the mounting object 20, when the first and second metallization via structures are welded, the welding material in the first metallization via structure 12 is connected with the second pad structure 21 after passing through the furnace, and the welding material in the second metallization via structure 22 is connected with the first pad structure 11 after passing through the furnace, so that, in addition to forming the connection of the welding spot 3 in the Z direction, the welding material in the first metallization via structure 12 and the second metallization via structure 22 can also increase the connection point in the X, Y direction in space, thereby improving the welding connection strength between the motherboard 10 and the mounting object 20.

Referring to fig. 8 to 10, in some embodiments, the first metallization via structure 12 includes a first metal film layer 121 formed on an inner wall of the cavity 10 b.

It can be appreciated that a first metal film 121 is formed on the inner wall of the cavity 10b by electroplating, spraying, etc., and the first metal film 121 may be a copper layer, a silver layer, etc., and the solder material is fixed on the first metal film 121 after reflow in the furnace by utilizing the wettability between the solder material and the metal film.

Here, the first metal film layer 121 can meet the conduction requirement between the motherboard 10 and the mounting object 20, and at the same time, provides an attachment location for the solder material.

In some embodiments, the first metal film 121 covers at least a portion of the inner wall of the cavity 10 b.

It can be appreciated that the area of the first metal film layer 121 disposed on the inner wall of the cavity 10b is not limited, and may cover all the inner walls of the cavity 10b or may cover part of the inner walls of the cavity 10b according to actual use requirements, so as to adjust the number of welding points, connection strength and the amount of welding materials between the motherboard 10 and the installation object 20.

Illustratively, a first metal film layer 121 is formed on the entire inner wall of the cavity 10b, i.e., the first metal film layer 121 covers the entire inner wall of the cavity 10b, while a solder material is disposed at a position corresponding to the second pad structure 21.

Illustratively, a first metal film layer 121 is formed at a partial inner wall of the cavity 10 b. For example, as shown in fig. 10, the number of the first metal film layers 121 is plural, and a certain interval is formed between the first metal film layers 121 in the X direction or the Y direction, and the first metal film layers 121 may be selected to entirely cover or partially cover the inner wall of the cavity 10b in the Z direction. Alternatively, as shown, the first metal film layer 121 is entirely covered in the X direction or the Y direction, and the first metal film layer 121 is partially covered in the Z direction and extends in a direction toward the first end face 10a so as to satisfy contact of the solder material with the mounting object 20.

Referring to fig. 4 and 5, in some embodiments, the first metallization via structure 12 includes a plurality of first metallization grooves 122, and each first metallization groove 122 is distributed on the inner wall of the cavity 10 b.

It is understood that the first metallization groove 122 may be a metal layer formed on the groove wall of the groove structure after forming the groove structure on the inner wall of the cavity 10 b; the groove structure may be formed on the metal layer after forming the metal layer on the inner wall of the cavity 10 b. The first metallization grooves 122 serve to meet the conduction requirements between the motherboard 10 and the mounting object 20, and also provide attachment locations for the solder material.

And, the groove extension direction and extension degree of each first metallization groove 122 may not be limited. For example, the groove extending direction of the first metallization groove 122 is the same as the thickness direction of the main board 10, that is, the first metallization groove 122 is a straight groove opened perpendicular to the first end face 10 a; alternatively, the groove extending direction of the first metallization groove 122 forms an angle with the thickness direction of the main board 10, i.e. the first metallization groove 122 is an inclined groove arranged obliquely. Meanwhile, the first metallization groove 122 may penetrate through the motherboard 10, or the first metallization groove 122 may not penetrate through the motherboard 10.

In some embodiments, the slot extension direction of the first metallization slot 122 is the same as the thickness direction of the motherboard 10.

By adopting the above technical scheme, the processing difficulty of the first metallization groove 122 is low, the molding efficiency is high, and each first metallization groove 122 is easier to be formed on the inner wall of the concave cavity 10 b.

In some embodiments, the first metallization groove 122 penetrates the motherboard 10 along the thickness direction of the motherboard 10.

By adopting the technical scheme, the volume maximization of each first metallization groove 122 can be realized, the total accommodating amount of welding materials is increased, and the welding connection strength is further improved.

In some embodiments, the channel profile of each first metallization channel 122 includes any one or more of an arc, a V, and a square, in the thickness direction of the motherboard 10.

Alternatively, as shown in fig. 5, in the thickness direction of the main board 10, the groove profile of each first metallization groove 122 is semicircular, and the first metallization groove 122 penetrates the main board 10 in the thickness direction of the main board 10, and the groove extending direction of the first metallization groove 122 is the same as the thickness direction of the main board 10.

Referring to fig. 8 and 9, in some embodiments, the second metallization via structure 22 includes a second metal film layer 221 formed on the side surface 20b.

It can be appreciated that the second metal film 221 is formed on the side 20b of the mounting object 20 by electroplating, spraying, or the like, and the second metal film 221 may be a copper layer, a silver layer, or the like, and the solder material is fixed on the second metal film 221 after reflow in the furnace by utilizing wettability between the solder material and the metal film.

Here, the second metal film layer 221 can meet the conduction requirement between the motherboard 10 and the mounting object 20, and at the same time, provide an attachment location for the solder material.

In some embodiments, the second metal film 221 covers at least a portion of the side 20b.

It can be appreciated that the area of the second metal film 221 disposed on the side 20b of the mounting object 20 is not limited, and may cover all the side 20b of the mounting object 20 or may cover a part of the side 20b thereof according to actual use requirements, so as to adjust the number of welding points, connection strength and the amount of welding materials between the motherboard 10 and the mounting object 20.

Illustratively, the second metal film layer 221 is formed on all the side surfaces 20b of the mounting object 20, that is, the second metal film layer 221 covers all the side surfaces 20b thereof, while the solder material is disposed at a position corresponding to the first pad structure 11.

Illustratively, the second metal film layer 221 is formed at the inner wall of the installation object 20. For example, as shown in fig. 10, the number of the second metal film layers 221 is plural, and a certain interval is formed between the second metal film layers 221 in the X direction or the Y direction, and the second metal film layers 221 may be selected to entirely cover or partially cover the side surface 20b in the Z direction. Alternatively, as shown, the second metal film layer 221 is entirely covered in the X direction or the Y direction, and the second metal film layer 221 is partially covered in the Z direction and extends in a direction toward the second end surface 20a so as to satisfy the contact of the solder material with the motherboard 10.

Referring to fig. 4 and 5, in some embodiments, the second metallization via structure 22 includes a plurality of second metallization grooves 222, and each second metallization groove 222 is distributed on the side 20b of the mounting object 20.

It is understood that the second metallization groove 222 may be a metal layer formed on the groove wall of the groove structure after forming the groove structure on the inner wall of the installation object 20; the groove structure may be formed on the metal layer after the metal layer is formed on the side surface 20b. The second metallization grooves 222 serve to meet the conduction requirements between the motherboard 10 and the mounting object 20, and also provide attachment locations for the solder material.

And, the groove extension direction and the extension degree of each second metallization groove 222 may not be limited. For example, the groove extending direction of the second metallization groove 222 is the same as the thickness direction of the mounting object 20, that is, the second metallization groove 222 is a straight groove opened perpendicular to the second end face 20 a; alternatively, the groove extending direction of the second metallization groove 222 forms an angle with the thickness direction of the mounting object 20, i.e., the second metallization groove 222 is a slanted groove provided obliquely. Meanwhile, the second metallization groove 222 may penetrate through the mounting object 20, or the second metallization groove 222 may not penetrate through the mounting object 20 yet.

In some embodiments, the slot extension direction of the second metallization slot 222 is the same as the thickness direction of the mounting object 20.

By adopting the above technical scheme, the processing difficulty of the second metallization grooves 222 is low, the molding efficiency is high, and each second metallization groove 222 is easier to form on the side surface 20b.

In some embodiments, the second metallization groove 222 penetrates the mounting object 20 in the thickness direction of the mounting object 20.

By adopting the technical scheme, the volume maximization of each second metallization groove 222 can be realized, the total accommodating amount of welding materials is increased, and the welding connection strength is further improved.

In some embodiments, the channel profile of each second metallization channel 222 includes any one or more of an arc, a V, a square, in the thickness direction of the mounting object 20.

Alternatively, as shown in fig. 5, in the thickness direction of the board of the mounting object 20, the groove profile of each second metallization groove 222 is semicircular, and the second metallization groove 222 penetrates the mounting object 20 in the thickness direction of the mounting object 20, and the groove extending direction of the second metallization groove 222 is the same as the thickness direction of the mounting object 20.

Referring to fig. 4 to 7, in a specific embodiment, two rows of first pad structures 11 are disposed on the first end surface 10a of the motherboard 10, the two rows of first pad structures 11 are disposed around the cavity 10b, a plurality of first metallization grooves 122 are disposed on the inner wall of the cavity 10b, in the thickness direction of the motherboard 10, the groove profile of each first metallization groove 122 is semicircular, the first metallization groove 122 penetrates through the motherboard 10 along the thickness direction of the motherboard 10, and the groove extending direction of the first metallization groove 122 is the same as the thickness direction of the motherboard 10; two rows of second pad structures 21 are provided on the second end surface 20a of the mounting object 20, a plurality of second metallization grooves 222 are provided on the side surface 20b, the groove profile of each second metallization groove 222 is semicircular in the thickness direction of the mounting object 20, the second metallization grooves 222 penetrate through the mounting object 20 in the thickness direction of the mounting object 20, and the groove extending direction of the second metallization grooves 222 is the same as the thickness direction of the mounting object 20.

Wherein, the first bonding pad structure 11 near the concave cavity 10b is correspondingly connected with the second bonding pad structure 21 near the side surface 20b, each first metallization groove 122 is correspondingly connected with the second bonding pad structure 21 far from the side surface 20b, and each second metallization groove 222 is correspondingly connected with the first bonding pad structure 11 far from the concave cavity 10 b. Compared with the mode of directly performing welding connection by only adopting the traditional welding spots 3, the avoidance size is not required to be reserved, the overall dimension of the installation object 20 can be designed to be smaller, and meanwhile, the overlapping area of the main board 10 and the installation object 20 designed by welding connection can also be smaller, so that when the required number of the installation objects 20 is fixed, the installation area occupied on the first end face 10a of the main board 10 can be smaller, and the miniaturization development of the circuit board module 100 is more facilitated.

For example, as shown in fig. 2, in the manner of directly performing the soldering connection by using the conventional solder joint 3, a certain avoiding dimension H needs to be set between the solder joint 3 on the main circuit board 1 and the slot edge of the through slot, and at the same time, a certain avoiding dimension M needs to be set between the solder joint 3 on the component 2 and the outer edge, which is difficult to avoid when the main circuit board 1 and the component 2 are manufactured. In the circuit board module 100 provided in the embodiment of the present utility model, the design of the first metallization groove 122 and the second metallization groove 222 is not considered with avoidance size, for example, round pads with a diameter of 0.3mm are used as welding points, the space between the two round pads is 0.35mm, avoidance sizes H and M are both 0.2mm, so that a module board with a minimum width of 0.3+0.3+0.35+0.2+0.2=1.35 mm and a length by width of 23.5×8.5mm required for designing two parallel rows of pads can be laid out with 164 welding points, and by adopting the layout mode of the present utility model, 3 rows of welding points, namely, two metallization grooves and one pad structure, the required minimum width is 0.3+0.3+0.35=0.95 mm, and the length by width is 23.5×8.5mm, can be laid out with 246 welding points on the mounting object 20, and the layout density is improved by 50%.

In some embodiments, the mounting object 20 comprises a sub-board.

By adopting the above-described technical solution, the sub-board is one of the objects to be welded to the main board 10, and of course, there are other mounting objects 20.

Referring to the drawings, in some embodiments, the sub-plate has a plurality of sides 20b, and at least one side 20b is formed with a second metallization via 22.

By adopting the above technical solution, the number of the second metallization via structures 22 formed can be increased or decreased according to the actual connection strength requirement.

Illustratively, the sub-plate has four sides 20b, and the second metallization via 22 may be selectively formed on one of the sides 20b, any two sides 20b, any three sides 20b, and four sides 20b, depending on the actual connection strength requirements.

Referring to fig. 2, an embodiment of the present utility model further provides a terminal device 1000, including the above-mentioned circuit board module 100.

The terminal device 1000 provided by the embodiment of the utility model may be a mobile phone, a tablet computer, a wearable device (such as a watch), a vehicle-mounted device, and the like, but is not limited thereto. Specifically, the terminal device 1000 is taken as a mobile phone as an example for description.

In the whole mobile phone, the circuit board module 100 comprises a main board 10 and a plurality of auxiliary boards, wherein the outline of the main board 10 is matched with the outline of the mobile phone, and the auxiliary boards are laminated on the main board 10 along the thickness direction of the mobile phone.

The terminal device 1000 provided by the embodiment of the utility model has improved anti-seismic performance in the extreme case on the basis of the circuit board module 100.

The foregoing is merely illustrative embodiments of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present utility model, and the utility model should be covered.

Claims (14)

1. A circuit board module, characterized in that: the novel welding device comprises a main board and a plurality of installation objects, wherein the main board is provided with a first end face for connecting the installation objects, a first welding pad structure is arranged on the first end face, a concave cavity is formed in the first end face in a concave mode, the first welding pad structure is arranged in the concave cavity in a surrounding mode, a first metallization conducting structure is formed in the inner wall of the concave cavity and used for containing welding materials, the installation objects are provided with side faces and a second end face corresponding to the first end face, a second welding pad structure is arranged on the second end face, a second metallization conducting structure is formed in the side faces and used for containing welding materials, the first metallization conducting structure is correspondingly connected with the second welding pad structure, and the second metallization conducting structure is correspondingly connected with the first welding pad structure.

2. The circuit board module according to claim 1, wherein: the first metallization via structure includes a first metal film layer formed on an inner wall of the cavity.

3. The circuit board module according to claim 2, wherein: the first metal film layer at least covers part of the inner wall of the concave cavity.

4. The circuit board module according to claim 1, wherein: the first metallization conducting structure comprises a plurality of first metallization grooves, and each first metallization groove is distributed on the inner wall of the concave cavity.

5. The circuit board module according to claim 4, wherein: the groove extending direction of the first metallization groove is the same as the thickness direction of the main board.

6. The circuit board module according to claim 4 or 5, wherein: the first metallization groove penetrates through the main board along the thickness direction of the main board.

7. The circuit board module according to claim 1, wherein: the second metallization via structure includes a second metal film layer formed on the side surface.

8. The circuit board module according to claim 7, wherein: the second metal film layer at least covers part of the side face.

9. The circuit board module according to claim 1, wherein: the second metallization via structure comprises a plurality of second metallization grooves, and each second metallization groove is distributed on the side surface.

10. The circuit board module according to claim 9, wherein: the second metallization groove extends in the same direction as the thickness direction of the mounting object.

11. The circuit board module according to claim 9 or 10, wherein: the second metallization groove penetrates through the installation object along the thickness direction of the installation object.

12. The circuit board module according to claim 1, wherein: the mounting object includes a sub-board.

13. The circuit board module according to claim 12, wherein: the auxiliary plate is provided with a plurality of side surfaces, and at least one side surface is provided with the second metallization conducting structure.

14. A terminal device, characterized by: a circuit board module comprising any of claims 1 to 13.