JP6906666B2 - Glass with display module and undercut plastic frame - Google Patents

Description

The following description relates to electronic devices. In particular, the following relates to electronic devices including display assemblies having several active layers. The display assembly is designed to bend or bend around the force sensing layer. Also, in order to increase the amount of space available in the electronic device, the electrical and mechanical connections of the active layer are located at different locations.

The electronic device may include a display assembly. When the display assembly contains multiple layers, the volume occupied by the display assembly increases, which can lead to engineering and design changes to accommodate the increased volume. Moreover, each of the layers requires electrical and mechanical connections. Additional design challenges can arise when electrical and mechanical connections are stacked on top of each other or in close proximity to each other.

In one aspect, a display assembly for an electronic device is described. The display assembly may include a touch sensitive layer capable of detecting touch inputs capable of controlling electronic devices. The display assembly may further include a force sensing layer capable of detecting the amount of force applied to the touch sensing layer. The display assembly may further include a display layer capable of presenting visual information. The display layer can be at least partially positioned between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display layer is at least partially curved around the force sensing layer.

In another aspect, electronic devices are described. The electronic device may include a protective layer formed from a transparent material. The electronic device may further include a display assembly covered by a protective layer. The display assembly may include a force sensing layer capable of detecting the amount of force applied to the protective layer. The display assembly may further include a display layer between the touch sensitive layer and the force sensitive layer. In some embodiments, the display is at least partially bent around a force sensing layer that defines the bend. The electronic device may further include a frame carrying a protective layer. The frame may include a notch that at least partially receives the display at the bend.

In another aspect, a method of forming a display assembly for an electronic device is described. The method may include positioning the display layer between the touch sensitive layer and the force sensitive layer. The touch sensing layer may be configured to detect the touch input that controls the electronic device. The force sensing layer may be configured to detect the amount of force applied to the touch sensing layer. The method may further include bending the display layer such that the display layer is at least partially curved around the force sensing layer.

Other systems, methods, features and advantages of embodiments will be apparent or will be apparent to those skilled in the art by scrutiny of the figures below and "forms for carrying out the invention". All such additional systems, methods, features and advantages are contained within this "form for carrying out the invention" and this "outline of the invention", within the scope of the embodiment and in the accompanying "Patent". It is intended to be protected by "Claims".

The present disclosure, along with the accompanying drawings, will be readily understood by the following "forms for carrying out the invention". In the accompanying drawings, similar reference numbers indicate similar structural elements.

A front isometric view of an embodiment of an electronic device according to some described embodiments is shown.

The rear isometric view of the electronic device shown in FIG. 1 is shown, further showing the additional features of the electronic device.

A partial decomposition diagram of the electronic device shown in FIG. 1 is shown showing the various components of the electronic device.

A partial decomposition diagram of the electronic device shown in FIG. 1 is shown, further showing additional components of the electronic device.

A cross-sectional view of the electronic device shown in FIG. 1 taken along line AA of FIG. 1 is shown.

FIG. 3 shows a cross-sectional view of an alternative embodiment of an electronic device according to some described embodiments.

A cross-sectional view of the electronic device shown in FIG. 1 taken along line BB of FIG. 1 is shown.

FIG. 3 shows a cross-sectional view of an alternative embodiment of an electronic device according to some described embodiments.

FIG. 3 shows a plan view of one embodiment of the frame according to some described embodiments.

FIG. 9 shows a cross-sectional view of the frame shown in FIG. 9 taken along lines AA.

FIG. 6 shows a cross-sectional view of an alternative embodiment of the frame showing a surface of the frame having protruding features according to some described embodiments.

FIG. 6 shows a cross-sectional view of an embodiment of an electronic device showing an electronic device having a frame and a support element partially embedded in the frame and substantially extending in the frame.

A cross-sectional view of an embodiment of an electronic device showing an electronic device with a protective cover and a side wall component extending to provide additional support for the protective cover, according to some described embodiments. show.

FIG. 6 shows a cross-sectional view of an embodiment of an electronic device showing an electronic device with various structural extensions according to some described embodiments.

FIG. 5 shows a plan view of an embodiment of an electronic device showing a plate positioned within an enclosure of the electronic device according to some described embodiments.

FIG. 15 shows a partial side view of the electronic device shown in FIG. 15, further showing a first extension of the display assembly and the fixed plate.

FIG. 6 shows a cross-sectional view of an embodiment of an electronic device showing an enclosure and an electronic device having a support structure integrally formed with the enclosure, according to some described embodiments.

FIG. 3 shows a plan view of one embodiment of the protective cover according to some described embodiments.

FIG. 8 shows a cross-sectional view of the protective cover shown in FIG. 18, taken along line BB, further showing the notches formed in the protective cover.

FIG. 6 shows a cross-sectional view of an embodiment of an electronic device showing a protective cover (shown in FIGS. 18 and 19) fixed to an enclosure according to some described embodiments.

FIG. 3 shows a cross-sectional view of an embodiment of an electronic device, according to some described embodiments, showing a protective cover extending over a frame and positioned close to a side wall component.

An exploded view of the battery according to some described embodiments is shown.

The plan view of the 1st electrode shown in FIG. 22 is shown.

FIG. 5 shows a plan view of alternative embodiments of electrodes suitable for use in battery assembly, according to some described embodiments.

FIG. 5 shows a plan view of alternative embodiments of electrodes suitable for use in battery assembly, according to some described embodiments.

FIG. 5 shows a plan view of alternative embodiments of electrodes suitable for use in battery assembly, according to some described embodiments.

Demonstrates one embodiment of a battery in an electronic device, according to some described embodiments, wherein the battery has a shape that accommodates internal components of the electronic device.

Demonstrates an alternative embodiment of a battery assembly in an electronic device, wherein the battery assembly according to some described embodiments has a shape that accommodates a plurality of internal components of the electronic device.

Demonstrates an alternative embodiment of a battery assembly in an electronic device, wherein the battery assembly according to some described embodiments has an opening for accommodating internal components of the electronic device.

An alternative embodiment of the battery assembly in an electronic device, wherein the battery assembly is located in an enclosure (of the electronic device) on the first internal component of the electronic device, according to some described embodiments. show.

FIG. 30 shows a cross-sectional view of the electronic device shown in FIG. 30, taken along line CC of FIG.

An exploded view of the circuit board assembly shown in FIG. 4 according to some described embodiments is shown.

FIG. 3 shows a cross-sectional view of the circuit board assembly shown in FIG. 32, showing various internal components of the circuit board assembly.

An alternative embodiment of a circuit board assembly is shown showing a circuit board assembly modified for intrusion protection.

An alternative embodiment of a circuit board assembly is shown showing a circuit board assembly having a flexible circuit electrically coupled to the circuit board of the circuit board assembly according to some described embodiments.

FIG. 5 shows a cross-sectional view of the circuit board assembly shown in FIG. 35, showing a flexible circuit extending between the circuit boards.

FIG. 6 shows a cross-sectional view of an alternative embodiment of a circuit board assembly showing the internal components of a circuit board assembly having the corresponding geometry according to some described embodiments.

FIG. 6 shows a cross-sectional view of an alternative embodiment of a circuit board assembly showing a circuit board assembly with some solder masks used to support the circuit board according to some described embodiments.

An isometric view of an embodiment of an audio module according to some described embodiments is shown.

FIG. 3 shows a cross-sectional view of the audio module shown in FIG. 39, taken along line DD of FIG. 39, showing some internal features.

A cross-sectional view of an electronic device showing an audio module positioned in the electronic device is shown.

Exploded views of the thermal dispersion assembly according to some described embodiments are shown.

FIG. 5 shows a partial cross-sectional view of the electronic device shown in FIG. 1, showing a heat dispersion assembly positioned in the electronic device.

A side view of an alternative embodiment of the thermal dispersion assembly according to some described embodiments is shown.

Shown is an isometric view of an alternative embodiment of the thermal dispersion assembly, showing the thermal dispersion assembly modified to accept the components according to some described embodiments.

An isometric view of an alternative embodiment of the thermal dispersion assembly according to some described embodiments is shown.

A flow diagram showing how to form a display assembly for an electronic device according to some described embodiments is shown.

A flow diagram illustrating a method of forming a battery assembly for an electronic device according to some described embodiments is shown.

A flow diagram showing a method of forming a circuit board assembly according to some described embodiments is shown.

A flow diagram showing a method of assembling an electronic device including an enclosure defining an internal volume according to some described embodiments is shown.

FIG. 5 shows a flow diagram illustrating a method of making a heat dispersion assembly that removes heat from heat generating components in an electronic device having enclosure sidewalls, according to some described embodiments.

Those skilled in the art, according to convention, the various features of the drawings described below are not necessarily drawn in proportion to their actual size, and the various features of the drawings and the dimensions of the elements are described herein. It will be recognized and understood that it may be scaled up or down to show more clearly the embodiments of the present invention.

Next, it will be described in detail with reference to the typical embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. Conversely, the following description covers alternatives, modifications, and equivalents that may be included within the intent and scope of the described embodiments, as defined by the appended claims. It is intended to be done.

In the "modes for carrying out the invention" below, reference is made to the accompanying drawings that form part of the description and illustrate specific embodiments according to the described embodiments. These embodiments will be described in sufficient detail so that those skilled in the art can practice the embodiments described, but these embodiments are not limiting and therefore other embodiments. It will be appreciated that embodiments can be used and changes can be made without departing from the spirit or scope of the embodiments described.

The following disclosure relates to electronic devices. Electronic devices may include some extensions over traditional devices. For example, an electronic device may include an enclosure that defines the internal volume of the electronic device. The electronic device may further include a display, which extends to the enclosure in at least some places, thereby increasing the size of the display. The display can be part of a display assembly that further includes a touch sensitive layer and a force sensitive layer. To accommodate the increased display size, the electronic device may include a boundary (or frame) surrounding the display, and the frame may have a reduced size. However, without some changes, the reduced size boundaries can expose the electrical and mechanical connections between the display assembly components (in electronic devices) and the flexible circuitry. In this regard, some components of the display assembly are electrically and electrically with their respective circuits (including flexible circuits) at different locations throughout the electronic device to hide electrical and mechanical connections from view. Can be mechanically coupled. For example, a touch-sensitive layer and a display can be electrically and mechanically coupled to their respective circuits at some location within an electronic device, and a force-sensitive layer can be a touch-sensitive layer, a display, and their respective. It is electrically and mechanically coupled to the circuit at different locations away from the electrical and mechanical connections to the flexible circuit. Also, by routing electrical and mechanical connections at different locations, the volume occupied by the display assembly (and its components) can be reduced, and additional space in the internal volume of the electronic device can be added to the electronic device. Available for use with different components (s) within.

The electronic device may further include a circuit board assembly designed to occupy less space in the electronic device. For example, a circuit board assembly can be divided into a first circuit board stacked on top of a second circuit board. A laminated configuration of multiple circuit boards (one stacked on top of the other) can reduce the footprint of the circuit board assembly in two dimensions. Also, the circuit boards described above may include operational components (such as integrated circuits or processor circuits) located on a plurality of opposing surfaces. The circuit board assembly also includes a first circuit plate and a second circuit board so that the first circuit board and the second circuit board (and their respective operating components) communicate with each other. It may include several interposers or interconnects designed to carry signals between.

In some cases, the laminated circuit board assembly has a working component (located above one of the circuit boards) that includes a recess and a convex (or protrusion) that is partially positioned within the recess. Features) may include additional operating components (located above one of the other circuit boards). In this way, the circuit boards are positioned closer to each other based on the recesses receiving some of the additional operating components, thereby further reducing the footprint of the laminated circuit board assembly. be able to. Moreover, in some cases, the operating components may be electrically coupled to each other. For example, the recess may include a connector and the protrusion may include a connector that is electrically coupled to the connector of the recess. As a result of the electrical connections between the operating components, the circuit boards can also telecommunications with each. This may reduce the need for separate and dedicated electrical connectors used to electrically couple the circuit boards.

The electronic device may further include a battery assembly or an internal power supply. Due in part to changes to the display assembly and circuit board assembly that create additional space in the enclosure, the battery assembly increases in size and occupies at least part of the additional space, thereby charging the battery assembly. The capacity can be increased. In addition, the battery assembly may include shapes other than the traditional linear shape. For example, the battery assembly may include an L-shape structure formed by die-cutting some electrodes into an L-shape structure similar to that of the battery assembly to form the battery assembly. Also, additional components such as antennas and circuits may be repositioned within the electronic device to increase the size of the battery assembly. Further, the battery assembly may include modifications such as channels designed to accommodate flexible circuits routed across the battery assembly, particularly across channels.

Also, in some cases, the enclosure may include a metal band coupled with a transparent protective layer (such as a cover glass) that covers the display assembly. The metal band may include a metal such as aluminum or a metal alloy containing aluminum. The enclosure may further include an additional protective layer coupled with a metal band. The additional protective layer may include non-metallic materials such as glass, sapphire and plastic. An additional protective layer may substantially define the back or bottom wall of the electronic device. Therefore, the amount of metal used for the enclosure is limited to the metal band, and the glass contains significantly lower thermal conductivity compared to the thermal conductivity of the metal forming the metal band, thus dissipating heat from the electronic device. The ability of the enclosure to disperse and dissipate can be limited.

When one or more components (such as integrated circuits) in an electronic device generate heat, the heat is removed from the internal volume to avoid damage to the components (or components) in the electronic device. It may be necessary to do. In this regard, the electronic device may include a thermal dispersion assembly disposed on or near an additional protective layer. The thermal dispersion assembly is designed to dissipate (or redistribute) the thermal energy generated from the thermal generating components (s) into the metal band, allowing the thermal energy to dissipate from the electronic device. .. The thermal dispersion assembly may include several layers of metal, one of which may contain a relatively high thermal conductivity (compared to the remaining layers). Therefore, the electronic device has the ability to remove heat from the electronic device before the temperature inside the electronic device increases and damages any of the internal components of the electronic device, while improving the overall aesthetics of the electronic device. Can also include an enclosure with a bottom wall made of glass. Moreover, a layer of relatively low thermal conductivity prevents heat transfer to the glass bottom wall, thereby preventing thermal energy from reaching the user of the electronic device while holding it, or it. Can be restricted.

Also, when the user interacts with the display assembly, the force sensing layer may determine the amount of force applied on the display to generate commands according to the determined amount of force. However, the force applied to the display assembly (via the protective layer covering the display assembly) can bend the display assembly and the protective layer, thereby reducing the internal volume and increasing the internal air pressure. The increased internal air pressure can affect other components, such as audio modules designed to generate acoustic energy. To shield the audio module from increased air pressure, the audio module includes a housing or enclosure that surrounds the components of the audio module, including the back volume of the audio module, from air in the internal volume of the electronic device. It can provide a shield and thus shield the back volume of the audio module from pressure changes in the electronic device. In this way, the audio module is unaffected by pressure changes in the electronic device and produces acoustic energy without interference from pressure changes.

Hereinafter, these embodiments and other embodiments will be discussed with reference to FIGS. 1 to 51. However, one of ordinary skill in the art will readily appreciate that the detailed description given herein with respect to these figures is for illustration purposes only and should not be construed as limiting. Let's do it.

FIG. 1 shows a front isometric view of an embodiment of the electronic device 100 according to some described embodiments. In some embodiments, the electronic device 100 is a tablet computer device. In another embodiment, the electronic device 100 is one or more straps (not shown) designed to surround the user's appendage (such as a wrist) to secure the electronic device 100 to the user. It is a wearable electronic device including. In the embodiment shown in FIG. 1, the electronic device 100 is a mobile communication device such as a smartphone. Thus, the electronic device 100 is, as a non-limiting example, in the form of cellular network communication, Bluetooth® communication (2.4 GHz), and / or wireless local area network (WLAN) communication (2.4 GHz to 5 GHz). Can enable wireless communication. As shown, the electronic device 100 may include a display assembly 102 that includes a display layer designed to present visual information in the form of text information, still images, and / or video information. Although not shown, the display assembly 102 may further include, for example, a touch sensitive layer designed to detect touch inputs to the display assembly 102 for controlling information presented on the display assembly 102. .. The display assembly 102 may further include a force sensing layer designed to detect the amount of force applied to the display assembly 102. The determined amount of force may correspond to a particular input or command to the processor circuit (not shown) that controls the display assembly 102. For example, the detected amounts of different forces may correspond to different or separate commands.

To protect the display assembly 102, the electronic device 100 may include a first protective layer 104 that overlaps the display assembly 102. A second protective layer (not shown) of the electronic device 100 is shown and described below. The first protective layer 104 may include, as a non-limiting example, a transparent material (s) including glass, sapphire, or plastic. As shown, the first protective layer 104 may include an opening that facilitates user interaction with the electronic device 100. For example, the first protective layer 104 may include a first opening 106 and a second opening 108. The electronic device 100 may include an image capture device (not shown) that captures an image (or a plurality of images) through the first opening 106. The electronic device 100 may further include an audio module (not shown) that produces acoustic energy in the form of audible sound exiting the electronic device 100 through the second opening 108.

Also, the electronic device 100 may include a band 110 that defines the outer perimeter of the electronic device 100. Generally, the band 110 includes a shape similar to the shape of a four-sided ring. However, other shapes are possible. The band 110 may also demarcate the plurality of sidewalls and openings to at least partially receive and secure the first protective layer 104 and the second protective cover (not shown). In some embodiments, the band 110 comprises a metal such as aluminum or an alloy containing aluminum. In this regard, the band 110 may be provided with a rigid support structure for the electronic device 100. Also, when the band 110 is made of metal, the band 110 may include several side walls, some of which are used to support wireless communication. For example, the band 110 may include a first side wall component 112 that forms a U-shaped design, and a second side wall component 114 that also forms a U-shaped design. In the first side wall component 112 and the second side wall component 114, the first side wall component 112 and the second side wall component 114 are each at least a part of the antenna for their respective radio circuits. Each may function with a radio circuit (not shown) in the electronic device 100 to form. For example, the first side wall component 112 may work with the WLAN radio circuit and the second side wall component 114 may work with the cellular network radio circuit.

Further, in the band 110, the third side wall component 116 and the fourth side wall component 118 are separated from the first side wall component 112 and the second side wall component 114 by a dividing region or an opening. The third side wall component 116 and the fourth side wall component 118 may be further included. For example, the band 110 is combined with a first partition region 122 and a second partition region 124 that separate the third side wall component 116 from the first side wall component 112 and the second side wall component 114. Can include. The band 110 also includes a third partition region 126 and a fourth partition region 128 that are combined to separate the fourth side wall component 118 from the first side wall component 112 and the second side wall component 114. Can include. The split region described above can be filled with a non-metallic material such as molded plastic (or other non-conductive material) to provide a flush, coplanar with the various parts of the band 110. When the first side wall component 112 and the second side wall component 114 are electrically insulated from the third side wall component 116 and the fourth side wall component 118, the first side wall component 112 and the first side wall component 112 and the second side wall component 114 are electrically insulated from each other. The side wall component 114 of the second can function as a part of the antenna, and the third side wall component 116 and the fourth side wall component 118 are the third side wall component 116 and the fourth side wall component 118, respectively. It can serve as an electrical ground for one or more internal components (not shown) that are electrically coupled to. Also, each of the first side wall component 112, the second side wall component 114, the third side wall component 116, and the fourth side wall component 118 is a protective structure for at least some internal components. Given the components, and if some heat-generating components (not shown) of the electronic device 100 are thermally coupled to at least one of the above-mentioned parts, the heat for those heat-generating components Can provide target dissipation and heat removal. Further, the first side wall component 112, the second side wall component 114, the third side wall component 116, and the fourth side wall component 118 are the first side wall, the second side wall, and the first side wall, respectively. It may represent at least a portion of the third side wall and the fourth side wall.

The electronic device 100 may further include one or more input devices. For example, the electronic device 100 includes a first button 130 designed to generate an input when pressed. The input may generate an electrical signal sent to a processor circuit (not shown) in the electronic device 100 to alter the visual information presented on the display assembly 102. As shown, the first button 130 is arranged along the third side wall component 116. However, other locations are possible. Also, although not shown, the electronic device 100 may include a switch designed to provide additional user input functionality.

The electronic device 100 may further include a data port 132 designed to accept and electrically couple a cable assembly (not shown). The data port 132 may receive data / communication from the cable assembly and may also receive electrical energy to charge the battery assembly (not shown) located in the electronic device 100. The electronic device 100 may also include additional openings designed for various user interactions. For example, the electronic device 100 may include an audio module (not shown) located near an opening 134 or through hole formed in a second side wall component 114. The opening 134 allows the acoustic energy generated from the audio module to exit the electronic device 100. The electronic device 100 may further include a microphone (not shown) located near the opening 136 or through hole formed in the second side wall component 114. The microphone may be positioned to receive acoustic energy through the opening 136.

FIG. 2 shows a rear isometric view of the electronic device 100 shown in FIG. 1, further showing the additional features of the electronic device 100. As shown, the electronic device 100 may include a second protective layer 144 fixed to the band 110. The second protective layer 144, as a non-limiting example, includes an internal volume or cavity that, in combination with the band 110, receives several internal components such as circuit boards, integrated circuits, and battery assemblies. The enclosure can be defined. In this regard, the band 110 receives a first protective layer 104 (shown in FIG. 1) where the first edge region and the second edge region are opposite or opposite to the band 110. It may include a first edge region that is present, as well as a second edge region that receives the second protective layer 144. Further, the second protective layer 144 may be referred to as a bottom wall or a rear wall.

In general, the second protective layer 144 may include a material (or a plurality of materials) that gives an aesthetic finish, such as glass, sapphire, or plastic. Also, in some cases, the material composition of the second protective layer 144 is the radio frequency (“radio frequency, RF”) communication generated from the internal radio circuit (not shown) of the electronic device 100. It may be possible to allow permeation through the protective layer 144 of. In this way, the electronic device 100 may wirelessly communicate with another device (not shown) via RF communication that is not substantially suppressed by the second protective layer 144.

The second protective layer 144 may also include an opening that facilitates user dialogue with the electronic device 100. For example, the second protective layer 144 may include a first opening 146 and a second opening 148. The electronic device 100 may include an image capture device (not shown) that captures an image (or a plurality of images) through the first opening 146. The electronic device 100 further includes a flash module (not shown) matched with the second opening 148, the flash module for improving the image quality of the image (s) taken by the image capture device. Can generate light energy through the second opening 148 during an image capture event from the image capture device. Also, in addition to the first button 130 (shown in FIG. 1), the electronic device 100 is designed to generate an input when pressed, in a manner similar to the input of the first button 130. It may further include a second button 150 that has been made. As shown, the second button 150 is arranged along the fourth side wall component 118. However, other locations are possible.

FIG. 3 shows a partial decomposition diagram of the electronic device 100 shown in FIG. 1, showing various components of the electronic device 100. Some features of the electronic device 100 are not shown for simplicity. As shown, the first protective layer 104 may overlap the display assembly 102. In addition, the first protective layer 104 may be adhesively fixed to the display assembly 102 by an adhesive layer (not shown).

As shown, the display assembly 102 includes a touch sensing layer 202 designed to receive touch input, a display layer 204 designed to present visual information, and a first protective layer 104, touch sensing. With the force sensing layer 206 designed to detect the amount of force applied to or applied to the display layer 204 as the force applied to the layer 202 and at least one of the display layers 204. May include. Also, although not shown, the display assembly 102 may include an adhesive layer for adhesively fixing the touch sensitive layer 202 to the display layer 204 and adhesively fixing the display layer 204 to the force sensitive layer 206. ..

The touch sensing layer 202 is designed to receive a touch input, for example, when a user (not shown) presses the first protective layer 104. The touch sensing layer 202 may include capacitive touch sensing technology. For example, the touch sensitive layer 202 may include a layer of charge-retaining capacitive material. The layer of capacitive material is designed to form part of a plurality of capacitive parallel plates over the entire location corresponding to display layer 204. In this regard, when the user touches the first protective layer 104, the user forms one or more capacitors. Moreover, the user causes a voltage drop across one or more capacitors, which changes the charge of the capacitive material at a particular contact point (or multiple contact points) corresponding to the location of the user's touch input. Capacitive changes and / or voltage drops can be measured by the electronic device 100 to determine the location of the touch input. The touch sensitive layer 202 may also include an edge region 226 that includes a connector (shown later).

In some embodiments, the display layer 204 comprises a liquid crystal display (“liquid crystal display, LCD”) that relies on back lighting to present visual information. In the embodiment shown in FIG. 3, display layer 204 includes an organic light emitted diode (OLED) display designed to illuminate individual pixels when needed. When the display layer 204 includes OLED technology, the display layer 204 may include a reduced form factor compared to the form factor of the LCD display. In this regard, the display assembly 102 includes a smaller footprint, which may create more space for other components, such as the battery assembly (shown later). Further, when the display layer 204 includes OLED technology, the display layer 204 can be curved or bent without causing damage to the display layer 204. For example, as shown in FIG. 3, the display layer 204 includes a bend 208. The bent portion 208 may include a 180 degree bent portion or an approximately 180 degree bent portion. The bend 208 allows the display layer 204 to bend or bend around at least a portion of the force sensing layer 206, as shown in FIG. The display layer 204 is also used to electrically and mechanically couple the display layer 204 to a flexible circuit (not shown) that is electrically coupled to a circuit board assembly (shown below). The flexible circuit may include an edge region 210, including a connector (not shown), to allow the display layer 204 to communicate with the schematic assembly. Also, in some embodiments, the display layer 204 may include an active matrix organic light emitting diode (AMOLED) display. Further, as shown in FIG. 3, the edge region 226 of the touch sensing layer 202 is parallel to the edge region 210 of the display layer 204 even when the display layer 204 includes the bent portion 208. Or at least substantially parallel.

The force sensing layer 206 may operate by determining the amount of force or pressure applied to the first protective layer 104, the touch sensing layer 202, and / or the display layer 204. In this regard, the force sensing layer 206 can distinguish between different amounts of force applied to the electronic device 100. Different amounts of force can accommodate different user inputs. The force sensing layer 206 may include a plurality of parallel capacitor plate arrays in which one plate of each capacitor plate array is charged. When a force is applied to the first protective layer 104, it reduces the distance between the first protective layer 104 and one or more pairs of parallel plate capacitors, thereby reducing the distance between one or more pairs of parallel plate capacitors. Causes a change in capacity. The amount of change in capacitance corresponds to the amount of force applied on the first protective layer 104. Further, as shown in the enlarged view, the force sensing layer 206 includes the connector 218 arranged on the edge region 220 of the force sensing layer 206, and the edge region 220 includes the edge region 210 and the touch of the display layer 204. It can be perpendicular to, or at least substantially perpendicular to, the edge region 226 of the sensing layer 202. Thus, the connector 218 may be positioned perpendicularly, or at least substantially perpendicularly, to the connector (shown below) of display layer 204.

Further, in order to support the first protective layer 104 and facilitate the assembly of the first protective layer 104 with the band 110 (shown in FIG. 1), the electronic device 100 has a first protection. It may include a frame 154 that receives the layer 104 and secures it to the first protective layer 104 by the adhesive layer 166. Therefore, the frame 154 may include a size and shape corresponding to the size and shape of the first protective layer 104. The frame 154 may be at least partially positioned between the first protective layer 104 and the band 110. The frame 154 may be formed from a polymeric material such as plastic and may also include a metal ring (not shown) partially embedded in the polymeric material during the insert molding operation. In this regard, the frame 154 may structurally support the first protective layer 104 and one or more components of the display assembly 102. This will be illustrated later.

FIG. 4 shows a partial decomposition view of the electronic device 100 shown in FIG. 1, further showing additional components of the electronic device 100. Some features of the electronic device 100 are not shown for simplicity. As shown, the band 110 and the second protective layer 144 may be combined to provide an internal volume 152 for some internal components. For example, the electronic device 100 may include a battery assembly 160 designed to distribute current to the operating components of the electronic device 100. Battery assembly 160 may include a rechargeable battery designed to receive current during recharging. For example, the electronic device 100 may include an inductive receiver coil 162 (made of metal, such as steel) that is electrically coupled to the battery assembly 160. The induction receiver coil 162 may receive an induced current from the alternating magnetic field when placed in close proximity to an alternating magnetic field from an external device (not shown) of the electronic device. The induced current from the inductive receiver coil 162 passes through the transducer and the alternating current is converted to direct current, which is then used to charge (or recharge) the battery assembly 160. Also, the second protective layer 144 gives little or no impedance to the external magnetic field so that the alternating magnetic field reaches the induction receiver coil 162.

The battery assembly 160 also further includes a channel 164 containing reduced dimensions (eg, in the z dimension in Cartesian coordinates), whereby components such as flexible circuits (not shown) are aligned with the battery assembly 160. It may extend and allow it to pass over the battery assembly 160 along channel 164. Due in part to the increased space provided by channel 164, other internal components, such as antenna elements (not shown), are repositioned within the internal volume 152 of the electronic device 100, thereby. Additional space can be created for the battery assembly 160. In this way, the volume (size) of the battery assembly 160 can be increased so that the increased volume gives the electronic device 100 longer use of the electronic device 100 during the charging event of the battery assembly 160. The assembly 160 allows the electrical storage capacity to be increased.

The electronic device 100 may further include a circuit board assembly 170 that includes a plurality of operating components. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174, the first circuit board 172 being laminated on the second circuit board 174. In this way, the circuit board assembly 170 can save space in the x and y dimensions in the internal volume 152. Also, the first circuit board 172 and the second circuit board 174 may include a plurality of surfaces, each of which is designed to carry one or more components (such as a processor circuit). Various features of the circuit board assembly 170 are described below.

The electronic device 100 may further include a first audio module 182 and a second audio module 184, both of which are designed to generate acoustic energy in the form of audible sound. Each of the audio modules may include an opening for emitting acoustic energy. However, each audio module is designed to include an acoustic volume (defined by their respective audio module) isolated from the internal volume 152 of the electronic device 100. In this way, for example, by pressing and bending the first protective layer 104 (shown in FIG. 3) to provide touch and / or force inputs to the electronic device 100, the internal volume 152 is increased. When changed, the audio module is (acoustic) unaffected by changes in internal volume 152 and associated increased air pressure in internal volume 152. This will be further explained below.

The electronic device 100 may further include a thermal dispersion assembly 190. Although not shown, the thermal dispersion assembly 190 may include several layers of material. In some embodiments, the layers of material are different. For example, some layers are formed from a first type of material and other layers are formed from a second type of material that is different from the first type of material. The first type of material may include a material having a relatively high thermal conductivity. As an example, the first type of material may include copper, which is known to contain a thermal conductivity of ^{about 400 W / m * K (watt per meter per meter Kelvin degree).} Alternatively, the first type may include graphite, which is known to contain a thermal conductivity of ^{about 170 W / m * K.} Thus, the first type of material receives thermal energy and transfers or disperses the thermal energy from one location to another within the electronic device 100, thereby facilitating the removal of thermal energy from the electronic device 100. Suitable for The second type of material may include more robust materials such as stainless steel. In this regard, the second type of material may contain relatively lower thermal conductivity. However, the second type of material is 1) a protective cover for the first type of material, 2) a structural support for the electronic device 100, and / or 3) a component (eg, by welding operation). (Not shown) may provide a processable surface for fixing to the heat dispersion assembly 190. The various layers of the thermal dispersion assembly 190 are further described below.

The thermal dispersion assembly 190 is designed to reorient or redistribute the heat generated in the electronic device 100. For example, circuit board assembly 170 may include operating components such as integrated circuits known to convert electrical energy (supplied by battery assembly 160) into thermal energy during operation. The thermal dispersion assembly 190 may, as a non-limiting example, be thermally coupled to the circuit board assembly 170 by contact between the thermal dispersion assembly 190 and the circuit board assembly 170. Also, the thermal dispersion assembly 190 can be thermally coupled to the band 110 such that the thermal energy received by the thermal dispersion assembly 190 from the circuit board assembly 170 can be transferred to the band 110 at least partially. Therefore, at least some of the thermal conductivity lost by using the second protective layer 144 (non-metal) is restored by using the thermal dispersion assembly 190. The thermal dispersion assembly 190 is also sized and shaped according to the second protective layer 144 so that the thermal dispersion assembly 190 covers, or at least substantially covers, the surface of the second protective layer 144. Can include. For example, the x and y dimensions of the thermal dispersion assembly 190 can be the same as or substantially the same as the x and y dimensions of the second protective layer 144, respectively.

Although not shown, the electronic device 100 may include, as a non-limiting example, additional components such as a haptic engine and an internal antenna. Also, although not shown, the electronic device 100 may include several flexible circuits that telecommunications electronic components (eg, display assembly 102, circuit board assembly 170) with each other and with battery assembly 160.

FIG. 5 shows a cross-sectional view of the electronic device 100 shown in FIG. 1, taken along line AA of FIG. As shown, the layers of the display assembly 102, namely the touch sensing layer 202, the display layer 204, and the force sensing layer 206, are assembled. Although not shown, the display assembly 102 may include an adhesive layer for adhesively fixing the touch sensitive layer 202 to the display layer 204 and adhesively fixing the display layer 204 to the force sensitive layer 206.

The touch sensing layer 202 is designed to receive a touch input, for example, when a user (not shown) presses the first protective layer 104. The touch input is circuited from the touch sensitive layer 202 (shown in FIG. 4) by a first flexible circuit 212 that is electrically and mechanically coupled to the touch sensitive layer 202 by the connector 222 of the touch sensitive layer 202. It can be relayed to the board assembly 170. The connector 222 may be located on the edge region 226 (shown in FIG. 3) of the touch sensing layer 202. As shown, the first flexible circuit 212 may bend or bend around the display layer 204 and the force sensing layer 206 so as to electrically and mechanically couple with the touch sensing layer 202.

The frame 154 may include design considerations that accommodate the display assembly 102. For example, the frame 154 may include a notch 156 or undercut region designed to at least partially accept the first flexible circuit 212 and / or the display layer 204. As shown in FIG. 5, the notch 156 includes a size and shape for receiving a bent / curved region of both the display layer 204 and the first flexible circuit 212. The notch 156 includes a curvature that generally corresponds to the curvature of the first flexible circuit 212 and the display layer 204, but other shapes, including straight edges, are possible as the notch 156. Also, the notch 156 can be formed during the molding operation of the frame 154. Alternatively, the notch 156 can be formed after the molding operation, for example by a cutting operation.

Also, the frame 154 is adhesively fixed to the first protective layer 104 and the second side wall component 114 (of the band 110, shown in FIG. 1) by an adhesive layer (not labeled). NS. The frame 154 may include a support element 158 partially embedded in the frame 154. In some embodiments, the support element 158 comprises a ring formed of a metallic material that extends continuously around the display assembly 102 depending on the frame 154. However, the support element 158 can also be discontinuous and can therefore be selectively embedded in the frame 154. As shown, the support element 158 may extend along the frame 154 to support the display assembly 102 and the first protective layer 104. Also, the first flexible circuit 212 may be adhesively fixed to the support element 158 by an adhesive layer (not labeled).

FIG. 5 further shows some components of the display assembly 102 that are not coupled with other components but are coupled with a flexible circuit at some point. For example, the touch sensing layer 202 is electrically and mechanically coupled to the first flexible circuit 212 by the connector 222, and the display layer 204 is electrically and mechanically coupled to the second flexible circuit 214 by the connector 224. Combined, the connector 222 and connector 224 are placed in close proximity to a second side wall component 114 (defined by a U-shaped configuration, as shown in FIG. 1). The connector 218 (shown in FIG. 3) of the force sensing layer 206 is arranged along different edge regions of the force sensing layer 206 (see FIG. 3). Moreover, although the force sensing layer 206 is not coupled, the connector 222 and connector 224 are electrically connected to the first flexible circuit 212 and the second flexible circuit 214, respectively, in a location close to the notch 156 in the frame 154. And mechanically coupled. Further, the connector 222 may be positioned parallel to, or at least substantially parallel to, the connector 224. The force sensing layer 206 may be electrically and mechanically coupled to a flexible circuit (not shown) at another separate location (such as the connector 218 on the edge region 220, shown in FIG. 3). This is illustrated and described below.

FIG. 6 shows a cross-sectional view of an alternative embodiment of the electronic device 250 according to some described embodiments. The electronic device 250 may include any feature (s) or component (s) or components (s) previously described for the electronic device. For example, the electronic device 250 may include a display assembly 252 that includes a touch sensitive layer 262, a display layer 264, and a force sensitive layer 266. However, as shown in FIG. 6, the display layer 264 may include a substantially flat configuration over the entire display layer 264, with the flexible circuitry 274 electrically and mechanically coupled to the display layer 264. As such, it is bent around the force sensing layer 266.

FIG. 7 shows a cross-sectional view of the electronic device 100 shown in FIG. 1, taken along line BB of FIG. As shown, the connector 218 of the force sensing layer 206 (also shown in FIG. 3) is force sensitive to communicate the force sensing layer 206 with the circuit board assembly 170 (shown in FIG. 4). Layer 206 is electrically and mechanically coupled to a third flexible circuit 216 that is electrically coupled to the circuit board assembly 170. Also, the third flexible circuit 216 can be adhesively fixed to the support element 158 by an adhesive layer (not labeled).

As shown in FIG. 7, only the force sensing layer 206 includes electrical and mechanical connections to the flexible circuit. In other words, the connector 218 that provides the electrical and mechanical connection between the force sensing layer 206 and the third flexible circuit 216 is the connector 222 (shown in FIG. 5) and the display layer 204 of the touch sensing layer 202. It is located in a different location on the electronic device 100 as compared to the connector 224 (shown in FIG. 5). Also, based on the location of each edge region, the connector 218 of the force sensing layer 206 is positioned perpendicular to, or at least substantially perpendicular to, the connector 222 of the touch sensing layer 202 and the connector 224 of the display layer 204. Is determined.

Further, the connector 218 is partially defined by a side wall that is perpendicular to or nearly perpendicular to a portion of the second side wall component 114 (shown in FIGS. 1 and 5) (FIG. 1). Also shown) in close proximity to the third side wall component 116. As a result, the frame 154 may not require a notch 156 (shown in FIG. 5) to accommodate the display layer 204 and the first flexible circuit 212 (shown in FIG. 5). .. Therefore, the frame 154 may include an asymmetric frame. Moreover, the additional material of the frame 154 may allow for additional structural rigidity to support the display assembly 102 and the first protective layer 104.

FIG. 8 shows a cross-sectional view of an alternative embodiment of the electronic device 300 according to some described embodiments. The electronic device 300 may include any feature (s) or component (s) or components (s) previously described for the electronic device. For example, the electronic device 300 may include a first protective layer 304 fixed to the display assembly 302 and a frame 354 carrying the first protective layer 304. However, the first protective layer 304 may include an extending portion 306 extending radially outward from the first protective layer 304 in the circumferential direction at least partially. To accommodate the extension 306, the frame 354 may include a notch 366 receiving the extension 306. The extending portion 306 can provide the first protective layer 304 with an additional structural outline and can also provide an additional surface area for adhesively joining the first protective layer 304 with the frame 354. For example, as shown in FIG. 8, the first protective layer 304 is a region partially defined by the interface between the frame 354 and the first protective layer 304 including the extending portion 306. An adhesive layer 362 extending through can be adhesively fixed to the frame 354. Also, due to the distance or gap between the frame 354 and the first protective layer 304 (including the extending portion 306), the adhesive layer 362 can extend through the interface region by capillary force. As a result, the frame 354 has a first protective layer 304 by a plurality of (vertical) surfaces to form a stronger adhesive bond that counteracts or offsets forces on the electronic device 300 in multiple directions. Is fixed adhesively.

FIG. 9 shows a plan view of one embodiment of the frame 454 according to some described embodiments. As shown, the frame 454 may include a support element 458, which may include a metal ring formed into the frame 454. The frame 454 may be mounted on one or more of the electronic devices described herein and may include any of the features previously described for the frame. The surface 462 may include some modifications in order to improve the adhesive force between the adhesive (not shown) and the surface 462 of the frame 454. For example, as shown in the enlarged view, the surface 462 may include a textured region 464 designed to increase the surface tension or surface energy of the surface 462. The textured area 464 is a frame 454 and a transparent cover (such as the first protective layer 104 shown in FIG. 5) with an adhesive (such as the adhesive layer 166 shown in FIG. 5). The adhesive bond between them can be improved.

FIG. 10 shows a cross-sectional view of the frame 454 shown in FIG. 9, taken along line AA. As shown, the textured region 464 may include a plurality of indentations or divot formed in the frame 454 along the surface 462. The textured area 464 provides an additional surface area for the adhesive described above. Several different processes can be used to form the textured area 464. For example, a molding tool (not shown) used to mold the frame 454 may include protruding features that include a shape that corresponds to the shape of the textured region 464. Alternatively, the frame 454 can be formed using a molding tool that does not include protruding features, and after the molding operation that formed the frame 454, the surface 462 is, for example, laser-etched and textured region 464. Can be formed. Also, the textured area 464 defines some indentations or divot formed in the frame 454, but some shapes other than indentations or divots are possible. For example, the textured area 464 may contain some dents that are linear and / or non-linear.

FIG. 11 shows a cross-sectional view of an alternative embodiment of the frame 554 showing the surface 562 of the frame 554 having the protruding feature 564 according to some described embodiments. The frame 554 may include any of the features previously described for the frame. In this regard, the surface 562 is to receive the transparent cover (such as the first protective layer 104 shown in FIG. 5) by the adhesive (such as the adhesive layer 166 shown in FIG. 5). Can be used for. As shown, the protruding feature 564 can extend from the surface 562. The frame 554, in particular the protruding feature 564, includes an insert designed to pull out a portion of the molding material (used to form the frame 554), thereby extending the protruding feature 564 from the surface 562. , Can be formed by a molding tool (not shown). The overhang feature 564 provides an additional surface area for the adhesive described above.

FIG. 12 shows an embodiment of an electronic device 700 showing an electronic device 700 having a frame 754 and a support element 758 partially embedded in the frame 754 and substantially extending into the frame 754. A cross-sectional view of the form is shown. The electronic device 700 may include any of the features described herein for the electronic device. Also, as in the previous embodiment, the support element 758 may include a ring formed according to the frame 754 from a metal material extending around the display assembly 702 of the electronic device 700. As shown, the support element 758 extends in the z dimension beyond the display assembly 702 and also beyond the protective cover 704 (similar to the first protective layer 104 shown in FIG. 1). obtain.

The frame 754 can be widened in the y dimension to further extend the support element 758 in the z dimension. Also, the dimensions of the side wall component 714 (similar to the second side wall component 114 shown in FIG. 1) of the electronic device 700 are reduced in the y dimension to offset the increased dimensions of the frame 754. obtain. In addition, the material (s) forming the frame 754 can be modified to accommodate the support element 758. For example, the frame 754 may include a nylon material mixed with a glass filler material that improves the overall strength and rigidity of the frame 754. However, in some embodiments, the frame 754 is made of ceramic. In this regard, the side wall component 714 and the remaining side wall components may also be formed from ceramic.

Other factors should be taken into account when the supporting element 758 is extended in the manner described. For example, in some cases, the side wall component 714 forms part of an antenna assembly (not shown) that includes an antenna component designed to provide wireless communication for the electronic device 700. The support element 758, when formed from metal, can cause some interference with the antenna component. This may include forming a parallel plate capacitor between the antenna assembly (including the side wall component 714) and the support element 758. Therefore, the size, shape, material, and position of the support element 758 should be considered to prevent unwanted interference. Note that additional techniques may be used to optimize the size of the support element 758 and the proximity to the side wall components 714. This includes, for example, reducing the z-dimension of the support element 758 and / or can provide openings or discontinuities in the support element 758.

The electronic device 700 may include a surface 762 that receives and adhesively combines the protective cover 704. The surface 762 may include dimensions 766 that provide a generally flat surface. However, in some embodiments, the surface 762 is modified to improve the adhesive junction with the protective cover 704. The frame 754 may also include a notch 756 or undercut formed in the frame 754 that allows the frame 754 to receive the display assembly 702, including the flexible circuitry and flexible layer of the display assembly 702. .. The notch 756 can be resized (eg, increased) based on the increased dimensions of the frame 754. However, by increasing the size of the notch 756 (in the y dimension), additional material in the frame 754 can be removed in place below the surface 762. Note that additional techniques are used to optimize the size of the notch 756 with respect to the dimension 766 of the surface 762.

Also, in order to secure the frame 754 to the side wall component 714, the electronic device 700 may include an adhesive 768 that joins the frame 754 to the side wall component 714. As shown, the amount of adhesive 768 used is generally continuous or generally as indicated by the edges of the aforementioned portions where the side wall components 714, frame 754, and protective cover 704 are aligned with each other. Allows the formation of planar configurations. However, in order to provide additional protection to the protective cover 704 by the side wall component 714, the amount of adhesive 768 used may be reduced and the protective cover 704 may be lowered in the z dimension relative to the side wall component 714. In this way, the side wall component 714 may further cover a portion of the protective cover 704 and provide additional protection to the protective cover 704 from forces having a force component in the y dimension. To optimize the amount of adhesive 768 used to maintain a generally continuous and planar configuration, and to adjust the size of the frame 754, side wall components 714, and protective cover 704. Note that additional techniques may be used.

FIG. 13 shows an electronic device 800 having a protective cover 804 and a side wall component 814 extending to provide additional support for the protective cover 804, according to some described embodiments. A cross-sectional view of one embodiment of 800 is shown. The electronic device 800 may include any of the features described herein for the electronic device. Compared to the previous embodiment, the side wall component 814 includes an outer circumference 824 that is raised or raised in the z dimension. As a result, the material (in the y dimension) forming the side wall component 814 is increased, providing additional support for the protective cover 804. Further, the side wall component 814 may include an edge 826 that is parallel to, or at least substantially parallel to, the surface 806 of the protective cover 804. As a result, the side wall component 814 may further provide additional support to the protective cover 804 and to the frame 854 between the protective cover 804 and the side wall component 814.

FIG. 14 shows a cross-sectional view of an embodiment of the electronic device 900, showing the electronic device 900 having various structural extensions according to some described embodiments. The electronic device 900 may include any of the features described herein for the electronic device. Similar to the previous embodiment, the electronic device 900 may include a display assembly 902, which is designed to present visual information with a touch sensitive layer 912 designed to receive touch input. A force applied to, or in addition to, a force applied to the display layer 914 and at least one of the protective cover 904 overlying the touch sensitive layer 912, the display layer 204, and the display assembly 902. It may include a force sensing layer 916 designed to detect the amount of force applied. The display assembly 902 may further include a plate 918 secured to the force sensing layer 916. As shown, the plate 918 is below the force sensing layer 916. However, in some embodiments (not shown), the plate 918 is positioned between the display layer 914 and the force sensing layer 916.

The plate 918 may include a rigid material such as metal or plastic. The plate 918 can provide structural support and rigidity to the display assembly 902. As a result, the plate 918 can shield the display assembly 902 from the impact of another component (not shown) in the electronic device 900 when the electronic device 900 is dropped. The plate 918 also prevents the layers of the display assembly 902 from bending, which can prevent the layers from overcoming the adhesive junction and detaching from each other.

In some embodiments, the electronic device comprises a flexible circuit coupled to a touch input layer. To limit the movement of the flexible circuit, an adhesive is applied to the support element (embedded in the frame) to attach the flexible circuit to the support element. However, adhesives are known to shrink when cured. The shrinkage effect of the adhesive can give a tensile force to the flexible circuit, which causes unnecessary tensile force on other components, causing some components to be repositioned or even some. The components can be damaged.

In general, the amount of adhesive shrinkage (from the uncured state to the cured state) depends on the amount of adhesive used. To reduce the tensile force caused by shrinkage, the electronic device can be modified to limit the amount of adhesive required. For example, FIG. 14 shows a plate 928 positioned between the flexible circuit 922 (similar to the first flexible circuit 212 shown in FIG. 5) and the support element 958 embedded in the frame 954. The electronic device 900 which has. The plate 928 may be positioned between the support element 958 and the adhesive 930 disposed on the support element 958. The plate 928 may include a metal plate used as a shim that can be secured to the flexible circuit 922. The plate 928 may occupy the space between the flexible circuit 922 and the support element 958, which is optionally occupied by the adhesive 930. In this way, the amount of adhesive 930 used can be reduced, and thus the shrinkage effect caused by the adhesive 930 is also reduced. Also, the plate 928 is designed and positioned to absorb any force that may possibly affect the display assembly 902. As a result, the plate 928 may limit or prevent visual problems, such as display artifacts, when the display assembly 902 is on and presenting visual information.

Similar to the previous embodiment, the display layer 914 extends beyond the force sensing layer 916 and includes a bend. However, as shown in FIG. 14, the display layer 914 may include a first material 932 that covers the surface of the display layer 914. The first material 932 may include a potting material that protects the display layer 914, in particular the bent region of the display layer 914, from external forces. A needle (not shown) can be inserted at a location within the bent region of the display layer 914 to supply the first material. The needle can diffuse the material while it is withdrawn from the electronic device 900.

The display layer 914 may further include a second material 934 that covers the surface of the display layer 914, including some (unlabeled) metal traces. The second material 934 is designed to apply compressive force to the metal trace and prevent tension from acting on the metal trace, thereby preventing damage to the metal trace. The second material 934 may also provide the display layer 914 with rigidity and structural support.

FIG. 15 shows a plan view of an embodiment of the electronic device 1000 showing a plate 1018 positioned in the enclosure 1010 of the electronic device 1000 according to some described embodiments. For illustration purposes, some features have been removed, including a transparent cover and display assembly. The electronic device 1000, enclosure 1010, and plate 1018, respectively, may include any of the features described herein for electronic devices, enclosures, and plates. Plate 1018 is designed for use with display assemblies (shown below). In this regard, plate 1018 may include any of the features previously described for plate 918 (shown in FIG. 14).

The plate 1018 may include a notch 1020 designed to receive a portion of the display assembly. As an example, the notch 1020 relates to a bent region and / or display assembly of the display assembly (similar to the display assembly 102 shown in FIG. 5) and / or the first (shown in FIG. 5). Flexible circuits (such as the flexible circuit 212) can be accepted. In other words, the bent region associated with the display assembly can be bent around the plate 1018 along the planar edge 1022 of the plate 1018 and avoid contacting the enclosure 1010. Therefore, the notch 1020 is sometimes referred to as the cutout region of the plate 1018.

Further, the plate 1018 may include an extension, such as a first extension 1024 and a second extension 1026. As shown, the first extension 1024 and the second extension 1026 extend beyond the planar edge 1028 of the plate 1018. The display assembly (not shown) may include a bent region and a flexible circuit that is bent around the planar edge 1028 in the manner described above, with a first extension 1024 and a second extension 1024. It can be positioned between 1026 and. The first extension 1024 and the second extension 1026 enlarge the plate 1018 in the y dimension. In this way, an external force applied to the electronic device 1000, which has a force component in the y dimension, can shift the plate 1018 (and the display assembly supported by the plate 1018) in the y dimension with respect to the enclosure 1010. However, the first extension 1024 and the second extension 1026 of the enclosure 1010 (in FIG. 1) are provided before the bent region and / or flexible circuit of the display assembly engages the enclosure 1010. It is designed to engage the side wall component 1014 (similar to the second side wall component 114 shown). As a result, damage to the display assembly and / or electrical disconnection can be prevented.

FIG. 16 shows a partial side view of the electronic device 1000 shown in FIG. 15, further showing a first extension 1024 of the plate 1018 fixed to the display assembly 1002. As shown, the display assembly 1002 can be curved around the plate 1018. Also, the plate 1018 may extend laterally in the y-dimensional beyond the display assembly 1002 and the frame 1054 fixing the protective cover 1004 on the display assembly 1002. As a result, the first extension 1024 (shown in FIG. 15) and the second extension 1026 are combined to form a side wall configuration of the display assembly (labeled in FIG. 15) enclosure 1010. A buffer for the display assembly 1002 may be provided against the force applied to the display assembly 1002 moving towards element 1014. The frame 1054, protective cover 1004, and display assembly 1002, respectively, may include any of the features previously described for the frame, protective cover, and display assembly.

FIG. 17 shows a cross-sectional view of an embodiment of an electronic device 1100 showing an electronic device 1100 having an enclosure 1110 and a support structure 1120 integrally formed with the enclosure 1110 according to some described embodiments. .. For simplicity, some features and components of electronic device 1100 are not shown. However, the electronic device 1100 and the enclosure 1110 may include any of the features described herein for the electronic device and enclosure, respectively. Unlike previous embodiments of electronic devices that have a frame fixed to the enclosure, the support structure 1120 can be part of the enclosure 1110. In some embodiments, the enclosure 1110 is formed from a metal such as aluminum or an alloy containing aluminum. In the embodiment shown in FIG. 17, the enclosure 1110 is made of ceramic. The ceramic material can also provide a robust housing while minimizing the effect of RF interference with the antenna assembly (not shown) of the electronic device 1100.

The support structure 1120 can receive and support the protective cover 1104 (similar to the first protective layer 104 shown in FIG. 1). The support structure 1120 may also include a notch 1156 designed to receive the bent region of the display assembly 1102 and / or the bent region of the flexible circuit 1112 used with the display assembly 1102. The notch 1156 may extend circumferentially around the display assembly 1102. Therefore, the notch 1156 can be incorporated into the enclosure 1110. This can reduce the associated costs and manufacturing times associated with the use of the frame.

FIG. 18 shows a plan view of one embodiment of the protective cover 1204 according to some of the described embodiments. Protective cover 1204 may include any of the features described herein for the protective cover and / or protective layer. Therefore, the protective cover 1204 may include transparent materials such as glass, sapphire and plastic. In this regard, the protective cover 1204 is designed to overlap the display assembly (not shown). The protective cover 1204 may include a base portion (shown below) and a notch partially defined by a dotted line 1206.

FIG. 19 shows a cross-sectional view of the protective cover 1204 shown in FIG. 18, taken along line BB, further showing the notch 1208 formed in the protective cover 1204. The notch 1208 may define a cavity partially extending into the material forming the protective cover 1204. In this way, the notch can accept the display assembly, or at least partially. This is further demonstrated below. The protective cover 1204 may also include a base portion 1212 extending around the notch 1208.

FIG. 20 shows a cross-sectional view of an embodiment of the electronic device 1200 showing a protective cover 1204 fixed to the enclosure 1210 (shown in FIGS. 18 and 19) according to some described embodiments. .. For simplicity, some features and components of the electronic device 1200 are not shown. However, the electronic device 1200 may include any of the features described herein for the electronic device. As shown, the electronic device 1200 may include a display assembly 1202 fixed to a protective cover 1204 and positioned in a notch 1208. The display assembly 1202 can be partially fitted to the notch 1208 or fully fitted to the notch 1208, depending on the desired configuration. By fitting the display assembly 1202 into the notch 1208 of the protective cover 1204, the protective cover 1204 may increase the protection provided to the display assembly 1202 by covering multiple dimensions of the display assembly 1202. As a result, the impact force on the electronic device 1200 can be absorbed by the protective cover 1204, or at least partially, prior to the impact on the display assembly 1202. Also, by modifying the protective cover 1204, design changes to other components can be restricted, which reduces manufacturing and engineering costs. Also, the frame 1254 may not require a notch (such as the notch 156 shown in FIG. 5), which may provide additional support to the protective cover 1204.

FIG. 21 is an embodiment of electronic device 1300, showing a protective cover 1304 extending over a frame 1354 and positioned close to side wall components 1314, according to some described embodiments. The cross-sectional view of the form is shown. The electronic device 1300, side wall components 1314, and frame 1354 may each include any of the features described herein for electronic devices, side wall components, and frames. As shown, the frame 1354 can be resized or reduced in size to allow the protective cover 1304 to extend over the frame 1354 and contact the side wall components 1314. This is in contrast to the frame 1354 extending between the side wall component 1314 and the protective cover 1304 (as shown in other embodiments), the protective cover 1204, particularly the protective cover 1304. The curved portion 1306 of the is allowed to receive protection directly from the side wall component 1314. Also, the protective cover 1304 may define an extended protective cover having a relatively larger length in the y dimension. This may allow modifications to the electronic device 1300 to display assembly 1302, also increasing in size in the y dimension. Alternatively or in combination, the extended length of the protective cover 1304 and the display assembly 1302 can facilitate a symmetrical looking display assembly, which also partially covers the symmetrical looking display assembly. It may be possible to change to a display frame (not shown). The overall appearance of the electronic device 1300 can be improved by providing a symmetrical display assembly.

FIG. 22 shows an exploded view of the battery assembly 160 according to some described embodiments. As shown, the battery assembly 160 includes a first cover element 1402 and a second cover element 1404, the first cover element 1402 forming a housing that shields the internal components of the battery assembly 160. As such, it can be sealed with a second cover element 1404. The housing formed by the first cover element 1402 and the second cover element 1404 may define a cavity for receiving and surrounding the internal component. For example, the battery assembly 160 includes a first electrode 1406 and a second electrode 1408 separated from the first electrode 1406 (thus, each of the first electrode 1406 and the second electrode 1408 contains a single electrode. ), Which provides some physical insulation between the first electrode 1406 and the second electrode 1408, while still allowing the flow of charge between the first electrode 1406 and the second electrode 1408. It may be further included with 1410. As is generally known in the art for batteries, one of the first electrode 1406 and the second electrode 1408 comprises an anode (of the first electrode 1406 and the second electrode 1408). The remaining electrodes include the cathode. Also, as is commonly known, electrodes can be used to convert chemical energy into electricity for use by electronic devices (such as the electronic device 100 shown in FIG. 1). Further, the battery assembly 160, and the battery assembly described herein, may include a rechargeable battery assembly designed for reuse after the battery assembly 160 receives electrical energy from an external source. The battery assembly 160 may further include a circuit board 1412 that includes one or more circuits designed to monitor the battery assembly 160 and the current flowing from it. Also, the circuit board 1412 and the components of the circuit board 1412 may be in telecommunications with the circuit board assembly 170 (shown in FIG. 4).

Also, the first cover element 1402 may form a channel 164 that provides additional space in the z dimension for components (not shown), such as flexible circuits. In other words, the dimensions (such as height) of the battery assembly 160 are reduced in place corresponding to the channel 164, while still providing ample space for the circuit board 1412 to be positioned below the channel 164. .. In this way, the components are positioned across the channel 164 so that the reconstruction of the other components in the electronic device 100 (shown in FIG. 1) is an additional space for the battery assembly 160. Can be made possible to create. As a result, the battery assembly 160 may include a large size corresponding to a larger charge capacity. The cover elements described above may allow for some electrical connections, while the first cover element 1402 and the second cover element 1404 provide a shield, including an electrical shield. For example, the first cover element 1402 may include an opening 1414 in close proximity to the circuit board 1412. Also, although not shown, the first cover element 1402 and / or the second cover element 1404 allows additional components (or a plurality of components) to be electrically coupled to the battery assembly 160. May include additional openings for While traditional battery electrodes generally include a linear shape, the electrodes in the battery assembly 160 and the battery assembly described herein can contain different shapes. For example, as shown in FIG. 22, the first electrode 1406 and the second electrode 1408 include an "L-shaped configuration" in which at least one surface comprises six different sides. This will be further explained below.

FIG. 23 shows a plan view of the first electrode 1406 shown in FIG. As shown, the first electrode 1406 includes an L-shaped configuration. In this regard, the first electrode 1406 includes a first portion 1420 or a first rectangular portion and a second portion 1422 or a second rectangular portion extending from the first portion 1420. obtain. The dotted line indicates the interface region between the first portion 1420 and the second portion 1422. In some embodiments (not shown), the size of the first portion 1420 is the same as or substantially the same as that of the second portion 1422. However, in the embodiment shown in FIG. 23, the size of the first portion 1420 is larger than the size of the second portion 1422.

The first electrode 1406 can also be characterized as including a first wall 1434 with a first dimension 1444 and a second wall 1436 with a second dimension 1446. As shown, the first wall 1434 is parallel to, or at least substantially parallel to, the second wall 1436, with the second dimension 1446 being smaller than the first dimension 1444. Also, the first electrode 1406 has a third wall 1438 with a third dimension 1448 (which separates the first wall 1434 from the second wall 1436) and a fourth wall with a fourth dimension 1450. It may include 1440 and. As shown, the third wall 1438 is parallel to, or at least substantially parallel to, the fourth wall 1440, with the fourth dimension 1450 being smaller than the third dimension 1448. Further, the first electrode 1406 may include a fifth wall 1442 that is parallel to, or at least substantially parallel to, the third wall 1438. The fifth wall 1442 may include a fifth dimension 1452, which is smaller than the third dimension 1448. As shown in FIG. 23, the fourth dimension 1450 and the fifth dimension 1452 can be combined to be equal to the third dimension 1448, and the third wall 1438 also includes the first wall 1434 and It is perpendicular to, or at least substantially perpendicular to, the second wall 1436. In some embodiments (not shown), the first dimension 1444 is the same as the second dimension 1446. Moreover, in some embodiments (not shown), the first dimension 1444 is smaller than the second dimension 1446. Also, a second electrode 1408 (shown in FIG. 22), and any additional electrodes (s) and separators (s) and separators (s) included in the battery assembly 160 (shown in FIG. 22). ) Shall include the same size and shape as the size and shape of the first electrode 1406, or substantially the same size and shape.

FIG. 24 shows a plan view of an alternative embodiment of the electrode 1506 suitable for use in battery assembly, according to some described embodiments. As shown, the electrode 1506 may include a "C-shaped configuration". In this regard, the electrode 1506 may include a first portion 1520 or a first rectangular portion. The electrode 1506 may further include a second portion 1522 or a second rectangular portion and a third portion 1524 or a third rectangular portion, both of which are perpendicular to the first portion 1520. Or it extends substantially vertically. The dotted line indicates the boundary surface region between the first portion 1520 and the second portion 1522, and the boundary surface region between the first portion 1520 and the third portion 1524. In some embodiments (not shown), the size of the first portion 1520 is the same as or substantially the same as the second portion 1522 and the third portion 1524. However, in the embodiment shown in FIG. 24, the size of the first portion 1520 is larger than the size of the second portion 1522 and also larger than the size of the third portion 1524. Also, as shown in FIG. 24, the size of the second portion 1522 is the same as or substantially the same as the size of the third portion 1524. However, in some embodiments (not shown), the size of the second portion 1522 can vary from the size of the third portion 1524. For example, the size of the second portion 1522 may be larger or smaller than the size of the third portion 1524.

The electrode 1506 can also be characterized as including a first wall 1534 with a first dimension 1544 and a second wall 1536 with a second dimension 1546. As shown, the first wall 1534 is parallel to, or at least substantially parallel to, the second wall 1536, with the second dimension 1546 being the length of the first dimension 1544. Includes lengths that are the same, or at least substantially similar. The electrodes 1506 also include a third wall 1538 having a third dimension 1548 (which separates the first wall 1534 from the second wall 1536) and a fourth wall 1540 having a fourth dimension 1550. It may include a fifth wall 1542 having a fifth dimension 1552. As shown, the third wall 1538 is parallel to, or at least substantially parallel to, the fourth wall 1540 and the fifth wall 1542. Also, each of the fourth dimension 1550 and the fifth dimension 1552 is smaller than the third dimension 1548. Also, the third wall 1538 is perpendicular to, or at least substantially perpendicular to, the first wall 1534 and the second wall 1536. As shown in FIG. 24, the first dimension 1544 is the same as the second dimension 1546. However, the first dimension 1544 may differ from the second dimension 1546, such as being smaller or larger than the second dimension 1546. Further, the electrode 1506 may include a sixth wall 1562 parallel to, or at least substantially parallel to, the third wall 1538. The sixth wall 1562 may include a sixth dimension 1572, which is smaller than the third dimension 1548. As shown in FIG. 24, the fourth dimension 1550, the fifth dimension 1552, and the sixth dimension 1572 can be combined to be equal to the third dimension 1548. Also, any additional electrodes (s) and separators (s) included in the battery assembly (not shown) may be of the same size and shape as, or substantially similar to, the size and shape of the electrodes 1506. Note that it can include size and shape.

FIG. 25 shows a plan view of an alternative embodiment of the electrode 1606 suitable for use in battery assembly, according to some described embodiments. As shown, the electrode 1606 may include an "I-shaped configuration". In this regard, the electrode 1606 may include a first portion 1620 or first rectangular portion, a second portion 1622 or second rectangular portion, and a third portion 1624 or third rectangular portion. The dotted line indicates the boundary surface region between the first portion 1620 and the second portion 1622, and the boundary surface region between the first portion 1620 and the third portion 1624. As shown, both the second portion 1622 and the third portion 1624 extend vertically or substantially vertically to the first portion 1620. Similar to the shape resembling the letter "I", the first portion 1620 can be centered or substantially centered with respect to the second portion 1622 and the third portion 1624. .. As shown, the size of the first portion 1620 is the same as or substantially the same as the second portion 1622 and the third portion 1624. However, in some embodiments (not shown), the size of the first portion 1620 is different from the size of the second portion 1622 and is also different from the size of the third portion 1624. Also, as shown in FIG. 25, the size of the second portion 1622 is the same as or substantially the same as the size of the third portion 1624. However, in some embodiments (not shown), the size of the second portion 1622 may vary from the size of the third portion 1624. For example, the size of the second portion 1622 may be larger or smaller than the size of the third portion 1624. Also, in some embodiments, the third portion 1624 is removed from the electrode 1606 so that the electrode 1606 includes a "T-shaped configuration".

The electrode 1606 can also be characterized as including a first wall 1634 with a first dimension 1644 and a second wall 1636 with a second dimension 1646. As shown, the first wall 1634 is parallel to, or at least substantially parallel to, the second wall 1636, with the second dimension 1646 being the length of the first dimension 1644. Includes lengths that are the same, or at least substantially similar. The electrode 1606 may also include a third wall 1638 that includes a third dimension 1648. The third wall 1638 may be perpendicular to, or at least substantially perpendicular to, the first wall 1634 and the second wall 1636, and the third dimension 1648 is the first dimension 1644 and Includes a length that is the same as, or at least substantially the same as, the length of the second dimension 1646.

The electrode 1606 is further characterized as having a first portion 1620 aligned with a first longitudinal axis 1652 extending through the first portion 1620 and arranged symmetrically about it. obtain. The term "longitudinal" as used throughout this "form for carrying out the invention" and in the "claims" refers to a direction extending along the principal axis of the component. , The "major" dimension corresponds to the largest (longest) dimension of a part or portion of the electrode. Electrodes 1606 also include a second portion 1622 and a third portion 1624 that are aligned with the second longitudinal axis 1654 and the third longitudinal axis 1656 and are symmetrically arranged about it, respectively. obtain. The second longitudinal axis 1654 can be aligned parallel to the third longitudinal axis 1656. Also, the first longitudinal axis 1652 may be perpendicular to the second longitudinal axis 1654 and the third longitudinal axis 1656. Also, any additional electrodes (s) and separators (s) included in the battery assembly (not shown) may be of the same size and shape as, or substantially similar to, the size and shape of the electrodes 1606. Note that it can include size and shape.

FIG. 26 shows a plan view of an alternative embodiment of electrode 1706 suitable for use in battery assembly, according to some described embodiments. As shown, the electrode 1706 may include an "L-shaped configuration" similar to the configuration of the first electrode 1406 (shown in FIG. 23). In this regard, the electrode 1706 may include a first portion 1720 or a first rectangular portion and a second portion 1722 or a second rectangular portion extending perpendicularly from the first portion 1720. The dotted line indicates the interface region between the first portion 1720 and the second portion 1722. In some embodiments (not shown), the size of the first portion 1720 is the same as or substantially the same as that of the second portion 1722. However, in the embodiment shown in FIG. 26, the size of the first portion 1720 is larger than the size of the second portion 1722. The electrode 1706 may further include an opening 1730 defining a void or space in the electrode 1706. The opening 1730 is a component (shown) where the battery assembly (not shown), which includes the electrode 1706 and other electrodes having a size and shape similar to the size and shape of the electrode 1706, corresponds to the opening 1730. It may be possible to determine the position of the battery. In this way, the battery assembly may accommodate components through the opening 1730 when the electrodes and separator openings are aligned with each other to form a continuous through hole through the layers of the battery assembly electrode and separator. This will be further explained below. Further, although the opening 1730 is shown in the electrode 1706, other embodiments may include the opening, such as the electrode embodiments shown in FIGS. 23-25.

Various embodiments of the electrodes illustrated and described in FIGS. 23-26 can be formed by cutting operations, including die cutting. The die-cutting operation may include the electrode sheet undergoing a cutting operation using a mold of a predetermined size and shape. The mold may include a size and shape corresponding to the size and shape of the electrodes shown in FIGS. 23-26. Note that the separator can be die-cut in a similar fashion. Therefore, the shape of the electrode described herein may include a shape other than a linear shape. In this regard, the battery assembly is an electrode so that the battery assembly can take various sizes and shapes to increase the battery assembly size and / or to accommodate other internal components in the electronic device. And may include sizes and shapes depending on the separator.

27-29 show various embodiments of battery assemblies suitable for use with the electronic devices described herein. Some components of the electronic device shown in FIGS. 27-29 have been removed for explanatory purposes. The die-cutting operation (described above) used to form the electrodes for the battery assembly described herein can be cut into various sizes and shapes. In this regard, battery assemblies can come in different sizes and shapes. Also, the electronic device and battery assembly shown in FIGS. 27-29 may include any component (s) and features (s) and features (s) previously described for the electronic device. Also, although individual numbers of embodiments are shown for battery assembly, some other configurations are possible.

FIG. 27 shows an embodiment of the battery assembly 1860 in an electronic device 1800 in which the battery assembly 1860 has a shape that accommodates the internal components 1870 of the electronic device 1800, according to some described embodiments. As shown, the battery assembly 1860 may include a C-shaped configuration for accommodating internal components 1870, which may include a circuit board assembly (described earlier). The term "contains" is used to avoid or mitigate modifying the size, shape, and / or position of another component (such as the internal component 1870) in electronic device 1800 (battery assembly 1860). It can refer to modifying the size and shape of components (such as). As an example, the battery assembly illustrated and described herein may accommodate another component (s) by providing space that is optionally occupied by a traditional, linear battery. Also, any electrode (s) and separator (s) and separator (s) of the battery assembly 1860 also include a C-shaped configuration having a shape similar to that of the electrode 1506 (shown in FIG. 24). Thus, battery assembly 1860 may include a housing defined by one or more cover elements, including a C-shaped configuration.

FIG. 28 shows an alternative embodiment of the battery assembly 1960 in the electronic device 1900, in which the battery assembly 1960 has a shape that accommodates a plurality of internal components of the electronic device 1900, according to some described embodiments. As shown, the battery assembly 1960 may include an "I-shaped" configuration for accommodating both the first internal component 1970 and the second internal component 1972. Each of the first internal component 1970 and the second internal component 1972 may represent a component, such as a circuit board, an audio module, a flexible circuit, or a similar component. FIG. 28 further shows the first internal component 1970 and the second internal component 1972 located in different spaces between the extensions of the battery assembly 1960. Also, any electrode (s) and separator (s) and separator (s) of the battery assembly 1960 also include an I-shaped configuration having a shape similar to that of the electrode 1606 (shown in FIG. 25). Thus, battery assembly 1960 may include a housing defined by one or more cover elements, including an I-shaped configuration.

FIG. 29 shows an alternative embodiment of the battery assembly 2060 in the electronic device 2000, wherein the battery assembly 2060 has an opening 2062 for accommodating the internal component 2072 of the electronic device 2000, according to some described embodiments. .. As shown, the opening 2062 may include a size and shape such that the internal component 2072 can be positioned with the outer circumference of the opening 2062. The opening 2062 generally includes a circular opening, but the opening 2062 may take the form of other shapes, including, as a non-limiting example, a ternary shape and a quadrilateral shape. Also, as shown in FIG. 29, the battery assembly 2060 may have an L-shaped configuration (although other aforementioned shapes may be possible) to accommodate the internal component 2070 (which may include a circuit board assembly). There is), and the opening 2062 may also be included. The L-shape configuration of the battery assembly 2060 allows the internal component 2070 to be positioned at least partially between the edges of the battery assembly 2060, such as the first edge 2064 and the second edge 2066. Also, the L-shaped configuration and the battery assembly including the opening (similar to the opening 2062) are aligned with each other and have an electrode and separator similar in shape to the electrode 1706 (shown in FIG. 26). Can include. In other words, any electrode (s) and separator (s) of the battery assembly 2060 have an L-shaped configuration with openings similar to that of electrode 1706 (shown in FIG. 26). Also includes. Thus, battery assembly 2060 may include an L-shaped configuration as well as a housing defined by one or more cover elements including openings.

In addition to having various sizes and shapes (other than the traditional linear shape), the battery assemblies described herein may include additional features. For example, FIG. 30 shows that the battery assembly 2160 according to some described embodiments is in the enclosure 2102 (of the electronic device 2100) on the first internal component 2172 (shown as the dotted line) of the electronic device 2100. An alternative embodiment of a battery assembly 2160 in a positioned electronic device 2100 is shown. Due in part to the additional space provided by display layer 204 (shown in FIG. 5), the battery assembly 2160 may cover some components, such as the first internal component 2172. Or it can overlap on top of them. Also, the battery assembly 2160 may include an L-shaped configuration to accommodate the circuit board assembly 2170 within the enclosure 2102. In this way, the battery assembly 2160 provides a place to accommodate a portion of the circuit board assembly 2170 (also including an L-shaped configuration, as shown herein), but instead a straight battery is a circuit board. May not accommodate assembly 2170. As shown in FIG. 30, the circuit board assembly 2170 can be "fitted" with the battery assembly 2160 as well as the puzzle pieces. The battery assembly 2160 may further include channel 2162 defining the reduced dimensions of the battery assembly 2160. In this way, the electronic device 2100 passes over the battery assembly 2160 along channel 2162 to telecommunications the second internal component 2174 with the circuit board assembly 2170, as well as the circuit board assembly 2170. As a non-limiting example, it may include a flexible circuit 2164 that electrically couples with a second internal component 2174, which may include an operating component (such as an audio module). The flexible circuit 2164 has been described as being electrically coupled to the second internal component 2174, but the flexible circuit 2164 is also electrically coupled to a third internal component (not shown), such as an antenna. obtain. In each case, the channel 2162 formed in the battery assembly 2160 allows the reconstruction of various internal components. The battery assembly 2160 may also include an increased size corresponding to the increased electrical storage capacity, as the battery assembly 2160 can be positioned on the first internal component 2172.

FIG. 31 shows a cross-sectional view of the electronic device 2100 shown in FIG. 30, taken along line CC of FIG. Due in part to the die-cutting operation (described above) for the electrodes and separators, the battery assembly 2160 may pass over the first internal component 2172. Moreover, as shown in FIG. 31, one portion of the battery assembly 2160 may lie flat on the enclosure 2102 and another portion of the battery assembly 2160 covers the first internal component 2172. In other words, the battery assembly 2160 is raised on the first internal component 2172 and can at least partially fit the size and shape of the first internal component 2172. Further, the electrodes may also pass over the first internal component 2172. For example, the battery assembly 2160 includes a first electrode 2182 and a second electrode 2184 together with a separator 2186 positioned between the first electrode 2182 and the second electrode 2184. As shown in FIG. 31, the first electrode 2182, the second electrode 2184, and the separator 2186 can pass over the first internal component 2172. In addition, the die-cutting operation terminates the first electrode 2182 and the second electrode 2184 before they enter a location in the battery assembly 2160 that corresponds to channel 2162, thereby accepting channel 2162 to accept flexible circuit 2164. The first electrode 2182 and the second electrode 2184 can be formed so as to allow the size of the battery assembly 2160 to be reduced. Although not shown, channel 2162 provides two or more flexible circuits to electrically couple additional internal components (not shown) with circuit board assembly 2170 (shown in FIG. 30). It may include a size and shape to accept. Therefore, the flexible circuit 2164 (or additional flexible circuit) need not be positioned around the perimeter of the battery assembly 2160.

FIG. 32 shows an exploded view of the circuit board assembly 170 shown in FIG. 4 according to some described embodiments. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174. In some embodiments, each of the first circuit board 172 and the second circuit board 174 includes a printed circuit board. Further, the first circuit board 172 can be fixed to the second circuit board 174 in a laminated structure and can be positioned on the second circuit board 174. As shown in FIG. 32, the first circuit board 172 includes a size and shape that is the same as, or at least substantially the same as, the size and shape of the second circuit board 174. However, in some embodiments (not shown), the first circuit board 172 contains at least some differences in size and / or shape as compared to the second circuit board 174. The laminated configuration of the circuit board assembly 170 increases the footprint of the circuit board assembly 170 in the electronic device 100 (shown in FIG. 1) in the z dimension, while the laminated configuration is in both the x and y dimensions. The footprint of the circuit board assembly 170 is reduced. The additional space provided by stacking the circuit boards described above may provide additional space in the electronic device 100 for other components, such as the battery assembly 160 (shown in FIG. 4). Also, the additional space provided by the reduced dimensions of the display assembly 102 (shown in FIG. 5) provides space for the circuit board assembly 170. In other words, the additional space in the z dimension due in part to the reduced dimensions of the display assembly 102 allows for a laminated configuration of the circuit board assembly 170. Although not shown, the circuit board assembly 170 may include three or more circuit boards in telecommunications with each other in a laminated configuration.

The first circuit board 172 and / or the second circuit board 174 may include several operating components. An "operational component" can refer to an integrated circuit or processor circuit that performs an operation (or a plurality of operations), such as executing an instruction from a software application stored in a memory circuit. The operating component can also refer to a transistor. Operating components on either the first circuit board 172 and / or the second circuit board 174 may convert electrical energy into thermal energy during operation. However, a thermal dispersion assembly (not shown) is designed to remove thermal energy from the circuit board assembly 170. This is explained below. As shown in FIG. 32, the circuit board may include operating components on a plurality of surfaces. For example, the first circuit board 172 may include a first mounting surface 2202 and a second mounting surface 2204 opposite the first mounting surface 2202, the first mounting surface 2202 being the first operation. It has a component 2212 and a second mounting surface 2204 has a second operating component 2214 (shown as a dotted line). As shown in FIG. 32, both the first mounting surface 2202 and the second mounting surface 2204 may include additional operating components. Also note that the operating components on the first circuit board 172 are in telecommunications with each other. The means of communication may include, for example, at least one via (not shown) extending through the first circuit board 172.

The second circuit board 174 may include a first mounting surface 2206 that includes some operating components, such as the operating component 2216. The second circuit board 174 also includes a second mounting surface 2208 opposite the first mounting surface 2206. In some embodiments, the second mounting surface 2208 comprises an operating component (or plurality of components) that is in telecommunications with an operating component located on the first mounting surface 2206. It should also be noted that when the circuit board assembly 170 is assembled, the second circuit board 174 is overlaid (or covered by the first circuit board 172) with the first circuit board 172 in a laminated configuration. .. However, it should be noted that the first circuit board 172 is still separated from the second circuit board 174 by at least some gaps or spaces. Further, when the circuit board assembly 170 is assembled, the first mounting surface 2206 of the second circuit board 174 faces the second mounting surface 2204 of the first circuit board 172, and vice versa. Is.

The first circuit board 172 may be mechanically connected to the second circuit board 174 by some support rods connected to the rivets. For example, as shown in FIG. 32, the second circuit board 174 is a first support rod 2222 designed to connect with a first rivet 2224 disposed on the first circuit board 172. including. Each of the remaining support rods shown in FIG. 19 (unlabeled) can be connected to the rivet shown in FIG. 32 (unlabeled). The support rod not only provides a mechanical connection, but also has components on the second mounting surface 2204 of the first circuit board 172 and components on the first mounting surface 2206 of the second circuit board 174. It is designed to maintain the desired distance between the first circuit board 172 and the second circuit board 174 so that it does not interfere (physically) and vice versa. Also, the positions of the support rods and rivets can be reversed such that the first circuit board 172 includes the support rods and the second circuit plate 174 includes the rivets.

Several interposers to route electrical signals between the first circuit board 172 and the second circuit board 174 in order to electrically couple the first circuit board 172 to the second circuit board 174. Can be used. For example, as shown in FIG. 32, the second circuit board 174 includes several interposers, such as the interposer 2232, which is electrically coupled to the second circuit board 174 by a soldering operation. obtain. Some additional (unlabeled) interposers are shown. Also, although not shown, the second circuit board 174 may include several metal traces that electrically couple the interposer with one or more operating components on the second circuit board 174. Also, when the first circuit board 172 is electrically coupled to the second circuit board 174, each of the interposers is one or more metal traces on the second mounting surface 2204 of the first circuit board 172. Can be electrically coupled (not shown).

The circuit board assembly 170 may include several shielding elements that shield the components of the circuit board assembly 170 from electromagnetic interference (“EMI”). For example, the circuit board assembly 170 may include a first shielding element 2242 that covers components disposed on the first mounting surface 2202 of the first circuit board 172. The first shielding element 2242 may include a metal-based material designed to provide an EMI shield to the components on the first mounting surface 2202. The circuit board assembly 170 is designed to provide an EMI shield for components placed on the second mounting surface 2204 of the first circuit board 172 and the first mounting surface 2206 of the second circuit board 174. The second shielding element 2244 may be further included. The second shielding element 2244 may include a metal such as copper or brass. The second shielding element 2244 may be fixed to (and between) the first circuit board 172 and the second circuit board 174 by some solder joints disposed on each circuit board. For example, FIG. 32 shows a second circuit board 174 having a first solder joint 2250 positioned around the outer perimeter of the second circuit board 174. Some additional solder joints are shown in addition to the first solder joint 2250, but they are not labeled. The first circuit board 172 may also include solder joints (not shown) at locations corresponding to the solder joints on the second circuit board 174. In some embodiments, the second shielding element 2244 comprises several discontinuous structural elements. In the embodiment shown in FIG. 32, the second shielding element 2244 may include a single, continuous structural component designed to extend along the outer perimeter of the circuit board assembly 170. Alternatively, the second shielding element 2244 may include several shielding element portions that are combined with each other to form the second shielding element 2244.

The circuit board assembly 170 may further include a third shielding element 2246 positioned on the second mounting surface 2208 of the second circuit board 174. The third occlusion element 2246 is designed to provide the circuit board assembly 170 with an EMI shield in combination with the first occlusion element 2242 and the second occlusion element 2244. Also, the second mounting surface 2208 of the second circuit board 174 may include metal traces (over the entire second mounting surface 2208). In this regard, in addition to forming the EMI shield, the third shield element 2246 is such that the third shield element 2246 is electrically connected to the second mounting surface 2208 via a metal trace. , At least a portion of the electrical grounding path for the circuit board assembly 170 may be defined. Also, when a component (or a plurality of components) of the circuit board assembly 170 generates an EMI during operation, the shielding element described above is external to the circuit board assembly 170 (shown in FIG. 1). ) The components of the electronic device 100 can be shielded from the EMI generated by the components (s) of the circuit board assembly 170.

FIG. 33 shows a cross-sectional view of the circuit board assembly 170 shown in FIG. 32 showing various internal components of the circuit board assembly 170. As shown, the first circuit board 172 can be separated from the second circuit board 174 by the support rod 2226. Further, in order to mechanically couple the first circuit board 172 to the second circuit board 174, the support rod 2226 may be mechanically coupled to the rivet 2228, and the support rod 2226 and the rivet 2228 are the first circuit. It is electrically isolated from the components of the plate 172 and the second circuit plate 174.

The first circuit board 172 may include vias 2218 made of metal to provide an electrical connection between the first operating component 2212 and the second operating component 2214. Further, the first circuit board 172 may communicate with the second circuit board 174 via the interposer 2234. As shown, the interposer 2234 can be electrically and mechanically connected to a first solder joint 2262 located on a first circuit board 172 and is located on a second circuit board 174. It can also be electrically and mechanically connected to the solder joint 2264 of 2. In addition to the interposer 2234, several additional interposers (not shown) may be used to carry the signal between the circuit boards. The first circuit board 172 may include a second operating component 2214 as well as a first metal trace 2272 electrically connected to the via 2218, and the second circuit board 174 is on the second circuit board 174. It may include a second metal trace 2274 that is electrically connected to a third operating component 2220 located in. In this way, the third motion component 2220 may electrically communicate with the second motion component 2214 via the interposer 2234 and the metal trace. The third motion component 2220 may electrically communicate with the first motion component 2212 via vias 2218, interposer 2234, and metal traces. Circuit board assembly 170 may use several additional metal traces, vias, and solder joints to provide additional electrical communication paths.

FIG. 34 shows an alternative embodiment of circuit board assembly 2370, showing circuit board assembly 2370 modified for intrusion protection. The circuit board assembly 2370 may include any of the components and features previously described for the circuit board assembly, such as the first circuit board 2372 and the second circuit board 2374. However, as shown in FIG. 34, the circuit board assembly 2370 includes a potting material 2390 embedded in the circuit board assembly 2370 between the first circuit board 2372 and the second circuit board 2374. obtain. The potting material 2390 may contain a resin that cures to form a liquid resistant shield for various operating components of the circuit board assembly 2370, such as the operating component 2314. In this regard, the potting material 2390 can prevent damage caused by liquid intrusion into the circuit board assembly 2370, in particular the components of the circuit board assembly 2370. Further, the potting material 2390 may extend to the first shielding element 2342 and the second shielding element 2344 of the circuit board assembly 2370 to prevent erosion of components such as the support rod 2326. The potting material 2390 can be used with the circuit assembly described herein.

FIG. 35 shows an alternative embodiment of a circuit board assembly 2470 that shows a circuit board assembly 2470 with a flexible circuit 2402 electrically coupled to the circuit board of the circuit board assembly according to some described embodiments. The circuit board assembly 2470 may include any of the components and / or features previously described for the circuit board assembly. For example, as shown, the circuit board assembly 2470 may include a first circuit board 2472 and a second circuit board 2474. The circuit board assembly 2470 may further include a first shielding element 2442 disposed on the first circuit board 2472 and at least some of its components. The circuit board assembly 2470 may further include a second shielding element 2444 that covers the gap between the first circuit board 2472 and the second circuit board 2474. The circuit board assembly 2470 may further include a third shielding element 2446 disposed on the second circuit board 2474. However, rather than using an interposer for telecommunications between the first circuit board 2472 and the second circuit board 2474 (with their respective components), the circuit board assembly 2470 of FIG. 35 Flexible circuits 2402 are used for the communication of telecommunications between operating components located on the first circuit board 2472 and / or the second circuit board 2474.

The flexible circuit 2402 may form a loop for electrically and mechanically coupling with the first circuit board 2472 and electrically and mechanically coupling with the second circuit board 2474. Electrical and mechanical coupling can be performed using hot bar soldering operations. A heat electrode (not shown) is heated to supply thermal energy to the flexible circuit 2402 and to the soldering elements (not shown) on the first circuit board 2472 and the second circuit board 2474. It can be used as a "hot bar" that results in the electromechanical connection of the flexible circuit 2402 to the circuit board 2472 of 1 and the circuit board 2474 of the second. It should be noted that multiple hot bar soldering operations can be used to couple the flexible circuit 2402 with the first circuit board 2472 and the second circuit board 2474.

FIG. 36 shows a cross-sectional view of the circuit board assembly 2470 shown in FIG. 35, taken along line DD, showing the flexible circuit 2402 extending between the circuit boards. As shown, the flexible circuit 2402 is electromechanically coupled to a first solder joint 2412 and a second solder joint 2414 arranged on the first circuit board 2472 and the second circuit board 2474, respectively. Will be done. Also, the first solder joint 2412 may be electrically coupled to the first metal trace 2422 on the first circuit board 2472, and the second solder joint 2414 is the second on the second circuit board 2474. Can be electrically coupled to the metal trace 2424 of. As a result, the flexible circuit 2402 may be electrically coupled to several operating components (not shown), some of which are electrically coupled to the first metal trace 2422, the first circuit. It is placed on the plate 2472, some of which are electrically coupled to the second metal trace 2424 and placed on the second circuit board 2474.

FIG. 37 shows a cross-sectional view of an alternative embodiment of circuit board assembly 2570 showing the internal components of circuit board assembly 2570 with corresponding geometry according to some described embodiments. The circuit board assembly 2570 may include any of the components and / or features previously described for the circuit board assembly. For example, the circuit board assembly 2570 may include a first circuit board 2572 and a second circuit board 2574, the first circuit board 257 telecommunication with the second circuit board 2574 via the interposer 2520. .. An additional interposer (not shown) may electrically couple the first circuit board 2572 (and its components above it) with the second circuit board 2574 (and its components above it). The first circuit board 2572 includes a first mounting surface 2502 having a first operating component 2512 and a second operating component 2514 electrically coupled to a (unlabeled) metal trace (unlabeled). It may include a second mounting surface 2504 (opposite the first mounting surface 2502). Further, the second circuit board 2574 may include a third operating component 2516 that is electrically coupled to the (unlabeled) metal trace, and the third operating component 2516 and the metal trace may include a second. It is arranged on the first mounting surface 2506 of the circuit board 2574 of.

As shown in FIG. 37, the second motion component 2514 and the third motion component 2516 may be in a nested configuration. For example, the third motion component 2516 may include a convex portion 2518 that at least partially extends into the recess 2522 of the second motion component 2514. The corresponding geometry between the second operating component 2514 and the third operating component 2516 allows for reduced dimensions (or reduced height) of the circuit board assembly 2570, thereby allowing the electronic device (or reduced height). The overall space occupied by the circuit board assembly 2570 in (not shown) can be reduced. In other words, the separation or gap between the first circuit board 2572 and the second circuit board 2574 is the first in the same manner as the configuration of the second operating component 2514 and the third operating component 2516. Due to the corresponding or nested configuration of the components of the circuit board 257 and the second circuit board 2574, it may be reduced as compared to the previous embodiment.

Also, in some cases, components on different circuit boards may be electrically and mechanically coupled to each other by direct means. For example, FIG. 37 shows a first circuit board 257 with a fourth operating component 2534 disposed on the second mounting surface 2504 and a first mounting surface 2506 of the second circuit board 2574. The fifth operation component 2536 and the above are further shown. The fourth operating component 2534 may include a recess 2542 and a connector 2544 positioned within the recess 2542. Further, the fifth operating component 2536 may include a convex portion 2538 extending into the recess 2542. The ridge 2538 may include a connector 2554 that is electrically and mechanically coupled to the connector 2544. In this way, the fourth motion component 2534 is electrically and mechanically coupled to the fifth motion component 2536.

Moreover, when the circuit board assembly 2570 includes motion components such as the fourth motion component 2534 and the fifth motion component 2536, the first circuit board 2572 is the fourth motion component 2534 and the fourth motion component 2534 and the first. It can be electrically coupled to the second circuit board 2574 via the operating component 2536 of 5. As a result, the circuit board assembly 2570 may not require an interposer (such as the interposer 2520) to provide telecommunications between the first circuit board 257 and the second circuit board 2574. Further, as shown in FIG. 37, the first circuit board 257 may include a fourth operating component 2534 as well as a via 2546 electrically coupled to a (unlabeled) metal trace. In this way, the first motion component 2512 may be electrically connected to the fifth motion component 2536 via a metal trace, vias 2546, and a fourth motion component 2534. In some embodiments, the circuit board assembly 2570 is any combination of a second motion component 2514 and a third motion component 2516, and a fourth motion component 2534 and a fifth motion component 2536. Please note that it includes.

FIG. 38 is a cross-sectional view of an alternative embodiment of circuit board assembly 2670 showing a circuit board assembly 2670 with some solder masks used to support the circuit board according to some described embodiments. show. The circuit board assembly 2670 may include any of the components and / or features previously described for the circuit board assembly. For example, the circuit board assembly 2670 may include a first circuit board 2672 and a second circuit board 2674. Further, each of the first circuit board 2672 and the second circuit board 2674 may include several solder joints (unlabeled), and the interposer may include the solder joints from the first circuit board 2672 and the solder joints from the first circuit board 2672. It is electrically coupled to the solder joint from the second circuit board 2674. For example, FIG. 38 shows the first interposer 2602, which is electrically and mechanically coupled to the (unlabeled) solder joint on the first circuit board 2672 and the second circuit board 2674, and the first. A second interposer 2604 electrically and mechanically coupled to a (unlabeled) solder joint on circuit board 2672 and second circuit board 2674, and first circuit board 2672 and second circuit board. Shown shows a circuit board assembly 2670 with a (unlabeled) solder joint on 2674 and a third interposer 2606 electrically and mechanically coupled.

The circuit board assembly 2670 may include several soldering masks to prevent oxidation of the solder joints and / or to prevent solder "bridges" from forming between adjacent solder joints during the soldering operation. .. For example, the circuit board assembly 2670 has a first solder mask 2622 between the first interposer 2602 and the second interposer 2604, and a second solder between the second interposer 2604 and the third interposer 2606. Mask 2624 may be included. Based on their position, the first solder mask 2622 prevents the solder bridge from forming between the first interposer 2602 and the second interposer 2604 (thus the first interposer 2602 and the second interposer 2602). Obtaining (preventing unwanted electrical coupling between the interposer 2604), the second solder mask 2624 prevents the solder bridge from forming between the second interposer 2604 and the third interposer 2606 (thus. (Prevents unwanted electrical coupling between the second interposer 2604 and the third interposer 2606). Moreover, the first solder mask 2622 and the second solder mask 2624 may provide a support structure that maintains the desired distance or separation between the first circuit board 2672 and the second circuit board 2674. Further, in order to maintain the first circuit board 2672 together with the second circuit board 2674, both the first circuit board 2672 and the second circuit board 2674 are made of a first solder mask 2622 and a second solder mask. Can be tightened onto the end of the 2624. The interposer, solder joint, and solder mask may represent several additional interposers, solder joints, and solder masks, respectively.

FIG. 39 shows an isometric view of an embodiment of the audio module 2700 according to some described embodiments. The audio module 2700 can be used in place of the first audio module 182 (shown in FIG. 4). The audio module 2700 can be used as a receiver module designed to generate acoustic energy in the form of audible sound. Receiver modules are commonly used in low power applications related to relatively low frequency outputs. However, the audio module 2700 may include changes for extended audio performance associated with the audio speaker module.

The audio module 2700 may include an audio module housing 2702 having an audio module opening 2704. The audio module housing 2702 may define an internal acoustic volume divided into a front volume and a back volume. This will be shown later. The audio module housing 2702 may carry a diaphragm 2706 or membrane designed to vibrate and thereby generate acoustic energy in the form of audible sound. Therefore, the diaphragm 2706 may be referred to as a membrane or acoustic membrane. The diaphragm 2706 may include additional vibrational energy (related to the additional power supplied to the audio module 2700) and, accordingly, additional thickness to handle additional audio frequencies. Also, the audio module opening 2704 can represent a single, immutable opening in the audio module housing 2702, in the audio module housing 2702 (used, for example, for wiring and telecommunications). Other openings can be air-sealed and liquid-sealed. In this regard, the diaphragm 2706 can prevent unwanted vibration due to air entering the audio module housing 2702 during changes in air pressure in an electronic device (not shown). This is further demonstrated below. Also, in some embodiments, the diaphragm 2706 includes a liquid resistant diaphragm (or liquid resistant membrane) designed to withstand damage from exposure to liquids such as water.

FIG. 40 shows a cross-sectional view of the audio module 2700 shown in FIG. 39, taken along line DD of FIG. 39, showing some internal features of the audio module 2700. As shown, the audio module 2700 includes a sound coil 2708 and a magnet 2710. The sound coil 2708 is designed to receive alternating current to form an electromagnet with alternating currents. The alternating poles can cause the sound coil to vibrate based on the interaction (attractive and repulsive) of the magnet 2710 with the external magnetic field.

The diaphragm 2706 is positioned within the audio module housing 2702 and separates the acoustic volume (partially defined by the audio module housing 2702) into a front volume 2720 and a back volume 2722. As shown, the front volume 2720 is open to the audio module opening 2704 and the back volume 2722 is sealed from the audio module opening 2704. Further, when the audio module 2700 is positioned in the electronic device 100 (shown in FIG. 1), the audio module housing 2702, for example, the diaphragm 2706, due to a change in air pressure in the electronic device 100. The components of the audio module 2700 can be sealed from the air in the electronic device 100 so that they are not acoustically driven or, in some cases, affected. As shown, the front volume 2720 and the back volume 2722 may be shielded from changes in air pressure in the electronic device 100. However, when the diaphragm 2706 vibrates to create acoustic energy, the acoustic energy exits the audio module opening 2704. Also, in some embodiments, the audio module 2700 is provided with air (air is the audio module opening) so that the back volume 2722 can balance with the environmental air when the air pressure of the external environmental air changes. Includes an air vent 2730 that allows entry into the back volume 2722 (by entering 2704) and exit from the back volume 2722 to the audio module opening 2704. Also, while the audio module 2700 can replace the first audio module 182 (shown in FIG. 4), the audio module 2700 is such that the audio module 2700 is the second audio (shown in FIG. 4). It may include different designs and shapes so that it can replace module 184.

FIG. 41 shows a cross-sectional view of an electronic device 100 showing an audio module 2700 positioned in the electronic device 100. As shown, the audio module 2700, in particular the audio module opening 2704, is aligned with at least one of the openings 134 (both of which are shown in FIG. 1). Also, the mesh material 2724 can cover the opening 134 to give an aesthetic finish. Also, in some embodiments, the audio module 2700 is fitted to the bracket 2726. The bracket 2726 may be secured to the audio module 2700 by the adhesive 2728, which may include a liquid resistant adhesive to prevent liquid from entering the electronic device 100 around the bracket 2726. The bracket 2726 may also include a sealing element 2732 located between the audio module 2700 and the bracket 2726 to form an entry barrier between the audio module 2700 and the bracket 2726. In this way, the audio module 2700 is positioned in the electronic device 100 so that the liquid that has entered the opening 134 can spread within the front volume 2720 but not within the back volume 2722. Also, the air that has entered the opening 134 can spread within both the front volume 2720 and the back volume 2722, the latter using an air port 2730 to receive the air. The air vent 2730 may also allow air to exit the back volume 2722. Therefore, the audio module 2700 can provide acoustic energy while preventing liquid from entering the electronic device 100. Also, the acoustic energy generated by the diaphragm 2706 can exit the audio module 2700 through the audio module opening 2704 and also exit the electronic device 100 through the opening 134.

Further, as shown in FIG. 41, the audio module 2700 is exposed only to the environmental air (outside the electronic device 100) in which the audio module opening 2704 has entered the electronic device 100 through the opening 134. As such, it can be positioned within the electronic device 100. In other words, the audio module housing 2702 has an internal volume change that causes a change in air pressure in the electronic device 100, for example by pressing the first protective layer 104 and the display assembly 102, to bring air into the audio module housing 2702. It is sealed in such a way that it does not enter the air, thereby preventing the diaphragm 2706 from producing unwanted acoustic noise.

FIG. 42 shows an exploded view of the thermal dispersion assembly 190 according to some described embodiments. The heat dispersion assembly 190 may include several layers of material that provide structural support as well as extended heat transfer properties. Extended heat transfer properties and structural support have been reduced because the heat transfer assembly 190 has a substantially non-metallic exterior, such as the electronic device 100 with a second protective layer 144 (shown in FIG. 2). It can be useful when used in electronic devices with heat transfer capability. In this regard, the thermal dispersion assembly 190 can be used in electronic devices to direct thermal energy from the non-metal bottom wall towards other structural features of the electronic device, such as the side wall components described above.

As shown, the thermal dispersion assembly 190 may include several layers of material. For example, the thermal dispersion assembly 190 may include a first layer 2802 formed from a first type of material, which may include a durable material such as stainless steel. The first layer 2802 may include a bottom wall 2812 along with a first side wall 2822 and a second side wall 2824, both of which extend vertically, or at least substantially vertically, from the bottom wall 2812. .. When assembled in electronic device 100 (shown in FIGS. 1 and 2), the thermal dispersion assembly 190, in particular the first layer 2802, becomes one or more heat generating components in electronic device 100. It is heat-bonded. At least one of the bottom wall 2812, the first side wall 2822, and the second side wall 2824 is in direct thermal contact with, or at least thermally coupled to, a heat generating component in the electronic device. May include. This will be shown later.

The thermal dispersion assembly 190 may further include a second layer 2804 designed to engage and thermally couple the first layer 2802 to it. The second layer 2804 may include a bottom wall 2814 along with a first side wall 2832 and a second side wall 2834, both of which extend vertically, or at least substantially vertically, from the bottom wall 2814. .. When the thermal dispersion assembly 190 is assembled, the bottom wall 2814 of the second layer 2804, the first side wall 2832, and the second side wall 2834 are the bottom wall 2812 and the first side wall of the first layer 2802, respectively. The 2822 and the second side wall 2824 may be engaged. Also, the second layer 2804 may contain a material having a relatively high thermal conductivity (compared to a first type material of the first layer 2802), such as copper or graphite, of a second type. Can be formed from material. In this regard, the second layer 2804 either redistributes the thermal energy from the heat-generating components (not shown) in the electronic device when the heat-generating components are thermally coupled to the heat-dispersing assembly 190. Designed to reorient or, in some cases, diffuse. The second layer 2804 may receive thermal energy from the first layer 2802 when the first layer 2802 receives thermal energy from the thermal generation component (s). At least one of the bottom wall 2816, the first side wall 2842, and the second side wall 2844 may include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the second layer 2804. ..

The thermal dispersion assembly 190 may also include a third layer 2806 designed to be combined with the first layer 2802 to improve structural support and rigidity to the thermal dispersion assembly 190. Thus, the third layer 2806 may, in some cases, be formed from a third type of material that is the same as or similar to that of the first type of material for the first layer 2802. The third layer 2806 may include a bottom wall 2816 along with a first side wall 2842 and a second side wall 2844, both of which extend vertically, or at least substantially vertically, from the bottom wall 2816. .. When the thermal dispersion assembly 190 is assembled, the bottom wall 2816 of the third layer 2806, the first side wall 2842, and the second side wall 2844 are the bottom wall 2814 and the first side wall of the second layer 2804, respectively. The 2832 and the second side wall 2834 may be engaged. Also, when the thermal dispersion assembly 190 is positioned in the electronic device 100 (shown in FIGS. 1 and 2), the first side wall 2842 and the second side wall 2844 of the third layer 2806 are A third side wall component 116 (shown in FIG. 1) and a fourth side wall component 118, respectively, can be engaged and thermally coupled to it. In this way, the thermal dispersion assembly 190 can be thermally coupled to a portion of the band 110 (shown in FIGS. 1 and 2). At least one of the bottom wall 2814, the first side wall 2832, and the second side wall 2834 may include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the first layer 2802. ..

Based on the material composition described above for the heat dispersion assembly 190, the second layer 2804 may contain heat transfer properties that are different from the heat transfer properties of the first layer 2802 and the third layer 2806. For example, the second layer 2804 may be formed from a material having a relatively high thermal conductivity as compared to the material (s) forming the first layer 2802 and the third layer 2806. Further, the first layer 2802 and the third layer 2806 can be formed from a material having a relatively high durability or rigidity as compared with the material forming the second layer 2804.

In order to assemble the thermal dispersion assembly 190 with layers of different material compositions, the various layers may undergo a clading operation designed to join the layers together. The clading operation may include placing each layer of material on a separate roller and then pressing the layers against each other as they pass through the rollers. The pressing effect can result in molecular binding between metal molecules. Note that the clading operation can be used when the second layer 2804 contains copper. Different assembly operations may be used when the second layer 2804 contains graphite. This is illustrated and described below. Also, when the thermal dispersion assembly 190 is assembled, the first layer 2802 and the third layer 2806 can provide support for the second layer 2804, as well as the electrons carrying the thermal dispersion assembly 190. It can provide some structural support to the device (not shown). Although the second layer 2804 is mainly used for heat transfer, the first layer 2802 and the third layer 2806 can also provide at least some heat transfer capability. Also, although the first layer 2802 and the third layer 2806 are mainly used for structural support, the second layer 2804 can also provide at least some structural support.

FIG. 43 shows a partial cross-sectional view of the electronic device 100 shown in FIG. 1, showing a thermal dispersion assembly 190 positioned in the electronic device 100. For illustration purposes, some components of electronic device 100 have been removed. As shown, the thermal dispersion assembly 190 allows heat generated from one or more operating components of the circuit board assembly 170 to pass from the circuit board assembly 170 to at least several layers of the thermal dispersion assembly 190. Can be in direct thermal contact with, or at least thermally coupled to, circuit board assembly 170. For example, as shown in the first enlarged view 2850, the thermal energy flow or heat flow (represented by the dotted line with the arrow) generated from the operating components of the circuit board assembly 170 is the first. It can pass through the first layer 2802 and reach the second layer 2804. As shown, the contact surface of the first layer 2802 (labeled in FIG. 42, bottom wall 2812) is in thermal contact with the circuit board assembly 170. In addition, due in part to the relatively high thermal conductivity of the second layer 2804 (compared to the third layer 2806), thermal energy passes through the first layer 2802 and through the first layer. At 2802, it tends to spread vertically, or at least partially vertically, through a second layer 2804 rather than through a third layer 2806. As further shown, the flow of thermal energy travels parallel to, or at least partially, parallel to the contact surface of the second layer 2804 (bottom wall 2814, labeled in FIG. 42). do. Therefore, the relatively low thermal conductivity of the third layer 2806 can prevent thermal energy accumulation at locations (s) near the second protective layer 144, also referred to as thermal hot spots. This will be further explained below.

Also, as shown in FIG. 43, the thermal dispersion assembly 190 may be designed to engage the band 110. For example, as shown in the second enlarged view 2852, the contact surface of the first side wall 2842 of the third layer 2806 of the thermal dispersion assembly 190 engages the third side wall component 116 of the band 110. I can let you. Thus, the third layer 2806 may be in direct thermal contact with, or at least thermally coupled to, the third sidewall component 116. The second layer 2804 may dissipate or reorient the thermal energy to the third layer 2806, in particular from the first side wall 2832 of the second layer 2804 to the first side wall 2842 of the third layer 2806. As a result, the thermal energy can be dispersed in the third side wall component 116, and the thermal energy can be dissipated from the third side wall component 116 into the environmental air. The thermal dispersion assembly 190 may further engage the fourth sidewall component 118 of the band 110, thus the thermal dispersion assembly 190 is in a manner similar to that of the third sidewall component 116 (ie). , Shown in FIG. 42, through the side walls of the second layer 2804 and the third layer 2806) can disperse heat to the fourth side wall component 118. In this way, at least one of the side wall components as a distributed heat sink, which prevents the heat generated by the circuit board assembly 170 from being trapped in or near the second protective layer 144, is therefore. The formation of hot spots must be prevented.

Further, in the thermal dispersion assembly 190, the second protective layer 144 is generated from the operating components of the circuit board assembly 170 because the third layer 2806 provides the minimum thermal conductivity as compared to the second layer 2804. It is possible to prevent or limit the reception of the heat energy generated, and therefore the heat energy in the electronic device 100 is mainly carried by the second layer 2804. In this regard, the second layer 2804 may define a thermal path or a major thermal path for the thermal energy generated by the operating components of the circuit board assembly 170. FIG. 43 shows that the thermal dispersion assembly 190 receives heat from the components (s) of the circuit board assembly 170, which is the electronic device 100 thermally coupled to the thermal dispersion assembly 190. Note that heat can be received from the heat generation component. The thermal dispersion assembly 190 may also provide a rigid support structure that supports the second protective layer 144. For example, the first layer 2802 and the third layer 2806 of the thermal dispersion assembly 190 may extend over the main surface of the second protective layer 144, as shown in FIG.

FIG. 44 shows a side view of an alternative embodiment of the thermal dispersion assembly 2900 according to some described embodiments. The thermal dispersion assembly 2900 may include any material (s) and / or features (s) previously described for the thermal dispersion assembly. The thermal dispersion assembly 2900 may include a first layer 2902, a second layer 2904 (shown as a dotted line), and a third layer 2906, the second layer 2904 being the first layer 2902. It is embedded between and the third layer 2906. As shown, the second layer 2904 can be completely covered by the first layer 2902 and the third layer 2906. This may prevent the movement or shift of the second layer 2904 with respect to the first layer 2902 and / or the third layer 2906. However, it should be noted that the second layer 2904 can still receive the heat that has passed through the first layer 2902 and / or the third layer 2906.

FIG. 45 shows an isometric view of an alternative embodiment of the thermal dispersion assembly 3000, showing the thermal dispersion assembly 3000 modified to accept component 3010 according to some described embodiments. The thermal dispersion assembly 3000 may include any material (s) and / or features (s) previously described for the thermal dispersion assembly. As shown, the thermal dispersion assembly 3000 may include a first layer 3002, a second layer 3004, and a third layer 3006, the second layer 3004 being the first layer 3002 and the third. It is embedded between the layer 3006 and the layer 3006.

However, the second layer 3004 can be modified to reduce the dimensions of the thermal dispersion assembly 3000. For example, a portion of the second layer 3004 has dimensions of the thermal dispersion assembly 3000 in which a portion of the thermal dispersion assembly 3000 contains only the first layer 3002 and the third layer 3006, thereby the absence of the second layer 3004 It can be removed locally at the desired location so as to reduce (locally). As a result of the reduced dimensions, the thermal dispersion assembly 3000 may include a first channel 3012 that receives component 3010. The thermal dispersion assembly 3000 may further include a second channel 3014 capable of accepting a second component (not shown). Note that the locations of the first channel 3012 and the second channel 3014 correspond to the locations where the second layer 3004 is absent. However, the components (s) fixed to the heat dispersion assembly 3000 in the first channel 3012 and / or the second channel 3014 are composed of the thermal energy generated by the components (s). It can be thermally coupled to the second layer 3004 so that it can be drawn from the singular or plural) to the second layer 3004.

The component 3010 may be fixed to the thermal dispersion assembly 3000 by welding, soldering, or adhering (by an adhesive), as a non-limiting example. Also, the dimensions of the first channel 3012 are such that the components 3010 are at least flush with respect to the first layer 3002, and in some cases are substantially flush with each other. Allows seating in the thermal dispersion assembly 3000. The dimensions of the second channel 3014 are such that the second component (not shown) is at least flush with respect to the third layer 3006 and, in some cases, substantially flush with each other. Note that it may be possible for the second component to be seated in the thermal dispersion assembly 3000. In addition, component 3010 may represent one or more components such as the heat generation component, audio module, bracket, or joint described above, as a non-limiting example. Alternatively, component 3010 may include a thermally conductive layer designed to receive (and thereby dissipate) thermal energy from the thermal dispersion assembly 3000.

FIG. 46 shows an isometric view of an alternative embodiment of the thermal dispersion assembly 3100 according to some described embodiments. The thermal dispersion assembly 3100 may include any material (s) and / or features (s) previously described for the thermal dispersion assembly. As shown, the thermal dispersion assembly 3100 may include a first layer 3102, a second layer 3104, and a third layer 3106, the second layer 3104 being the first layer 3102 and the third. It is located between the layers 3106 and.

In some embodiments, the second layer 3104 comprises a metal, such as copper. In the embodiment shown in FIG. 46, the second layer 3104 comprises graphite. The thermal dispersion assembly 3100 may undergo a welding operation to join the second layer 3104 to the first layer 3102 and the third layer 3106. For example, as shown in FIG. 46, the thermal dispersion assembly 3100 includes several welds, such as the first weld 3112 and the second weld 3114, both with the first layer 3102. Represents some welds to and from the second layer 3104. Also, the thermal dispersion assembly 3100 may include several welds between the third layer 3106 and the second layer 3104, as represented by the third weld 3116. By welding the second layer 3104 to the first layer 3102 and the third layer 3106, the second layer 3104 is first, especially when the second layer 3104 contains a granular material such as graphite. Can resist the shear forces that optionally displace the second layer 3104 with respect to the layer 3102 and the third layer 3106.

FIG. 47 shows a flow diagram 3200 showing how to form a display assembly for an electronic device according to some described embodiments. Electronic devices may include portable electronic devices, such as smartphones or mobile wireless communication devices, including wearable electronic devices.

In step 3202, the display layer is positioned between the touch sensitive layer and the force sensitive layer. The touch sensing layer is configured to detect the touch input that controls the electronic device. The force sensing layer is configured to detect the amount of force applied to the touch sensing layer. Each of the display layer, the touch sensitive layer, and the force sensitive layer may include an edge region containing at least one connector. Moreover, some edge regions with connectors (s) may be perpendicular or parallel to other edge regions. For example, the touch sensitive layer may include an edge region having a connector, the display layer may include an edge region having a connector, and the edge regions described above may be parallel to, or at least substantially parallel to, each other. Is. In addition, the force sensing layer may include an edge region that includes a connector. However, the edge region of the force sensing layer may be perpendicular to, or at least substantially perpendicular to, the edge region of the display layer and / or the edge region of the touch sensing layer.

In step 3204, the display layer is bent such that the display layer is at least partially curved around the force sensing layer. In some cases, the display layer is pre-bent. Also, the edge region of the display (carrying the connector) can be separated from the main part of the display layer. The main part of the display layer refers to the surface defining a substantial majority of the display layer, and the small part of the display layer refers to the part separated from the main part by the bend. The edge region with the connector can be placed on or supported by a small portion.

FIG. 48 shows a flow diagram 3300 showing a method of forming a battery assembly for an electronic device according to some described embodiments. Battery assemblies can be used to supply current to several internal components (such as integrated circuits, audio modules, cameras, lighting components, etc.) located within an electronic device.

In step 3302, a housing is provided. The enclosure is designed to provide an enclosure to some of the components of the battery. The housing may include a second cover element and a sealed first cover element after the components have been positioned between the first cover element and the second cover element. Also, the housing may take the form of one of several different shapes. In this regard, the housing may include an L-shaped configuration, an I-shaped configuration, or a C-shaped configuration (as a non-limiting example) based on the shapes of the electrodes and separators. Moreover, any of these above-mentioned configurations may include openings or through-holes designed to accommodate or provide space for the internal components of the electronic device.

In step 3304, a plurality of electrodes are inserted into the housing. Multiple electrodes may include an anode and a cathode pair. Also, each pair of electrodes is separated by a separator that physically insulates the pair of electrodes from each other, while still allowing the flow of charge between the pairs of electrodes. In addition, each electrode may undergo a die-cutting operation in order to form an electrode having a specific size and shape. The size and shape may include a size and shape depending on the housing. In this regard, each electrode in the electrode pair may include, as a non-limiting example, an L-shape, a C-shape, or an I-shape. Moreover, each separator and each electrode in the electrode pair may include an opening when the housing also includes the above-mentioned openings to provide through holes in the battery assembly.

In step 3306, a channel is formed in the housing. Channels can define reduced dimensions within the enclosure. In this regard, the housing may (substantially) include a first height. However, at locations corresponding to the channels, the housing may include a second height that is smaller than the first height. The channel is designed to reduce the contour of the battery assembly so that additional components (such as flexible circuitry) can easily pass over the battery along the channel. In this regard, the channel may allow additional components in the electronic device to be repositioned. However, the battery housing can still accept components, such as circuit boards, at locations corresponding to (or within) the channel.

FIG. 49 shows a flow diagram 3400 showing a method of forming a circuit board assembly according to some described embodiments. The circuit board assembly is designed to carry several operating components. The circuit board assembly may include a laminated configuration in which the first circuit board is laminated on the second circuit board, or, instead, the first circuit board is laminated on the second circuit board. When positioned within the enclosure or housing of the electronic device, the laminated configuration can reduce the overall space (in multiple dimensions) occupied by the circuit board assembly.

In step 3402, a first circuit board is provided. The first circuit board may include a first operating component. The first operating component includes a recess. Also, the first circuit board may include multiple (opposing) surfaces, each of which is designed to carry multiple operating components, some of which are metal traces and / or vias. Telecommunications with each other via.

In step 3404, the second circuit is fixed to the first circuit board so that the first circuit overlaps the second circuit board. The second circuit board may include a second operating component having a protrusion.

In step 3406, the convex portion of the second operating component is positioned (or at least partially positioned) in the concave portion. In this way, the first motion component is "fitted" with the second motion component via the recesses and protrusions. This is because the first operating component and the second operating component are positioned closer to each other, as opposed to the operating components that cannot be fitted to each other. The gap between the circuit board and the circuit board can be reduced. As a result, the circuit board assembly may include a lower profile and may occupy less space in the electronic device.

FIG. 50 shows a flow diagram 3500 showing a method of assembling an electronic device including an enclosure defining an internal volume according to some described embodiments. The enclosure may include through holes that are open relative to the internal volume. In step 3502, the audio module is disposed in the internal volume. The audio module may include an audio module housing carrying a diaphragm. The audio module may further include an audio module opening formed within the audio module housing and aligned with the through hole. Also, with the exception of the audio module opening, the audio module enclosure can be without additional openings, or, instead, the audio module enclosure is separate from the air within the internal volume defined by the enclosure. It may include an opening (or multiple openings) covered by an airtight, liquidtight seal to define a maintained acoustic volume (including front and back volumes).

In step 3504, the bracket is positioned around a portion of the audio module housing. For example, the bracket may at least partially enclose a portion of the audio module enclosure associated with the audio module opening, thereby providing additional support to the audio module enclosure. Also, the bracket may be adhesively secured to the enclosure at or near the through hole. The adhesive used to secure the bracket to the enclosure may include a liquid resistant adhesive.

In step 3506, the sealing element seals the bracket against the enclosure at the through hole. The sealing element may be positioned between the bracket and the enclosure and may engage the bracket and the enclosure. In this regard, the audio module housing may be sealed from the air in the internal volume and the diaphragm may be sealed from the air in the internal volume. Further, the audio module housing is positioned and designed to receive or expel air from an external environment outside the electronic device, such as air that has entered the through hole. The diaphragm can also be used to allow the audio module to emit acoustic energy from the audio module openings and through holes.

FIG. 51 shows a flow diagram 3600 showing a method of making a thermal dispersion assembly that removes thermal energy from thermal energy components in an electronic device having enclosure sidewalls, according to some described embodiments. The thermal dispersion assembly is designed to provide structural support to the electronic device, especially when the glass bottom wall coupled to the enclosure sidewall defines the enclosure of the electronic device.

In step 3602, the first layer is fixed to the second layer. The first layer may include a first bottom wall and a first side wall extending from the first bottom wall. The second layer may include a second bottom wall that engages the first bottom wall. The second layer also extends from the second bottom wall and may further include a second side wall that engages the first side wall. In some cases, the first layer comprises a first type of material, such as steel (including stainless steel), to provide structural support. Also, in some cases, the second layer comprises a second type of material, such as copper or graphite, designed to improve the thermal conductivity of the thermal dispersion assembly. Also, the first and second layers may each include additional side walls.

In step 3604, the third layer is fixed to the second layer. The third layer may include a third bottom wall that engages the second bottom wall. The third layer extends from the third bottom wall and may further include a third side wall that engages the second side wall with the enclosure side wall. The third layer may include a third type of material, such as steel (including stainless steel). In this regard, the third layer may be combined with the first layer to provide additional structural support. Also, the first and third layers can completely cover the second layer so that the second layer is hidden from view by the first and third layers.

When the thermal dispersion assembly is assembled and positioned in the electronic device, the first layer is designed to disperse thermal energy from the thermal generation components to the second layer. The second layer is also designed to disperse the thermal energy throughout the various locations of the second layer so that the thermal energy can reach the third layer and be distributed across the enclosure sidewalls.

The various aspects, embodiments, implementations, or features of the embodiments described may be used individually or in any combination. Various aspects of the embodiments described may be implemented by software, hardware, or a combination of hardware and software. The described embodiment can also be embodied as a computer-readable code on a computer-readable medium that controls a manufacturing operation, or as a computer-readable code on a computer-readable medium that controls a manufacturing line. This computer-readable medium is any data storage device capable of storing data that can later be read by a computer system. Examples of computer-readable media include read-only memory, random access memory, CD-ROMs, HDDs, DVDs, magnetic tapes, and optical data storage devices. Computer-readable media can be distributed across networked computer systems so that computer-readable code is stored and executed in a distributed format.

In the above description, certain terms have been used for illustration purposes and to provide a complete understanding of the described embodiments. However, it will be apparent to those skilled in the art that no particular details are required to implement the described embodiments. Accordingly, the above description of the particular embodiments described herein are provided for illustration and explanation. They are not intended to be exhaustive or to limit embodiments to the exact forms disclosed. It will be apparent to those skilled in the art that many modifications and modifications can be made in light of the above teachings.

Claims (14)

A display assembly for electronic devices
A touch-sensitive layer capable of detecting a touch input capable of controlling the electronic device, the touch-sensitive layer including a first edge region having a first electrical connector.
A display layer that is capable of presenting visual information and includes a bending region and a second edge region having a second electrical connector.
A flexible circuit coupled to the first electrical connector, which surrounds the outer circumference of the bending region and extends in parallel with the second electrical connector.
A frame that defines the undercut region and at least partially receives the display layer in the bend region.
A band defining the outer circumference of the electronic device and
A display assembly comprising: the frame is coupled to the band. The display assembly according to claim 1, further comprising a force sensing layer that is capable of detecting the amount of force applied to the touch sensing layer and includes a third edge region having a third electrical connector. The display assembly according to claim 2, wherein the first edge region is perpendicular to the third edge region. The display assembly of claim 1, wherein the display layer comprises a curved organic light emitting diode display. It ’s an electronic device,
With a protective layer made of transparent material,
A display assembly covered by the protective layer.
A touch sensing layer capable of detecting a touch input applied to the protective layer, and a touch sensing layer.
A display assembly that includes a display layer that defines a bend located on the outer periphery of the display assembly.
A frame that carries the protective layer and includes a support element that defines an undercut region at the bend that at least partially receives the display layer and supports the display assembly.
A band defining the outer circumference of the electronic device and
An electronic device comprising: The frame is coupled to the band. A flexible circuit coupled to the touch-sensitive layer in a connector, further comprising a flexible circuit that surrounds the display layer and the undercut region receives at least a portion of the flexible circuit. 5. The electronic device according to 5. The touch sensitive layer includes a first edge region having a first connector electrically and mechanically coupled to the first flexible circuit.
The display layer includes a second edge region having a second connector electrically and mechanically coupled to the second flexible circuit.
The first edge region is parallel to the second edge region,
The electronic device according to claim 5. The band is made of metal and includes a first portion and a second portion facing the first portion, the first connector being closer to the first portion than the second connector. The electronic device according to claim 7, wherein the second connector is closer to the second portion than the first connector. The band further includes a third portion and a fourth portion, the first portion, the second portion, the third portion, and the fourth portion being electrically insulated from each other. The electronic device according to claim 8. The electronic device of claim 7, further comprising a force sensing layer comprising a third edge region having a third connector electrically and mechanically coupled to the third flexible circuit. The electronic device according to claim 10, wherein the first edge region is perpendicular to the third edge region. The support element is embedded in the frame and
The electronic device according to claim 5, wherein the electronic device further comprises an adhesive between the support element and the display assembly. 12. The electronic device of claim 12, further comprising a flexible circuit that is coupled to the display assembly and adhesively secured to the support element by an adhesive. The electronic device of claim 5, wherein the frame defines a notch, and the protective layer comprises an extension located in the notch.

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