TWM542332U - Air cooling heat dissipation device - Google Patents

Description

Air cooling device

The present invention relates to an air-cooling heat dissipating device, and more particularly to an air-cooling heat dissipating device that uses a gas pump to provide a driving airflow for heat dissipation.

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been trending toward thin, portable, high-performance, and these electronic devices are In the limited internal space, various high-accumulation or high-power electronic components must be configured. In order to make the electronic device faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Causes high temperatures. In addition, most of these electronic devices are designed to be thin, flat, and compact, and have no additional internal space for heat dissipation. Therefore, electronic components in electronic devices are susceptible to heat and high temperatures, which may cause interference or interference. Damage and other issues.

Generally speaking, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually disposed inside the electronic device by using an axial fan or a blower fan, and the airflow is driven by the axial fan or the blower fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation. . However, axial fans and blower fans generate large noise during operation, and their bulk is not easy to be thinner and smaller, and axial fans and blower fans have a shorter service life. Therefore, the traditional axial flow fan and the blower fan are not suitable for heat dissipation in thin and light portable and portable electronic devices.

Furthermore, many electronic components are soldered to a printed circuit board (PCB) using techniques such as Surface Mount Technology (SMT) and Selective Soldering, but soldered by the soldering method described above. The electronic components are easily separated from the printed circuit board after being in a high thermal energy and high temperature environment for a long time, and most of the electronic components are not resistant to high temperatures. If the electronic components are in a high heat and high temperature environment for a long time, It is easy to cause the performance stability of electronic components to decrease and the lifespan to be shortened.

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. As shown in FIG. 1 , the conventional heat dissipating mechanism is a passive heat dissipating mechanism, and includes a heat conducting plate 12 which is adhered to a electronic component 11 to be dissipated by a thermal conductive adhesive 13 by a thermal conductive adhesive. 13 and the heat conduction path formed by the heat conduction plate 12 allows the electronic component 11 to achieve heat dissipation by heat conduction and natural convection. However, the heat dissipation mechanism of the foregoing heat dissipation mechanism is inferior and cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat sink to solve the problems faced by the prior art.

The purpose of the present invention is to provide an air-cooling heat dissipating device, which can be applied to various electronic devices to perform side-wind heat convection heat dissipation on electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and make electronic components internal electronic components. Stabilizes and prolongs the service life, and eliminates the need to stack heat sinks on electronic components, making the thickness of the overall electronic device thinner.

Another object of the present invention is to provide an air-cooling heat dissipating device having a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the use of the air cooling device. life.

In order to achieve the above objective, one of the more general embodiments of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a carrier having a first surface, a second surface, and a pump receiving groove. a first flow guiding chamber, a second flow guiding chamber, an air guiding end opening, a communication groove and at least one venting groove, wherein the first surface and the second surface are respectively upper and lower surfaces of the carrier, and the pump accommodating groove The first guiding cavity is recessed on a bottom surface of the pump receiving groove, and the air guiding end opening is disposed on the bottom surface, the air guiding end opening is connected to the first guiding flow chamber, and the second The guiding chamber is recessed on the second surface, the communicating groove is communicated between the first guiding chamber and the second guiding chamber, and at least one exhausting groove is connected to the second guiding chamber and is cooled by air cooling Outside the device, the second flow guiding chamber cover accommodates the electronic component; and the gas pump is disposed in the pump receiving groove of the carrier, and the closed air guiding end opening is disposed in the pump receiving groove of the carrier Middle, and closing the air guiding end opening, the gas pump comprises: a resonance piece having one a piezoelectric actuator, disposed corresponding to the resonant plate; and a cover having a side wall, a bottom plate, and an opening, the side wall surrounding the bottom of the bottom plate protruding from the bottom plate and forming a space with the bottom plate a space is disposed, and the resonant plate and the piezoelectric actuator are disposed in the accommodating space, and the opening is disposed on the sidewall, wherein a first surface is formed between the bottom plate of the cover and the resonant plate a chamber, the resonator plate and the side wall of the cover plate jointly define a confluence chamber; wherein the gas is pumped to introduce the airflow into the first diversion chamber through the air guide opening, and the airflow is transmitted through the communication slot The second flow guiding chamber is introduced, and the electronic components are exchanged for heat, and the airflow after heat exchange with the electronic components is discharged through at least one exhausting groove.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.

Please refer to FIG. 2A, FIG. 2B and FIG. 3A and FIG. 3B. FIG. 2A is a schematic structural view of the air-cooling heat dissipating device of the preferred embodiment of the present invention, and FIG. 2B is an air-cooling heat dissipating device of FIG. 2A. FIG. 3A is a schematic view showing the appearance of the carrier for removing the gas pump in FIG. 2A, and FIG. 3B is a schematic view showing the bottom structure of the carrier of the air-cooling heat dissipating device shown in FIG. 2A. As shown in the figure, the air-cooling heat sink 2 of the present invention can be applied to an electronic device such as, but not limited to, a portable computer, a tablet computer, an industrial computer, a portable communication device, a video player, and the like. The heat dissipating electronic component 3 dissipates heat, and the electronic component 3 can be, but is not limited to, an integrated circuit (IC). In the present embodiment, the air-cooling heat sink 2 includes a carrier 20 and a gas pump 21. The carrier 20 further includes a first surface 20a, a second surface 20b, a pump accommodating groove 201, a first flow guiding chamber 202, a second guiding chamber 203, an air guiding end opening 204, a communication groove 205, and at least one row. Air trough 206. The first surface 20a and the second surface 20a are respectively upper and lower surfaces of the carrier 20, and are disposed corresponding to each other, and the pump accommodating groove 201 is recessed in the first surface 20a, and the second flow guiding chamber 203 is The recess is disposed in the second surface 20b, and the pump accommodating groove 201 and the second flow guiding chamber 203 can be, but are not limited to, a groove-like structure, wherein the pump accommodating groove 201 is used for accommodating the gas pump The second guiding chamber 203 is used to cover the electronic component 3. By designing the gas pump 21 to be disposed in the pump accommodating groove 201, the overall height of the air-cooling heat sink 2 can be reduced, and the effect of lightening and thinning can be achieved.

In addition, the first flow guiding chamber 202 is also a groove-like structure, and the recess is disposed in the bottom surface 201a of the pump receiving groove 201, and the air guiding end opening 204 is disposed on the bottom surface 201a, and is first The flow guiding chamber 202 and the pump receiving groove 201 are in communication. The communication groove 205 is connected between the first flow guiding chamber 202 and the second flow guiding chamber 203 for airflow to be transmitted. And at least one exhaust groove 206 is connected between the second flow guiding chamber 203 and the outside of the air cooling heat sink 2 for discharging the airflow to the outside of the air cooling heat sink 2. The gas pump 21 is disposed in the pump accommodating groove 201 of the carrier 20, and is attached to the bottom surface 201a to close the air guiding end opening 204. The gas pump 21 is driven to introduce the gas flow into the first flow guiding chamber 202 via the air guiding end opening 204, the air flow is introduced into the second guiding flow chamber 203 through the communication groove 205, and the electronic component 3 is provided. The cross-flow airflow is used for heat exchange, and the airflow after heat exchange with the electronic component 3 is discharged through the slot of the at least one exhaust slot 206, so that heat dissipation to the electronic component 3 is achieved. Of course, in another embodiment (not shown), the carrier 20 may not be provided with the pump accommodating groove 201, and the gas pump 21 may be directly assembled on the first surface 20a, and the air-cooling heat dissipating device 2 described above may also be implemented. The heat dissipation effect.

In this embodiment, the electronic component 3 is disposed on a carrier substrate 4, wherein the carrier substrate 4 can be, but is not limited to, a printed circuit board (PCB). The carrier substrate 4 is connected to the second surface 20b of the carrier 20, and the electronic component 3 is housed in the second flow guiding chamber 203 of the carrier 20.

Referring to FIG. 2A and FIG. 3A, as shown, the carrier 20 of the present embodiment is further provided with an air inlet slot 207, wherein the air inlet slot 207 is also recessed on the first surface 20a and is connected to the pump receiving portion. One side of the tank 201 is for the gas to circulate and enter the gas pump 21 to prevent the gap between the pump accommodating tank 201 and the gas pump 21 from being too small, resulting in poor intake effect. In addition, the air inlet slot 207 can also be used to accommodate a conductive device (not shown). The conductive device can be, but is not limited to, a wire, and is electrically connected to the gas pump 21 for providing power to the gas pump 21 . Moreover, the arrangement of the conductive device does not increase the overall structural height of the air-cooling heat dissipating device 2, and the air-cooling heat dissipating device is light and thin.

Referring to FIG. 2B to FIG. 3B, as shown in the figure, the communication groove 205 of the carrier 20 of the present embodiment further includes a confluence portion 205a, a plurality of communication portions 205b, a confluence portion opening 205c, and a plurality of communication portion openings 205d, wherein The confluence portion 205a communicates with the first diversion chamber 202 through the confluence portion opening 205c, and the plurality of communication portions 205b communicate with the second diversion chamber 203 through the plurality of communication portion openings 205d, and the confluence portion 205a further includes a The inclined surface 205e is disposed corresponding to the plurality of communicating portions 205b. When the gas pump 21 introduces the gas into the first guiding flow chamber 202 via the manifold opening 205c, the airflow flows from the first guiding chamber 202 to the communication. The confluence portion 205a of the groove 205 passes through the inclined surface 205e to concentrate the airflow, and increases the flow rate of the airflow. Then, the airflow flows into the plurality of communication portions 205b, and then is introduced into the second diversion chamber 203 via the plurality of communication portion openings 205d, and the electrons. Element 3 performs heat exchange. Therefore, the area of the confluence opening 205c of the confluence portion 205a can be made larger than the area of the bottom portion of the confluence portion 205a through the arrangement of the slope 205e of the confluence portion 205a to further concentrate the airflow, increase the gas flow rate, and accelerate the second diversion flow. The gas convection inside the chamber 203 enhances the heat exchange effect with the electronic component 3.

Please refer to FIG. 4A and FIG. 4B. FIG. 4A is a schematic diagram showing the front exploded structure of the gas pump of the preferred embodiment of the present invention, and FIG. 4B is a schematic view showing the rear exploded structure of the gas pump of the preferred embodiment of the present invention. In the present embodiment, the gas pump 21 is a piezoelectrically actuated gas pump for driving gas flow. As shown, the gas pump 21 of the present invention includes elements such as a resonator piece 212, a piezoelectric actuator 213, and a cover plate 216. The resonator piece 212 is disposed corresponding to the piezoelectric actuator 213 and has a hollow hole 2120 disposed in the central area of the resonator piece 212, but is not limited thereto. The piezoelectric actuator 213 has a suspension plate 2131, an outer frame 2132, and a piezoelectric ceramic plate 2133. The suspension plate 2131 has a central portion 2131c and a peripheral portion 2131d. When the piezoelectric ceramic plate 2133 is driven by a voltage, the suspension plate 2131 can be The central portion 2131c is bent and vibrated to the outer peripheral portion 2131d. The outer frame 2132 is disposed on the outer side of the suspension plate 2131 and has at least one bracket 2132a and a conductive pin 2132b. However, not limited thereto, each bracket 2132a is disposed on The suspension plate 2131 and the outer frame 2132 are connected to the suspension plate 2131 and the outer frame 2132 to provide elastic support. The conductive pins 2132b are outwardly protruded from the outer frame 2132 for For the power supply connection, the piezoelectric ceramic plate 2133 is attached to the second surface 2131b of the suspension plate 2131 for receiving an applied voltage to generate deformation to drive the suspension plate 2131 to bend and vibrate. The cover plate 216 has a side wall 2161, a bottom plate 2162 and an opening portion 2163. The side wall 2161 is disposed on the bottom plate 2162 around the periphery of the bottom plate 2162, and forms a receiving space 216a with the bottom plate 2162 for the resonant piece 212 and the piezoelectric body. The actuator 213 is disposed therein, and the opening portion 2163 is disposed on the sidewall 2161 for the conductive pin 2132b of the outer frame 2132 to protrude outwardly through the opening portion 2163 and protrude outside the cover plate 216 to facilitate external power supply. Connected, but not limited to this.

In the present embodiment, the gas pump 21 of the present invention further includes two insulating sheets 2141, 2142 and a conductive sheet 215, but not limited thereto, wherein the two insulating sheets 2141 and 2142 are respectively disposed on the conductive sheet 215. The shape is substantially corresponding to the outer frame 2132 of the piezoelectric actuator 213, and is composed of an insulating material, such as plastic, for insulation, but not limited thereto, and the conductive sheet 215 is It is made of a conductive material, such as a metal, for electrical conduction, and its shape also corresponds to the outer frame 2132 of the piezoelectric actuator 213, but is not limited thereto. In this embodiment, a conductive pin 2151 can also be disposed on the conductive sheet 215 for electrical conduction. The conductive pin 2151 also passes through the opening of the cover 216 as the conductive pin 2132b of the outer frame 2132. The portion 2163 protrudes out of the cover 216 to facilitate connection with an external power source.

Please refer to FIGS. 5A, 5B, and 5C. FIG. 5A is a front view of the piezoelectric actuator of the preferred embodiment of the present invention, and FIG. 5B is a rear structure of the piezoelectric actuator of the preferred embodiment of the present invention. FIG. 5C is a schematic cross-sectional view showing the piezoelectric actuator of the preferred embodiment of the present invention. As shown in the figure, in the present embodiment, the suspension plate 2131 of the present invention has a stepped surface structure, that is, a convex portion 2131e is further formed on the central portion 2131c of the first surface 2131a of the suspension plate 2131, and the convex portion 2131e is a The circular raised structure is not limited thereto. In some embodiments, the suspension plate 2131 may also be a plate-shaped square that is flat on both sides. As shown in FIG. 5C, the convex portion 2131e of the suspension plate 2131 is coplanar with the first surface 2132c of the outer frame 2132, and the first surface 2131a of the suspension plate 2131 and the first surface 2132a' of the bracket 2132a are also coplanar. In addition, the convex portion 2131e of the suspension plate 2131 and the first surface 2132c of the outer frame 2132 and the first surface 2131a of the suspension plate 2131 and the first surface 2132a' of the bracket 2132a have a specific depth. As for the second surface 2131b of the suspension plate 2131, as shown in FIGS. 5B and 5C, the second surface 2132d of the outer frame 2132 and the second surface 2132a of the bracket 2132a are flat and planar, and the pressure is The electric ceramic plate 2133 is attached to the second surface 2131b of the flat suspension plate 2131. In other embodiments, the shape of the suspension plate 2131 may also be a double-sided flat plate-like square structure, not In this embodiment, the suspension plate 2131, the outer frame 2132, and the bracket 2132a may be integrally formed, and may be composed of a metal plate, for example, may be made of stainless steel. The material is composed of, but not limited to, in this embodiment, the gas pump 21 of the present invention further has at least one gap 2134 between the suspension plate 2131, the outer frame 2132 and the bracket 2132a for gas to pass therethrough.

Next, the internal structure of the gas pump 21 after the assembly is completed, please refer to FIG. 6A and FIG. 6B, and FIG. 6A is a cross-sectional view of the air-cooling heat dissipating device shown in FIG. 2A in the BB cross section, FIG. 6B. It is a partially enlarged schematic view of a cross section of the air-cooling heat dissipating device shown in FIG. 2B. As shown in the figure, the gas pump 21 of the present invention is sequentially stacked from top to bottom by a cover plate 216, an insulating sheet 2142, a conductive sheet 215, an insulating sheet 2141, a piezoelectric actuator 213, a resonator piece 212, and the like. And after the stacked piezoelectric actuator 213, the insulating sheet 2141, the conductive sheet 215, and the other insulating sheet 2142 are glued to form a colloid 218, thereby filling the periphery of the accommodating space 216a of the cover 216. seal. After the assembly, the gas pump 21 is a quadrangular structure, but it is not limited thereto, and its shape may be changed according to actual needs. In addition, in the embodiment, only the conductive pins 2151 (not shown) of the conductive sheet 215 and the conductive pins 2132b of the piezoelectric actuator 213 (shown in FIG. 6A ) are protruded from the cover 216 . In addition, it is convenient to connect to an external power supply, but it is not limited to this. The assembled gas pump 21 forms a first chamber 217b between the cover plate 216 and the resonator piece 212.

After the gas pump 21 and the carrier 20 are assembled, the side wall 2161 of the cover plate 216 abuts against the bottom surface 201a of the pump receiving groove 201 of the carrier 20, and closes the air guiding end opening 204, and passes through the side wall of the cover plate 216. 2161, the resonance piece 212 and the bottom surface 201a jointly define a confluence chamber 217a, that is, as shown in FIG. 6B, and as shown in FIG. 6A, the opening portion 2163 of the cover plate 216 communicates with the outside, thereby being accessible from the external environment. Collect gas. In this embodiment, the resonator plate 212 of the gas pump 21 of the present invention has a gap g0 between the piezoelectric actuator 213 and the piezoelectric material 213, and the conductive material is filled in the gap g0, for example, conductive adhesive, but not Therefore, the resonance piece 212 and the convex portion 2131e of the suspension plate 2131 of the piezoelectric actuator 213 are maintained at a depth of a gap g0, thereby guiding the airflow to flow more rapidly, and the suspension plate 2131 The convex portion 2131e is kept at an appropriate distance from the resonant piece 212 to reduce the mutual contact interference, thereby causing the noise to decrease. In other embodiments, the height of the outer frame 2132 can be increased by adding the high voltage electric actuator 213. A gap is added when assembling the resonator piece 212, but is not limited thereto. Thereby, when the piezoelectric actuator 213 is driven to perform the air collecting operation, the gas system is first collected by the opening portion 2163 of the cover plate 216 to the confluence chamber 217a, and further flows through the hollow hole 2120 of the resonance piece 212 to the first A chamber 217b is temporarily stored. When the piezoelectric actuator 213 is driven to perform an exhaust operation, the gas system first flows from the first chamber 217b through the hollow hole 2120 of the resonator 212 to the confluence chamber 217a, and then passes through the guide. The gas end opening 204 flows into the first flow guiding chamber 202.

The operation flow of the gas pump 21 in this case is further described below. Please refer to FIGS. 7A-7D, and the 7A-7D diagram is a schematic diagram of the operation of the gas pump in the preferred embodiment of the present invention. First, as shown in FIG. 7A, the structure of the gas pump 21 is as described above, in order from the cover plate 216, the other insulating sheet 2142, the conductive sheet 215, the insulating sheet 2141, the piezoelectric actuator 213, and the resonator 212. The stacked assembly is positioned to have a gap g0 between the resonant piece 212 and the piezoelectric actuator 213, and the resonant piece 212 and the side wall 2161 of the cover plate 216 jointly define the confluent chamber 217a on the resonant piece 212 and The piezoelectric actuator 213 has a first chamber 217b between them. When the gas pump 21 has not been driven by the voltage, the position of each element is as shown in Fig. 7A.

Next, as shown in Fig. 7B, when the piezoelectric actuator 213 of the gas pump 21 is vibrated upward by the voltage, the gas enters the gas pump 21 from the opening portion 2163 of the cap plate 216, and is collected into the confluence. The chamber 217a then flows upward into the first chamber 217b via the hollow hole 2120 on the resonator piece 212, and the resonance piece 212 is resonated by the resonance of the suspension plate 2131 of the piezoelectric actuator 213. That is, the resonant piece 212 is deformed upward, that is, the resonant piece 212 is slightly convex upward at the hollow hole 2120.

Thereafter, as shown in FIG. 7C, at this time, the piezoelectric actuator 213 is vibrated downward to the initial position, at which time the convex portion 2131e of the suspension plate 2131 of the piezoelectric actuator 213 is close to the resonance piece 212. The micro-convex portion is upwardly raised at the hollow hole 2120, thereby causing the gas in the gas pump 21 to temporarily accumulate to the upper first chamber 217b.

Further, as shown in FIG. 7D, the piezoelectric actuator 213 vibrates downward again, and the resonance piece 212 is vibrated by the vibration of the piezoelectric actuator 213, and the resonance piece 212 is also vibrated downward. The downward deformation of the resonator piece 212 compresses the volume of the first chamber 217b, thereby causing the gas in the upper half of the first chamber 217b to push to flow to both sides and pass through the gap 2134 of the piezoelectric actuator 213 to circulate downward. And flowing to the hollow hole 2120 of the resonator piece 212 to be compressed and discharged, forming a compressed gas flowing through the air guiding end opening 204 to the first guiding cavity 202 of the carrier 20. It can be seen from this embodiment that when the resonant piece 212 performs vertical reciprocating vibration, the gap g0 between the resonant piece 212 and the piezoelectric actuator 213 can be increased by the maximum distance of the vertical displacement, in other words, The gap g0 provided between the vibrating plate 12 and the piezoelectric actuator 213 allows the resonating piece 212 to generate a larger vertical displacement when resonating.

Finally, the resonant piece 212 will return to the initial position, that is, as shown in FIG. 7A, and then continue to circulate through the steps 7A to 7D through the aforementioned operation flow, and the gas will continuously pass through the opening portion 2163 of the cover plate 216. The flow enters the confluence chamber 217a, flows into the first chamber 217b, and then flows into the confluence chamber 217a from the first chamber 217b, so that the airflow continuously flows into the air guide opening 204, thereby enabling stable gas transfer. In other words, when the gas pump 21 of the present invention operates, the gas system sequentially flows through the opening portion 2163 of the cover plate 216, the confluence chamber 217a, the first chamber 217b, the confluence chamber 217a, and the air guide end opening 204. The gas pump 21 of the present invention can pass through a single component, that is, the cover plate 216, and is designed by using the opening portion 2163 of the cover plate 216, thereby reducing the number of components of the gas pump 21 and simplifying the overall process.

As described above, the gas is introduced into the first flow guiding chamber 202 of the carrier 20 through the operation of the gas pump 21, and the air flow is introduced into the second flow guiding chamber 203 via the communication groove 205, so that the introduced gas and electrons are introduced. The component 3 performs heat exchange, and continuously pushes the gas in the first flow guiding chamber 202 to introduce the airflow into the second guiding cavity 203 via the communication groove 205, so that the gas in the second guiding cavity 203 flows rapidly, and the heat is promoted. The exchanged gas discharges heat energy to the outside of the air-cooling heat sink 2 via a plurality of exhaust grooves 206 of the carrier 20, thereby improving the efficiency of heat dissipation and cooling, thereby increasing the performance stability and life of the electronic component 3.

Please refer to Fig. 8. Fig. 8 is a schematic structural view of the control system of the air-cooling heat dissipating device of the present invention. As shown in the figure, the air-cooling heat dissipating device 2 of the preferred embodiment of the present invention has a temperature control function, and further includes a control system 5, wherein the control system 5 further includes a control unit 51 and a temperature sensor 52, wherein the control unit 51 is It is electrically connected to the gas pump 21 to control the operation of the gas pump 21. The temperature sensor 52 is disposed in the second flow guiding chamber 201 of the carrier 20 and disposed adjacent to the electronic component 3 for sensing the temperature of the electronic component 3. The temperature sensor 52 is electrically connected to the control unit 51, senses the temperature in the vicinity of the electronic component 3, or directly attaches to the electronic component 3 to sense the temperature of the electronic component 3, and transmits the sensing signal to the control unit 51. The control unit 51 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 52. When the control unit 51 determines that the temperature of the electronic component 3 is higher than the temperature threshold, the control unit 51 issues a The control signal is applied to the gas pump 21 so that the gas pump 21 operates, whereby the gas pump 21 drives the airflow to cool the electronic component 3, and the electronic component 3 is cooled to cool and lower the temperature. When the control unit 51 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 21 to stop the operation of the gas pump 21, thereby preventing the gas pump 21 from continuing to operate and causing the life. Shorten and reduce the loss of extra energy. Therefore, through the setting of the control system 5, the gas pump 21 of the air-cooling heat sink 2 can be cooled and cooled when the temperature of the electronic component 3 is overheated, and stops after the temperature of the electronic component 3 is lowered, thereby avoiding the gas pump. The continued operation of the Pu 21 results in a shortened life span, reducing the loss of additional energy, and also allowing the electronic component 3 to operate in a preferred temperature environment to improve the stability of the electronic component 3.

In summary, the present invention provides an air-cooling heat dissipating device, which can be applied to various electronic devices to perform side-wind heat convection heat dissipation on electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and make electronic components internal electronic components. The performance is stable and the service life is extended, and it is not necessary to superimpose a heat sink on the electronic components, so that the thickness of the overall electronic device can be made thinner. In addition, the air-cooling heat dissipating device of the present case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the service life of the heat dissipating device.

11‧‧‧Electronic components
12‧‧‧heat transfer board
13‧‧‧thermal adhesive
2‧‧‧Air-cooling heat sink
20‧‧‧ Carrier
20a‧‧‧ first surface
20b‧‧‧ first surface
201‧‧‧ pump accommodating slot
202‧‧‧First diversion chamber
203‧‧‧Second diversion chamber
204‧‧‧ Air conduction opening
205‧‧‧Connecting slot
205a‧‧ ‧ Confluence Department
205b‧‧‧Connecting Department
205c‧‧‧ confluence opening
205d‧‧‧Connecting opening
205e‧‧‧Bevel
206‧‧‧Exhaust trough
207‧‧‧Air intake slot
21‧‧‧ gas pump
212‧‧‧Resonance film
2120‧‧‧ hollow holes
213‧‧‧ Piezoelectric Actuator
2131‧‧‧suspension plate
2131a‧‧‧ first surface
2131b‧‧‧ second surface
2131c‧‧‧ Central Department
2131d‧‧‧The outer part
2131e‧‧‧ convex
2132‧‧‧Front frame
2132a‧‧‧ bracket
2132a'‧‧‧ first surface
2132a”‧‧‧second surface
2132b‧‧‧Electrical pins
2132c‧‧‧ first surface
2132d‧‧‧ second surface
2133‧‧‧ Piezoelectric ceramic plate
2134‧‧‧ gap
2141, 2142‧‧‧Insulation
215‧‧‧Conductor
2151‧‧‧Electrical pins
216‧‧‧ cover
216a‧‧‧ accommodating space
2161‧‧‧ side wall
2162‧‧‧floor
2163‧‧‧ openings
217b‧‧‧ first chamber
217a‧‧ ‧ confluence chamber
218‧‧ ‧ colloid
3‧‧‧Electronic components
4‧‧‧Loading substrate
5‧‧‧Control system
51‧‧‧Control unit
52‧‧‧temperature sensor
G0‧‧‧ gap

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. 2A is a schematic structural view of the air-cooling heat dissipating device of the preferred embodiment of the present invention. Fig. 2B is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A in the AA cross section. Figure 3A is a schematic view showing the appearance of the carrier for removing gas pumping in Figure 2A. Fig. 3B is a schematic view showing the structure of the bottom of the carrier of the air-cooling heat dissipating device shown in Fig. 2A. 4A and 4B are respectively schematic views showing the decomposition structure of the gas pumped at different viewing angles in the preferred embodiment of the present invention. Fig. 5A is a schematic view showing the front structure of the piezoelectric actuator of the preferred embodiment of the present invention. Fig. 5B is a schematic view showing the structure of the back surface of the piezoelectric actuator of the preferred embodiment of the present invention. Fig. 5C is a schematic cross-sectional view showing the piezoelectric actuator of the preferred embodiment of the present invention. Fig. 6A is a schematic cross-sectional view of the air-cooling heat dissipating device shown in Fig. 2A taken along the line BB. Fig. 6B is a partially enlarged schematic cross-sectional view showing the air-cooling heat dissipating device shown in Fig. 2B. 7A to 7D are schematic views showing the operation of the gas pumping of the preferred embodiment of the present invention. Figure 8 is a schematic view showing the structure of the control system of the air-cooling heat dissipating device of the preferred embodiment of the present invention.

2‧‧‧Air-cooling heat sink

20‧‧‧ Carrier

20a‧‧‧ first surface

20b‧‧‧ first surface

201‧‧‧ pump accommodating slot

202‧‧‧First diversion chamber

203‧‧‧Second diversion chamber

204‧‧‧ Air conduction opening

205‧‧‧Connecting slot

205a‧‧ ‧ Confluence Department

205b‧‧‧Connecting Department

205c‧‧‧ confluence opening

205d‧‧‧Connecting opening

205e‧‧‧Bevel

206‧‧‧Exhaust trough

21‧‧‧ gas pump

3‧‧‧Electronic components

4‧‧‧Loading substrate

Claims (13)

An air-cooling heat dissipating device for dissipating heat to an electronic component, the air-cooling heat dissipating device comprising: a carrier having a first surface, a second surface, a pump receiving groove, a first guiding chamber, a second flow guiding chamber, a gas guiding end opening, a communication groove and at least one venting groove, wherein the first surface and the second surface are respectively upper and lower surfaces of the carrier, and the pump receiving groove is concave Provided on the first surface, the first flow guiding chamber is recessed on a bottom surface of the pump receiving groove, and the air guiding end opening is disposed on the bottom surface, and the air guiding end opening is connected to the first guiding a flow chamber, the second flow guiding chamber is recessed on the second surface, the communication groove is communicated between the first flow guiding chamber and the second guiding flow chamber, and the at least one exhausting groove Connected to the second flow guiding chamber and the outside of the air cooling device, the second guiding chamber cover receives the electronic component; and a gas pumping device disposed in the pump receiving groove of the carrier Middle, and closing the air guiding end opening, the gas pump comprises: a resonant piece having a hollow hole; a piezoelectric actuator disposed corresponding to the resonant plate; and a cover having a side wall, a bottom plate and an opening portion, the side wall is protruded from the bottom plate and protrudes from the bottom plate and forms with the bottom plate a accommodating space, and the resonant plate and the piezoelectric actuator are disposed in the accommodating space, the opening is disposed on the sidewall, wherein a bottom surface of the cover and the resonant piece form a a first chamber, the resonator plate and the side wall of the cover plate together define a confluence chamber; wherein the gas is pumped to introduce a gas flow into the first diversion chamber via the air guide opening, The airflow is introduced into the second flow guiding chamber through the communication groove, and the electronic component is heat-exchanged, and the airflow after heat exchange with the electronic component is discharged through the at least one exhausting groove. The air-cooling heat dissipating device of claim 1, further comprising a carrier substrate coupled to the second surface of the carrier, wherein the electronic component is disposed on the carrier substrate. The air-cooling heat dissipating device of claim 1, wherein the carrier is further provided with an air inlet groove, the air inlet groove is recessed on the first surface, and communicates with one side of the pump receiving groove for gas circulation. And enter the gas pump. The air-cooling heat dissipating device of claim 1, wherein the communication groove further comprises a confluence portion and a plurality of communication portions communicating with each other, and the confluence portion is in communication with the first diversion chamber, the plurality of communication portions And communicating with the second flow guiding chamber, the confluent portion includes a slope, and the slope is disposed corresponding to the plurality of communicating portions. The air-cooling heat dissipating device of claim 4, wherein the confluence portion includes a confluence opening, the confluence opening is open between the air-conducting end opening and the confluence portion, and an area of the confluence opening is larger than the confluence The area at the bottom of the section. The air-cooling heat dissipating device of claim 1, wherein the gas pump is positioned by the cover plate, the piezoelectric actuator and the resonant piece in a correspondingly arranged position, when the piezoelectric actuator is driven When performing a gas gathering operation, the gas system first flows from the hollow hole of the resonance piece to the first chamber, and when the piezoelectric actuator is driven to perform an exhaust operation, the gas system is firstly A chamber flows into the air guide opening through the hollow hole of the resonator. The air-cooling heat dissipating device of claim 1, wherein the piezoelectric actuator comprises: a suspension plate having a first surface and a second surface; an outer frame having at least one bracket, the at least one bracket connected The suspension plate and the outer frame are disposed between the suspension plate and the outer frame; and a piezoelectric ceramic plate attached to the first surface of the suspension plate for applying a voltage to drive the suspension plate to bend and vibrate . The air-cooling heat dissipating device of claim 7, wherein the resonator piece has a gap with the piezoelectric actuator. The air-cooling heat dissipating device of claim 7, wherein the bracket, the suspension plate and the outer frame further have at least one gap, and the two ends of the bracket are respectively connected to the outer frame and the suspension plate. The air-cooling heat dissipating device of claim 7, wherein the suspension plate further has a convex portion on the second surface, and the convex portion has a cylindrical structure. The air-cooling heat dissipating device of claim 7, wherein the gas pump further comprises at least one insulating sheet and a conductive sheet, and the at least one insulating sheet and the conductive sheet are sequentially disposed under the piezoelectric actuator . The air-cooling heat dissipating device of claim 11, wherein the piezoelectric actuator outer frame has a conductive pin, the conductive piece has a conductive pin, and the gas pumps the opening of the cover The conductive pin of the outer frame and the conductive pin of the conductive sheet protrude outwardly from the opening to protrude from the cover to facilitate connection with an external power source. The air-cooling heat dissipating device of claim 1, further comprising a control system comprising: a control unit electrically connected to the gas pump to control the gas pumping operation; and a temperature sensor Electrically connected to the control unit and adjacent to the electronic component to sense a temperature of the electronic component to output a sensing signal to the control unit; wherein, when the control unit receives the sensing signal, When the temperature of the electronic component is greater than a temperature threshold, the control unit enables the gas pump to drive the airflow, and when the control unit receives the sensing signal, and determines the electronic component When the temperature is below the temperature threshold, the control unit stops the gas pump from operating.