CN112432086B - LED (light-emitting diode) down lamp - Google Patents
LED (light-emitting diode) down lamp Download PDFInfo
- Publication number
- CN112432086B CN112432086B CN202011335131.7A CN202011335131A CN112432086B CN 112432086 B CN112432086 B CN 112432086B CN 202011335131 A CN202011335131 A CN 202011335131A CN 112432086 B CN112432086 B CN 112432086B
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- Prior art keywords
- lamp
- bottom plate
- air
- semiconductor refrigeration
- heat dissipation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED (light-emitting diode) down lamp which comprises a lamp shell, a lamp panel arranged in the lamp shell and a heat dissipation structure arranged on the upper surface of the lamp panel, wherein the heat dissipation structure comprises a radiator, a semiconductor refrigeration piece and an air draft assembly; the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate; the semiconductor refrigeration piece is arranged in the annular mounting groove on the side wall of the lamp shell and positioned at the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned at the outer side, the cold end of the semiconductor refrigeration piece is positioned at the inner side, the cold end of the semiconductor refrigeration piece is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with air flow outside the lamp shell, and the second end of the air inlet hole is in butt joint with the flow channel; the air draft assembly is arranged at the inner top of the lamp shell. The invention can achieve high-efficiency heat dissipation effect to ensure that the down lamp can emit light with high stability under the condition of high power for a long time.
Description
Technical Field
The invention relates to the technical field of lamps, in particular to an LED down lamp.
Background
The LED down lamp is a product developed by improving the traditional down lamp by applying a novel LED lighting source, and has the following advantages compared with the traditional down lamp: energy saving, low carbon, long service life, good color rendering and high response speed. The LED down lamp is more attractive and light in design, and can keep the overall unity and perfection of architectural decoration during installation.
The down lamp has different luminous requirements under different use occasions. If under large-scale occasion, the luminous of down lamp needs stably, and the degree of consistency is high, can not have the requirement of black spot. Under this requirement, the density that needs to arrange LED lamp pearl on the lamp plate is higher, and the power that leads to down lamp is great, also can further increase the heat production of down lamp, so the fault rate of LED lamp pearl and lamp plate can obviously increase, therefore the down lamp heat radiation structure of prior art obviously can't satisfy the heat dissipation requirement of this type of down lamp, has improved space.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the LED down lamp which can achieve a high-efficiency heat dissipation effect so as to ensure that the down lamp emits light with high stability under the condition of high power for a long time.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a LED down lamp, includes the lamp body, sets up the lamp plate in the lamp body and sets up in the heat radiation structure of lamp plate upper surface, characterized by: the heat dissipation structure comprises a radiator, a semiconductor refrigeration piece and an air draft assembly;
the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate;
the semiconductor refrigeration piece is arranged in the annular mounting groove on the side wall of the lamp shell and positioned at the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned at the outer side, the cold end of the semiconductor refrigeration piece is positioned at the inner side, the cold end of the semiconductor refrigeration piece is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with air flow outside the lamp shell, and the second end of the air inlet hole is in butt joint with the flow channel;
the air draft assembly is arranged at the inner top of the lamp shell and positioned above the radiator so as to exhaust air flow around the radiator to the outside of the lamp shell.
Preferably, the flow channel passes through the center of the heat dissipation bottom plate and traverses the whole heat dissipation bottom plate.
Preferably, the number of the semiconductor chilling plates is at least two.
Preferably, the air inlet hole extends in a winding way up and down in the refrigerating block.
Preferably, the circumferential edge of the radiating bottom plate is formed with an enclosure wall attached to the refrigerating block.
Preferably, the lamp further comprises a ring cover, the ring cover is covered on a notch of the annular mounting groove on the side wall of the lamp shell, and an upper opening for heat dissipation of the hot end of the semiconductor refrigeration sheet and a lower opening for air intake of the air intake are respectively arranged on the top wall and the bottom wall of the ring cover.
Preferably, the hot end of the semiconductor refrigeration sheet is positioned outside the lamp shell.
Preferably, the air draft assembly is an air draft fan.
The invention has the advantages that: the air draft assembly can drive the air flow inside and outside the lamp shell to circularly flow, when the air flow outside the lamp shell enters the lamp shell, the air flow can pass through the refrigerating block, so that the temperature of the air flow is relatively low, and the air flow can play a refrigerating role on the heat dissipation bottom plate when passing through a flow channel of the heat dissipation bottom plate so as to reduce the temperature of the heat dissipation bottom plate and the lamp plate and achieve an efficient heat dissipation effect.
Drawings
Fig. 1 is a broken view of an LED tube light provided in this embodiment;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a top view of the heat sink and semiconductor chilling plate mating structure.
Detailed Description
The LED tube light of the present invention will be further described with reference to fig. 1 to 3.
The utility model provides a LED down lamp, includes lamp body 1, sets up lamp plate 7 in lamp body 1 and sets up in the heat radiation structure of lamp plate 7 upper surface. The top wall of the lamp shell 1 is densely provided with air outlets; a perspective cover 8 is arranged on the lower opening 24 of the lamp shell 1, and lenses are densely distributed on the perspective cover 8 and correspond to the LED lamp beads 71 on the lamp panel 7; an annular mounting groove 11 is provided on an annular outer side wall of the lamp housing 1. The heat dissipation structure comprises a radiator 6, a semiconductor refrigeration piece 3 and an air draft assembly 5. The lamp panel 7 is fixed at the position of the lamp housing 1 close to the lower opening 24 through bolts. The heat sink 6 includes a heat dissipating base plate 61 and heat dissipating fins 62, the heat dissipating base plate 61 has a plurality of flow channels 612 therein, the upper surface of the heat dissipating base plate 61 is provided with a plurality of air outlets 611 communicated with the flow channels, that is, each flow channel has a plurality of air outlets 611, and the heat dissipating fins 62 are formed on the upper surface of the heat dissipating base plate 61 in an evenly distributed state, so as to achieve a heat dissipating effect. The semiconductor refrigeration piece 3 is arranged in the annular mounting groove 11 on the side wall of the lamp housing 1 and located at the periphery of the radiator 6, the hot end 31 of the semiconductor refrigeration piece 3 is located at the outer side, the cold end 32 is located at the inner side, the refrigeration block 4 is attached to the cold end 32, an air inlet 41 is formed in the refrigeration block 4, the first end 411 of the air inlet 41 is connected with air flow outside the lamp housing 1, and the second end 412 is in butt joint with an inlet of a flow channel 612 located on the side wall of the heat dissipation bottom block. The air draft assembly 5 is arranged at the inner top of the lamp housing 1 and is located above the radiator 6 so as to draw the air flow around the radiator 6 to the outside of the lamp housing 1.
Based on the structure, the air draft assembly 5 drives the air flow inside and outside the lamp housing 1 to circularly flow during heat dissipation, namely, the air draft assembly 5 drives the hot air in the lamp housing 1 to flow to the outside through the air outlet at the top of the lamp housing 1, and the air flow outside the lamp housing 1 enters the lamp housing 1 through the air inlet 41 of the refrigerating block 4 and the flow passage 612 in the heat dissipation bottom plate 61; the refrigeration piece is cooled down by the cold junction of semiconductor refrigeration piece, lamp body 1 outside air current is when passing through inlet port 41, refrigeration piece 4 is to this air current refrigeration, the air current after being refrigerated flows to the runner in to the cooling of radiating bottom plate 61, then rethread venthole 611 is to the cooling of heat radiation fins 62, flow to lamp body 1 outside at last, play the efficient radiating effect to radiator 6 and lamp plate 7, make LED lamp pearl 71 steady operation on lamp plate 7 and the lamp plate 7.
Each of the flow channels passes through the center of the heat dissipating base plate 61 and traverses the entire heat dissipating base plate 61, and each of the flow channels has a plurality of air outlets 611. This structure is convenient for the abundant flow of air current in radiating bottom plate 61, promotes the effect to the cooling of radiating bottom plate 61.
The semiconductor refrigerating pieces 3 are at least two, in the embodiment, the number of the semiconductor refrigerating pieces is two, and the semiconductor refrigerating pieces 3 can be conveniently assembled and disassembled singly by the structure.
The air inlet holes 41 are extended in the refrigeration block 4 in a vertically circuitous manner, and the structure can improve the contact time of the air flow entering the lamp shell 1 and the refrigeration block 4 so as to reduce the temperature of the air flow entering the heat dissipation bottom plate 61 as much as possible.
An enclosure wall 63 attached to the refrigerating block 4 is formed on the circumferential edge of the heat radiation base plate 61. The surrounding wall 63 can increase the contact area between the radiator 6 and the refrigerating block 4, and further improve the refrigerating effect of the refrigerating block 4.
The LED down lamp further comprises a ring cover 2, the ring cover 2 is covered on a notch of an annular mounting groove in the side wall of the lamp shell 1 through bolts, and an upper opening 23 for heat dissipation of a hot end 31 of the semiconductor refrigerating sheet 3 and a lower opening 24 for air inlet of the air inlet 41 are respectively arranged on the top wall and the bottom wall of the ring cover 2. Specifically, an upper groove 21 corresponding to the hot end 31 and a lower groove 22 corresponding to the first end 411 of the air inlet 41 are arranged in the ring cover 2, the hot end 31 and the first end 411 of the air inlet 41 can be separated by the upper groove 21 and the lower groove 22, and heat generated by the hot end 31 is prevented from entering the lamp housing 1 through the first end 411 of the air inlet 41. Meanwhile, since the hot end 31 is located above the first end 411 of the air inlet hole 41, the hot airflow generated by the hot end 31 rises, and further the airflow generated by the hot end 31 is prevented from entering the air inlet hole 41.
Sealing nets are provided on both the upper opening 23 and the lower opening 24.
The hot junction 31 of semiconductor refrigeration piece 3 is located the outside of lamp body 1, and this hot junction 31 is located the outside of annular mounting groove notch promptly, and this setting can make the heat that hot junction 31 produced directly give off the environment in, reduces the influence to the down lamp.
The exhaust assembly 5 includes a bracket 51 disposed at the inner top of the lamp housing 1 by bolts and an exhaust fan 52 mounted on the bracket 51.
Further, a temperature sensor is further disposed on the heat dissipation bottom plate 61 of the present embodiment, and the temperature sensor is electrically connected to the semiconductor chilling plate 3. When the temperature of the radiating bottom plate 61 reaches the set value of the temperature sensor, the semiconductor refrigerating sheet 3 is started; when the temperature of the radiating bottom plate 61 does not reach the set value, the semiconductor refrigerating sheet 3 does not work so as to reasonably control the temperature of the lamp panel 7.
Unless otherwise specified, in the present invention, if there is an orientation or positional relationship indicated by terms of "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, the terms describing orientation or positional relationship in the present invention are for illustrative purposes only, and should not be construed as limiting the present patent, specific meanings of the above terms can be understood by those of ordinary skill in the art in light of the specific circumstances in conjunction with the accompanying drawings.
Unless expressly stated or limited otherwise, the terms "disposed," "connected," and "connected" are used broadly and encompass, for example, being fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. The utility model provides a LED down lamp, includes the lamp body, sets up the lamp plate in the lamp body and sets up in the heat radiation structure of lamp plate upper surface, characterized by: the heat dissipation structure comprises a radiator, a semiconductor refrigeration piece and an air draft assembly;
the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate;
the semiconductor refrigeration piece is arranged in the annular mounting groove on the side wall of the lamp shell and positioned at the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned at the outer side, the cold end of the semiconductor refrigeration piece is positioned at the inner side, the cold end of the semiconductor refrigeration piece is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with air flow outside the lamp shell, and the second end of the air inlet hole is in butt joint with the flow channel;
the air draft assembly is arranged at the inner top of the lamp shell and positioned above the radiator so as to exhaust air flow around the radiator to the outside of the lamp shell.
2. The LED downlight of claim 1, wherein: the flow channel passes through the circle center of the heat dissipation bottom plate and transversely penetrates through the whole heat dissipation bottom plate.
3. An LED downlight according to claim 1, wherein: the number of the semiconductor chilling plates is at least two.
4. An LED downlight according to claim 1, wherein: the air inlet hole is extended in a roundabout way up and down in the refrigerating block.
5. An LED downlight according to claim 1, wherein: and a surrounding wall attached to the refrigerating block is formed on the circumferential edge of the heat dissipation bottom plate.
6. An LED downlight according to claim 1, wherein: the lamp is characterized by further comprising a ring cover, wherein the ring cover is covered on a notch of the annular mounting groove in the side wall of the lamp shell, and an upper opening for heat dissipation of the hot end of the semiconductor refrigerating sheet and a lower opening for air inlet of the air inlet are formed in the top wall and the bottom wall of the ring cover respectively.
7. An LED downlight according to claim 1, wherein: the hot end of the semiconductor refrigeration sheet is positioned outside the lamp shell.
8. An LED downlight according to claim 1, wherein: the air draft assembly is an air draft fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011335131.7A CN112432086B (en) | 2020-11-25 | 2020-11-25 | LED (light-emitting diode) down lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011335131.7A CN112432086B (en) | 2020-11-25 | 2020-11-25 | LED (light-emitting diode) down lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112432086A CN112432086A (en) | 2021-03-02 |
| CN112432086B true CN112432086B (en) | 2022-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011335131.7A Active CN112432086B (en) | 2020-11-25 | 2020-11-25 | LED (light-emitting diode) down lamp |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267724A (en) * | 2007-03-16 | 2008-09-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN101368713A (en) * | 2007-08-17 | 2009-02-18 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101482256A (en) * | 2008-01-09 | 2009-07-15 | 一诠精密工业股份有限公司 | Radiating device |
| EP2458625A2 (en) * | 2010-11-29 | 2012-05-30 | Honeywell International, Inc. | Fin fabrication process for entrainment heat sink |
| CN102548348A (en) * | 2010-12-28 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN102679193A (en) * | 2011-03-08 | 2012-09-19 | 建准电机工业股份有限公司 | Lamp fitting |
| CN102901073A (en) * | 2011-07-27 | 2013-01-30 | 都江堰市华刚电子科技有限公司 | Side draft type LED (light-emitting diode) heat radiator |
| CN103347375A (en) * | 2013-06-19 | 2013-10-09 | 余姚市佳诚汽车部件有限公司 | Heat sink for full electric automobile master-drive machine controller |
| CN204629271U (en) * | 2015-06-09 | 2015-09-09 | 常山优博特机电科技有限公司 | A kind of LED down with active heat removal fan and central suction hole |
| TW201819766A (en) * | 2016-11-24 | 2018-06-01 | 研能科技股份有限公司 | Air cooling heat dissipation device |
| CN208750546U (en) * | 2018-09-27 | 2019-04-16 | 东莞市赛欧光电科技有限公司 | A kind of radiating LED downlight facilitating installation |
| CN209180793U (en) * | 2019-01-22 | 2019-07-30 | 广东顺德金护光电股份有限公司 | A kind of high-efficient heat-dissipating downlight |
| CN210399239U (en) * | 2019-04-19 | 2020-04-24 | 青岛海尔空调器有限总公司 | Heat radiation component, radiator, air condensing units and air conditioner |
-
2020
- 2020-11-25 CN CN202011335131.7A patent/CN112432086B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267724A (en) * | 2007-03-16 | 2008-09-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN101368713A (en) * | 2007-08-17 | 2009-02-18 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101482256A (en) * | 2008-01-09 | 2009-07-15 | 一诠精密工业股份有限公司 | Radiating device |
| EP2458625A2 (en) * | 2010-11-29 | 2012-05-30 | Honeywell International, Inc. | Fin fabrication process for entrainment heat sink |
| CN102548348A (en) * | 2010-12-28 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN102679193A (en) * | 2011-03-08 | 2012-09-19 | 建准电机工业股份有限公司 | Lamp fitting |
| CN102901073A (en) * | 2011-07-27 | 2013-01-30 | 都江堰市华刚电子科技有限公司 | Side draft type LED (light-emitting diode) heat radiator |
| CN103347375A (en) * | 2013-06-19 | 2013-10-09 | 余姚市佳诚汽车部件有限公司 | Heat sink for full electric automobile master-drive machine controller |
| CN204629271U (en) * | 2015-06-09 | 2015-09-09 | 常山优博特机电科技有限公司 | A kind of LED down with active heat removal fan and central suction hole |
| TW201819766A (en) * | 2016-11-24 | 2018-06-01 | 研能科技股份有限公司 | Air cooling heat dissipation device |
| CN208750546U (en) * | 2018-09-27 | 2019-04-16 | 东莞市赛欧光电科技有限公司 | A kind of radiating LED downlight facilitating installation |
| CN209180793U (en) * | 2019-01-22 | 2019-07-30 | 广东顺德金护光电股份有限公司 | A kind of high-efficient heat-dissipating downlight |
| CN210399239U (en) * | 2019-04-19 | 2020-04-24 | 青岛海尔空调器有限总公司 | Heat radiation component, radiator, air condensing units and air conditioner |
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| Publication number | Publication date |
|---|---|
| CN112432086A (en) | 2021-03-02 |
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