CN213810279U - Heat radiation structure of LED down lamp - Google Patents
Heat radiation structure of LED down lamp Download PDFInfo
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- CN213810279U CN213810279U CN202022763980.4U CN202022763980U CN213810279U CN 213810279 U CN213810279 U CN 213810279U CN 202022763980 U CN202022763980 U CN 202022763980U CN 213810279 U CN213810279 U CN 213810279U
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- radiator
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- down lamp
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Abstract
The utility model discloses a heat radiation structure of LED down lamp, characterized by: the cooling device comprises a radiator, a semiconductor refrigeration sheet and an air draft assembly; the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate; the semiconductor refrigeration piece is arranged on the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned on the outer side, the cold end of the semiconductor refrigeration piece is positioned on the inner side, the cold end is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with external air flow, and the second end of the air inlet hole is in butt joint with the flow channel; the air draft assembly is arranged above the radiator to upwardly pump air flow around the radiator. The utility model discloses can reach the efficient radiating effect to guarantee that the down lamp carries out the giving off light of high stability under the high power condition for a long time.
Description
Technical Field
The utility model relates to a lamps and lanterns heat dissipation technical field, more specifically relate to a heat radiation structure of LED down lamp.
Background
The LED down lamp is a product developed by improving the traditional down lamp by applying a novel LED lighting source, and has the following advantages compared with the traditional down lamp: energy saving, low carbon, long service life, good color rendering and high response speed. The LED down lamp is more attractive and light in design, and can keep the overall unity and perfection of architectural decoration during installation.
The down lamp has different luminous requirements under different use occasions. If under large-scale occasion, the luminous of down lamp needs stably, and the degree of consistency is high, can not have the requirement of black spot. Under this requirement, the density that needs to arrange LED lamp pearl on the lamp plate is higher, and the power that leads to down lamp is great, also can further increase the heat production of down lamp, so the fault rate of LED lamp pearl and lamp plate can obviously increase, therefore the down lamp heat radiation structure of prior art obviously can't satisfy the heat dissipation requirement of this type of down lamp, has improved space.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a heat radiation structure of LED down lamp can reach the efficient radiating effect to guarantee that the down lamp carries out the giving out light of high stability under the high power condition for a long time.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a heat radiation structure of LED down lamp, characterized by: the cooling device comprises a radiator, a semiconductor refrigeration sheet and an air draft assembly;
the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate;
the semiconductor refrigeration piece is arranged on the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned on the outer side, the cold end of the semiconductor refrigeration piece is positioned on the inner side, the cold end is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with external air flow, and the second end of the air inlet hole is in butt joint with the flow channel;
the air draft assembly is arranged above the radiator to upwardly pump air flow around the radiator.
Preferably, the flow channel passes through the center of the heat dissipation bottom plate and traverses the whole heat dissipation bottom plate.
Preferably, the number of the semiconductor chilling plates is at least two.
Preferably, the air inlet hole extends in a winding way up and down in the refrigerating block.
Preferably, the circumferential edge of the radiating bottom plate is formed with an enclosure wall attached to the refrigerating block.
Preferably, the air draft assembly is an air draft fan.
The utility model has the advantages that: the air draft assembly can drive air flow to circularly flow, when the air flow outside the radiator enters the radiator, the air flow passes through the refrigerating block, so that the temperature of the air flow is relatively low, the air flow can play a refrigerating role on the radiating bottom plate when passing through a flow channel of the radiating bottom plate, the temperature of the radiating bottom plate and the temperature of the lamp plate attached to the lower surface of the radiating bottom plate are reduced, and the efficient radiating effect is achieved.
Drawings
Fig. 1 is a broken view of an LED tube light provided in this embodiment;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a top view of the heat sink and semiconductor chilling plate mating structure.
Detailed Description
The heat dissipation structure of the LED down lamp of the present invention is further described with reference to fig. 1 to 3.
The utility model provides a LED down lamp, includes lamp body 1, sets up lamp plate 7 in lamp body 1 and sets up in the heat radiation structure of lamp plate 7 upper surface. The top wall of the lamp shell 1 is densely provided with air outlets; a perspective cover 8 is arranged on the lower opening 24 of the lamp shell 1, and lenses are densely distributed on the perspective cover 8 and correspond to the LED lamp beads 71 on the lamp panel 7; an annular mounting groove 11 is provided on an annular outer side wall of the lamp housing 1. The heat dissipation structure comprises a radiator 6, a semiconductor refrigeration piece 3 and an air draft assembly 5. The lamp panel 7 is fixed at the position of the lamp housing 1 close to the lower opening 24 through bolts. The heat sink 6 includes a heat dissipating base plate 61 and heat dissipating fins 62, the heat dissipating base plate 61 has a plurality of flow channels 612 therein, the upper surface of the heat dissipating base plate 61 is provided with a plurality of air outlets 611 communicated with the flow channels, that is, each flow channel has a plurality of air outlets 611, and the heat dissipating fins 62 are formed on the upper surface of the heat dissipating base plate 61 in an evenly distributed state, so as to achieve a heat dissipating effect. The semiconductor refrigeration piece 3 is arranged in the annular mounting groove 11 on the side wall of the lamp housing 1 and located at the periphery of the radiator 6, the hot end 31 of the semiconductor refrigeration piece 3 is located at the outer side, the cold end 32 is located at the inner side, the refrigeration block 4 is attached to the cold end 32, an air inlet 41 is formed in the refrigeration block 4, the first end 411 of the air inlet 41 is connected with air flow outside the lamp housing 1, and the second end 412 is in butt joint with an inlet of a flow channel 612 located on the side wall of the heat dissipation bottom block. The air draft assembly 5 is arranged at the inner top of the lamp housing 1 and is positioned above the radiator 6 so as to draw the air flow around the radiator 6 to the outside of the lamp housing 1.
Based on the structure, the air draft assembly 5 drives the air flow inside and outside the lamp shell 1 to circularly flow during heat dissipation, namely the air draft assembly 5 drives the hot air in the lamp shell 1 to flow to the outside through the air outlet at the top of the lamp shell 1, and the air flow outside the lamp shell 1 enters the lamp shell 1 through the air inlet 41 of the refrigerating block 4 and the flow passage 612 in the heat dissipation bottom plate 61; the refrigeration piece is cooled down by the cold junction of semiconductor refrigeration piece, lamp body 1 outside air current is when passing through inlet port 41, refrigeration piece 4 is to this air current refrigeration, the air current after being refrigerated flows to the runner in to the cooling of radiating bottom plate 61, then rethread venthole 611 is to the cooling of heat radiation fins 62, flow to lamp body 1 outside at last, play the efficient radiating effect to radiator 6 and lamp plate 7, make LED lamp pearl 71 steady operation on lamp plate 7 and the lamp plate 7.
Each of the flow channels passes through the center of the heat dissipating base plate 61 and traverses the entire heat dissipating base plate 61, and each of the flow channels has a plurality of air outlets 611. This structure is convenient for the abundant flow of air current in radiating bottom plate 61, promotes the effect to the cooling of radiating bottom plate 61.
The semiconductor refrigerating pieces 3 are at least two, in the embodiment, the number of the semiconductor refrigerating pieces is two, and the semiconductor refrigerating pieces 3 can be conveniently assembled and disassembled singly by the structure.
The air inlet holes 41 are extended in the refrigeration block 4 in a vertically circuitous manner, and the structure can improve the contact time of the air flow entering the lamp shell 1 and the refrigeration block 4 so as to reduce the temperature of the air flow entering the heat dissipation bottom plate 61 as much as possible.
An enclosure wall 63 attached to the refrigerating block 4 is formed on the circumferential edge of the heat radiation base plate 61. The surrounding wall 63 can increase the contact area between the radiator 6 and the refrigerating block 4, and further improve the refrigerating effect of the refrigerating block 4.
The LED down lamp further comprises a ring cover 2, the ring cover 2 is covered on a notch of an annular mounting groove in the side wall of the lamp shell 1 through bolts, and an upper opening 23 for heat dissipation of a hot end 31 of the semiconductor refrigerating sheet 3 and a lower opening 24 for air inlet of the air inlet 41 are respectively arranged on the top wall and the bottom wall of the ring cover 2. Specifically, an upper groove 21 corresponding to the hot end 31 and a lower groove 22 corresponding to the first end 411 of the air inlet 41 are arranged in the ring cover 2, the hot end 31 and the first end 411 of the air inlet 41 can be separated by the upper groove 21 and the lower groove 22, and heat generated by the hot end 31 is prevented from entering the lamp housing 1 through the first end 411 of the air inlet 41. Meanwhile, since the hot end 31 is located above the first end 411 of the air inlet hole 41, the hot airflow generated by the hot end 31 rises, and further the airflow generated by the hot end 31 is prevented from entering the air inlet hole 41.
Sealing nets are provided on both the upper opening 23 and the lower opening 24.
The hot junction 31 of semiconductor refrigeration piece 3 is located the outside of lamp body 1, and this hot junction 31 is located the outside of annular mounting groove notch promptly, and this setting can make the heat that hot junction 31 produced directly give off the environment in, reduces the influence to the down lamp.
The exhaust assembly 5 includes a bracket 51 disposed at the inner top of the lamp housing 1 by bolts and an exhaust fan 52 mounted on the bracket 51.
Further, a temperature sensor is further disposed on the heat dissipation bottom plate 61 of the present embodiment, and the temperature sensor is electrically connected to the semiconductor chilling plate 3. When the temperature of the radiating bottom plate 61 reaches the set value of the temperature sensor, the semiconductor refrigerating sheet 3 is started; when the temperature of the radiating bottom plate 61 does not reach the set value, the semiconductor refrigerating sheet 3 does not work so as to reasonably control the temperature of the lamp panel 7.
Unless otherwise specified, in the present invention, if the terms "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, the terms describing orientation or positional relationship in the present invention are used for illustrative purposes only, and should not be construed as limiting the present patent, specific meanings of the above terms can be understood by those of ordinary skill in the art in light of the specific circumstances in conjunction with the accompanying drawings.
Unless expressly stated or limited otherwise, the terms "disposed," "connected," and "connected" are used broadly and encompass both fixed and removable connections, or integral connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. The utility model provides a heat radiation structure of LED down lamp, characterized by: the cooling device comprises a radiator, a semiconductor refrigeration sheet and an air draft assembly;
the radiator comprises a radiating bottom plate and radiating fins, wherein a plurality of flow channels are arranged in the radiating bottom plate, a plurality of air outlet holes communicated with the flow channels are formed in the upper surface of the radiating bottom plate, and the radiating fins are formed on the upper surface of the radiating bottom plate;
the semiconductor refrigeration piece is arranged on the periphery of the radiator, the hot end of the semiconductor refrigeration piece is positioned on the outer side, the cold end of the semiconductor refrigeration piece is positioned on the inner side, the cold end is connected with the refrigeration block, an air inlet hole is formed in the refrigeration block, the first end of the air inlet hole is connected with external air flow, and the second end of the air inlet hole is in butt joint with the flow channel;
the air draft assembly is arranged above the radiator to upwardly pump air flow around the radiator.
2. A heat dissipating structure of an LED down lamp according to claim 1, wherein: the flow channel passes through the circle center of the heat dissipation bottom plate and transversely penetrates through the whole heat dissipation bottom plate.
3. A heat dissipating structure of an LED down lamp according to claim 1, wherein: the number of the semiconductor refrigeration pieces is at least two.
4. A heat dissipating structure of an LED down lamp according to claim 1, wherein: the air inlet hole is extended in a roundabout way up and down in the refrigerating block.
5. A heat dissipating structure of an LED down lamp according to claim 1, wherein: and a surrounding wall attached to the refrigerating block is formed on the circumferential edge of the heat dissipation bottom plate.
6. A heat dissipating structure of an LED down lamp according to claim 1, wherein: the air draft assembly is an air draft fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022763980.4U CN213810279U (en) | 2020-11-25 | 2020-11-25 | Heat radiation structure of LED down lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022763980.4U CN213810279U (en) | 2020-11-25 | 2020-11-25 | Heat radiation structure of LED down lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213810279U true CN213810279U (en) | 2021-07-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022763980.4U Active CN213810279U (en) | 2020-11-25 | 2020-11-25 | Heat radiation structure of LED down lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213810279U (en) |
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2020
- 2020-11-25 CN CN202022763980.4U patent/CN213810279U/en active Active
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