TWI419371B - Led package - Google Patents
Led package Download PDFInfo
- Publication number
- TWI419371B TWI419371B TW99127320A TW99127320A TWI419371B TW I419371 B TWI419371 B TW I419371B TW 99127320 A TW99127320 A TW 99127320A TW 99127320 A TW99127320 A TW 99127320A TW I419371 B TWI419371 B TW I419371B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- light emitting
- substrate
- hole
- heat conducting
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Description
本發明涉及一種發光二極體封裝結構。 The invention relates to a light emitting diode package structure.
先前的發光二極體封裝體通常包括一基板、設置在所述基板上的發光二極體晶片以及固設在所述基板上並環繞所述發光二極體晶片的反射杯。所述反射杯吸收發光二極體晶片所產生的熱量並散發至發光二極體封裝體外,從而達到提高所述發光二極體封裝體散熱效率的目的。惟係,所述反射杯與基板的材質不同,兩者之間藉由一連接層相連。因不同材質之間導熱比率的差異,反射杯與基板之間的熱傳輸效率會受到影響。 The prior light-emitting diode package generally includes a substrate, a light-emitting diode chip disposed on the substrate, and a reflective cup fixed on the substrate and surrounding the light-emitting diode wafer. The reflector cup absorbs the heat generated by the LED chip and is emitted to the outside of the LED package, thereby achieving the purpose of improving the heat dissipation efficiency of the LED package. However, the reflective cup and the substrate are made of different materials, and the two are connected by a connecting layer. Due to the difference in thermal conductivity between different materials, the heat transfer efficiency between the reflector cup and the substrate is affected.
有鑒於此,有必要提供一種具有高散熱效率的發光二極體封裝結構。 In view of the above, it is necessary to provide a light emitting diode package structure with high heat dissipation efficiency.
一種發光二極體封裝結構,其包括基板、發光二極體晶片、反射杯及連接電極。所述連接電極埋設在所述基板內。所述反射杯固設在所述基板上。所述反射杯上開設有一容置通孔。所述反射杯包括一設置於所述容置通孔底部的導熱部。所述發光二極體晶片設置在所述導熱部上並與所述連接電極電 連接。所述發光二極體晶片所產生的熱量由該導熱部傳出並藉由反射杯向外發散。 A light emitting diode package structure includes a substrate, a light emitting diode chip, a reflective cup and a connection electrode. The connection electrode is embedded in the substrate. The reflective cup is fixed on the substrate. A receiving through hole is defined in the reflective cup. The reflector cup includes a heat conducting portion disposed at a bottom of the receiving through hole. The light emitting diode chip is disposed on the heat conducting portion and electrically connected to the connecting electrode connection. The heat generated by the light-emitting diode wafer is transmitted from the heat conducting portion and is diverged outward by the reflecting cup.
相對於先前技術,本發明所提供的發光二極體封裝結構係藉由在反射杯上設置導熱部,並把發光二極體晶片安裝在所述導熱部以使得發光二極體晶片所產生的熱量直接藉由導熱部傳遞至反射杯,從而大大提高發光二極體封裝結構的散熱效率。 Compared with the prior art, the LED package structure provided by the present invention is provided by providing a heat conducting portion on the reflective cup and mounting the light emitting diode chip on the heat conducting portion to cause the light emitting diode chip to be produced. The heat is directly transmitted to the reflective cup through the heat conducting portion, thereby greatly improving the heat dissipation efficiency of the light emitting diode package structure.
1‧‧‧發光二極體封裝結構 1‧‧‧Light emitting diode package structure
10‧‧‧基板 10‧‧‧Substrate
12‧‧‧發光二極體晶片 12‧‧‧Light Emitter Wafer
14‧‧‧反射杯 14‧‧‧Reflection Cup
15‧‧‧保護物質 15‧‧‧Protective substances
16‧‧‧連接電極 16‧‧‧Connecting electrode
100‧‧‧上表面 100‧‧‧ upper surface
102‧‧‧下表面 102‧‧‧lower surface
103‧‧‧第一連接通孔 103‧‧‧First connection through hole
104‧‧‧通孔隊列 104‧‧‧through hole queue
105‧‧‧側表面 105‧‧‧ side surface
140‧‧‧容置通孔 140‧‧‧ accommodating through holes
141‧‧‧散熱部 141‧‧‧ Department of heat dissipation
142‧‧‧導熱部 142‧‧‧Transfer Department
143‧‧‧固定部 143‧‧‧ fixed department
104a‧‧‧第二連接通孔 104a‧‧‧Second connection through hole
140a‧‧‧上開口 140a‧‧‧Opening
140b‧‧‧下開口 140b‧‧‧ opening
140c‧‧‧內表面 140c‧‧‧ inner surface
141a‧‧‧頂面 141a‧‧‧ top surface
141b‧‧‧底面 141b‧‧‧ bottom
141c‧‧‧側壁 141c‧‧‧ side wall
141d‧‧‧散熱鰭片 141d‧‧‧heat fins
142a‧‧‧第一表面 142a‧‧‧ first surface
142b‧‧‧第二表面 142b‧‧‧ second surface
143a‧‧‧連接杆 143a‧‧‧ Connecting rod
143b‧‧‧平板 143b‧‧‧ tablet
圖1係本發明實施方式所提供的發光二極體封裝結構的俯視圖。 1 is a top plan view of a light emitting diode package structure according to an embodiment of the present invention.
圖2係圖1中的發光二極體封裝結構沿直線II-II的剖視圖。 2 is a cross-sectional view of the light emitting diode package structure of FIG. 1 taken along line II-II.
圖3係圖1中的發光二極體封裝結構沿直線III-III的剖視圖。 3 is a cross-sectional view of the light emitting diode package structure of FIG. 1 taken along line III-III.
以下將結合附圖對本發明作進一步的詳細說明。 The invention will be further described in detail below with reference to the accompanying drawings.
如圖1和圖2所示,本發明實施方式所提供的發光二極體封裝結構1包括基板10、發光二極體晶片12、反射杯14及連接電極16。所述連接電極16埋設在所述基板10內。所述反射杯14固設在所述基板10上。所述反射杯14包括一容置通孔140及設置於容置通孔140底部的導熱部142。所述發光二極體晶片12設置在所述導熱部142上並與所述連接電極16電連接。所述發光二極體晶片12所產生的熱量由該導熱部142傳出並藉 由反射杯14向外發散。 As shown in FIG. 1 and FIG. 2 , the LED package structure 1 provided by the embodiment of the present invention includes a substrate 10 , a light emitting diode chip 12 , a reflective cup 14 , and a connection electrode 16 . The connection electrode 16 is buried in the substrate 10. The reflector cup 14 is fixed on the substrate 10. The reflector cup 14 includes a receiving through hole 140 and a heat conducting portion 142 disposed at a bottom of the receiving through hole 140. The light emitting diode chip 12 is disposed on the heat conducting portion 142 and electrically connected to the connecting electrode 16. The heat generated by the light emitting diode chip 12 is transmitted and borrowed by the heat conducting portion 142 It is diverged outward by the reflective cup 14.
具體地,所述基板10包括上表面100、下表面102及側表面105。所述上表面100與所述下表面102平行相對。所述側表面105分別與所述上表面100和下表面102垂直連接。所述上表面100的中心開設有一垂直貫穿至下表面102的第一連接通孔103。所述上表面100分別於所述第一連接通孔103的兩側開設有相互平行排布的通孔隊列104。每個通孔隊列104包括等間距排布的複數第二連接通孔104a。所述不同通孔隊列104中的第二連接通孔104a分別與發光二極體晶片12一一對應。 Specifically, the substrate 10 includes an upper surface 100, a lower surface 102, and a side surface 105. The upper surface 100 is parallel to the lower surface 102. The side surfaces 105 are vertically connected to the upper surface 100 and the lower surface 102, respectively. A center of the upper surface 100 defines a first connecting through hole 103 extending perpendicularly to the lower surface 102. The upper surface 100 defines a through-hole array 104 arranged parallel to each other on both sides of the first connecting through hole 103. Each via queue 104 includes a plurality of second connection vias 104a that are equally spaced. The second connection vias 104a of the different via queues 104 are in one-to-one correspondence with the LEDs 12, respectively.
所述連接電極16藉由所述第二連接通孔104a穿透基板10,並延伸至基板10的下表面102及側表面105。本實施方式中,所述每一個第二連接通孔104a內分別設置有所述連接電極16。 The connection electrode 16 penetrates the substrate 10 through the second connection via 104a and extends to the lower surface 102 and the side surface 105 of the substrate 10. In the embodiment, the connection electrode 16 is disposed in each of the second connection vias 104a.
請一併參閱圖2與圖3,其中,圖2為圖1中的發光二極體封裝結構1沿直線II-II的剖視圖,圖3為圖1中的發光二極體封裝結構1沿直線III-III的剖視圖。所述反射杯14還包括散熱部141及固定部143。所述容置通孔140開設於所述頂面141a的中心並貫穿至所述底面141b。所述容置通孔140包括上開口140a、下開口140b和內表面140c。在本實施方式中,所述容置通孔140之上開口140a的面積大於下開口140b的面積,即所述容置通孔140為一上寬下窄的倒圓錐台狀。 2 and FIG. 3, wherein FIG. 2 is a cross-sectional view of the LED package structure 1 of FIG. 1 along a line II-II, and FIG. 3 is a line of the LED package 1 of FIG. A cross-sectional view of III-III. The reflector cup 14 further includes a heat dissipation portion 141 and a fixing portion 143. The receiving through hole 140 is opened at a center of the top surface 141a and penetrates to the bottom surface 141b. The receiving through hole 140 includes an upper opening 140a, a lower opening 140b, and an inner surface 140c. In the present embodiment, the area of the upper opening 140a of the receiving through hole 140 is larger than the area of the lower opening 140b, that is, the receiving through hole 140 is an inverted truncated cone shape with an upper width and a lower width.
所述散熱部141包括側壁141c以及相互平行的頂面141a和底 面141b。所述側壁141c上形成有複數平行於頂面141a的散熱鰭片141d,用於加大散熱面積而提高散熱效率。 The heat dissipation portion 141 includes a sidewall 141c and a top surface 141a and a bottom parallel to each other Face 141b. The side wall 141c is formed with a plurality of heat dissipation fins 141d parallel to the top surface 141a for increasing the heat dissipation area to improve heat dissipation efficiency.
所述導熱部142為一矩形金屬板,其包括相互平行的第一表面142a和第二表面142b。所述導熱部142的兩端沿所述容置通孔140的下開口140b的徑向延伸,並分別連接至容置通孔140的內表面140c。所述導熱部142與內表面140c的連接處鄰近散熱部141的底面141b。所述導熱部142的第二表面142b與所述散熱部141的底面141b相互平齊。 The heat conducting portion 142 is a rectangular metal plate including a first surface 142a and a second surface 142b that are parallel to each other. Both ends of the heat conducting portion 142 extend in the radial direction of the lower opening 140b of the receiving through hole 140, and are respectively connected to the inner surface 140c of the receiving through hole 140. The junction of the heat conducting portion 142 and the inner surface 140c is adjacent to the bottom surface 141b of the heat dissipation portion 141. The second surface 142b of the heat transfer portion 142 and the bottom surface 141b of the heat dissipation portion 141 are flush with each other.
所述固定部143包括連接杆143a及平板143b。所述連接杆143a的一端垂直連接所述導熱部142的第二表面142b的中心。所述連接杆143a遠離導熱部142的另一端與所述平板143b的中心垂直相連,即,所述連接杆143a與所述平板143b形成一倒“T”形的卡扣結構。 The fixing portion 143 includes a connecting rod 143a and a flat plate 143b. One end of the connecting rod 143a is perpendicularly connected to the center of the second surface 142b of the heat conducting portion 142. The other end of the connecting rod 143a away from the heat conducting portion 142 is perpendicularly connected to the center of the flat plate 143b, that is, the connecting rod 143a and the flat plate 143b form an inverted "T" shaped snap structure.
所述反射杯14設置在所述基板10上。所述散熱部141的底面141b和導熱部142的第二表面142b緊密地貼合在所述基板10的上表面100上。所述導熱部142的兩側分別露出所述第二連接通孔104a。所述固定部143的連接杆143a穿過所述基板10上的第一連接通孔103。所述固定部143的平板143b抵持在所述基板10的下表面102上。在本實施方式中,所述散熱部141、導熱部142和固定部143一體成型並藉由低溫共燒的方法形成在所述基板10上。 The reflective cup 14 is disposed on the substrate 10. The bottom surface 141b of the heat dissipation portion 141 and the second surface 142b of the heat conduction portion 142 are closely attached to the upper surface 100 of the substrate 10. The second connecting through holes 104a are respectively exposed on both sides of the heat conducting portion 142. The connecting rod 143a of the fixing portion 143 passes through the first connecting through hole 103 on the substrate 10. The flat plate 143b of the fixing portion 143 abuts on the lower surface 102 of the substrate 10. In the present embodiment, the heat radiating portion 141, the heat transfer portion 142, and the fixing portion 143 are integrally molded and formed on the substrate 10 by a low temperature co-firing method.
所述發光二極體晶片12設置在所述導熱部142的第一表面 142a上。每一個發光二極體晶片12分別藉由打線的方式一一對應地與第二連接通孔104a內的連接電極16電連接。所述發光二極體晶片12工作時所產生的熱量藉由導熱部142傳輸至散熱部141並藉由散熱鰭片141d及連接杆143a向外發散。 The light emitting diode chip 12 is disposed on the first surface of the heat conducting portion 142 On 142a. Each of the LED chips 12 is electrically connected to the connection electrode 16 in the second connection via 104a in a one-to-one correspondence by wire bonding. The heat generated by the operation of the LED wafer 12 is transmitted to the heat dissipation portion 141 by the heat transfer portion 142 and is radiated outward by the heat dissipation fins 141d and the connecting rod 143a.
所述基板10可以採用高導熱係數的絕緣材料製成,例如氧化鈹、碳化矽、氮化鋁、氧化鋁等高導熱係數的陶瓷材料、印刷電路板基材或耐高溫的塑膠。所述反射杯14通常採用金屬材質所製成,例如銅、鋁、鐵等。由於金屬材質具有高表面反射率及高導熱係數,不但可使投射在所述容置通孔140的內表面140c上的光線產生反射而達到導光的效果,還可以將發光二極體晶片12所產生的熱量快速地向外發散。另外,所述容置通孔140內還可以填充具有高導熱係數的透明保護物質15,從而進一步提高整個發光二極體封裝結構1的散熱效率。 The substrate 10 can be made of an insulating material having a high thermal conductivity, such as a ceramic material having a high thermal conductivity such as yttrium oxide, tantalum carbide, aluminum nitride, or aluminum oxide, a printed circuit board substrate, or a high temperature resistant plastic. The reflector cup 14 is usually made of a metal material such as copper, aluminum, iron, or the like. Since the metal material has high surface reflectance and high thermal conductivity, not only the light projected on the inner surface 140c of the receiving through hole 140 can be reflected to achieve the light guiding effect, but also the light emitting diode wafer 12 can be The heat generated quickly diverges outward. In addition, the transparent through-hole 140 can also be filled with a transparent protective material 15 having a high thermal conductivity, thereby further improving the heat dissipation efficiency of the entire LED package structure 1.
因為所述導熱部142與散熱部141為一體成型的金屬材質。所以整個反射杯14的導熱效率大大地提高。而所述反射杯14藉由固定部143卡扣在所述基板10上以防止反射杯14從基板10上脫落,大大地增加了整個發光二極體封裝結構1的牢固性。 The heat conducting portion 142 and the heat dissipating portion 141 are made of a metal material integrally formed. Therefore, the heat transfer efficiency of the entire reflector cup 14 is greatly improved. The reflector cup 14 is fastened to the substrate 10 by the fixing portion 143 to prevent the reflector cup 14 from falling off the substrate 10, which greatly increases the robustness of the entire LED package structure 1.
另外,本領域技術人員還可在本發明精神內做其他變化,當然,該等依據本發明精神所做之變化,均應包含在本發明所要求保護之範圍之內。 In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, such changes in accordance with the spirit of the present invention should be included in the scope of the present invention.
1‧‧‧發光二極體封裝結構 1‧‧‧Light emitting diode package structure
10‧‧‧基板 10‧‧‧Substrate
15‧‧‧保護物質 15‧‧‧Protective substances
141‧‧‧散熱部 141‧‧‧ Department of heat dissipation
142‧‧‧導熱部 142‧‧‧Transfer Department
142a‧‧‧第一表面 142a‧‧‧ first surface
142b‧‧‧第二表面 142b‧‧‧ second surface
143a‧‧‧連接杆 143a‧‧‧ Connecting rod
143b‧‧‧平板 143b‧‧‧ tablet
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99127320A TWI419371B (en) | 2010-08-16 | 2010-08-16 | Led package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99127320A TWI419371B (en) | 2010-08-16 | 2010-08-16 | Led package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201210076A TW201210076A (en) | 2012-03-01 |
TWI419371B true TWI419371B (en) | 2013-12-11 |
Family
ID=46763849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99127320A TWI419371B (en) | 2010-08-16 | 2010-08-16 | Led package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI419371B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200531294A (en) * | 2004-03-12 | 2005-09-16 | Opto Tech Corp | Light-emitting device with high heat dissipation efficiency |
TWM361098U (en) * | 2009-01-22 | 2009-07-11 | Tcst Tech Co Ltd | LED base structure capable of preventing leakage |
-
2010
- 2010-08-16 TW TW99127320A patent/TWI419371B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200531294A (en) * | 2004-03-12 | 2005-09-16 | Opto Tech Corp | Light-emitting device with high heat dissipation efficiency |
TWM361098U (en) * | 2009-01-22 | 2009-07-11 | Tcst Tech Co Ltd | LED base structure capable of preventing leakage |
Also Published As
Publication number | Publication date |
---|---|
TW201210076A (en) | 2012-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101125296B1 (en) | Light unit | |
US7755099B2 (en) | Light emitting device package | |
JP2011129949A (en) | Power surface mount light emitting die package | |
JP2007123777A (en) | Semiconductor light-emitting apparatus | |
JP2007510297A5 (en) | ||
KR101367360B1 (en) | Flexible heat dissipating substrate for led lighting module and led lighting module with the same | |
KR100909366B1 (en) | Led module with cooling structure | |
JP2007324547A (en) | Light emitting diode light source, illuminator, display unit, and traffic signal | |
JP4683013B2 (en) | Light emitting device | |
US20120025215A1 (en) | Semiconductor package with heat dissipating structure | |
TWI469395B (en) | Light-emitting module | |
US20160315240A1 (en) | Mounting assembly and lighting device | |
KR101363070B1 (en) | Led lighting module | |
JP2011082074A (en) | Light emitting device and lighting device | |
TWI385824B (en) | Light source device | |
TWI419371B (en) | Led package | |
TWI449226B (en) | Thermal structure for led device | |
TWI478395B (en) | Led package module | |
KR101006246B1 (en) | Ceramic heat sink plate for light emitting diode | |
KR100634303B1 (en) | Light emitting diode | |
TWI451556B (en) | Led package module | |
KR101188350B1 (en) | Light Emitting Diode Lamp using Heat Spreader | |
TWI451606B (en) | Light-emitting module provided with heat-dissipation channel | |
TWI495079B (en) | Light-emitting module | |
KR101803003B1 (en) | LED lamp |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |