TWI419371B - Led package - Google Patents

Description

Light emitting diode package structure

The invention relates to a light emitting diode package structure.

The prior light-emitting diode package generally includes a substrate, a light-emitting diode chip disposed on the substrate, and a reflective cup fixed on the substrate and surrounding the light-emitting diode wafer. The reflector cup absorbs the heat generated by the LED chip and is emitted to the outside of the LED package, thereby achieving the purpose of improving the heat dissipation efficiency of the LED package. However, the reflective cup and the substrate are made of different materials, and the two are connected by a connecting layer. Due to the difference in thermal conductivity between different materials, the heat transfer efficiency between the reflector cup and the substrate is affected.

In view of the above, it is necessary to provide a light emitting diode package structure with high heat dissipation efficiency.

A light emitting diode package structure includes a substrate, a light emitting diode chip, a reflective cup and a connection electrode. The connection electrode is embedded in the substrate. The reflective cup is fixed on the substrate. A receiving through hole is defined in the reflective cup. The reflector cup includes a heat conducting portion disposed at a bottom of the receiving through hole. The light emitting diode chip is disposed on the heat conducting portion and electrically connected to the connecting electrode connection. The heat generated by the light-emitting diode wafer is transmitted from the heat conducting portion and is diverged outward by the reflecting cup.

Compared with the prior art, the LED package structure provided by the present invention is provided by providing a heat conducting portion on the reflective cup and mounting the light emitting diode chip on the heat conducting portion to cause the light emitting diode chip to be produced. The heat is directly transmitted to the reflective cup through the heat conducting portion, thereby greatly improving the heat dissipation efficiency of the light emitting diode package structure.

1‧‧‧Light emitting diode package structure

10‧‧‧Substrate

12‧‧‧Light Emitter Wafer

14‧‧‧Reflection Cup

15‧‧‧Protective substances

16‧‧‧Connecting electrode

100‧‧‧ upper surface

102‧‧‧lower surface

103‧‧‧First connection through hole

104‧‧‧through hole queue

105‧‧‧ side surface

140‧‧‧ accommodating through holes

141‧‧‧ Department of heat dissipation

142‧‧‧Transfer Department

143‧‧‧ fixed department

104a‧‧‧Second connection through hole

140a‧‧‧Opening

140b‧‧‧ opening

140c‧‧‧ inner surface

141a‧‧‧ top surface

141b‧‧‧ bottom

141c‧‧‧ side wall

141d‧‧‧heat fins

142a‧‧‧ first surface

142b‧‧‧ second surface

143a‧‧‧ Connecting rod

143b‧‧‧ tablet

1 is a top plan view of a light emitting diode package structure according to an embodiment of the present invention.

2 is a cross-sectional view of the light emitting diode package structure of FIG. 1 taken along line II-II.

3 is a cross-sectional view of the light emitting diode package structure of FIG. 1 taken along line III-III.

The invention will be further described in detail below with reference to the accompanying drawings.

As shown in FIG. 1 and FIG. 2 , the LED package structure 1 provided by the embodiment of the present invention includes a substrate 10 , a light emitting diode chip 12 , a reflective cup 14 , and a connection electrode 16 . The connection electrode 16 is buried in the substrate 10. The reflector cup 14 is fixed on the substrate 10. The reflector cup 14 includes a receiving through hole 140 and a heat conducting portion 142 disposed at a bottom of the receiving through hole 140. The light emitting diode chip 12 is disposed on the heat conducting portion 142 and electrically connected to the connecting electrode 16. The heat generated by the light emitting diode chip 12 is transmitted and borrowed by the heat conducting portion 142 It is diverged outward by the reflective cup 14.

Specifically, the substrate 10 includes an upper surface 100, a lower surface 102, and a side surface 105. The upper surface 100 is parallel to the lower surface 102. The side surfaces 105 are vertically connected to the upper surface 100 and the lower surface 102, respectively. A center of the upper surface 100 defines a first connecting through hole 103 extending perpendicularly to the lower surface 102. The upper surface 100 defines a through-hole array 104 arranged parallel to each other on both sides of the first connecting through hole 103. Each via queue 104 includes a plurality of second connection vias 104a that are equally spaced. The second connection vias 104a of the different via queues 104 are in one-to-one correspondence with the LEDs 12, respectively.

The connection electrode 16 penetrates the substrate 10 through the second connection via 104a and extends to the lower surface 102 and the side surface 105 of the substrate 10. In the embodiment, the connection electrode 16 is disposed in each of the second connection vias 104a.

2 and FIG. 3, wherein FIG. 2 is a cross-sectional view of the LED package structure 1 of FIG. 1 along a line II-II, and FIG. 3 is a line of the LED package 1 of FIG. A cross-sectional view of III-III. The reflector cup 14 further includes a heat dissipation portion 141 and a fixing portion 143. The receiving through hole 140 is opened at a center of the top surface 141a and penetrates to the bottom surface 141b. The receiving through hole 140 includes an upper opening 140a, a lower opening 140b, and an inner surface 140c. In the present embodiment, the area of the upper opening 140a of the receiving through hole 140 is larger than the area of the lower opening 140b, that is, the receiving through hole 140 is an inverted truncated cone shape with an upper width and a lower width.

The heat dissipation portion 141 includes a sidewall 141c and a top surface 141a and a bottom parallel to each other Face 141b. The side wall 141c is formed with a plurality of heat dissipation fins 141d parallel to the top surface 141a for increasing the heat dissipation area to improve heat dissipation efficiency.

The heat conducting portion 142 is a rectangular metal plate including a first surface 142a and a second surface 142b that are parallel to each other. Both ends of the heat conducting portion 142 extend in the radial direction of the lower opening 140b of the receiving through hole 140, and are respectively connected to the inner surface 140c of the receiving through hole 140. The junction of the heat conducting portion 142 and the inner surface 140c is adjacent to the bottom surface 141b of the heat dissipation portion 141. The second surface 142b of the heat transfer portion 142 and the bottom surface 141b of the heat dissipation portion 141 are flush with each other.

The fixing portion 143 includes a connecting rod 143a and a flat plate 143b. One end of the connecting rod 143a is perpendicularly connected to the center of the second surface 142b of the heat conducting portion 142. The other end of the connecting rod 143a away from the heat conducting portion 142 is perpendicularly connected to the center of the flat plate 143b, that is, the connecting rod 143a and the flat plate 143b form an inverted "T" shaped snap structure.

The reflective cup 14 is disposed on the substrate 10. The bottom surface 141b of the heat dissipation portion 141 and the second surface 142b of the heat conduction portion 142 are closely attached to the upper surface 100 of the substrate 10. The second connecting through holes 104a are respectively exposed on both sides of the heat conducting portion 142. The connecting rod 143a of the fixing portion 143 passes through the first connecting through hole 103 on the substrate 10. The flat plate 143b of the fixing portion 143 abuts on the lower surface 102 of the substrate 10. In the present embodiment, the heat radiating portion 141, the heat transfer portion 142, and the fixing portion 143 are integrally molded and formed on the substrate 10 by a low temperature co-firing method.

The light emitting diode chip 12 is disposed on the first surface of the heat conducting portion 142 On 142a. Each of the LED chips 12 is electrically connected to the connection electrode 16 in the second connection via 104a in a one-to-one correspondence by wire bonding. The heat generated by the operation of the LED wafer 12 is transmitted to the heat dissipation portion 141 by the heat transfer portion 142 and is radiated outward by the heat dissipation fins 141d and the connecting rod 143a.

The substrate 10 can be made of an insulating material having a high thermal conductivity, such as a ceramic material having a high thermal conductivity such as yttrium oxide, tantalum carbide, aluminum nitride, or aluminum oxide, a printed circuit board substrate, or a high temperature resistant plastic. The reflector cup 14 is usually made of a metal material such as copper, aluminum, iron, or the like. Since the metal material has high surface reflectance and high thermal conductivity, not only the light projected on the inner surface 140c of the receiving through hole 140 can be reflected to achieve the light guiding effect, but also the light emitting diode wafer 12 can be The heat generated quickly diverges outward. In addition, the transparent through-hole 140 can also be filled with a transparent protective material 15 having a high thermal conductivity, thereby further improving the heat dissipation efficiency of the entire LED package structure 1.

The heat conducting portion 142 and the heat dissipating portion 141 are made of a metal material integrally formed. Therefore, the heat transfer efficiency of the entire reflector cup 14 is greatly improved. The reflector cup 14 is fastened to the substrate 10 by the fixing portion 143 to prevent the reflector cup 14 from falling off the substrate 10, which greatly increases the robustness of the entire LED package structure 1.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, such changes in accordance with the spirit of the present invention should be included in the scope of the present invention.

1‧‧‧Light emitting diode package structure

10‧‧‧Substrate

15‧‧‧Protective substances

141‧‧‧ Department of heat dissipation

142‧‧‧Transfer Department

142a‧‧‧ first surface

142b‧‧‧ second surface

143a‧‧‧ Connecting rod

143b‧‧‧ tablet

Claims (10)

A light emitting diode package structure comprising a substrate, a light emitting diode chip, a reflective cup and a connecting electrode, wherein the connecting electrode is embedded in the substrate, the reflective cup is fixed on the substrate, and the reflection An improved through hole is formed in the cup, wherein the reflective cup comprises a heat conducting portion integrally formed on the reflective cup and located at the bottom of the receiving through hole, and the light emitting diode chip is disposed at the bottom The heat conducting portion is electrically connected to the connecting electrode, and the heat generated by the light emitting diode chip is conducted by the heat conducting portion to the periphery of the reflective cup and is diverged outward. The light emitting diode package structure of claim 1, wherein: the substrate comprises parallel opposite upper and lower surfaces and side surfaces perpendicularly connected to the upper and lower surfaces, respectively, a first connecting through hole extending perpendicularly to the lower surface is formed in the center of the surface, and the upper surface is respectively provided with a through-hole queue arranged in parallel with each other on the two sides of the first connecting through hole, each through hole The queue includes a plurality of second connection through holes arranged at equal intervals, and the second connection through holes in the different through hole queues respectively correspond to the LED arrays, and each of the second connection through holes is respectively disposed There is the connection electrode, and the connection electrode penetrates the substrate through the second connection via and extends to a lower surface and a side surface of the substrate. The light emitting diode package structure of claim 2, wherein the reflective cup further comprises a heat dissipating portion and a fixing portion, the heat dissipating portion comprising a side wall and a top surface and a bottom surface parallel to each other, the receiving portion a through hole is opened in the top surface The heart penetrates to the bottom surface. The light emitting diode package structure according to claim 3, wherein the sidewall is formed with a plurality of heat dissipating fins parallel to the top surface. The light emitting diode package structure of claim 3, wherein the heat conducting portion comprises a first surface and a second surface parallel to each other, and opposite ends of the heat conducting portion are along the receiving through hole The radial direction is respectively connected to the inner surface of the receiving through hole, and the connection between the heat conducting portion and the inner surface is adjacent to the bottom surface of the heat dissipating portion. The light emitting diode package structure according to claim 5, wherein the second surface of the heat conducting portion and the bottom surface of the heat dissipating portion are flush with each other. The light emitting diode package structure of claim 5, wherein: a bottom surface of the heat dissipating portion and a second surface of the heat conducting portion are closely attached to an upper surface of the substrate, and the connecting electrode is disposed The light emitting diode chip is disposed on the first surface of the heat conducting portion and electrically connected to the connecting electrode by wire bonding in the second connecting through hole and on both sides of the heat conducting portion. The light emitting diode package structure according to claim 5, wherein the fixing portion includes a connecting rod and a flat plate, and one end of the connecting rod is perpendicularly connected to a center of the second surface of the heat conducting portion, The other end of the connecting rod away from the heat conducting portion is perpendicularly connected to the center of the flat plate, the connecting rod and the flat plate form an inverted "T" shaped snap structure, and the connecting rod passes through the first on the substrate A through hole is connected, and the flat plate abuts on a lower surface of the substrate. The light emitting diode package structure according to claim 1, wherein the substrate is made of an insulating material having a high thermal conductivity. The light emitting diode package structure according to claim 9, wherein the material of the substrate is selected from the group consisting of ruthenium oxide, tantalum carbide, aluminum nitride, aluminum oxide, and A composition of a circuit board substrate.