201043832 六、發明說明： 【發明所屬之技術領域】 [醒]本發明係關於一種燈具及其照明裝置，特別是有關於一 種可增加散熱效果並節省成本之燈具及其照明裝置。 【先前技術】 [0002] 高效率與高亮度之發光二極體（LED)在作動時會散發熱量 ’累積的熱量將使得溫度的升高而對發光二極體之發光 效率與使用壽命造成不良之影響’因此現有發光二極體 之照明需結合散熱結構來散熱，為解決散熱問題，習知 〇 的方法是針對發光二極體光源的特性設計專用的散熱結 構而成一獨立可保持一定溫度的L E D.光源結構，請參閱第 1圖，其顯示習知LED燈管1，此LED燈管之散熱結構13形 狀設計與日光燈管類似’散熱結構13上方具有一印刷電 路板12，在印刷電路板12表面設置複數個發光二極體u ’此LED燈管1可裝設於傳統燈具中。然而，當獨立可散 熱的LED燈管1裝設於燈具_，由於傳、繞麼具屬於半封閉 Q 型的結構，其散熱效果會受到很大的影響，而且LED燈管 1的散熱結構13—般是以鋁擠成型，本身的材料成本和開 模製作的成本都相當昂貴。 【發明内容】 [0003] 本發明之目的在於提供一種可增加散熱效果並節省成本 之燈具及其照明裝置。 緣是’為達上述目的’依據本發明之燈具包括一框體、 至少一印刷電路板以及至少一發光二極體，該印刷電路 板設置於框體之底部，發光二極體則設置於印刷電路板 098118308 表單編號A0101 第3頁/共28頁 0982031045-0 201043832 之表面，框體用以容置該至少一印刷電路板及該至少一 發光二極體，且該發光二極體透過該框體散熱。 其中該印刷電路板具有至少一孔洞’每一孔洞具有對應 之一散熱板設置於該孔洞内’散熱板透過緊配方式與印 刷電路板結合為一體’該發光二極體設置於散熱板上， 或跨設於印刷電路板及散熱板上，該印刷電路板及該散 熱板表面分別具有印刷電路，透過零歐姆電阻或導線相201043832 VI. Description of the invention: [Technical field to which the invention pertains] [Wake] The present invention relates to a luminaire and a lighting device thereof, and more particularly to a luminaire and a lighting device thereof which can increase the heat dissipation effect and save cost. [Prior Art] [0002] High-efficiency and high-brightness LEDs emit heat when they are activated. 'The accumulated heat will increase the temperature and cause poor luminous efficiency and service life of the LEDs. The influence of the existing lighting diodes needs to be combined with the heat dissipation structure to dissipate heat. In order to solve the heat dissipation problem, the conventional method is to design a dedicated heat dissipation structure for the characteristics of the light-emitting diode light source to form an independent temperature. LE D. Light source structure, please refer to FIG. 1 , which shows a conventional LED tube 1 , the heat dissipation structure 13 of the LED tube has a shape similar to that of a fluorescent tube. The heat dissipation structure 13 has a printed circuit board 12 above the printed circuit. A plurality of light-emitting diodes u are disposed on the surface of the board 12. The LED tube 1 can be installed in a conventional lamp. However, when the independent heat-dissipating LED tube 1 is installed in the lamp _, since the transmission and winding are semi-closed Q-type structures, the heat dissipation effect is greatly affected, and the heat dissipation structure of the LED tube 1 is 13 Generally, it is extruded by aluminum, and the material cost of itself and the cost of mold making are quite expensive. SUMMARY OF THE INVENTION [0003] It is an object of the present invention to provide a luminaire and a lighting device thereof that can increase heat dissipation and save cost. The luminaire according to the present invention comprises a frame, at least one printed circuit board and at least one light emitting diode, the printed circuit board is disposed at the bottom of the frame, and the light emitting diode is disposed on the printing The surface of the circuit board 098118308, which is the surface of the form number A0101, and the frame of the frame, is used for accommodating the at least one printed circuit board and the at least one light emitting diode, and the light emitting diode passes through the frame. Body heat dissipation. The printed circuit board has at least one hole. Each hole has a corresponding one of the heat dissipation plates disposed in the hole. The heat dissipation plate is integrated with the printed circuit board through a tight fit manner. The light emitting diode is disposed on the heat dissipation plate. Or across a printed circuit board and a heat sink, the printed circuit board and the surface of the heat sink respectively have a printed circuit that transmits zero ohm resistance or a wire phase
連接導熱接著層設置於印刷電路板及框體之間，以 緊密連接該印刷電路板及該框體，或設置於散熱板及框 體之間，以緊密連接該散熱板及該框體。該導熱接著層 較佳為散熱膏、散熱膠、散熱塾或散熱膠布》 該印刷電路板為長條狀延伸，該至少.一發光二極體間隔 一適當散熱距離排列於印刷電路板表面。未發明之燈具 更包括一反射器設置於框體内，位於該印刷電路板之側 邊，用以反射發光二極體所發射之光線，該反射器較佳 呈隆脊狀，其表面為斜面、凹凸面或拋物面。該燈具更 包括一透光板設置於兩相鄰之反射器間，並位於該發光 —極體之發光路徑上’透光板表面具有複數個凹凸件， 用以均勻擴展發光二極體所發出之光線，反射器表面具 有一突起部，該透光板卡合於該突起部處，該燈具更包 括-固定件’設置於透光板上，使得透光板被卡固於固 &件及反射器之間’反射器表面具有至少—卡槽，該固 疋件扣合於該卡槽，並與該反射器交錯形成—陣列結構 ’該固定件較料1光板，用以防止炫光。 該印刷電路板較佳為㈣纖維膠片fr_4 098118308 OMame Retardant Substrate)，以螺絲或鉚釘固定 表單編號A0101 第4 κ 共 28 頁 0982031045-0 201043832 於該框體之底部，該框體較佳為大面積之薄金屬板或散 熱器，該框體之材質較佳為銅、鋁、鐵、鎂合金、金屬 或高熱傳導材質’該散熱板較佳為陶瓷基板、銘基板、 非導電性散熱基板或金屬基印刷電路板（Metal Printed Circuit Board, MCPCB)» 該框體之底部設置有一反射層，鄰接於印刷電路板，用 以反射該發光二極體所發射之光線，該反射層以含浸或 靜電塗佈方式設置於該框體之底部’較佳為〜白色塗料 〇 該燈具更包括一輔助散熱板，設置於該框體之底部相對 於該至少一發光二極體之另一側，用以増加該框體之該 散熱面積，該輔助散熱板為波浪狀，以雷射銲接或鉚接 方式固定於該框體之底部。 該發光二極體包括至少一第一發光二極鱧和至少一第二 發光二極體交錯設置於該印刷電路板上，該至少一第一 發光二極體和該至少一第二發光二極體不同時驅動點亮 ，且該至少一第一發光二極體和該至少一第二發光二極 體為不同色溫。 該發光二極體包括至少一發光晶片和一封裝體，該至少 一發光晶片可被封裝於該封裝體上，再將該封裝體設置 於該散熱板表面或跨設在該散熱板與該印刷電路板上， 或將該至少一發先晶片直接封裝在該散熱板表面。 該燈具更包括至少一壓板及至少一固定機構，該壓板設 置或黏置於該印刷電路板上，以增加印刷電路板之剛性 ’該固定機構用以將壓板及印刷電路板固定於框體底部 ，該固定機構較佳為一彈片。 098118308 表單編號A0101 第5頁/共28頁 0982031045-0 201043832 緣是，為達上述目的’依據本發明之照明裝置包括一印 刷電路板、至少一散熱板、至少一發光二極體及一散熱 器。印刷電路板具有至少一孔洞’該散熱板設置於該印 刷電路板之孔洞内’該至少一發光二極體設置於散熱板 表面，或跨設在散熱板與印刷電路板上，散熱器設置在 散熱板相對於該發光二極體之另一側。 其中，該散熱器為一薄金屬片體、一導熱基板、一銘擠 或壓鑄成型之散熱器或由數片散熱鰭片組接之散熱器。 緣是，為達上述目的’依據本發明之照明裝置包括一散 熱器、一印刷電路板、至少一發光二極體及一反射層’ 印刷電路板設置在散熱器上，發洗二極體設置在印刷電 路板表面，反射層設置在散熱器表面’用以反射發光二 極體所發射之光線。 【實施方式】 [0004] 098118308 以下將參照相關圖式，以說明依據本發明之較佳實施例 ，其中相同的元件將以相同的參照符號加以說明。 請參閱第2 A和2 B圖，其顯示本發明之燈具之較佳實施例 ’其包括一框體23、至少一印刷電路板22以及至少一發 光二極體21 ’框體23用以容置印刷電路板22和發光二極 體21 ’印刷電路板22以螺絲26固定於框體之底部231， 也可以透過鲫釘固定，該印刷電路板以長條狀延伸，發 光一極體21間隔一適當散熱距離而排列設置於印刷電路 板22之表面，該發光二極體21透過該框體23散熱。 该發光二極體21包括至少一第一發光二極體A和至少一第 一發光二極體B交錯設置於該印刷電路板22上，該第一發 光一極體八和該第二發光二極體B可不同時驅動點亮，以 A_ 第6頁/共28頁 201043832 降低框體底部231每單位面積所要排除的熱量，且該第一 發光二極體A和該第二發光二極體B亦可為不同色溫，在 不同時間驅動下可達到同--燈具内有不同色溫表現的要 求’也可以達到混色的效果。 一導熱接著層25設置於印刷電路板22及框體的底部231之 間，如第2B圖所示，其為第2A圖之部分剖面圖，該導熱 接著層25用以緊密連接該印刷電路板22和該框體底部231 ，該導熱接著層25較佳為散熱膏、散熱膠、散熱墊或散 熱膠布。另有—反射層24設置於框體之底部231，鄰接於 印刷電路板22，用以反射發光二極體21所發射之光線， 該反射層2 4以含浸或靜電塗佈方式設置於該框體之底部 231’較佳為一白色塗料。.. 該印刷電路板較佳為玻璃纖維膠片’該樞體之材質較佳 為銅、鋁、鐵、鎂合金、金屬或高熱傳導材質，該散熱 板較佳為陶瓷基板、鋁基板、非導電性散熱基板或金屬 基印刷電路板。 依據本發明之另一較佳實施例如第2(：和21)圖所示’在印 刷電路板上方設置或黏置有非導電材質之壓板27，以增 加該印刷電路板的剛性。在框體底部231上裝置有複數個 固定機構28用以固定麽板’固定機構28較佳為一彈片’ 可將壓板27及印刷電路板22固定於框體底部231，經由壓 板及固定機構的辅助’印刷電路板亦可達到方便更換的 目的。 請參閱第3A和3B圖’其顯示本發明之照明裝置之第一較 佳實施例，第3B圖為第3A圖之部分别面圖’該照明裝置 包括一印刷電路板22、至少一散熱板31、至少一發光二 098118308 表單編號A0101 第7頁/共28頁 0982031045-0 201043832 極體21及一散熱器32。 即刷電路板22具有至少一孔洞33 ’該散熱板31設置於該印刷電路板以之孔洞”内，散熱 板31透過緊配方式與印刷電路㈣結合為-體，該印刷 電路板22及該散熱板31表面分別具有印刷電路221、川 ’透過零歐姆電阻34相連接，亦可使用導線域。該發 光—極體21包括至少-發光晶片211和-封裝體212，該 至夕-發光晶片211被封裝於封裝體212上，而該封裝體 2跨。又在遠散熱板31與!亥印刷電路板22上，散熱器32 則叹置在散熱板31相對於該發光二極體21之另一側。 其申，導熱接著層25設置於散熱板31與散熱 器32之間， 用以緊岔連接散熱板31及散熱器32，該散熱器32較佳為 導熱基板、一鋁擠或壓鑄成型之散祕器或由數片散熱 %片組接之散熱器，亦可為__大面積之薄★屬板，例如 為第2A圖中框體之底部231。 凊參閱第4A和4B圖，其顯示本發明之照明裝置之第二較 佳實施例，第4B圖為第4A圖之部分剖面圖，第4A圖與第 3A圖之差異在於發光二極體21並未跨設於印刷電路板22 及散熱板31之間’而是直接整體設置於散熱板31上，散 熱板31表面的印刷電路311則於兩端分別透過零歐姆電阻 34與印刷電路板22表面的印刷電路221相連接。 此外’發光二極體21之發光晶片211亦可直接封裳於散熱 板31表面，如第5A和5B圖所示，其為本發明之照明裝置 之第三較佳實施例，該照明裝置由於省略了封裝體，發 光晶片211直接透過散熱板31散熱’可進一步提高散熱效 率。 098118308 本發明之燈具更包括一反射器61設置於框體23内 表單編號A0101 第8頁/共28頁 如第 0982031045-0 201043832 6A圖所示’反射器61設置於該印刷電路板之侧邊，用以 反射發光二極體21所發射之光線，該反射器61呈隆脊狀 ，其表面為斜面，但亦可為凹凸面或拋物面，印刷電路 板與反射器61之間具有白色塗料形成的反射層24。印刷 電路板上方設置有壓板27，以固定機構28將壓板27及印 刷電路板固定於框體底部》 該燈具更包括至少一透光板62，如第6Β圖所示，該透光 板62設置於兩相鄰反射器61間，並位於發光二極體之發 光路徑上’反射器61表面具有一突起部611，該透光板62 卡合於該突起部611處，該透光板表62面具有複數個凹凸 件，用以均勻擴展發光二極體所發出之光線。 該燈具更包括一固定件63，如第6Β圖所示，該固定件63 設置於透光板62上，使得透光板62被卡固於固定件63及 反射器61的下緣之間，反射器61表面具有至少一卡槽612 ，該固定件63扣合於該卡槽612，並與該反射器61之上緣 交錯形成一陣列結構，如第6D圖所示，談固定件較佳為 一遮光板’用以防止炫光。 本發明之燈具可包括一輔助散熱板71，如第7圖所示’設 置於該框體23之底部相對於該至少一發光二極體之另一 側，用以增加該框體23之該散熱面積，該輔助散熱板71 為波浪狀’以雷射銲接或鉚接方式固定於該框體23之底 部。 上述第2Α〜5Β圖之照明裝置皆可搭配第6Α〜7圖之燈具使 用。 綜上所述’本發明之燈具及其照明裝置透過將發光二極 體及印刷電路板直接設置在燈具外部的框體上’使得發 098118308 表單編號Α0101 第9頁/共28頁 0982031045-0 201043832 光一極體透過框體散鼓，丄 …、由於框體為大面積的薄金屬板 ，可有效增加散熱面積，並且在印刷電路板上嵌入散熱 性佳的《板’可提升散_率再加上料製作額外 鋁擠式散熱器的費用’ *大·1¾降低散熱的單位成本。 以上所述僅為舉例性，而' w非為限制性者。任何未脫離本 發明之精神與範疇，而對装 主了具進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 [0005] 098118308 第1圖顯示習知LED燈管之示意圖· 第2A圖顯示本發明之燈具之較佳實施例之示意圖； 第2B圖顯示本發明之燈具之較佳實施例之部分剖面圖； 第2C圖顯示本發明之燈具之另一較佳實施例之部分剖面 图· 圖， 第2D圖顯示第2C圖之侧視圖； 第3A圖顯示本發明之照明裝置之第一較佳實施例之示意 圖； 第3B圖顯示第3A圖之部分剖面圖； 第4A圖顯示本發明之照明裝置之第二較佳實施例之示意 ]Ξ1 · 圖， 第4B圖顯示第4 A圖之部分剖面圖； 第5A圖顯示本發明之照明裝置之第三較佳實施例之示意 圖； 第5B圖顯示第5A圖之部分剖面圖； 第6 A至6 D圖顯示本發明之燈具之較佳實施例之組裝示意 圖；以及 第7圖顯示本發明之燈具結合輔助散熱板之較佳實施之示 表單編號A0101 第10頁/共28頁 201043832 意圖。 【主要元件符號說明】 [0006] Ο ❹ 098118308 I : LED燈管 II :發光二極體 12 :印刷電路板 13 :散熱結構 21 :發光二極體 211 :發光晶片 212 :封裝體 22 :印刷電路板 221、311 :印刷電路 23 :框體 231 :框體底部 24 :反射層 25 :導熱接著層 26 :螺絲 27 :壓板 28 :固定機構 31 :散熱板 32 :散熱器 33 :孔洞 34 :零歐姆電阻 61 :反射器 611 :突起部 612 :卡槽 62 :透光板 表單編號A0101 第11頁/共28頁 0982031045-0 201043832 63 :固定件 71 :散熱輔助板 098118308 表單編號A0101 第12頁/共28頁The connection thermal conduction layer is disposed between the printed circuit board and the frame to tightly connect the printed circuit board and the frame, or is disposed between the heat dissipation plate and the frame to tightly connect the heat dissipation plate and the frame. The thermal conductive adhesive layer is preferably a thermal grease, a heat dissipating adhesive, a heat dissipating heat sink or a heat dissipating adhesive tape. The printed circuit board has an elongated strip extending, and the at least one light emitting diode is arranged on the surface of the printed circuit board with a proper heat dissipating distance. The uninvented luminaire further includes a reflector disposed in the frame at a side of the printed circuit board for reflecting light emitted by the LED, the reflector preferably having a ridge shape and having a beveled surface , bump or paraboloid. The luminaire further comprises a light-transmitting plate disposed between the two adjacent reflectors and located on the light-emitting path of the light-emitting body. The surface of the light-transmitting plate has a plurality of concave and convex members for uniformly spreading the light-emitting diodes. The light beam has a protrusion on the surface of the reflector, and the light-transmitting plate is engaged with the protrusion. The lamp further includes a fixing member disposed on the light-transmitting plate, so that the light-transmitting plate is fixed to the solid member. And the reflector between the reflector has at least a card slot, the fixing member is fastened to the card slot and is formed by interleaving with the reflector - the array structure is fixed to the light plate to prevent glare . The printed circuit board is preferably (four) fiber film fr_4 098118308 OMame Retardant Substrate), which is fixed by screws or rivets, form number A0101, 4 κ, 28 pages 0982031045-0 201043832, at the bottom of the frame, the frame is preferably large. The thin metal plate or the heat sink, the material of the frame is preferably copper, aluminum, iron, magnesium alloy, metal or high heat conductive material. The heat sink is preferably a ceramic substrate, a substrate, a non-conductive heat sink substrate or a metal. Metal printed circuit board (MCPCB)» The bottom of the frame is provided with a reflective layer adjacent to the printed circuit board for reflecting the light emitted by the light emitting diode. The reflective layer is impregnated or electrostatically coated. The cloth is disposed at the bottom of the frame, preferably a white paint. The lamp further includes an auxiliary heat sink disposed at the bottom of the frame relative to the other side of the at least one light emitting diode. The heat dissipation area of the frame is wavy and is fixed to the bottom of the frame by laser welding or riveting. The light emitting diode includes at least one first light emitting diode and at least one second light emitting diode interlaced on the printed circuit board, the at least one first light emitting diode and the at least one second light emitting diode The body is not illuminated at the same time, and the at least one first light emitting diode and the at least one second light emitting diode are at different color temperatures. The light emitting diode includes at least one light emitting chip and a package, the at least one light emitting chip can be packaged on the package, and the package is disposed on the surface of the heat sink or across the heat sink and the printing On the circuit board, or at least one of the first wafers is directly packaged on the surface of the heat sink. The lamp further includes at least one pressing plate and at least one fixing mechanism disposed or adhered to the printed circuit board to increase the rigidity of the printed circuit board. The fixing mechanism is used for fixing the pressing plate and the printed circuit board to the bottom of the frame. The fixing mechanism is preferably a spring piece. 098118308 Form No. A0101 Page 5 of 28 0982031045-0 201043832 Edge, for the above purpose, the lighting device according to the present invention comprises a printed circuit board, at least one heat sink, at least one light emitting diode and a heat sink . The printed circuit board has at least one hole formed in the hole of the printed circuit board. The at least one light emitting diode is disposed on the surface of the heat dissipation plate, or is disposed on the heat dissipation plate and the printed circuit board, and the heat sink is disposed on the The heat sink is opposite to the other side of the light emitting diode. The heat sink is a thin metal sheet body, a heat-conducting substrate, a heat sink formed by die-casting or die-casting, or a heat sink assembled by a plurality of heat-dissipating fins. Therefore, for the above purpose, the lighting device according to the present invention comprises a heat sink, a printed circuit board, at least one light emitting diode and a reflective layer. The printed circuit board is disposed on the heat sink, and the cleaning diode is disposed. On the surface of the printed circuit board, a reflective layer is disposed on the surface of the heat sink to reflect light emitted by the light emitting diode. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0004] The following description of the preferred embodiments of the present invention will be described with reference 2A and 2B, which show a preferred embodiment of the lamp of the present invention, which includes a frame 23, at least one printed circuit board 22, and at least one light-emitting diode 21' frame 23 for receiving The printed circuit board 22 and the light-emitting diode 21' are printed on the bottom 231 of the frame by screws 26, and can also be fixed by a stud. The printed circuit board extends in a strip shape, and the light-emitting body 21 is spaced apart. A suitable heat dissipation distance is arranged on the surface of the printed circuit board 22, and the light-emitting diode 21 is radiated through the frame 23. The light emitting diode 21 includes at least one first light emitting diode A and at least one first light emitting diode B staggered on the printed circuit board 22, the first light emitting body 8 and the second light emitting diode The polar body B may not be driven to illuminate at the same time, and the heat to be excluded per unit area of the bottom portion 231 of the frame body is reduced by A_ page 6/28 pages 201043832, and the first light emitting diode A and the second light emitting diode B are It can also be used for different color temperatures, and can be achieved under different time driving - the requirements of different color temperature performance in the lamp can also achieve the effect of color mixing. A thermally conductive adhesive layer 25 is disposed between the printed circuit board 22 and the bottom 231 of the frame. As shown in FIG. 2B, which is a partial cross-sectional view of FIG. 2A, the thermally conductive adhesive layer 25 is used to closely connect the printed circuit board. 22 and the bottom portion 231 of the frame, the heat conductive adhesive layer 25 is preferably a heat dissipation paste, a heat dissipation adhesive, a heat dissipation pad or a heat dissipation adhesive tape. In addition, the reflective layer 24 is disposed at the bottom 231 of the frame, adjacent to the printed circuit board 22 for reflecting the light emitted by the LED 21, and the reflective layer 24 is disposed in the frame by impregnation or electrostatic coating. The bottom 231' of the body is preferably a white paint. The printed circuit board is preferably a glass fiber film. The material of the pivot is preferably copper, aluminum, iron, magnesium alloy, metal or high heat conductive material. The heat sink is preferably a ceramic substrate, an aluminum substrate, and a non-conductive material. Thermal substrate or metal-based printed circuit board. According to another preferred embodiment of the present invention, as shown in Figures 2 (and 21), a pressure plate 27 of a non-conductive material is placed or adhered over the printed circuit board to increase the rigidity of the printed circuit board. A plurality of fixing mechanisms 28 are disposed on the bottom portion 231 of the frame for fixing the board. The fixing mechanism 28 is preferably a spring piece. The pressure plate 27 and the printed circuit board 22 can be fixed to the bottom 231 of the frame body through the pressing plate and the fixing mechanism. The auxiliary 'printed circuit board can also be easily replaced. Please refer to FIGS. 3A and 3B for a first preferred embodiment of the illumination device of the present invention, and FIG. 3B is a partial view of the portion of FIG. 3A. The illumination device includes a printed circuit board 22 and at least one heat dissipation plate. 31, at least one light two 098118308 Form No. A0101 Page 7 / Total 28 pages 0982031045-0 201043832 Polar body 21 and a heat sink 32. That is, the brush circuit board 22 has at least one hole 33', the heat dissipation plate 31 is disposed in the hole of the printed circuit board, and the heat dissipation plate 31 is coupled to the printed circuit (4) through a tight fit manner, and the printed circuit board 22 and the The surface of the heat dissipation plate 31 has a printed circuit 221, a connection through a zero ohm resistor 34, and a wire field. The light-emitting body 21 includes at least an illuminating wafer 211 and a package 212. The 211 is packaged on the package 212, and the package 2 is spanned. On the far heat sink 31 and the printed circuit board 22, the heat sink 32 is slanted on the heat sink 31 relative to the light emitting diode 21. The other side of the heat conduction layer 25 is disposed between the heat dissipation plate 31 and the heat sink 32 for connecting the heat dissipation plate 31 and the heat sink 32. The heat sink 32 is preferably a heat conductive substrate, an aluminum extruded or The die-casting device or the heat sink assembled by a plurality of heat-dissipating sheets may also be a thin plate of a large area, for example, the bottom 231 of the frame in the second drawing. 凊 See 4A and 4B. Figure showing a second preferred embodiment of the illumination device of the present invention, Figure 4B The difference between the 4A and 3A is that the LED 21 is not disposed between the printed circuit board 22 and the heat sink 31 but is directly disposed on the heat sink 31. The printed circuit 311 on the surface of the heat dissipation plate 31 is connected to the printed circuit 221 on the surface of the printed circuit board 22 through the zero ohm resistor 34 at both ends. Further, the light-emitting chip 211 of the light-emitting diode 21 can be directly sealed on the heat dissipation plate. The surface of the 31, as shown in Figs. 5A and 5B, is a third preferred embodiment of the illuminating device of the present invention. Since the illuminating device omits the package, the illuminating wafer 211 directly dissipates heat through the heat dissipating plate 31 to further improve heat dissipation. 098118308 The lamp of the present invention further comprises a reflector 61 disposed in the frame 23. Form No. A0101, page 8 / page 28, as shown in the figure 098231045-0 201043832 6A, the reflector 61 is disposed on the printed circuit board. The side is for reflecting the light emitted by the light-emitting diode 21. The reflector 61 has a ridge shape, and the surface thereof is a sloped surface, but may also be a concave or convex surface or a paraboloid. The printed circuit board and the reflector 61 have a white color. a reflective layer 24 is formed on the printed circuit board. A pressing plate 27 is disposed above the printed circuit board, and the pressing plate 27 and the printed circuit board are fixed to the bottom of the frame by the fixing mechanism 28. The lamp further includes at least one transparent plate 62, as shown in FIG. The light-transmitting plate 62 is disposed between the two adjacent reflectors 61 and is located on the light-emitting path of the light-emitting diode. The reflector 61 has a protrusion 611 on the surface thereof. The light-transmitting plate 62 is engaged with the protrusion 611. The surface of the light-transmitting plate 62 has a plurality of concave and convex members for uniformly expanding the light emitted by the light-emitting diode. The lamp further includes a fixing member 63. As shown in FIG. On the light board 62, the light-transmitting plate 62 is fastened between the fixing member 63 and the lower edge of the reflector 61. The surface of the reflector 61 has at least one slot 612. The fixing member 63 is fastened to the card slot 612. And forming an array structure with the upper edge of the reflector 61. As shown in FIG. 6D, the fixing member is preferably a light shielding plate for preventing glare. The illuminating device of the present invention may include an auxiliary heat dissipating plate 71, which is disposed at the bottom of the frame body 23 opposite to the other side of the at least one light emitting diode, as shown in FIG. The auxiliary heat sink 71 is wavy and is fixed to the bottom of the frame 23 by laser welding or riveting. The lighting devices of the above paragraphs 2 to 5 can be used with the lamps of Figures 6 to 7. In summary, the luminaire of the present invention and its illuminating device transmit the illuminating diode and the printed circuit board directly on the frame outside the luminaire, so that the 098118308 form number Α 0101 page 9 / 28 pages 0982031045-0 201043832 The light-pole body is scattered through the frame, 丄..., because the frame is a large-area thin metal plate, the heat-dissipating area can be effectively increased, and the "plate" with good heat dissipation is embedded on the printed circuit board to increase the scatter rate. The cost of making additional aluminum extruded radiators for loading '*大·13⁄4 reduces the unit cost of heat dissipation. The above description is for illustrative purposes only, and 'w is not a limitation. Any equivalent modifications or alterations to the owner of the invention will be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0005] 098118308 FIG. 1 is a schematic view showing a conventional LED lamp tube, FIG. 2A is a schematic view showing a preferred embodiment of the lamp of the present invention, and FIG. 2B is a view showing a preferred embodiment of the lamp of the present invention. FIG. 2C is a partial cross-sectional view showing another preferred embodiment of the lamp of the present invention, FIG. 2D is a side view showing FIG. 2C; and FIG. 3A is a view showing the lighting device of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3B is a partial cross-sectional view of FIG. 3A; FIG. 4A is a schematic view showing a second preferred embodiment of the illumination device of the present invention; FIG. 4B shows a fourth A Figure 5A is a partial cross-sectional view showing a third preferred embodiment of the illumination device of the present invention; Figure 5B is a partial cross-sectional view of Figure 5A; and Figures 6A to 6D are views showing the lamp of the present invention. A schematic view of the assembly of the preferred embodiment; and Figure 7 shows a preferred embodiment of the luminaire of the present invention in combination with an auxiliary heat sink. Form No. A0101, page 10 of 28, 201043832. [Main component symbol description] [0006] 0006 098 098118308 I : LED tube II : LED 2 : Printed circuit board 13 : Heat dissipation structure 21 : Light-emitting diode 211 : Light-emitting diode 212 : Package 22 : Printed circuit Plates 221, 311: Printed circuit 23: Frame 231: Frame bottom 24: Reflective layer 25: Thermally conductive back layer 26: Screw 27: Platen 28: Fixing mechanism 31: Heat sink 32: Heat sink 33: Hole 34: Zero ohm Resistor 61: Reflector 611: Projection portion 612: Card slot 62: Translucent plate form No. A0101 Page 11/28 page 0982031045-0 201043832 63: Fixing member 71: Heat sink auxiliary plate 098118308 Form No. A0101 Page 12 of 28 pages
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