1375772 •九、發明說明： 【發明所屬之技術領域】 本發明係有關一種應用在燈具等照明裝置之發光模 组’旨在提供一種能夠有效降低對照明裝置構成溫度影響 的發光模組。 【先前技術】 眾所皆知發光二極體產品的優點基本上包括有省 電、郎能、體積小、堅固耐用以及使用壽命長等等，其種 類則主要可以區分為一般亮度發光二極體及高亮度發光 二極體；其中，一般亮度發光二極體多應用於消費性電氣 裝置或家電產品上的指示燈，至於高亮度發光二極體則應 用在手機、背光源、戶外看板以及燈具等照明裝置。 由於發光二極體之照明應用類型可以廣泛包含—般 照明、輔助照明以及指示照明等用途，因此以目前發光二 極體的發展趨勢而言，照明市場應該為發光二極體應用的 主要目標之一；雖然，發光二極體可以視為耗電極小的新 ，代節能發光元件，高亮度發光二極體所產生的高溫—直 疋目如相關業者無不絞盡腦汁所急欲解決的課題。 原因在於高亮度發光二極體本身並不容易散熱，除了 導致其所應用的照明裝置的溫度上升之外，更有可能因為 長時間的使用，而對其光線所照射的區域造成溫度干擾， 進而對使用發光二極體的照明裝置適用範圍造成限制。 1375772 .【發明内容】 本發明之主要目的即在提供一種能夠有效降低對照 明裝置構成溫度影響，以及使接受光線照明的區域不致於 受發光二極體溫度干擾的發光模組；為達上揭目的，整體 發光模組基本上係由一導光組.件、至少一散熱體，以及複 數個發光二極體所組成。 其中，各發光二極體係建構在散熱體上，其散熱體則 可以為導熱材、散熱材或其結合；據以，整體發光模組即 可透過散熱體立即降低對照明裝置構成溫度影響，以及幫 助發光二極體的熱源朝往出光面以外的方向釋放，進而降 低發光模組出光面的溫度，使接受其光線照明的區域不致 於受到溫度上的干擾。 【實施方式】 本發明之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地嘹解。 本發明之發光模組主要應用於如第一圖所示之燈具 或手電筒之類的照明裝置20，使整體照明裝置20得以透 過發光模組10之運作，而達到節能省電之照明效果；請 同時配合參照第二圖所示，整體發光模組10基本上係包 括有一導光組件11、至少一散熱體12，以及複數個發光 二極體13 ;其中： 各發光二極體13係建構在散熱體12上，用以產生光 源，導光組件11係設有相關的光學機制5用以將發光二 1375772 •:體13的光線導引至照明裝置2〇的出光面均勻射出的效 ;放熱體12則係用以將發光二極體13所產 源導引至照明裝置2〇外部排放。 斤產生熱 如第-圖及第三圖所示’上述散熱體12係可以加工 成為整體光學模組1〇用以裝配相關構件的框形結構體， 而整個散熱體12則可以為導熱材、散熱材或是導熱材與 散熱材之結合，並且加工成為如第三_示具有邊框⑵ 的框形結構體或是如第四圖所示具有邊框121及背板122 的框形結構體；當然，其邊框121及背板122可以分由導 熱材、散熱材的材質（例如金屬材f)所構成（如第五圖所 示）並且利用螺絲123結合的方式將不同材料特性的邊 框121及背板122組合成一結構完整的散熱體12。再者， 可以如第六圖所示，進—步在散諸…目對應於發光模 組10外側的部位設有增加與空氣接觸面積的若干鰭片 124增加散熱效率。 、請同時配合參照第二圖所#，上述導光組# U則係 進一步包括有一導光板1U、一設於導光板lu背面的反 射材112、一设在導光板in正面的光學膜片ιι3;另外， 在導光組件11的正面設有用以將導光組件u固定的面板 141及前框142;於實施時，用以將導光組件u固定的前 框142亦可以如第七圖所示，配合一框架143將整體發光 模組10包覆，使整體發光模組1〇的外觀結構趨於完整， 甚至於可以直接做為照明裝置的燈頭總成。 據以，當發光模組10當中的發光二極體13通電產生 7 u〇772 ，源時’其所i生的熱源即可透過散熱體12導引至，昭明 的外部釋放，除了可以降低對照明裝置構成溫度影塑 :外’更有利於將發光二極體13的熱源朝往出光面以外 ^向釋放，藉崎低發光模組出光面的溫度，而不致於 對接受其光線照明的區域造成溫度上的干擾。 值得-提的是，本發明在具體實施時發光模組⑴系 L配合照明裝置之規格需求將所有發光二極體13配置在 籲光板111的-個平直邊面上，當然其導光板⑴的外形 小，並不需要有特定的限制，原則上以如第八圖所示，至 .少，有一個供配設發光二極體13的平直邊面1U1為佳， 或疋如第九圖至第十一圖所示，設有複數個平直邊面 1111 ’而可在導光板111複數個平直邊面llu處佈 光二極體13。 x 至於，每一個平直邊面mi上所排列的發光二極體 13★可以為單行排列、如第十二圖所示之雙行排列，或是 鲁如第十三圖所示之雙行並且相互交錯的方式排列；而且， 導光板，板面可以為如第十四圖所示均一厚度的平直 板’或是如第十五圖所示的兩邊厚度不一的楔形板。 藉由上述發光模組之結構設計，確實可以將發光二極 體產生的熱源快速導引至照明裝置外部釋放，有效降低對 照明裝置構成溫度影響，以及降低對接受其光線照明的區 域造成溫度上的干擾，提供照明裝置另一較佳可行之發光 模組，爰依法提呈專利之申請 本發明之技術内容及技術特點巳揭示如上，然而熟悉 1375772 -本項技術之人士仍可能基於本發明之揭示而作各種不背 ，離本案發明精神之替換及修飾。因此，本發明之保護範圍 ' 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 第一圖係為本發明所應用之照明裝置外觀圖。 第二圖係為本發明第一實施例之發光模組結構分解圖。 • 第三圖係為本發明第一實施例之發光模組局部結構剖面 • 圖。 第四圖係為本發明第二實施例之發光模組局部結構剖面 圖。 第五圖係為本發明第三實施例之發光模組局部結構剖面 圖。 第六圖係為本發明第四實施例之發光模組局部結構剖面 圖。 • 第七圖係為本發明第五實施例之發光模組局部結構剖面 圖。 第八圖係為本發明第六實施例之導光板外觀結構圖。 第九圖係為本發明第七實施例之導光板外觀結構圖。 第十圖係為本發明第八實施例之導光板外觀結構圖。 第十一圖係為本發明第九實施例之導光板外觀結構圖。 第十二圖係為本發明第十實施例之發光二極體_列方式 圖。 9 1375772 •第十三圖係為本發明第十一實施例之發光二極體排列方 η 式圖。 '第十四圖係為本發明第十二實施例之發光模組局部結構 剖面圖。 第十五圖係為本發明第十三實施例之發光模組局部結構 剖面圖。 【主要元件代表符號說明】 • 10發光模組 11導光組件 .111導光板 112反射材 113光學膜片 12散熱體 121邊框 122背板 籲123螺絲 124鰭片 13發光二極體 141面板 142前框 143框架 20照明裝置1375772 IX. OBJECTS OF THE INVENTION: 1. Field of the Invention The present invention relates to a lighting module for use in a lighting device such as a lamp, and aims to provide a lighting module capable of effectively reducing the temperature influence on a lighting device. [Prior Art] It is well known that the advantages of the light-emitting diode product basically include power saving, Lang energy, small size, durability, long service life, etc., and the types thereof can be mainly classified into general brightness light-emitting diodes. And high-brightness light-emitting diodes; among them, general brightness light-emitting diodes are mostly used for indicator lights on consumer electrical devices or home appliances, and high-brightness light-emitting diodes are used in mobile phones, backlights, outdoor billboards, and lamps. And other lighting devices. Since the lighting application type of the light-emitting diode can widely include general illumination, auxiliary illumination, and indication illumination, the lighting market should be the main target of the LED application in terms of the current development trend of the LED. 1. Although the light-emitting diode can be regarded as a new, low-energy-consuming light-emitting element, the high-temperature light-emitting diode generates high-temperature, such as the problem that the relevant industry has to rack its brains to solve. . The reason is that the high-brightness light-emitting diode itself does not easily dissipate heat, and in addition to causing the temperature rise of the lighting device to which it is applied, it is more likely to cause temperature disturbance to the area irradiated by the light due to long-term use, and further There is a limit to the range of application of lighting devices using light-emitting diodes. 1375772. SUMMARY OF THE INVENTION The main object of the present invention is to provide a light-emitting module capable of effectively reducing the temperature influence on a lighting device and preventing the light-illuminated region from being disturbed by the temperature of the light-emitting diode; The overall illumination module is basically composed of a light guiding group, at least one heat sink, and a plurality of light emitting diodes. Wherein, the light-emitting diode system is constructed on the heat sink body, and the heat sink body can be a heat conductive material, a heat dissipation material or a combination thereof; accordingly, the overall light-emitting module can immediately reduce the temperature influence on the lighting device through the heat sink body, and The heat source of the light-emitting diode is released in a direction other than the light-emitting surface, thereby lowering the temperature of the light-emitting surface of the light-emitting module, so that the area receiving the light illumination is not subject to temperature interference. [Embodiment] The features of the present invention can be clearly understood by referring to the detailed description of the drawings and the embodiments. The illuminating module of the present invention is mainly applied to a illuminating device 20 such as a luminaire or a flashlight as shown in the first figure, so that the illuminating device 20 can be operated through the illuminating module 10 to achieve energy-saving and lighting-saving effects; With reference to the second figure, the overall light-emitting module 10 basically includes a light guiding component 11, at least one heat sink 12, and a plurality of light-emitting diodes 13; wherein: each light-emitting diode 13 is constructed in The light-dissipating body 12 is configured to generate a light source, and the light-guiding component 11 is provided with an optical mechanism 5 for guiding the light of the light-emitting layer 1377772:: body 13 to the light-emitting surface of the illumination device 2 to uniformly emit the light; The body 12 is used to guide the source of the light-emitting diode 13 to the external discharge of the illumination device 2 . The heat generated by the jin is as shown in the first and third figures. The heat dissipating body 12 can be processed into a frame structure of the integral optical module 1 for assembling related components, and the entire heat dissipating body 12 can be a heat conducting material. a heat dissipating material or a combination of a heat dissipating material and a heat dissipating material, and is processed into a frame structure having a frame (2) as shown in the third embodiment or a frame structure having a frame 121 and a back plate 122 as shown in the fourth figure; The frame 121 and the back plate 122 may be composed of a material of a heat conductive material and a heat dissipation material (for example, a metal material f) (as shown in FIG. 5), and the frame 121 and the back of different material properties are combined by means of a screw 123. The plates 122 are combined into a structurally complete heat sink 12. Furthermore, as shown in the sixth figure, a plurality of fins 124 which increase the contact area with the air are provided in the portion corresponding to the outer side of the light-emitting module 10 to increase the heat dissipation efficiency. Referring to the second figure, the light guide group #U further includes a light guide plate 1U, a reflective material 112 disposed on the back surface of the light guide plate lu, and an optical film ιι3 disposed on the front surface of the light guide plate in. In addition, a front panel 141 and a front frame 142 for fixing the light guide assembly u are disposed on the front surface of the light guide assembly 11; in implementation, the front frame 142 for fixing the light guide assembly u may also be as shown in FIG. It is shown that the overall light-emitting module 10 is covered by a frame 143, so that the overall structure of the overall light-emitting module 1〇 tends to be complete, and even can be directly used as a lamp head assembly of the lighting device. Therefore, when the light-emitting diode 13 in the light-emitting module 10 is energized to generate 7 u 772, the source of the heat source can be guided through the heat sink 12, and the external release of Zhaoming can be reduced. The illuminating device constitutes the temperature filming: the outer part is more favorable for releasing the heat source of the light-emitting diode 13 to the outside of the light-emitting surface, and the temperature of the light-emitting surface of the low-light-emitting module is not used for the area receiving the light illumination. Causes temperature disturbances. It is worth mentioning that, in the specific implementation of the present invention, the light-emitting module (1) is compatible with the specification requirements of the illumination device, and all the light-emitting diodes 13 are disposed on a straight side surface of the light-receiving plate 111, of course, the light guide plate (1) The shape is small, and does not need to have specific restrictions. In principle, as shown in the eighth figure, there is a small flat surface 1U1 for the light-emitting diode 13 or, for example, the ninth. As shown in the eleventh figure, a plurality of straight side faces 1111' are provided, and the light-emitting diodes 13 can be disposed at a plurality of straight side faces 11u of the light guide plate 111. x As for the light-emitting diodes 13 arranged on each of the straight sides mi, it can be arranged in a single line, as shown in the two-row arrangement shown in Fig. 12, or as a double line as shown in the thirteenth figure. And arranged in a staggered manner; and, the light guide plate, the plate surface may be a flat plate of uniform thickness as shown in FIG. 14 or a wedge plate having different thicknesses on both sides as shown in FIG. By the structural design of the above-mentioned light-emitting module, the heat source generated by the light-emitting diode can be quickly guided to the outside of the lighting device, thereby effectively reducing the temperature influence on the lighting device and reducing the temperature on the area receiving the light illumination. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Revelation and variety, and the replacement and modification of the spirit of the invention. Therefore, the scope of the present invention should be construed as not limited by the scope of the invention, and the invention is intended to BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an appearance view of a lighting device to which the present invention is applied. The second figure is an exploded view of the structure of the light emitting module according to the first embodiment of the present invention. The third figure is a partial structural sectional view of the light-emitting module according to the first embodiment of the present invention. The fourth figure is a cross-sectional view showing a partial structure of a light-emitting module according to a second embodiment of the present invention. Figure 5 is a cross-sectional view showing a partial structure of a light-emitting module according to a third embodiment of the present invention. Figure 6 is a cross-sectional view showing a partial structure of a light-emitting module according to a fourth embodiment of the present invention. Figure 7 is a cross-sectional view showing a partial structure of a light-emitting module according to a fifth embodiment of the present invention. The eighth drawing is an external structural view of a light guide plate according to a sixth embodiment of the present invention. The ninth drawing is an external structural view of a light guide plate according to a seventh embodiment of the present invention. The tenth figure is an external structural view of a light guide plate according to an eighth embodiment of the present invention. The eleventh drawing is an external structural view of a light guide plate according to a ninth embodiment of the present invention. Fig. 12 is a view showing the light-emitting diode_column of the tenth embodiment of the present invention. 9 1375772 • The thirteenth diagram is a η-type diagram of the arrangement of the light-emitting diodes according to the eleventh embodiment of the present invention. Figure 14 is a cross-sectional view showing a partial structure of a light-emitting module according to a twelfth embodiment of the present invention. Figure 15 is a cross-sectional view showing a partial structure of a light-emitting module according to a thirteenth embodiment of the present invention. [Main component representative symbol description] • 10 light module 11 light guide component. 111 light guide plate 112 reflective material 113 optical film 12 heat sink 121 frame 122 back plate call 123 screw 124 fin 13 light emitting diode 141 panel 142 front Frame 143 frame 20 lighting device