CN105006515B - A kind of LED chip radiator structure - Google Patents
A kind of LED chip radiator structure Download PDFInfo
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- CN105006515B CN105006515B CN201510305865.3A CN201510305865A CN105006515B CN 105006515 B CN105006515 B CN 105006515B CN 201510305865 A CN201510305865 A CN 201510305865A CN 105006515 B CN105006515 B CN 105006515B
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- Prior art keywords
- heat
- cooling pad
- radiating
- led chip
- fluting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
A kind of LED chip radiator structure of the present invention, that includes LED chip, cooling pad and heat-radiating substrate, the cooling pad is provided with groove, the LED chip is arranged in groove, the surface of LED chip contacts with bottom with the cooling pad, it is characterised in that the cooling pad is at least provided with a radiating pin, fluting is provided with the heat-radiating substrate, the radiating pin is inserted in fluting.Pass through pin and fluting, cooling pad and heat-radiating substrate can be combined together, the effect of pin and fluting, on the one hand it can play a part of fixed and combine, on the other hand, both contact, heat transfer can be realized, the heat for distributing chip bottom and sidepiece, heat-radiating substrate is transmitted to by cooling pad, so as to realize heat sinking function.
Description
Technical field
The present invention relates to LED field, especially designs a kind of LED chip radiator structure.
Background technology
Present LED lamp, has been widely used in daily life, and white heat is even more progressively instead of in lighting field
Lamp, meanwhile, LED is in other field also in positive popularization.LED light source has the characteristics of high brightness and energy-conservation, therefore so ring
Guarantor's type illuminates.But LED also has the defects of certain in itself as light source, one of problem is exactly heat dissipation problem, its direct shadow
Sound has arrived the life-span of LED light source in itself.Therefore, all it is the mesh that achievement is pursued all the time if heat dissipation problem can be solved effectively
Mark.
The content of the invention
In order to solve the above technical problems, a kind of LED chip radiator structure of the present invention, that includes LED chip, cooling pad and
Heat-radiating substrate, the cooling pad are provided with groove, and the LED chip is arranged in groove, the surface of LED chip and bottom
Contacted with the cooling pad, it is characterised in that the cooling pad is set at least provided with a radiating pin on the heat-radiating substrate
There is fluting, the radiating pin is inserted in fluting.
Preferably, the cooling pad is provided with more than two radiating pins, and respective amount is provided with the heat-radiating substrate
Fluting.
Preferably, the both ends of the cooling pad are respectively equipped with radiating pin, and corresponding fluting is provided with the heat-radiating substrate.
Preferably, heat-conducting layer is provided between the cooling pad and heat-radiating substrate, the heat-conducting layer can be silica gel.
Preferably, ventilation slot is provided with below the heat-radiating substrate.
Preferably, radiating salient point or heat sink strip are provided with above the cooling pad.
Preferably, the depth of the radiating pin and the fluting is 1-2mm.
Preferably, the cooling pad is metal, and the heat-radiating substrate is ceramic substrate.
Beneficial effects of the present invention：By pin and fluting, cooling pad and heat-radiating substrate can be combined together, pin
With the effect of fluting, it on the one hand can play a part of fixed and combine, on the other hand, both contact, it is possible to achieve heat transfer,
The heat for distributing chip bottom and sidepiece, heat-radiating substrate is transmitted to by cooling pad, so as to realize heat sinking function.
Brief description of the drawings
The embodiment of the present invention is furtherd elucidate below in conjunction with the accompanying drawings.
Fig. 1 is the first embodiment of the present invention；
Fig. 2 is second embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
First embodiment
As shown in figure 1, in the first embodiment of the present invention, there is provided a kind of LED chip radiator structure, that includes LED
Chip 21, cooling pad 22 and heat-radiating substrate 24, cooling pad are provided with groove, and LED chip is arranged in groove, the portion of LED chip
Point side contacts with bottom with cooling pad, wherein, cooling pad is provided with heat-radiating substrate and opened at least provided with a radiating pin 25
Groove, radiating pin are inserted in fluting.The form of fluting is unlimited, can be rectangle, square or circle.
Cooling pad is metal, and such as copper, silver or aluminium, heat-radiating substrate is ceramic substrate, such as aluminum oxide or aluminium nitride.
In the present invention, by pin and fluting, cooling pad and heat-radiating substrate can be combined together, pin and fluting
Effect, it on the one hand can play a part of fixed and combine, on the other hand, both contact, it is possible to achieve heat transfer, i.e., by chip
The heat that bottom and sidepiece distribute, heat-radiating substrate is transmitted to by cooling pad, so as to realize heat sinking function.
In the present invention, chip is set in a groove, chip bottom and sidepiece can be caused effectively to carry out heat
Distribute.
It in the embodiment of the present invention, by the combination of pin and fluting, can effectively fix, adhesive linkage is set without extra,
Heat-radiating substrate and ceramic substrate can mechanically be combined.But the present invention is not limited thereto, can also as shown in FIG.,
Heat-conducting layer 23 is provided between cooling pad and heat-radiating substrate, heat-conducting layer 23 can be silica gel, play bonding and the function of heat conduction.
Preferably, cooling pad is provided with more than two radiating pins 25, and the fluting of respective amount is provided with heat-radiating substrate.
Can also be respectively equipped with radiating pin at the both ends of cooling pad, corresponding fluting is provided with heat-radiating substrate.
Preferably, the depth of radiating pin and the fluting is 1-2mm.
Second embodiment
Fig. 2 illustrates second embodiment of the present invention, and LED chip radiator structure, that includes LED chip 31, radiating
Pad 32 and heat-radiating substrate 34, cooling pad are provided with groove, and LED chip 31 is arranged in groove, the surface of LED chip 31
Contacted with bottom with cooling pad 32, wherein, cooling pad at least provided with one radiating pin 35, on heat-radiating substrate be provided with fluting,
Radiate in the insertion fluting of pin 35.The form of fluting is unlimited, can be rectangle, square or circle.
Cooling pad is metal, and such as copper, silver or aluminium, heat-radiating substrate is ceramic substrate, such as aluminum oxide or aluminium nitride.
In this implementation, ventilation slot 37 is provided with below heat-radiating substrate, the setting of ventilation slot 37, increase the table of heat-radiating substrate
Area, more can effectively it be radiated
Meanwhile radiating salient point or heat sink strip 36 are additionally provided with above cooling pad.The setting of radiating salient point or heat sink strip,
Heat can be caused just to obtain part in radiating pad part and discharge, the heat dissipation capacity of heat-radiating substrate is reduced, avoid heat build-up.
Preferably, the depth of radiating pin and fluting is 1-2mm, and radiating pin size is slightly less than fluting.
It is pointed out that above example is not intended to limit the present invention only to explain the present invention.Based on the present invention
The small variation done, such as material are replaced all without departing from protection scope of the present invention.
Claims (3)
1. a kind of LED chip radiator structure, that includes LED chip, cooling pad and heat-radiating substrate, the cooling pad is provided with recessed
Groove, the LED chip are arranged in groove, and the surface of LED chip contacts with bottom with the cooling pad, and its feature exists
In the cooling pad is provided with fluting, the radiating pin insertion is opened at least provided with a radiating pin on the heat-radiating substrate
In groove；Heat-conducting layer is provided between the cooling pad and heat-radiating substrate, the heat-conducting layer can be silica gel；On the cooling pad
Side is provided with radiating salient point or heat sink strip；
The both ends of the cooling pad are respectively equipped with radiating pin, and corresponding fluting is provided with the heat-radiating substrate；The cooling pad
For metal, the heat-radiating substrate is ceramic substrate；The depth of the radiating pin and the fluting is 1-2mm.
2. LED chip radiator structure as claimed in claim 1, it is characterised in that the cooling pad is provided with more than two dissipate
Hot pin, the fluting of respective amount is provided with the heat-radiating substrate.
3. LED chip radiator structure as claimed in claim 1, it is characterised in that ventilation is provided with below the heat-radiating substrate
Groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510305865.3A CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510305865.3A CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105006515A CN105006515A (en) | 2015-10-28 |
| CN105006515B true CN105006515B (en) | 2018-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510305865.3A Active CN105006515B (en) | 2015-06-04 | 2015-06-04 | A kind of LED chip radiator structure |
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| Country | Link |
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| CN (1) | CN105006515B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN108075029B (en) * | 2017-12-27 | 2019-12-13 | 浙江绿创新拓建筑规划设计有限公司 | Energy-saving lighting device |
| CN109742198A (en) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | A kind of high-powered LED lamp of perfect heat-dissipating |
| CN111853733B (en) * | 2020-06-17 | 2023-03-07 | 安徽一路明光电科技有限公司 | LED chip heat dissipation device |
| CN114551641B (en) * | 2022-02-10 | 2023-09-12 | 中国科学院上海技术物理研究所 | Thermal layer structure of focal plane detector for physically isolating coupling stress |
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| CN105006515A (en) | 2015-10-28 |
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Effective date of registration: 20200717 Address after: 102299 2F, building 2, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing (Changping demonstration area) Patentee after: Golden Scorpion Co.,Ltd. Address before: 528226, A8 building, Guangdong new light source base, Luo Cun, Nanhai District, Foshan, Guangdong Patentee before: FOSHAN CITY NANHAI DISTRICT GUANGDONG NEW LIGHT SOURCE INDUSTRY INNOVATION CENTER |
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