CN201749869U

CN201749869U - Light-emitting diode (LED) encapsulation device

Info

Publication number: CN201749869U
Application number: CN2010201956132U
Authority: CN
Inventors: 曹海兵
Original assignee: Shenzhen Refond Optoelectronics Co Ltd
Current assignee: Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2010-05-19
Filing date: 2010-05-19
Publication date: 2011-02-16
Anticipated expiration: 2020-05-19

Abstract

The utility model relates to a light-emitting diode (LED) encapsulation device. The LED encapsulation device comprises an LED element and a base plate; the LED element is adhered on the base plate; at least one fin is arranged on the bottom surface of the LED element; mounting holes are formed in the corresponding positions of the base plate; the fins are inserted into the mounting holes on the base plate; the mounting holes are in interference fit with the fins; and the depth of the mounting holes is larger than the height of the fins (or the mounting holes adopt through holes). As the fins on the bottom surface of the LED element are inserted in the mounting holes on the base plate, and the mounting holes are in interference fit with the fins, the LED element can be effectively prevented from tilting, the bottom surface of the LED element is in well contact with the surface of the base plate, and the reliability in heat radiation is improved. As the side surfaces of the fins are in contact with the surfaces of the mounting holes on the base plate, the heat radiation area of the LED element is increased, the heat is better radiated, the capability of radiating heat in the normal direction of the base plate is improved, and the problems that the light decays and the service life is shortened, which are caused by the overheating LED element, are solved.

Description

A kind of LED packaging

Technical field

The utility model relates to a kind of LED packaging, specifically is meant a kind of LED packaging of high efficiency and heat radiation.

Background technology

LED has numerous advantages such as light efficiency height, long service life, energy-conserving and environment-protective, be that other light sources is difficult to be equal to, ground more and more widely is applied in the lighting field, but, the photoelectric efficiency of led light source has only about 15% at present, it is heat energy that LED work the time has 85% power conversion approximately, now the size of LED packaging is also becoming lighter and thinner littler rapidly, even caloric value is not high, the heat zone minimum at LED element chip place piled up and still may be made the intensification of LED element too high, causes light decay and life-span sharply to shorten.And the bottom surface of conventional LED element all is planes, the desirable situation that mounts as shown in Figure 1, LED element 1 bottom surface contacts good with substrate 2 surfaces, heat flow as shown by arrows, but the actual situation of mounting is the bottom surface of LED element 1 often can not fit with substrate 2 surface perfections, a but end perk of LED element 1, as shown in Figure 2, LED element 1 bottom surface and substrate 2 surperficial loose contacts, cause the bottom surface zone line heat sinking function of LED element 1 to completely lose, the heat radiation poor reliability influences bigger to its middle situation that has designed heating column of high-power illumination LED especially.

The utility model content

The technical problem that the utility model mainly solves provides a kind of high efficiency and heat radiation, LED packaging that especially heat-transfer capability significantly promotes on the normal direction of substrate.

For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of LED packaging, comprise LED element and substrate, the LED component mounter is on substrate, described LED element bottom surface is provided with at least one fin, and correspondence position is provided with installing hole on the substrate, in the installing hole on the described fin insertion substrate, described installing hole and fin are interference fit, and the degree of depth of installing hole is a through hole greater than the height or the installing hole of fin.

The beneficial effects of the utility model are: owing to be provided with fin in the bottom surface of LED element, correspondence position is provided with installing hole on the substrate, in the installing hole on the described fin insertion substrate, fin and installing hole are interference fit, adopt this scheme can guarantee effectively that the LED element is difficult for tilting, LED element bottom surface contacts with substrate surface well, improves the heat radiation reliability; And the fin side contacts with installing hole surface on the substrate, thereby increased the area of dissipation of LED element big, can dispel the heat better; Most substrate normal direction thermal conductivity far is less than the thermal conductivity of in-plane, especially PCB or MPCB class substrate, because fin is to insert substrate inside, fin passes to heat the middle and lower part of substrate apace, even pass to the substrate outside, thereby improve the heat-sinking capability of LED packaging greatly, alleviate the light decay and the lost of life that the LED element causes because of temperature rise is too high in the substrate normal direction.

Description of drawings

Below in conjunction with drawings and Examples the utility model is elaborated.

Fig. 1 is the structural representation of prior art LED packaging;

Fig. 2 is that prior art LED packaging mounts bad structural representation;

Fig. 3 is the structural representation of the utility model LED packaging embodiment.

Wherein, 1, LED element; 11, fin; 2, substrate; 21, installing hole.

Embodiment

By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.

Embodiment as the utility model LED packaging, see also Fig. 3, comprise LED element 1 and substrate 2, LED element 1 is mounted on the substrate 2, described LED element 1 bottom surface is provided with at least one fin 11, different as the case may be, the number of fins preferred value is 3～6, present embodiment is 4, correspondence position is provided with the installing hole 21 of equivalent amount on the substrate 2, in the installing hole 21 that described fin 11 inserts on the substrate 2, installing hole 21 is an interference fit with fin 11, and the degree of depth of installing hole 21 is greater than the height of fin 11, and perhaps installing hole 21 is a through hole, the cross sectional shape of fin 11 can be quadrangle, different shapes such as circle, fin is generally made by highly heat-conductive materials such as metals.

Owing to be provided with fin in the bottom surface of LED element, correspondence position is provided with installing hole on the substrate, in the installing hole on the described fin insertion substrate, fin and installing hole are interference fit, adopt this scheme can guarantee effectively that the LED element does not tilt, LED element bottom surface contacts with substrate surface well, improves the heat radiation reliability; And the fin side contacts with installing hole surface on the substrate, thereby increased the area of dissipation of LED element big, can dispel the heat better; Most substrate normal direction thermal conductivity far is less than the thermal conductivity of in-plane, especially PCB or MPCB class substrate, because fin is to insert substrate inside, fin passes to heat the middle and lower part of substrate apace, even pass to the substrate outside, thereby improve the heat-sinking capability of LED packaging greatly, alleviate the light decay and the lost of life that the LED element causes because of temperature rise is too high in the substrate normal direction.

The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.

Claims

1. LED packaging, comprise LED element and substrate, the LED component mounter is on substrate, it is characterized in that: described LED element bottom surface is provided with at least one fin, correspondence position is provided with installing hole on the substrate, in the installing hole on the described fin insertion substrate, described installing hole and fin are interference fit, and the degree of depth of installing hole is a through hole greater than the height or the installing hole of fin.

2. according to the described LED packaging of claim 1, it is characterized in that: described fin cross sectional shape is a quadrangle.

3. according to the described LED packaging of claim 1, it is characterized in that: described fin cross sectional shape is for circular.

4. according to the described LED packaging of claim 1, it is characterized in that: described number of fins is 3～6.

5. according to the described LED packaging of claim 1, it is characterized in that: described fin is made by highly heat-conductive material.