CN214898482U - Diode packaging structure with light condensation effect - Google Patents
Diode packaging structure with light condensation effect Download PDFInfo
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- CN214898482U CN214898482U CN202120814019.5U CN202120814019U CN214898482U CN 214898482 U CN214898482 U CN 214898482U CN 202120814019 U CN202120814019 U CN 202120814019U CN 214898482 U CN214898482 U CN 214898482U
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Abstract
The utility model is suitable for the technical field of diodes, and provides a diode packaging structure with a light-focusing effect, which comprises a metal substrate, a diode chip and a protective cover, wherein the upper surface of the metal substrate is fixedly provided with a light-focusing layer, the upper surface of the metal substrate is provided with a semi-annular groove, the side wall of the semi-annular groove is provided with a slot, a limiting groove is arranged in the slot, a lug is arranged below the protective cover, one side of the lug is fixedly provided with an insert block which is matched with the slot, the upper surface of the insert block is fixedly provided with a limiting block which is matched with the limiting groove, the diode chip is protected from being damaged by arranging a detachable protective cover, the diode chip is convenient to be replaced, heat generated by the diode chip is radiated by arranging a heat radiation mechanism, the light-emitting effect of the diode chip is ensured, and a standby power supply is arranged, therefore, when no proper external power supply is available, the diode chip can be operated through the standby power supply.
Description
Technical Field
The utility model belongs to the technical field of the diode, especially, relate to a diode packaging structure who has spotlight effect.
Background
Light Emitting Diodes (LEDs) have the advantages of long life, power saving, durability, etc., so that the high brightness LED lighting device is an environment-friendly product of green energy and can be widely used in the future, but the Light Emitting efficiency of the LEDs is limited, and the LED Light source product is still not enough to be fully applied to various products in human life, so that a Diode packaging device with good Light condensation and capable of eliminating uneven Light emission of the LEDs is required.
SUMMERY OF THE UTILITY MODEL
The utility model provides a diode packaging structure who has spotlight effect aims at solving the technical problem that exists at present.
The utility model discloses a realize like this, a diode packaging structure who has spotlight effect, including metal substrate, diode chip, safety cover.
The LED light source comprises a metal substrate and is characterized in that a groove is formed in the upper surface of the metal substrate, a diode chip is fixedly arranged in the groove, a light-gathering layer is fixedly arranged on the upper surface of the metal substrate, the light-gathering layer covers the groove, two semi-annular grooves are symmetrically formed in the upper surfaces of two sides of the metal substrate, a slot is formed in one side wall of each semi-annular groove, a limiting groove is formed in the upper surface of the slot, and a spring is arranged at the bottom of each semi-annular groove.
The safety cover below be provided with the lug that the semicircular groove is mutually supported, one side of lug is fixed be provided with the inserted block that the slot is mutually supported, inserted block upper surface fixed be provided with the stopper that the spacing groove is mutually supported.
Preferably, the diode chip is coated with a fluorescent coating.
Preferably, an insulating substrate is fixedly arranged on the lower surface of the metal substrate.
Preferably, a heat dissipation mechanism is arranged in the metal substrate and used for dissipating heat generated by the diode chip in the protective cover to the outside.
Preferably, the upper surface of the metal substrate is fixedly provided with an electrode, the electrode is provided with a matching part, the diode chip is provided with a pin, and the pin is provided with a clamping part matched with the matching part.
Preferably, a standby power supply is fixedly arranged in the metal substrate and electrically connected with the diode chip.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a diode packaging structure that has spotlight effect, through setting up the detachable safety cover, the protection diode chip is difficult for impairedly, conveniently changes the diode chip simultaneously, dispels the heat that the diode chip produced through setting up heat dissipation mechanism, guarantees the luminous effect of diode chip, through setting up stand-by power supply for when not having suitable external power supply, can let the work of diode chip through stand-by power supply.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is an enlarged view of the structure at a of the present invention.
In the figure: 1. a metal substrate; 2. a diode chip; 3. a protective cover; 4. a groove; 5. a light-condensing layer; 6. A semi-annular groove; 7. a slot; 8. a limiting groove; 9. a spring; 10. a bump; 11. inserting a block; 12. a limiting block; 13. an insulating substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-3, the present invention provides a technical solution of a diode package structure with light-gathering effect: the diode chip comprises a metal substrate 1, a diode chip 2 and a protective cover 3.
The upper surface of the metal substrate 1 is provided with a groove 4, the diode chip 2 is fixedly arranged in the groove 4, the upper surface of the metal substrate 1 is fixedly provided with a light-gathering layer 5, the light-gathering layer 5 covers the groove 4, two semi-annular grooves 6 are symmetrically arranged on the upper surfaces of two sides of the metal substrate 1, a slot 7 is arranged on one side wall of each semi-annular groove 6, the upper surface of the slot 7 is provided with a limiting groove 8, and the bottom of each semi-annular groove 6 is provided with a spring 9.
The below of the protective cover 3 is provided with a convex block 10 mutually matched with the semi-annular groove 6, one side of the convex block 10 is fixedly provided with an inserting block 11 mutually matched with the slot 7, and the upper surface of the inserting block 11 is fixedly provided with a limiting block 12 mutually matched with the limiting groove 8.
When installing protection cover 3, place into semi-annular groove 6 with lug 10 of protection cover 3 below, spring 9 atress shrink, rotatory protection cover 3 inserts inserted block 11 in slot 7, then with stopper 12 embedding spacing groove 8 in, loose fast protection cover 3, spring 9 continues to give lug 10 pharmacology because the relaxation force of self this moment to fix protection cover 3 at metal substrate 1 upper surface.
When the protective cover 3 needs to be detached, the protective cover 3 is pressed firstly, the spring 9 is stressed to contract, the limiting block 12 is separated from the limiting groove 8, then the protective cover 3 is rotated, the inserting block 11 is separated from the inserting groove 7, and then the protective cover 3 can be taken down.
The light-gathering layer 5 plays a role in gathering light, so that light emitted by the diode chip 2 is gathered and uniform.
Wherein, the diode chip 2 is covered with a fluorescent coating.
The fluorescent coating has a light-gathering effect, and light emitted by the diode chip 2 can be further more uniform and gathered.
Further, an insulating substrate 13 is fixedly provided on the lower surface of the metal substrate 1.
The insulating substrate 13 has an insulating effect, and can prevent the potential safety hazard caused by the electric leakage of the diode chip 2, so that the safety protection effect is better.
Further, a heat dissipation mechanism is arranged in the metal substrate 1, and the heat dissipation mechanism is used for dissipating heat generated by the diode chip 2 in the protective cover 3 to the outside.
The heat dissipation mechanism absorbs heat generated by the diode chip 2 in the protective cover 3 and then dissipates the absorbed heat to the outside, thereby ensuring that the diode chip 2 is not influenced by high temperature.
Further, the upper surface of the metal substrate 1 is fixedly provided with an electrode, the electrode is provided with a matching part, the diode chip 2 is provided with a pin, and the pin is provided with a card part which is matched with the matching part.
Through setting up card and portion and cooperation portion for diode chip 2 is difficult for droing, thereby promotes the reliability of diode chip 2 during operation.
In addition, a standby power supply is fixedly arranged in the metal substrate 1 and electrically connected with the diode chip 2.
When no suitable external power supply exists, the diode chip 2 can be supplied with power through the standby power supply, so that the diode chip 2 can work normally.
The utility model discloses a theory of operation and use flow: when installing protection cover 3, place into semi-annular groove 6 with lug 10 of protection cover 3 below, spring 9 atress shrink, rotatory protection cover 3 inserts inserted block 11 in slot 7, then with stopper 12 embedding spacing groove 8 in, loose fast protection cover 3, spring 9 continues to give lug 10 pharmacology because the relaxation force of self this moment to fix protection cover 3 at metal substrate 1 upper surface.
When the protective cover 3 needs to be detached, the protective cover 3 is pressed firstly, the spring 9 is stressed to contract, the limiting block 12 is separated from the limiting groove 8, then the protective cover 3 is rotated, the inserting block 11 is separated from the inserting groove 7, and then the protective cover 3 can be taken down.
The light-gathering layer 5 plays a role in gathering light, so that light emitted by the diode chip 2 is gathered and uniform.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a diode packaging structure that has spotlight effect which characterized in that: comprises a metal substrate (1), a diode chip (2) and a protective cover (3);
the LED light source comprises a metal substrate (1), wherein a groove (4) is formed in the upper surface of the metal substrate (1), a diode chip (2) is fixedly arranged in the groove (4), a light-gathering layer (5) is fixedly arranged on the upper surface of the metal substrate (1), the light-gathering layer (5) covers the groove (4), two semi-annular grooves (6) are symmetrically formed in the upper surfaces of two sides of the metal substrate (1), a slot (7) is formed in one side wall of each semi-annular groove (6), a limiting groove (8) is formed in the upper surface of each slot (7), and a spring (9) is arranged at the bottom of each semi-annular groove (6);
the safety cover (3) below be provided with lug (10) that semi-annular groove (6) mutually supported, one side of lug (10) fixed be provided with slot (7) are inserting piece (11) of mutually supporting, inserting piece (11) last fixed surface be provided with spacing groove (8) are stopper (12) of mutually supporting.
2. The diode package structure with light condensing effect as claimed in claim 1, wherein: the diode chip (2) is coated with a fluorescent coating.
3. The diode package structure with light condensing effect as claimed in claim 1, wherein: and an insulating substrate (13) is fixedly arranged on the lower surface of the metal substrate (1).
4. The diode package structure with light condensing effect as claimed in claim 1, wherein: the LED protection device is characterized in that a heat dissipation mechanism is arranged in the metal substrate (1), and the heat dissipation mechanism is used for dissipating heat generated by the diode chip (2) in the protection cover (3) to the outside.
5. The diode package structure with light condensing effect as claimed in claim 1, wherein: the LED chip is characterized in that electrodes are fixedly arranged on the upper surface of the metal substrate (1), the electrodes are provided with matching portions, pins are arranged on the diode chip (2), and clamping portions matched with the matching portions are arranged on the pins.
6. The diode package structure with light condensing effect as claimed in claim 1, wherein: the diode chip is characterized in that a standby power supply is fixedly arranged in the metal substrate (1), and the standby power supply is electrically connected with the diode chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120814019.5U CN214898482U (en) | 2021-04-20 | 2021-04-20 | Diode packaging structure with light condensation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120814019.5U CN214898482U (en) | 2021-04-20 | 2021-04-20 | Diode packaging structure with light condensation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214898482U true CN214898482U (en) | 2021-11-26 |
Family
ID=78888072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120814019.5U Active CN214898482U (en) | 2021-04-20 | 2021-04-20 | Diode packaging structure with light condensation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214898482U (en) |
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2021
- 2021-04-20 CN CN202120814019.5U patent/CN214898482U/en active Active
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