CN202901896U - Light-emitting diode (LED) lamp - Google Patents
Light-emitting diode (LED) lamp Download PDFInfo
- Publication number
- CN202901896U CN202901896U CN2012204399801U CN201220439980U CN202901896U CN 202901896 U CN202901896 U CN 202901896U CN 2012204399801 U CN2012204399801 U CN 2012204399801U CN 201220439980 U CN201220439980 U CN 201220439980U CN 202901896 U CN202901896 U CN 202901896U
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- Prior art keywords
- led
- heat sink
- pcb board
- light fixture
- heat
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- Expired - Fee Related
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Abstract
The utility model discloses a light-emitting diode (LED) lamp, and aims at providing the LED lamp which is good in heat dissipation effect. The LED lamp comprises a shell body, a printed circuit board (PCB) and a surface-mounting LED, wherein the PCB is arranged inside the shell body, the surface-mounting LED is arranged on the PCB and comprises a base body and an LED chip which is arranged on the base body, a heat sink hole is formed in the PCB, and a protruded heat conduction heat sink is arranged on the bottom of the base body and in the heat sink hole and contacted with the shell body. The LED lamp can be used in LED lamps adopting surface-mounting LEDs with small and medium power.
Description
Technical field
The utility model relates to the LED light fixture, especially relates to a kind of LED light fixture of good heat dissipation effect.
Background technology
LED is widely used owing to plurality of advantages such as having energy-conserving and environment-protective life-span length.But, because the caloric value of LED is larger, and very large the contacting of the luminous efficiency of radiating effect and LED existence, if going out, the heat Quick diffusing that LED can not be distributed will affect the luminous efficiency of LED, therefore, must handle the radiator structure of LED well.Existing middle low power SMD LED(Surface Mounted Devices LED, surface labeling LED) encapsulation mostly is is not with heat sink or heat sink to flush with solder side, and the heat of LED need lean on the PCB aluminium base of paster to conduct to shell and distribute.These encapsulating structures are owing to need to conduct heat by the PCB aluminium base, and the common heat-transfer effect of PCB aluminium base and bad, thereby radiating effect is bad when causing existing LED light fixture to adopt the middle low power surface labeling LED.
The utility model content
The bad technical problem of radiating effect provided a kind of LED light fixture when the utility model adopted the middle low power surface labeling LED in order to solve prior art LED light fixture.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is a kind of LED light fixture of design, comprise housing, be located at the pcb board in the housing and be located at surface labeling LED on the pcb board, described surface labeling LED comprises matrix and the led chip that is located on the matrix, be provided with heat sink hole on the described pcb board, it is heat sink that the bottom of described matrix is provided with outstanding heat conduction, and described heat conduction is heat sink to place in the described heat sink hole and directly contact with described housing.
Described heat conduction is heat sink to be the copper post.
The height that described heat conduction is heat sink is 0.22mm-1.05mm.
Described LED light fixture is the fluorescent tube that is the strip-shaped fluorescent lamp shape.
Described pcb board is FR4 or PP material pcb board.
The utility model is by being provided with heat sink hole on the pcb board, it is heat sink to be provided with outstanding heat conduction in the bottom of matrix, and heat sink the placing in the described heat sink hole and with described housing of described heat conduction directly contacted, thereby can not need in actual applications to conduct heat by pcb board, the heat of led chip can be directly conducted to shell minimizing thermal resistance when the paster assembling was used, radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the utility model is elaborated, wherein:
Fig. 1 is the structural representation of the utility model LED light fixture;
Fig. 2 is the generalized section of the utility model LED light fixture;
Fig. 3 is the partial enlarged drawing at A place among Fig. 2;
Fig. 4 is the structural representation of the utility model surface labeling LED;
Fig. 5 is the front view of Fig. 4.
The specific embodiment
See also Fig. 1, Fig. 2 and Fig. 3.The utility model LED light fixture comprises housing 1, pcb board 2 and surface labeling LED 3.The utility model LED light fixture can be for various lamps, and in this specific embodiment, described LED light fixture is preferably the fluorescent tube that is the strip-shaped fluorescent lamp shape.Wherein:
Please in the lump referring to Fig. 4 and Fig. 5.Surface labeling LED 3 electrically is installed on the pcb board, and it comprises matrix 31 and the led chip 32 that is located on the matrix.Wherein:
The bottom of matrix 31 is provided with outstanding heat conduction heat sink 311.Heat conduction is heat sink 311 place in the described heat sink hole and the heat sink and described housing of described heat conduction directly contacts.
Heat conduction is heat sink, and 311 heats that are mainly used in led chip is conducted to matrix 31 conduct, and come heat conduction to cause the poor technical problem of radiating effect thereby solved prior art by pcb board.Because the heat-conducting effect of copper is fine, therefore, in this specific embodiment, preferred heat conduction is heat sink to be the copper post.The height H that heat conduction is heat sink can be set as the case may be, in the time of only need to being practical application, but the heat sink heat of led chip directly can being conducted of heat conduction and do not need to conduct by pcb board and get final product.In this specific embodiment, the height H that heat conduction is heat sink is preferably 0.22mm-1.05mm.
It is heat sink that the utility model is provided with outstanding heat conduction by the bottom at matrix, thereby can not need in actual applications to conduct heat by pcb board, the heat of led chip can be directly conducted to shell minimizing thermal resistance when the paster assembling was used, radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
Tradition middle low power surface labeling LED paster conducts to shell by the PCB aluminium base with the led chip heat and distributes to the PCB aluminium base, and the heat conductivility of PCB aluminium base directly affects the led chip temperature.Only need to use common FR4 or PP material pcb board after using the utility model, the heat of led chip distributes by heat sink being directly conducted on the shell of heat conduction of itself, has promoted light efficiency, has prolonged the life-span, has reduced simultaneously cost.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (5)
1. LED light fixture, comprise housing, be located at the pcb board in the housing and be located at surface labeling LED on the pcb board, described surface labeling LED comprises matrix and the led chip that is located on the matrix, it is characterized in that: be provided with heat sink hole on the described pcb board, it is heat sink that the bottom of described matrix is provided with outstanding heat conduction, and described heat conduction is heat sink to place in the described heat sink hole and directly contact with described housing.
2. LED light fixture according to claim 1 is characterized in that: described heat conduction is heat sink to be the copper post.
3. LED light fixture according to claim 2, it is characterized in that: the height that described heat conduction is heat sink is 0.22mm-1.05mm.
4. LED light fixture according to claim 1, it is characterized in that: described LED light fixture is the fluorescent tube that is the strip-shaped fluorescent lamp shape.
5. LED light fixture according to claim 1, it is characterized in that: described pcb board is FR4 or PP material pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204399801U CN202901896U (en) | 2012-08-31 | 2012-08-31 | Light-emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204399801U CN202901896U (en) | 2012-08-31 | 2012-08-31 | Light-emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202901896U true CN202901896U (en) | 2013-04-24 |
Family
ID=48122564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204399801U Expired - Fee Related CN202901896U (en) | 2012-08-31 | 2012-08-31 | Light-emitting diode (LED) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202901896U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102798023A (en) * | 2012-08-31 | 2012-11-28 | 深圳市红色投资有限公司 | LED lamp |
-
2012
- 2012-08-31 CN CN2012204399801U patent/CN202901896U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102798023A (en) * | 2012-08-31 | 2012-11-28 | 深圳市红色投资有限公司 | LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20140831 |
|
| EXPY | Termination of patent right or utility model |