CN202772193U - Surface mounted device light emitting diode - Google Patents
Surface mounted device light emitting diode Download PDFInfo
- Publication number
- CN202772193U CN202772193U CN 201220440044 CN201220440044U CN202772193U CN 202772193 U CN202772193 U CN 202772193U CN 201220440044 CN201220440044 CN 201220440044 CN 201220440044 U CN201220440044 U CN 201220440044U CN 202772193 U CN202772193 U CN 202772193U
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- China
- Prior art keywords
- light emitting
- emitting diode
- led
- mounted device
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a surface mounted device light emitting diode, and the objective of the utility model is to provide a light emitting diode having the advantage of better heat conduction effect when being used. The surface mounted device light emitting diode comprises a matrix, and an LED chip which is arranged on the matrix. The bottom of the matrix is provided with a protruded heat conduction type heat sink. The surface mounted device light emitting diode of the utility model can be used as a medium-power or low-power surface mounted device light emitting diode.
Description
Technical field
The utility model relates to LED, especially relates to a kind of surface labeling LED.
Background technology
LED is widely used owing to plurality of advantages such as having energy-conserving and environment-protective life-span length.But, because the caloric value of LED is larger, and very large the contacting of the luminous efficiency of radiating effect and LED existence, if going out, the heat Quick diffusing that LED can not be distributed will affect the luminous efficiency of LED, therefore, must handle the radiator structure of LED well.Existing middle low power SMD LED(Surface Mounted Devices LED, surface labeling LED) encapsulation mostly is is not with heat sink or heat sink to flush with solder side, and the heat of LED need lean on the PCB aluminium base of paster to conduct to shell and distribute.These encapsulating structures are owing to needing to conduct heat by the PCB aluminium base, and the common heat-transfer effect of PCB aluminium base and bad, thereby cause the radiating effect of existing middle low power surface labeling LED bad.
The utility model content
The utility model provides a kind of surface labeling LED in order to solve the bad technical problem of radiating effect of prior art middle low power surface labeling LED.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is a kind of surface labeling LED of design, comprises matrix and the led chip that is located on the matrix, and it is heat sink that the bottom of described matrix is provided with outstanding heat conduction.
Described heat conduction is heat sink to be the copper post.
The height that described heat conduction is heat sink is 0.22mm-1.05mm.
It is heat sink that the utility model is provided with outstanding heat conduction by the bottom at matrix, thereby can not need in actual applications to conduct heat by pcb board, the heat of led chip can be directly conducted to shell minimizing thermal resistance when the paster assembling was used, radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the utility model is elaborated, wherein:
Fig. 1 is the structural representation of the utility model surface labeling LED;
Fig. 2 is the front view of Fig. 1.
Embodiment
See also Fig. 1 and Fig. 2.The utility model surface labeling LED comprises matrix 1 and the led chip 2 that is located on the matrix.Wherein:
The bottom of matrix 1 is provided with outstanding heat conduction heat sink 11.Heat conduction is heat sink, and 11 heats that are mainly used in led chip is conducted to matrix 1 conduct, and come heat conduction to cause the poor technical problem of radiating effect thereby solved prior art by pcb board.Because the heat-conducting effect of copper is fine, therefore, in this specific embodiment, preferred heat conduction is heat sink to be the copper post.The height H that heat conduction is heat sink can be set as the case may be, in the time of only need to being practical application, but the heat sink heat of led chip directly can being conducted of heat conduction and do not need to conduct by pcb board and get final product.In this specific embodiment, the height H that heat conduction is heat sink is preferably 0.22mm-1.05mm.Owing to not needing to come heat conduction by pcb board, therefore, when practical application, can adopt the pcb board of common material and do not adopt expensive PCB aluminium base, get final product as adopting FR4 or PP material pcb board.
It is heat sink that the utility model is provided with outstanding heat conduction by the bottom at matrix, thereby can not need in actual applications to conduct heat by pcb board, the heat of led chip can be directly conducted to shell minimizing thermal resistance when the paster assembling was used, radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (3)
1. a surface labeling LED comprises matrix and the led chip that is located on the matrix, and it is characterized in that: it is heat sink that the bottom of described matrix is provided with outstanding heat conduction.
2. surface labeling LED according to claim 1 is characterized in that: described heat conduction is heat sink to be the copper post.
3. surface labeling LED according to claim 2, it is characterized in that: the height that described heat conduction is heat sink is 0.22mm-1.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440044 CN202772193U (en) | 2012-08-31 | 2012-08-31 | Surface mounted device light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440044 CN202772193U (en) | 2012-08-31 | 2012-08-31 | Surface mounted device light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202772193U true CN202772193U (en) | 2013-03-06 |
Family
ID=47778743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220440044 Expired - Fee Related CN202772193U (en) | 2012-08-31 | 2012-08-31 | Surface mounted device light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202772193U (en) |
-
2012
- 2012-08-31 CN CN 201220440044 patent/CN202772193U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151010 Address after: 523430, No. two, 15, Qu Ling Road, Dongguan Town, Liaobu, Guangdong Patentee after: Dongguan Kexiang Photoelectric Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Futian District Tairan Industrial Zone Tairan cedar building A, 4A1 industry Patentee before: Shenzhen Red Investment Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20190831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |