CN102798023A - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN102798023A CN102798023A CN2012103178007A CN201210317800A CN102798023A CN 102798023 A CN102798023 A CN 102798023A CN 2012103178007 A CN2012103178007 A CN 2012103178007A CN 201210317800 A CN201210317800 A CN 201210317800A CN 102798023 A CN102798023 A CN 102798023A
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- China
- Prior art keywords
- heat sink
- led
- heat
- pcb board
- light fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses an LED lamp, and aims to providing an LED lamp with a better heat radiating effect, which comprises a shell, a PCB (Printed Circuit Board) and a surface-pasted LED, wherein the PCB is arranged in the shell; the surface-pasted LED is arranged on the PCB and comprises a basal body and an LED chip arranged on the basal body; a heat countersink is formed in the PCB; a protruding thermally-conductive heat sink is formed in the bottom part of the basal body; and the thermally-conductive heat sink is arranged in the heat countersink and is in direct contact with the shell. The LED lamp can be used as an LED lamp adopting a surface-pasted LED with middle and small power.
Description
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Technical field
The present invention relates to the LED light fixture, especially relate to a kind of LED light fixture of good heat dissipation effect.
Background technology
LED is widely used owing to plurality of advantages such as having energy-conserving and environment-protective life-span length.But, because the caloric value of LED is bigger, and very big the getting in touch of the luminous efficiency of radiating effect and LED existence, if can not the heat that LED distributes be distributed fast, therefore, must handle the radiator structure of LED well with the luminous efficiency that influences LED.Mostly the encapsulation of existing middle low power SMD LED (Surface Mounted Devices LED, surface mount light emitting diode) is not to be with heat sink or heat sink to flush with solder side, and the heat of LED need lean on the PCB aluminium base of paster to conduct to shell and distribute.These encapsulating structures are owing to need to lean on the PCB aluminium base to conduct heat, and the common heat-transfer effect of PCB aluminium base and bad, thereby radiating effect is bad when causing existing LED light fixture to adopt middle low power surface mount light emitting diode.
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Summary of the invention
The bad technical problem of radiating effect provided a kind of LED light fixture when the present invention adopted middle low power surface mount light emitting diode in order to solve prior art LED light fixture.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is a kind of LED light fixture of design; Comprise housing, be located at the pcb board in the housing and be located at the surface mount light emitting diode on the pcb board that said surface mount light emitting diode comprises matrix and be located at the led chip on the matrix that said pcb board is provided with heat sink hole; It is heat sink that the bottom of said matrix is provided with outstanding heat conduction, and said heat conduction is heat sink to place in the said heat sink hole and with said housing and directly contact.
Said heat conduction is heat sink to be the copper post.
The height that said heat conduction is heat sink is 0.22mm-1.05mm.
Said LED light fixture is the fluorescent tube that is bar shaped fluorescent lamp shape.
Said pcb board is FR4 or PP material pcb board.
The present invention is provided with heat sink hole through pcb board; It is heat sink to be provided with outstanding heat conduction in the bottom of matrix; And heat sink the placing in the said heat sink hole and with said housing of said heat conduction directly contacted, thereby can in practical application, need not conduct heat through pcb board, the heat of led chip can be directly conducted to shell and reduces thermal resistance when the paster assembling was used; Radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the present invention is elaborated, wherein:
Fig. 1 is the structural representation of LED light fixture of the present invention;
Fig. 2 is the generalized section of LED light fixture of the present invention;
Fig. 3 is the partial enlarged drawing at A place among Fig. 2;
Fig. 4 is a surface mount light-emitting diode structure sketch map of the present invention;
Fig. 5 is the front view of Fig. 4.
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The specific embodiment
See also Fig. 1, Fig. 2 and Fig. 3.LED light fixture of the present invention comprises housing 1, pcb board 2 and surface mount light emitting diode 3.LED light fixture of the present invention can be for various lamps, and in this specific embodiment, said LED light fixture is preferably the fluorescent tube that is bar shaped fluorescent lamp shape.Wherein:
Please in the lump referring to Fig. 4 and Fig. 5.Surface mount light emitting diode 3 electrically is installed on the pcb board, and it comprises matrix 31 and is located at the led chip 32 on the matrix.Wherein:
The bottom of matrix 31 is provided with outstanding heat conduction heat sink 311.Heat conduction is heat sink 311 place in the said heat sink hole and the heat sink and said housing of said heat conduction directly contacts.
Heat conduction is heat sink 311 to be mainly used in the heat that led chip is conducted to matrix 31 and to conduct, and comes heat conduction to cause the technical problem of radiating effect difference thereby solved prior art through pcb board.Because the heat-conducting effect of copper is fine, therefore, in this specific embodiment, preferred heat conduction is heat sink to be the copper post.The height H that heat conduction is heat sink can be set as the case may be, and in the time of only need being practical application, but heat sink can the heat of led chip directly being conducted of heat conduction and need not conducting through pcb board gets final product.In this specific embodiment, the height H that heat conduction is heat sink is preferably 0.22mm-1.05mm.
It is heat sink that the present invention is provided with outstanding heat conduction through the bottom at matrix; Thereby can in practical application, need not conduct heat through pcb board; The heat of led chip can be directly conducted to shell minimizing thermal resistance when the paster assembling was used; Radiating effect is better than the encapsulating structure that does not have the heat conduction of heat sink dependence PCB aluminium base, has improved led chip light efficiency and life-span.
Tradition middle low power surface mount light emitting diode paster conducts to shell by the PCB aluminium base with the led chip heat and distributes to the PCB aluminium base, and the heat conductivility of PCB aluminium base directly influences the led chip temperature.Only need to use common FR4 or PP material pcb board after using the present invention, the heat of led chip distributes through heat sink being directly conducted on the shell of heat conduction of itself, has promoted light efficiency, has prolonged the life-span, has reduced cost simultaneously.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. LED light fixture; Comprise housing, be located at the pcb board in the housing and be located at the surface mount light emitting diode on the pcb board; Said surface mount light emitting diode comprises matrix and is located at the led chip on the matrix; It is characterized in that: said pcb board is provided with heat sink hole, and it is heat sink that the bottom of said matrix is provided with outstanding heat conduction, and said heat conduction is heat sink to place in the said heat sink hole and with said housing and directly contact.
2. LED light fixture according to claim 1 is characterized in that: said heat conduction is heat sink to be the copper post.
3. LED light fixture according to claim 2 is characterized in that: the height that said heat conduction is heat sink is 0.22mm-1.05mm.
4. LED light fixture according to claim 1 is characterized in that: said LED light fixture is the fluorescent tube that is bar shaped fluorescent lamp shape.
5. LED light fixture according to claim 1 is characterized in that: said pcb board is FR4 or PP material pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103178007A CN102798023A (en) | 2012-08-31 | 2012-08-31 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103178007A CN102798023A (en) | 2012-08-31 | 2012-08-31 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102798023A true CN102798023A (en) | 2012-11-28 |
Family
ID=47197243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103178007A Pending CN102798023A (en) | 2012-08-31 | 2012-08-31 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102798023A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790413A (en) * | 2021-10-08 | 2021-12-14 | 安徽明威照明器材有限公司 | Track lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10242532A (en) * | 1997-02-28 | 1998-09-11 | Iwasaki Electric Co Ltd | Light emitting diode lamp and its unit |
| CN1960016A (en) * | 2005-11-02 | 2007-05-09 | 西铁城电子股份有限公司 | Light emitting diode |
| CN201025338Y (en) * | 2007-03-09 | 2008-02-20 | 天台县海威机电有限公司 | A LED lamp |
| US20080074279A1 (en) * | 2006-09-15 | 2008-03-27 | Idealite Optoelectronics Inc. | Rotating flashing warning signal lamp |
| CN201547554U (en) * | 2009-10-21 | 2010-08-11 | 东莞勤上光电股份有限公司 | High power LED lamp panel |
| CN202901896U (en) * | 2012-08-31 | 2013-04-24 | 深圳市红色投资有限公司 | Light-emitting diode (LED) lamp |
-
2012
- 2012-08-31 CN CN2012103178007A patent/CN102798023A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10242532A (en) * | 1997-02-28 | 1998-09-11 | Iwasaki Electric Co Ltd | Light emitting diode lamp and its unit |
| CN1960016A (en) * | 2005-11-02 | 2007-05-09 | 西铁城电子股份有限公司 | Light emitting diode |
| US20080074279A1 (en) * | 2006-09-15 | 2008-03-27 | Idealite Optoelectronics Inc. | Rotating flashing warning signal lamp |
| CN201025338Y (en) * | 2007-03-09 | 2008-02-20 | 天台县海威机电有限公司 | A LED lamp |
| CN201547554U (en) * | 2009-10-21 | 2010-08-11 | 东莞勤上光电股份有限公司 | High power LED lamp panel |
| CN202901896U (en) * | 2012-08-31 | 2013-04-24 | 深圳市红色投资有限公司 | Light-emitting diode (LED) lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790413A (en) * | 2021-10-08 | 2021-12-14 | 安徽明威照明器材有限公司 | Track lamp |
| CN113790413B (en) * | 2021-10-08 | 2024-04-12 | 安徽明威照明器材有限公司 | Rail lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121128 |