1267964 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體模組，特別是指一種 放熱性能佳的高功率發光二極體模組。 【先前技術】 發光二極體（Light Emitting Diode，以下簡稱LED)是一 種可直接將電能轉化為可見光和輻射能的發光元件，早期 應用在產σ口上作為訊號指不燈，但由於其具有工作電壓 低、耗電量小、發光效率高、光色純、質量輕、體積小、 結構穩固、耐震、成本低等多方優點，極具市場潛力，因 此有許多大廠積極投入相關技術之研發，並已在照明等用 途上有所突破。舉例來說，目前已有高亮度LED逐漸取代 一般傳統照明領域的趨勢。 在免度及效率不斷增加的同時，為達到高亮度而設計 之高功率LED直接面臨到的就是發光過程中產生發熱性損 耗的散熱問題。 高溫對於LED本身有許多不良的影響，不但會使led 晶粒因溫度提昇而降低效率，也會減少其使用壽命，對於 白光LED而言還會造成螢光粉劣化、影響輸出的色彩平衡 等現象。因此近年來對於高功率LED所產生的散熱問題， 已為眾家廠商首要解決之一環。 參閱圖1，習知一種散熱方式係將經封裝過的LED 1 〇 以直接焊接的方式，將其金屬接腳π 1焊於印刷電路板 (Printed Circuit Board，以下簡稱PCB)1表面之一銅箱層12 1267964 位置上並與PCB i電連接。該設置方式乃藉由導熱性質良 好的銅箔層12吸收LED 10所產生的熱量並傳導出去，、^ led ίο僅以面積不大的金屬接腳lu與該銅箔層P作局部 的熱傳接觸，因此並不能滿足高功率LED丨〇所需之散熱量 ，以同瓦數的LED 10來說，即使增加該銅箔層12的佈嗖 面積散熱能力仍嫌不足，且造成PCB丨面積之浪費。 由於LED整體製程包括晶粒設計製造、封裝及測試等 ，因此亦可由封裝技術上著手解決散熱問題。參閱圖2，習 知之另一種散熱方式是將LED晶粒u封裝在一導熱性質二 好的金屬散熱基座2中，該金屬散熱基座2具有二供電連 接的金屬接腳21，而該等金屬接腳21則同樣是焊在一 1的銅猪㉟12上，並使得該金屬散熱基i 2之底面直接與 該銅绪層12接觸。該方法係將LED晶粒^所產生的熱量 得透過金屬散熱基I 2傳導出來，但就系統而言，其仍= 藉由該銅羯層來進行散熱，而在焊接過程中對銅落層= 所上的防焊塗料（圖未示）亦不利於散熱的進行，因此仍需藉 由加大糊層12之面積以求得較好的散熱效果，如I; 樣造成了 PCB 1使用面積之浪費。 ί閱圖3，為了應付上述問題，習知之另一種散熱方式 疋使用金屬芯印刷電路板（Metal c〇re州⑽ci咖h ，以下簡％]VICPCB)l〇來克服。該MCpCB 1〇具有一薄型 PCB 1及一黏於該薄型pcB丨底下的金屬基板ι〇ι，封裝於 一金屬散熱基座2上的LED絲11麻其金屬接腳21焊 在j MCPCB 1〇之銅羯層12±，並使該金屬散熱基座2之 1267964 腳則分別與晶粒正、負極 、電連接。该橋接件佈設於該散熱 表置之5又置面上並提供雷、、店 ^. /、電源，该橋接件包括正、負二接電 邛，而該等接腳分別與該等接 寻接包邛电連接，並使該散熱基 座之底面對應貼設於該散㈣置之設置面上。 ^接件以電路軟板’該電路軟板係讀質絕緣材 :土底佈於心置面上’並以銅箱作為導體而舖設 於该基底上。除了正、倉接 員接電σ卩之外，該電路軟板更包括1267964 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode module, and more particularly to a high-power light-emitting diode module with excellent heat dissipation performance. [Prior Art] Light Emitting Diode (LED) is a kind of light-emitting element that can directly convert electrical energy into visible light and radiant energy. It was applied early on the σ port as a signal, but it has work. Low voltage, low power consumption, high luminous efficiency, pure light color, light weight, small size, stable structure, shock resistance, low cost, etc., have great market potential, so many large companies are actively investing in research and development of related technologies. And has made breakthroughs in lighting and other uses. For example, high-brightness LEDs have gradually replaced the trend in the traditional lighting field. While the degree of freedom and efficiency are increasing, the high-power LEDs designed to achieve high brightness directly face the heat dissipation problem that generates heat loss during the illumination process. High temperature has many adverse effects on the LED itself, which not only reduces the efficiency of the LED die due to temperature increase, but also reduces its service life. For white LEDs, it also causes degradation of the phosphor powder and affects the color balance of the output. . Therefore, in recent years, the heat dissipation problem caused by high-power LEDs has been one of the primary solutions for the manufacturers. Referring to FIG. 1 , a conventional heat dissipation method is to solder the metal pin π 1 to a printed circuit board (PCB) 1 on the surface of the printed circuit board (hereinafter referred to as PCB) 1 by directly soldering the packaged LED 1 〇. The box 12 1267964 is located in position and electrically connected to the PCB i. The arrangement is to absorb the heat generated by the LED 10 by the copper foil layer 12 having good thermal conductivity and conduct it, and the local heat transfer is performed only by the metal pin lu having a small area and the copper foil layer P. Contact, therefore, can not meet the heat dissipation required for high-power LED ,. For the same wattage LED 10, even if the fabric area of the copper foil layer 12 is increased, the heat dissipation capability is still insufficient, and the PCB area is waste. Since the overall LED process includes die design, packaging, and testing, it is also possible to solve the heat dissipation problem by packaging technology. Referring to FIG. 2, another heat dissipation method is to package the LED die u in a metal heat dissipation base 2 having a good thermal conductivity. The metal heat dissipation base 2 has two metal pins 21 for power connection. The metal pin 21 is also soldered to a copper pig 3512, and the bottom surface of the metal heat sink base i 2 is directly in contact with the copper layer 12. In this method, the heat generated by the LED die is conducted through the metal heat sink I 2 , but in terms of the system, it still uses the copper layer to dissipate heat, and the copper is dropped during the soldering process. = The solder resist coating (not shown) is also not conducive to heat dissipation. Therefore, it is still necessary to increase the area of the paste layer 12 to obtain a better heat dissipation effect, such as I; Waste. In order to cope with the above problem, another conventional heat dissipation method is used to overcome the use of a metal core printed circuit board (Metal c〇re state (10) ci coffee h, the following simple %] VICPCB). The MCpCB 1〇 has a thin PCB 1 and a metal substrate ι〇ι adhered to the bottom of the thin PCBB, and the LED wire 11 packaged on a metal heat sink base 2 is soldered to the j MCPCB 1〇. The copper layer 12±, and the 1267964 legs of the metal heat sink base 2 are electrically connected to the positive and negative electrodes of the die. The bridge member is disposed on the 5th surface of the heat dissipating surface and provides a lightning, a shop, a power supply, the bridge member includes a positive and a negative two, and the pins are respectively connected to the same The package is electrically connected, and the bottom surface of the heat dissipation base is correspondingly disposed on the disposed surface of the dispersion (four). The connector is a circuit board. The circuit board is made of a quality insulating material: the soil is placed on the core surface and the copper box is used as a conductor to be laid on the substrate. In addition to the positive and warehouse contacts, the circuit board includes
二为別由該等接電部延伸並繞 τ卫、兀過該放熱基座之投影區域而 佈設的電路走線。 "該橋接件可為電線’該電“㈣的方式使線路繞過 忒政熱基座之投影區域而佈設於該設置面上。 該橋接件可為裁切過之印刷電路板’該印刷電路板上 之二接電部係間隔設置，並於該等接電部之間形成一預留 的空間供該散熱基座容設並使其底面能直接貼設於該散熱 裝置之設置面上。 -種發光二極體的散熱方法’該發光二極體包括一散 熱基座、二供電連接的接腳及至少―封裝於該散熱基座上 之發光二極體晶粒，該散熱方法包含下列步驟： Α)提供一具有一設置面的散熱裝置； 、，Β)於該設置面上佈設一橋接#，該橋接件連接電源端 亚包括正、負二接電部，該等接電部對應該等接腳之位置 設置’並形成一預留的空間；及 C)將該發光二極體置入該空間，一方面使其二接腳分 別對應地與該等接電部電連接，另—方面使其散熱基座之 1267964 底面對應設置於該空間直接與該設置面貼設。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内备中，類似或相同的元件是以相同的編號來表示。 參閱圖4，本發明發光二極體散熱系統之第一較佳實施 例包3放熱裝置5，以及一發光二極體模組6。散熱裝置 5係與發光二極體模組6，亦即一熱源熱連接，並能=熱源 所產生的熱政逸至外界環境中。市面上可見散熱裝置$之 型態者眾，例如：均熱器、液冷式散熱器、散熱鰭片，或 是上述元件之複合體等等，而其共同特徵皆具有一可與熱 源熱連接的設置面51。本實施例中，所述之散熱裝置5係 為一具有一設置面5 1的散熱鰭片。 參閱圖5，該發光二極體模組6包括一散熱基座61、 複數封裝於該散熱基座61内的LED晶粒62、二分別與 LED晶粒62正、負極電連接的接腳612，以及一佈設於該 散熱裝置5之設置面51上並提供電源的橋接件㈣。該散 熱基座61之工作原理是藉其内部優異的熱導性材料將該等 LED晶粒62於發光過程中所產生的熱量傳導出來，如圖$ 所示，該散熱基i 61之底部通常具有一用以導出熱量且供 熱連接的金屬散熱底面611。 橋接件630係為一提供電源並供二接腳612電連接之 1267964 元件本貝^例中’ 4橋接件63Q是以軟質絕緣材質作為 基底632佈設於該設置面51上並以銅猪6 於該基底㈣上的電路軟板631。該橋接件㈣包括間= 置的正、負二接電部634，以及二分別由該等接電部634延 伸且佈設於該設置面51上的電路走線635。其中，接電部 634 i、接腳612連谭’而電路走線635則用以直接導接電源 端或是與其他元件串、並聯使用。在此要說明的是，由於The second is a circuit trace that is not extended by the power-receiving portions and is disposed around the projection area of the heat-radiating susceptor. " The bridge member can be a wire 'this electric' (four) way to make the line bypass the projection area of the thermal hot base and is disposed on the setting surface. The bridge can be a cut printed circuit board 'the printing The two power receiving portions on the circuit board are spaced apart, and a reserved space is formed between the power receiving portions for the heat dissipation base to be received and the bottom surface thereof can be directly attached to the heat dissipating device - a method for dissipating heat of a light-emitting diode', the light-emitting diode includes a heat-dissipating base, two power-connecting pins, and at least a light-emitting diode die packaged on the heat-dissipating base, the heat dissipation method includes The following steps are as follows: Α) providing a heat dissipating device having a setting surface; Β, 布) arranging a bridge # on the setting surface, the bridging piece connecting the power terminal includes a positive and a negative two power receiving portions, and the power receiving portion Setting the position of the pin to be 'and forming a reserved space; and C) placing the light-emitting diode into the space, and on the other hand, the two pins are respectively electrically connected to the power-on portions. On the other hand, the bottom surface of the 1267964 The space is directly attached to the installation surface. [Embodiment] The foregoing and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the reference drawings. Before the present invention is described in detail, it is to be noted that in the following description, similar or identical elements are denoted by the same reference numerals. Referring to FIG. 4, the first embodiment of the light-emitting diode heat dissipation system of the present invention A preferred embodiment includes a heat release device 5 and a light emitting diode module 6. The heat sink 5 is thermally coupled to the light emitting diode module 6, that is, a heat source, and can be heated by the heat source. In the external environment, there are visible types of heat sinks on the market, such as: heat spreaders, liquid-cooled heat sinks, heat sink fins, or composites of the above components, etc., and their common features have The heat dissipating device 5 is a heat dissipating fin having a setting surface 51. In the embodiment, the light emitting diode module 6 includes a heat dissipating fin. Heat sink base 61, plural A LED die 62 mounted in the heat dissipation base 61, two pins 612 respectively electrically connected to the positive and negative electrodes of the LED die 62, and a bridge disposed on the setting surface 51 of the heat sink 5 and providing power supply (4) The working principle of the heat dissipation base 61 is to conduct the heat generated by the LED chips 62 during the illumination process by using the excellent thermal conductive material inside, as shown in FIG. The bottom portion usually has a metal heat dissipation bottom surface 611 for heat extraction and heat connection. The bridge member 630 is a 1267964 component that provides power and is electrically connected to the two pins 612. In the example, the 4 bridge member 63Q is soft. The insulating material is disposed as a substrate 632 on the mounting surface 51 and is a circuit board 631 on the substrate (4). The bridge member (4) includes a positive and a negative two-connecting portion 634, and two The power receiving portion 634 extends and is disposed on the circuit trace 635 on the setting surface 51. The power receiving unit 634 i and the pin 612 are connected to the tan ‘ and the circuit trace 635 is used for direct connection to the power terminal or in series or in parallel with other components. What I want to explain here is because
’路权板631在結構上僅包含接電部634以及精簡的電路 走線635，且電路走線635在其佈置上更可依需求作適當的 曲繞’因此本發明㈣目的即藉此調整出-預留的空間636， 使接腳612付與接電部634導接，同時散熱基座μ設置於 該空間636且直接與散熱褒置5之設置面51貼設。、 承上，本發明發光二極體的散熱方法，是依照下列步 驟設置： (A)提供一具有一設置面51的散熱裝置5。The road board 631 structurally includes only the power receiving portion 634 and the simplified circuit trace 635, and the circuit trace 635 can be appropriately spliced according to requirements in its arrangement. Therefore, the purpose of the present invention (4) is to adjust The space 636 is reserved, and the pin 612 is connected to the power receiving portion 634, and the heat dissipation base μ is disposed in the space 636 and directly attached to the setting surface 51 of the heat dissipation device 5. According to the above, the heat dissipation method of the light-emitting diode of the present invention is set according to the following steps: (A) A heat sink 5 having a setting surface 51 is provided.
W將該散熱裝置5之設置面51以及該散熱基座6ι之 金屬散熱底面611進行拋光處理。 (〇將>該電路軟板631黏持於該散熱裝置5之設置面51 使/等接電σρ 634對應散熱基座6丨之接腳6丨2的位置 :置’同4使其電路走線635預先繞過該散熱基座Μ之投 影位置而形成一預留的空間636。 扣()將忒封衣有複數LED晶粒62的散熱基座61置入該W polishes the mounting surface 51 of the heat sink 5 and the metal heat sink bottom surface 611 of the heat sink base 6i. (〇) The circuit board 631 is adhered to the setting surface 51 of the heat sink 5 so that the power supply σρ 634 corresponds to the position of the pin 6丨2 of the heat sink base 6: The trace 635 pre-circles the projection position of the heat sink base to form a reserved space 636. The buckle () is placed in the heat sink base 61 in which the plurality of LED chips 62 are sealed.
工間636，-方面使其兩側的接腳612分別對應地與二接電 部 634 it、!:里，ψ I 一方面同時使散熱基座61之金屬散熱底面 10 1267964 611透過該空間636直接與該設置面51貼設。另外，為加 強散熱基座6丨與該設置面51之固定性，本實施例更以具° 熱傳導性之導熱膠7膠著於該設置面51上。The work area 636, the side of the two sides of the pin 612 corresponding to the two electrical parts 634 it, !: inside, ψ I on the one hand at the same time the heat dissipation base 61 of the metal heat dissipation bottom surface 10 1267964 611 through the space 636 It is directly attached to the setting surface 51. In addition, in order to enhance the fixing property of the heat dissipation base 6A and the installation surface 51, the present embodiment further bonds the heat conductive adhesive 7 having a thermal conductivity to the installation surface 51.
參閱圖6與圖7,在其他的實施態樣中，橋接件63〇可 以為電線637，係如圖6般以電線637牵引的方式避開散熱 基座61並以二接電部634與兩接腳612導接；橋接件 亦可以為-PCB 638，係如圖7般預先在該pcB㈣上佈 好電路，然後於散熱基座61預定設置於pcB 638上的位置 ，以裁切的方式空出一能讓金屬散熱底面611直接與該設置 面51貼設的穿槽639 ’如此同樣都能達到本創作欲達成之 功效，也同屬於本創作之設計概念。 由上述可知，本發明發光二極體散熱系統及散熱方法 在設計上，係將電路部分與散熱部分完全分離一電路方面 以接腳6i2透過橋接件63〇導接，散熱方面則使得咖晶 粒62於發光時所產生的熱量可透過散熱基座^之金屬散 熱底面611直接傳導到散熱裝置5而散逸至外界環境中，解 决了 s知/、藉由銅箱層散熱或需經多道傳熱介質、效果不 佳、成本高的問題。 —麥閱圖8與圖9，本發明發光二極體散熱系統之第二較 乜：¼例包3 一散熱裝置5、一發光二極體模組6，以及一 口疋4置8忒散熱裝置5及該發光二極體模組6之結構以 又置方法大邛分與該第一較佳實施例相同，故相同之處 ::¾述不同的是’本實施例並不使用導熱膠7(圖未示) 膠著’而是利用該Μ裝置8以機械聯結的方式將該散熱 11 1267964 基座61固定於該散熱裝置5之設置面51上。 該固定裝置8包括一壓板81以及二螺絲82，該壓板 81係配合該散熱基座61外型而以不遮蔽到光源的鏤空套蓋 方式，由上而下將散熱基座61持壓於該散熱裝置5之設置 面51上，最後再以該等螺絲82將壓板81螺鎖於該散熱裝 置5上即完成組裝。 歸納上述，本發明發光二極體散熱系統及散熱方法， 能將熱量透過散熱基座61之金屬散熱底面611直接傳導到 散熱裝置5 ’故熱傳的路徑沒有任何散熱不良的介質存在， 可即痛成本又同時具有優秀的散熱效能，增力口 led晶粒Μ 的出光效率及使用壽命。 惟以上所述者，僅為本發明之較佳實施例而已，當不 ，以此限定本發明實施之範圍’即大凡依本發明中請二利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 過的TPn :V …一種散熱方式是將經封裝 、 以直接焊接的方式將其金屬接腳焊於PCB上· 曰圖2是一侧視圖，說明習知另一種散熱方 ’Referring to FIG. 6 and FIG. 7 , in other embodiments, the bridge 63 〇 can be an electric wire 637 , which is driven by the electric wire 637 as shown in FIG. 6 to avoid the heat dissipation base 61 and the two electric parts 634 and two. The pin 612 is connected; the bridge member may also be a -PCB 638, which is pre-wired on the pcB (four) as shown in FIG. 7, and then placed on the pcB 638 at the position of the heat dissipation base 61, and is cut in a blank manner. A groove 639 which allows the metal heat-dissipating bottom surface 611 to be directly attached to the setting surface 51 can achieve the same effect as the creation of the creation, and also belongs to the design concept of the creation. It can be seen from the above that the light-emitting diode heat-dissipating system and the heat-dissipating method of the present invention are designed to completely separate the circuit portion from the heat-dissipating portion. The circuit is guided by the pin 6i2 through the bridge member 63. The heat generated by the light-emitting surface of the heat-dissipating base can be directly transmitted to the heat-dissipating device 5 through the heat-dissipating bottom surface 611 of the heat-dissipating base, and is dissipated into the external environment, thereby solving the problem of heat dissipation or multi-channel transmission through the copper box layer. Heat medium, poor performance, and high cost. - Figure 8 and Figure 9, the second comparison of the light-emitting diode cooling system of the present invention: 1⁄4 case package 3 a heat sink 5, a light-emitting diode module 6, and a 疋4 set 8 忒 heat sink 5 and the structure of the LED module 6 is the same as that of the first preferred embodiment in a repetitive manner, so the same thing: the difference is that 'this embodiment does not use the thermal adhesive 7 Instead of being glued, the heat sink 11 1267964 base 61 is fixed to the setting surface 51 of the heat sink 5 by means of the twisting device 8 in a mechanically coupled manner. The fixing device 8 includes a pressing plate 81 and two screws 82. The pressing plate 81 cooperates with the outer shape of the heat dissipation base 61 to hold the heat dissipation base 61 from the top to the bottom in a manner of not covering the light source. The mounting surface 51 of the heat sink 5 is finally assembled by screwing the pressure plate 81 to the heat sink 5 with the screws 82. In summary, the light-emitting diode heat dissipation system and the heat dissipation method of the present invention can conduct heat directly to the heat dissipation device 5 through the metal heat dissipation bottom surface 611 of the heat dissipation base 61. Therefore, the heat transfer path does not have any medium with poor heat dissipation, that is, The cost of pain also has excellent heat dissipation performance, and the light-emitting efficiency and service life of the led die of the booster port. However, the above is only the preferred embodiment of the present invention, and if not, the scope of the present invention is defined as a simple equivalent change according to the scope of the present invention and the description of the invention. And modifications are still within the scope of the invention patent. [Simple description of the diagram] TPn: V ... a heat dissipation method is to solder and solder the metal pins to the PCB by direct soldering. FIG. 2 is a side view showing another heat dissipation method. '
日日粒封裝在—金屬散熱 ，LED 屬接腳焊在—PCB上； ㈣座之二金 圖3是一側視圖，說明f知另_ 屬散熱基座之二金屬接腳谭在—McpcB上’;、、、方式疋將該金 圖4是一上視圖，說明本發明發光二極體散熱系統之 12 1267964 第一較佳實施例。 加侵1干 < 二接電部分別與散 熱基座之二接腳電連接，並使嗲埒 使壤放熱基座之金屬散熱底面 對應貼設於一散熱裝置之設置面上： 、、圖6是-上視圖，說明該第一較佳實施例之橋接件可 以為電線；The daily grain is encapsulated in - metal heat dissipation, and the LED is soldered on the PCB; (4) The seat of the two gold figure 3 is a side view, indicating that the other two are the metal base of the heat sink base on the -McpcB The figure 4 is a top view illustrating the first preferred embodiment of the 12 1267964 light-emitting diode heat dissipation system of the present invention. The intrusion 1 dry < 2 electrical connection parts are respectively electrically connected with the two pins of the heat dissipation base, and the metal heat dissipation bottom surface of the soil heat release base is correspondingly attached to the setting surface of a heat dissipation device: 6 is a top view, illustrating that the bridge member of the first preferred embodiment may be an electric wire;
、、圖7是-上視圖，說明該第一較佳實施例之橋接件可 以為一裁切過之PCB ; 从_圖8是一上視圖，1兒明本發明發光二極體散熱系統之 第二較佳實施例；及 壯圖9是一側視圖，說明該第二較佳實施例是以一固定 裝置以機械聯結的方式將該散熱基座固定於該設置面上。 13 1267964 【主要元件符號說明】 5…… •…散熱裝置 634… •…接電部 51…… •…設置面 635… •…電路走線 6 ....... •…發光二極體模組 636… …·空間 61 ·.··. •…散熱基座 637… …·電線 611 ··· •…金屬散熱底面 638… …PCB 612… …·接腳 639… •…穿槽 f. 〇..... …· Τ Ρ Ή 曰私 7 ...... ____道為舰 0 Z JL Jt!/ U日日牙IL 630… …·橋接件 8 ....... •…固定裝置 63卜· …·電路軟板 81…… •…壓板 632… 基底 82…… •…螺絲 633… 銅括 147 is a top view, illustrating that the bridge member of the first preferred embodiment can be a cut PCB; from FIG. 8 is a top view, the light emitting diode heat dissipation system of the present invention is The second preferred embodiment; and the rear view 9 is a side view showing that the second preferred embodiment is a fixing device for fixing the heat dissipation base to the installation surface in a mechanically coupled manner. 13 1267964 [Description of main component symbols] 5... •... Heat sink 634... •...Power supply unit 51... •...Setting surface 635... •...Circuit wiring 6.......•...Lighting diode Module 636...·Space 61 ····.•...heating base 637...·wire 611 ···•...metal heat sink bottom surface 638... PCB 612... ...·pin 639... •...through slot f. 〇..... · Ρ 曰 曰 7 7 ...... ____ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ • Fixing device 63... Circuit board 81... •... Platen 632... Base 82... •... Screw 633... Brass 14