CN111853733B - LED chip heat dissipation device - Google Patents
LED chip heat dissipation device Download PDFInfo
- Publication number
- CN111853733B CN111853733B CN202010553610.XA CN202010553610A CN111853733B CN 111853733 B CN111853733 B CN 111853733B CN 202010553610 A CN202010553610 A CN 202010553610A CN 111853733 B CN111853733 B CN 111853733B
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- CN
- China
- Prior art keywords
- heat dissipation
- heat
- hole
- water inlet
- water outlet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention provides an LED chip heat dissipation device, which comprises a heat dissipation pad and a heat dissipation substrate, wherein an LED chip is arranged on the heat dissipation pad, the heat dissipation pad is arranged on the heat dissipation substrate, a plurality of heat dissipation holes are arranged in the heat dissipation substrate, one end of each heat dissipation hole is connected with the end face of a water inlet hole, the other end of each heat dissipation hole is connected with the end face of a water outlet hole, the water inlet hole and the water outlet holes are of a single-face opening structure, one end of each water inlet hole is connected with a heat dissipation tube through a water inlet electromagnetic valve and a pipeline, a water inlet is arranged at the top of the heat dissipation tube, one end of each water outlet hole is connected with the other end of the heat dissipation tube through a water outlet electromagnetic valve and a pipeline, and the heat dissipation tube is arranged at the top of the heat dissipation substrate; through setting up the radiating basal plate to at the inside a plurality of louvres that are equipped with of radiating basal plate, and in transmitting the heat transfer on with the cooling pad for the louvre through the heat pipe, absorb its heat through the water-cooling, and dispel the heat through the heat after the cooling tube will absorb, realized heat circulation, effectively solved the problem among the background art.
Description
Technical Field
The invention relates to a light-emitting diode (LED) chip heat dissipation device, and belongs to the field of LEDs.
Background
The LED is a light emitting diode, and has the characteristics of energy conservation, environmental protection, long service life, small size and the like, and can be widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like.
Disclosure of Invention
The invention provides an LED chip heat dissipation device, which solves the problem that the existing heat dissipation device adopts a metal heat dissipation piece, and the temperature of the surface of the metal heat dissipation piece can be continuously increased in the heat dissipation process, so that the heat dissipation device and the air can not conduct heat well.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides an LED chip heat dissipation device, which comprises a heat dissipation pad and a heat dissipation substrate, wherein an LED chip is arranged on the heat dissipation pad, the heat dissipation pad is arranged on the heat dissipation substrate, a plurality of heat dissipation holes are arranged in the heat dissipation substrate, one end of each heat dissipation hole is connected with the end face of a water inlet hole, the other end of each heat dissipation hole is connected with the end face of a water outlet hole, the water inlet holes and the water outlet holes are of a single-face opening structure, one end of each water inlet hole is connected with the heat dissipation tube through a water inlet electromagnetic valve and a pipeline, a water inlet is formed in the top of the heat dissipation tube, one end of each water outlet hole is connected with the other end of the heat dissipation tube through a water outlet electromagnetic valve and a pipeline, the heat dissipation tube is arranged on the top of the heat dissipation substrate, and the water inlet electromagnetic valve is electrically connected with a control device through the water outlet electromagnetic valve.
Preferably, a plurality of heat dissipation grooves are formed in the bottom of the heat dissipation substrate, and the heat dissipation grooves are concave.
Preferably, the shape of the heat dissipation hole is s-shaped, and the shape of the heat dissipation pipe is formed by connecting a plurality of continuous s-shaped heat dissipation holes. The radiating holes and the radiating pipes are in s shapes, so that the contact area with air is increased, and the radiating effect is improved.
Preferably, the bottom of the heat dissipation hole is connected with a heat conduction pipe, the heat conduction pipe is made of metal, and the top of the heat conduction pipe is movably connected with the heat dissipation pad.
Preferably, the bottom of the heat dissipation pad is provided with a connecting hole, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.
Preferably, the water outlet is obliquely arranged, and one end of the opening of the water outlet is lower than the other end of the water outlet.
Preferably, the water outlet electromagnetic valve and the water inlet electromagnetic valve are respectively positioned at two ends of the radiating base plate, a temperature sensor is arranged in the radiating hole, and the temperature sensor is electrically connected with the control device.
Preferably, the heat dissipation pad adopts metal material, be equipped with on the heat dissipation pad and accomodate the groove, the LED chip sets up in accomodating the groove.
Through the technical scheme, the invention has the beneficial effects that: through setting up the radiating basal plate to at the inside a plurality of louvres that are equipped with of radiating basal plate, and in transmitting the heat transfer on with the cooling pad for the louvre through the heat pipe, absorb its heat through the water-cooling, and dispel the heat through the heat after the cooling tube will absorb, realized heat cycle, effectively solved the problem among the background art.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a water outlet;
fig. 3 is a schematic view of the water inlet hole.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
According to the LED chip heat abstractor shown in the figure, including cooling pad 2 and radiating basal plate 1, be equipped with LED chip 4 on the cooling pad 2, cooling pad 2 sets up on radiating basal plate 1, radiating basal plate 1 is inside to be equipped with a plurality of louvres 10, louvre 10 one end links to each other with inlet opening 12 terminal surface, the louvre 10 other end links to each other with apopore 9 terminal surface, inlet opening 9 is single face open structure with apopore 12, inlet opening 9 one end is passed through into water solenoid valve 5, pipeline and is linked to each other with cooling tube 7, 7 tops of cooling tube are equipped with the water inlet, 9 one end of apopore is passed through outlet solenoid valve 6, pipeline and is linked to each other with 7 other ends of cooling tube, cooling tube 7 sets up at 1 top of radiating basal plate, inlet solenoid valve 5 passes through electric connection controlling means with outlet solenoid valve 6.
Preferably, a plurality of heat dissipation grooves 8 are formed in the bottom of the heat dissipation substrate 1, and the heat dissipation grooves 8 are concave.
Preferably, the radiating hole 10 has an s-shape, and the radiating pipe 7 has a plurality of s-shapes connected in series. The radiating holes and the radiating pipes are shaped into s, so that the contact area with air is increased, and the radiating effect is improved.
Preferably, the bottom of the heat dissipation hole 10 is connected to a heat pipe 11, the material of the heat pipe 11 is a metal material, and the top of the heat pipe 11 is movably connected to the heat dissipation pad 2.
Preferably, the bottom of the heat dissipation pad 2 is provided with a connecting hole, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.
Preferably, apopore 9 sets up in the slope, 9 opening part one ends of apopore highly is less than the apopore 9 other end height.
Preferably, the water outlet solenoid valve 5 and the water inlet solenoid valve 6 are respectively located at two ends of the heat dissipation substrate 1, and a temperature sensor is arranged inside the heat dissipation hole 10 and electrically connected with the control device.
Preferably, the heat dissipation pad 2 is made of metal, the heat dissipation pad 2 is provided with a containing groove 3, and the LED chip 4 is arranged in the containing groove 3.
During the specific use, when needs dispel the heat, open water inlet solenoid valve 5, during the cooling water enters into louvre 10 through the inlet opening, louvre 10 passes through the cooling water of heat transfer in with cooling pad 2 in the heat pipe for louvre 10, and temperature sensor detects the cooling water temperature and reaches the set temperature in the cooling water, opens out water solenoid valve 6, enters into cooling tube 7 with the cooling water and cools off, and then enters into louvre 10 with the cooling water through water inlet solenoid valve 6, constantly circulates above-mentioned process, can dispel the heat to LED chip 4.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (3)
1. The utility model provides a LED chip heat abstractor, includes radiating pad and radiating basal plate, its characterized in that: the LED heat dissipation structure is characterized in that an LED chip is arranged on a heat dissipation pad, the heat dissipation pad is arranged on a heat dissipation substrate, a plurality of heat dissipation holes are formed in the heat dissipation substrate, one ends of the heat dissipation holes are connected with a water inlet hole end face, the other ends of the heat dissipation holes are connected with a water outlet hole end face, the water inlet hole and the water outlet hole are of a single-face opening structure, one end of the water inlet hole is connected with the heat dissipation tube through a water inlet electromagnetic valve and a pipeline, the top of the heat dissipation tube is provided with a water inlet, one end of the water outlet hole is connected with the other end of the heat dissipation tube through a water outlet electromagnetic valve and a pipeline, the heat dissipation tube is arranged at the top of the heat dissipation substrate, the water inlet electromagnetic valve and the water outlet electromagnetic valve are in a concave shape, the heat dissipation hole is in an s shape, the heat dissipation holes are continuously connected in a plurality of s shapes, the heat dissipation holes are connected with the bottom of the heat conduction tube, the heat conduction tube is made of metal material, the top of the heat conduction tube is movably connected with the heat dissipation pad, the water outlet hole is obliquely arranged, one end of the water outlet hole is lower than the other end of the water outlet hole, the water outlet electromagnetic valve, the water inlet electromagnetic valve and the water inlet electromagnetic valve are respectively located at two ends of the heat dissipation substrate, a temperature sensor are arranged in the heat dissipation substrate, and the temperature sensor through an electric connection control device.
2. The LED chip heat sink according to claim 1, wherein: the heat dissipation pad is characterized in that a connecting hole is formed in the bottom of the heat dissipation pad, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.
3. The LED chip heat sink according to claim 1, wherein: the LED lamp is characterized in that the heat dissipation pad is made of metal materials, the heat dissipation pad is provided with an accommodating groove, and the LED chip is arranged in the accommodating groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010553610.XA CN111853733B (en) | 2020-06-17 | 2020-06-17 | LED chip heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010553610.XA CN111853733B (en) | 2020-06-17 | 2020-06-17 | LED chip heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111853733A CN111853733A (en) | 2020-10-30 |
| CN111853733B true CN111853733B (en) | 2023-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010553610.XA Active CN111853733B (en) | 2020-06-17 | 2020-06-17 | LED chip heat dissipation device |
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| Country | Link |
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| CN (1) | CN111853733B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117631423B (en) * | 2024-01-25 | 2024-04-30 | 广州金迪电子有限公司 | Thin liquid crystal projection display LED polarized light source and liquid crystal television |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158820U (en) * | 2009-12-23 | 2010-04-22 | 発菱科技股▲ふん▼有限公司 | High power LED street light heat sink device |
| CN201652270U (en) * | 2010-01-22 | 2010-11-24 | 深圳市世纪安耐光电科技有限公司 | Light source radiator of LED lamp |
| CN105006515A (en) * | 2015-06-04 | 2015-10-28 | 佛山市南海区联合广东新光源产业创新中心 | LED chip heat dissipation structure |
| CN205048278U (en) * | 2015-10-15 | 2016-02-24 | 广州市力侬照明技术有限公司 | Plant growth lamp |
| CN207760573U (en) * | 2017-12-21 | 2018-08-24 | 青岛杰生电气有限公司 | Sterilization module and bath apparatus |
| CN209926121U (en) * | 2019-06-27 | 2020-01-10 | 广州市明道灯光科技股份有限公司 | High-efficient heat dissipation stage lamps and lanterns |
-
2020
- 2020-06-17 CN CN202010553610.XA patent/CN111853733B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158820U (en) * | 2009-12-23 | 2010-04-22 | 発菱科技股▲ふん▼有限公司 | High power LED street light heat sink device |
| CN201652270U (en) * | 2010-01-22 | 2010-11-24 | 深圳市世纪安耐光电科技有限公司 | Light source radiator of LED lamp |
| CN105006515A (en) * | 2015-06-04 | 2015-10-28 | 佛山市南海区联合广东新光源产业创新中心 | LED chip heat dissipation structure |
| CN205048278U (en) * | 2015-10-15 | 2016-02-24 | 广州市力侬照明技术有限公司 | Plant growth lamp |
| CN207760573U (en) * | 2017-12-21 | 2018-08-24 | 青岛杰生电气有限公司 | Sterilization module and bath apparatus |
| CN209926121U (en) * | 2019-06-27 | 2020-01-10 | 广州市明道灯光科技股份有限公司 | High-efficient heat dissipation stage lamps and lanterns |
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| CN111853733A (en) | 2020-10-30 |
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Address after: 237000 West side of Hexia Road, Xiafuqiao Town, Huoshan County, Lu'an City, Anhui Province Patentee after: Anhui Yiluming Optoelectronics Technology Co.,Ltd. Address before: 237200 west side of Hexia Road, xiafuqiao Town, Huoshan County, Lu'an City, Anhui Province Patentee before: ANHUI YILUMING PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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