CN101388379A - Illuminating diode module - Google Patents

Illuminating diode module Download PDF

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Publication number
CN101388379A
CN101388379A CNA2007100769926A CN200710076992A CN101388379A CN 101388379 A CN101388379 A CN 101388379A CN A2007100769926 A CNA2007100769926 A CN A2007100769926A CN 200710076992 A CN200710076992 A CN 200710076992A CN 101388379 A CN101388379 A CN 101388379A
Authority
CN
China
Prior art keywords
heat
emitting diode
diode module
light
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100769926A
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Chinese (zh)
Inventor
余光
赖振田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CNA2007100769926A priority Critical patent/CN101388379A/en
Publication of CN101388379A publication Critical patent/CN101388379A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A light-emitting diode module comprises several groups of light-emitting diodes and a radiator, wherein the radiator comprises a base and a plurality of fins which are arranged on one side of the base, a plurality of heat pipes which are in the same plane with the side surface of the base are embedded on the other side of the base in the radiator, a heat conducting plate is attached on the other side of the base to contact with the heat pipes, and the light-emitting diode module is attached on the heat conducting plate. The heat pipes are embedded on the other side of the base of the radiator, and have the same plane with the base, thereby guaranteeing the whole structure of the light-emitting diode module compact and light. The heat conducting plate is attached on the other side of the base and is contacted with the heat pipes, thereby facilitating heat energy concentrated on the heat conducting plate to be transferred to the fins through rapidly passing through the base and the heat pipes, and guaranteeing the higher heat radiating efficiency of the light-emitting diode module.

Description

Light emitting diode module
Technical field
The present invention relates to a kind of light emitting diode module, particularly a kind of light emitting diode module that comprises a heat abstractor.
Background technology
Light-emitting diode (Light Emitting Diode, be called for short LED), it is a kind of light emitting semiconductor device, it is to utilize semiconductor chip as luminescent device, by charge carrier compound energy of emitting surplus taking place causes photo emissions in semiconductor, directly send versicolor light such as white, indigo plant, the led lighting product utilizes light-emitting diode as the produced ligthing paraphernalia of light source exactly, is widely used in fields such as communication, illumination, traffic, billboards.But, high brightness, High Power LED then can Yin Wendu rising and cause luminous efficiency obviously to descend, even cause the damage of assembly, therefore, how the working temperature with led lamp keeps within the specific limits to avoid the generation of above-mentioned phenomenon, is the present urgent problems of people.At present, the common way of industry is sticked radiator to distribute its heat below LED circuitboard, as U.S. Pat 6,517, promptly disclosed a kind of light emitting diode module 218B2 number, it comprises a pedestal and the several dissipation fins of extending on this pedestal, because the simple radiating fin that relies on dispels the heat, the radiating efficiency of this heat abstractor is restricted.In order to improve radiating efficiency, can increase radiating fin quantity or increase the fin size, but made the volume of light emitting diode module excessive so, heavy.
Summary of the invention
In view of this, be necessary to provide a kind of light emitting diode module that has than high cooling efficiency and compact conformation.
A kind of light emitting diode module, comprise some groups of light-emitting diodes and a radiator, described radiator comprises a pedestal and is formed at some fin of pedestal one side, described radiator is embedded with some heat pipes with this side surface coplane of pedestal in the opposite side of pedestal, the be sticked opposite side of this pedestal and contact with heat pipe of one heat-conducting plate, described light emitting diode module is sticked on heat-conducting plate.
Above-mentioned heat pipe be embedded at radiator base opposite side and with its coplane, guarantee the integrally-built compactness of light emitting diode module, light and handy; Heat-conducting plate is attached at the opposite side of pedestal and contacts with heat pipe simultaneously, makes the heat that concentrates on heat-conducting plate reach fin by pedestal and heat pipe fast, guarantees that light emitting diode module has than high cooling efficiency.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the light emitting diode module of a preferred embodiment of the present invention.
Fig. 2 is the three-dimensional combination figure of Fig. 1 part.
Fig. 3 is the three-dimensional combination figure of Fig. 1.
Fig. 4 is 3 inversion schematic diagram.
Embodiment
See also Fig. 1 to Fig. 2, be the light emitting diode module of a preferred embodiment of the present invention, comprise that some groups of light-emitting diodes 100 reach in order to the heat abstractor (not label) to its heat radiation.This heat abstractor comprises a radiator 220, is sticked at the some heat pipes 240 of radiator 220 and the heat-conducting plate 260 of be sticked simultaneously radiator 220 and heat pipe 240.Light-emitting diode 100 heat-conducting plate 260 that closely is sticked, as light emitting source, it comprises some circuit boards 120 and the some light-emitting diodes 124 (only showing among the figure) that is parallel to each other, be interval with plurality of holes 122 on each circuit board 120, these light-emitting diodes 124 evenly are installed in the hole 122 of this circuit board 120 and electrically connect with this circuit board 120.
Radiator 220 adopts the metal or alloy of high thermal conductivity, make as copper, aluminium or albronze material, comprise the pedestal 222 of a horizontal positioned, rectangular plate shape and be formed at a side of pedestal 222, be the basal surface of pedestal 222 and the fin 224 that extends vertically downward, the opposite side of this pedestal 222, the top surface that is pedestal 222 is provided with some grooves 226 along its length direction is parallel, so that accommodate heat pipe 240 in wherein.
Each heat pipe 240 all is flat, comprise top surface 242 and the basal surface (scheme do not show) relative with top surface 242, this heat pipe 240 is weldingly fixed in the groove 226 of pedestal 222 of radiator 220, makes the top surface 242 of heat pipe 240 and the top surface coplane of pedestal 222.
This heat-conducting plate 260 is a rectangle, and its material is the metal or alloy that adopts high thermal conductivity, as copper, aluminium or albronze.This heat-conducting plate 260 is provided with first surface 262 and and first surface 262 opposing second surface (figure does not show).The second surface of this heat-conducting plate 260 closely is sticked at the top surface 242 of above-mentioned heat pipe 240 and the top surface of pedestal 222.Closely the be sticked basal surface of circuit board 120 of light emitting diode module 100 of the first surface 262 of this heat-conducting plate 260 is so that the heat that fast Absorption light-emitting diode 124 produces.
See also Fig. 3 and Fig. 4, during light emitting diode module work, the heat of its generation is at first absorbed by heat-conducting plate 260 and heat pipe 240, conducted to afterwards on the pedestal 222 of radiator 220, then, heat is dispersed in the surrounding air along the fin 224 of radiator 220 and goes, and realizes heat radiation.
In the present embodiment, on the pedestal 222 of radiator 220, groove 226 is set, heat pipe 240 can be housed in pedestal 222 opposite sides fully and with the surface of this side group seat 222, promptly the top surface coplane of pedestal 222 guarantees the integrally-built compactness of light emitting diode module, light and handy; In addition, because the top surface 242 of 260 whiles of heat-conducting plate with pedestal 222 and heat pipe 240 closely is sticked, make the heat that concentrates on heat-conducting plate 260 can reach the fin 224 of radiator 220 fast by pedestal 222 and heat pipe 240, guaranteed that light emitting diode module has than high cooling efficiency.

Claims (5)

1. light emitting diode module, comprise some groups of light-emitting diodes and a radiator, described radiator comprises a pedestal and is formed at some fin of pedestal one side, it is characterized in that: described radiator is embedded with some heat pipes with this side surface coplane of pedestal in the opposite side of pedestal, the be sticked opposite side of this pedestal and contact with heat pipe of one heat-conducting plate, described light emitting diode module is sticked on heat-conducting plate.
2. light emitting diode module as claimed in claim 1 is characterized in that: described pedestal is provided with the some grooves that are parallel to each other of accommodating heat pipe.
3. light emitting diode module as claimed in claim 2 is characterized in that: described fin heat pipe dorsad is vertically set on the pedestal.
4. light emitting diode module as claimed in claim 3 is characterized in that: some light-emitting diodes that described every group of light-emitting diode comprises a circuit board and be embedded in this circuit board and be electrically connected with it.
5. light emitting diode module as claimed in claim 4 is characterized in that: described circuit board is sticked with heat pipe is corresponding one by one.
CNA2007100769926A 2007-09-14 2007-09-14 Illuminating diode module Pending CN101388379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007100769926A CN101388379A (en) 2007-09-14 2007-09-14 Illuminating diode module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007100769926A CN101388379A (en) 2007-09-14 2007-09-14 Illuminating diode module

Publications (1)

Publication Number Publication Date
CN101388379A true CN101388379A (en) 2009-03-18

Family

ID=40477680

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100769926A Pending CN101388379A (en) 2007-09-14 2007-09-14 Illuminating diode module

Country Status (1)

Country Link
CN (1) CN101388379A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385346B (en) * 2010-02-09 2013-02-11 Everlight Electronics Co Ltd Heat dissipation device and lighting apparatus comprising the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385346B (en) * 2010-02-09 2013-02-11 Everlight Electronics Co Ltd Heat dissipation device and lighting apparatus comprising the same

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Open date: 20090318