CN1840958B - System-in-package high-power high-efficiency diode bulb - Google Patents

System-in-package high-power high-efficiency diode bulb Download PDF

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Publication number
CN1840958B
CN1840958B CN2005100624504A CN200510062450A CN1840958B CN 1840958 B CN1840958 B CN 1840958B CN 2005100624504 A CN2005100624504 A CN 2005100624504A CN 200510062450 A CN200510062450 A CN 200510062450A CN 1840958 B CN1840958 B CN 1840958B
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China
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heat
module
light emitting
diode
diode lamp
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CN2005100624504A
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Chinese (zh)
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CN1840958A (en
Inventor
陈振贤
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新灯源科技有限公司
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Priority to PCT/CN2005/000389 priority Critical patent/WO2006102785A1/en
Priority to CN2005100624504A priority patent/CN1840958B/en
Publication of CN1840958A publication Critical patent/CN1840958A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/648Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

Abstract

The invention discloses a system structure high-efficient high-power diode bulb, which comprises the following parts: heat conductive and radiation mode, diode luminous mode, optical mode and control circuit mode, wherein the heat conductive and radiation mode contains a heat conductive device and at least one radiation fin; the diode luminous mode is set in the flat part of the heat conductive device; the optical mode focuses the light of diode luminous mode; the control circuit mode controls the diode bulb; when the diode bulb connects power, the control circuit mode laminates the diode luminous mode selectively; the heat of diode luminous mode can be radiated by multiple radiating fins from flat guide to at least one radiation fin.

Description

系统构装的高功率高效率二极管灯泡 High power systems diode package as high efficiency lamp

技术领域 FIELD

[0001] 本发明涉及一种高效率高功率的二极管灯泡,并且特别地,本发明的二极管灯泡为一种系统构装(System in package)的照明装置。 [0001] The present invention relates to an efficient high-power LED lamps, and in particular, the diode lamp according to the present invention is a system configuration means (System in package) of the illumination device.

背景技术 Background technique

[0002] 由于发光二极管(Light emitting diode, LED)具有如省电、耐震、反应快以及适合批量生产等许多优点,因此目前以发光二极管为光源的照明产品日益广泛。 [0002] Since the light emitting diode (Light emitting diode, LED) has such a power saving, shock, fast response and suitable for mass production and many other advantages, the current source with LED lighting products increasingly widespread. 然而,现有的高功率发光二极管在持续发亮一段时间后,会有温度过高的问题,使得发光二极管本身的发光效率下降,造成亮度无法提升。 However, the conventional high-power light-emitting diode lights continuously after some time, there will be the problem of high temperature, so that the efficiency of the light emitting diode itself is reduced, resulting in brightness can not be improved. 因此,各种应用高功率的发光二极管的产品均需要良好的散热机制。 Therefore, various applications of high power LED products require good heat dissipation mechanism.

[0003] 请参阅图1。 [0003] Referring to FIG. 1. 图1显示了一现有的整合了散热装置的照明器。 Figure 1 shows a conventional integrated heat sink of the luminaire. 为了增加单一照明装置所能提供的光线强度,图中的导热板10之上设置有多个发光二极管12。 In order to increase the light intensity of the single lighting device can provide, on the light emitting diode 10 is provided with a plurality of heat conducting plate 12 in FIG. 导热板10的周围则设有多个散热鳍片14。 Around the heat conducting plate 10 is provided with a plurality of heat-dissipating fins 14. 由于各个发光二极管12之间的距离太远,该照明装置无法提供如点光源的发光效果。 Since each distance between the light emitting diode 12 is too far, the lighting device can not provide lighting effects, such as a point light source.

[0004] 请参阅图2。 [0004] See Figure 2. 图2是显示了台湾第568,358号专利所揭示的照明器。 FIG 2 is a Taiwan Patent No. 568,358 disclosed luminaire. 图中的红色发光二极管21、绿色发光二极管22以及蓝色发光二极管23设置于一控制电路M之上。 FIG red LED 21, green LED 22 and a blue light emitting diode 23 is disposed on a control circuit M. 控制电路M用以控制该多个发光二极管,在控制电路M之下的载体25则是用以帮助该多个发光二极管和控制电路M散热。 M control circuit for controlling the plurality of light emitting diodes, circuit carrier under the control of the M 25 is used to help control the plurality of light emitting diodes and M cooling circuit. 如图2所示的照明器的缺点是控制电路M与发光二极管太过接近。 Disadvantage of the luminaire shown in FIG. 2 is a control circuit of the light emitting diode M too close. 当发光二极管产生热能时,极容易影响甚至破坏控制电路M的运作。 When the light emitting diode generates heat, very susceptible to damage and even the operation of the control circuit of M.

[0005] 因此,本发明提供了一种高效率高功率的二极管灯泡,并且特别地,本发明的二极管灯泡为一种系统构装的照明装置。 [0005] Accordingly, the present invention provides an efficient high-power LED lamps, and in particular, the diode lamp according to the present invention is a system configuration of the lighting device package.

发明内容 SUMMARY

[0006] 本发明的第一主要目的在于提供一种系统构装(System in package)的高效率高功率二极管灯泡。 [0006] The first main object of the present invention to provide a system configuration means (System in package) of high efficiency, high power diode lamp. 根据本发明的二极管灯泡除了可有效解决先前技术中的散热问题外,还可提供相当于点光源的发光效果。 The diode lamp of the present invention, in addition can effectively solve heat dissipation problem of prior art, it can also provide lighting effects equivalent to point light source.

[0007] 根据本发明的较佳具体实施例的二极管灯泡包含一导热及散热模块、一二极管发光模块、一光学模块以及一控制电路模块。 [0007] Example diode lamp comprises a heat conduction and heat dissipating module according to the present invention is particularly preferred, a light emitting diode module, an optical module and a control circuit module. 该导热及散热模块包含一导热装置(Heat-conducting device)与至少一散热鳍片(Heat-dissipating fin)。 The heat conduction and heat dissipating module comprising a heat-conducting device (Heat-conducting device) and at least one heat-dissipating fin (Heat-dissipating fin). 该二极管发光模块设置于该导热装置的一平坦部上,并与该平坦部平整且紧密地接合。 The light emitting diode module is disposed on a flat portion of the heat-conducting device, and flat and tightly engaged with the flat portion. 该光学模块用以将该二极管发光模块所发出的光线聚焦。 The optical module is used for the light emitted by the diode light-emitting module focusing. 该控制电路模块则用以控制该二极管发光模块。 The control circuit module is used to control the light emitting diode module. 当该二极管灯泡连接至一电源时,该控制电路模块选择性地使该二极管发光模块发光,并且该二极管发光模块于发光时所产生的热由该导热装置自该平坦部导引至该至少一散热鳍片,进而由该至少一散热鳍片散热。 When the diode lamp is connected to a power source, the control circuit module selectively to cause the light emitting diode emits light module, and the heat of the light emitting diode emits light in the module generated by the heat-conducting device from the flat portion to the at least one guide radiation fins, and further at least one heat-dissipating fin of the heat sink.

[0008] 由于本发明所提供的二极管灯泡将导热及散热模块与二极管发光模块整合在一起,该导热及散热模块可由各散热鳍片将该二极管发光模块所产生的热能立即发散至周围的空气中,大幅提升散热效率。 [0008] Since the LED lamp of the present invention provides a heat dissipating module is integrated with the heat conduction and the light emitting diode module, the thermally conductive heat dissipating module and the heat dissipating fins may each diode emits light generated by the module to the air immediately surrounding the divergent , significantly increasing cooling efficiency. 因此,相较于先前技术,根据本发明的二极管灯泡更适合应用于需要高效率的发光二极管的照明装置中。 Therefore, compared to the prior art, the diode lamp according to the present invention is more suitable for the light emitting diode requiring a lighting device of high efficiency.

[0009] 本发明的第二主要目的是提供一种相当于点光源的发光效果的二极管灯泡。 [0009] The second main object of the present invention is to provide lighting effects equivalent to one kind of diode point light source lamp. 由于根据本发明的二极管发光模块是将多颗发光二极管或激光二极管封装在一起,相对于光学模块内的凹面镜的体积相当小,因此可提供相当于点光源的发光效果。 Since the light emitting diode module of the present invention is a multi-segment LED or laser diode package together, relative to the volume of the concave mirror in the optical module relatively small, thereby providing the light emitting effect is equivalent to point light source.

[0010] 本发明的第三主要目的是提供一种能广泛整合于现有的照明设备中的二极管灯泡。 [0010] The third object of the invention is to provide a diode lamp integrated with a wide range of existing illumination apparatus. 上述较佳具体实施例的二极管灯泡可进一步包含一外壳。 LED lamp of the above-described preferred embodiment may further comprise a housing. 该外壳可被设计为与现有的圆柱型电池或方型电池尺寸相搭配。 The housing may be designed as a conventional cylindrical battery or square battery size matched. 因此,若要将根据本发明的二极管灯泡与现有的电源装置整合在一起相当容易。 Thus, relatively easy to integrate the diode lamp of the conventional power supply apparatus according to the invention.

[0011] 关于本发明的优点与精神可以由以下的发明详述及附图得到进一步的了解。 [0011] The advantage and spirit of the present invention can be obtained from the following detailed description and the accompanying drawings Further understanding of the invention. 附图说明 BRIEF DESCRIPTION

[0012] 图1显示了一现有的整合了散热装置的照明器; [0012] Figure 1 shows a conventional integrated heat sink of the luminaire;

[0013] 图2显示了台湾第568,358号专利所揭示的照明器; [0013] Figure 2 shows the Taiwan Patent No. 568,358 discloses an illumination device;

[0014] 图3A是根据本发明的一较佳具体实施例的二极管灯泡的侧视图; [0014] FIG 3A is a side view of the diode lamp according to a preferred embodiment of the present invention, the specific embodiment;

[0015] 图;3B是根据本发明的一较佳具体实施例的二极管灯泡的立体图; [0015] FIG.; FIG. 3B is a perspective view of the diode lamp according to a preferred embodiment of the present invention, the particular embodiment;

[0016] 图4显示了导热及散热模块中的导热及散热机制; [0016] FIG. 4 shows the thermal conductivity and the thermal conductivity and heat dissipation module mechanism;

[0017] 图5至图6显示了发光二极管模块32的多种实现方式; [0017] Figures 5 to 6 show various implementations LED module 32;

[0018] 图7至图10显示了散热鳍片312的多种实现方式; [0018] Figures 7 to 10 show various implementations of the heat dissipating fins 312;

[0019] 图11显示了本发明中的导热装置与发光二极管芯片的另一实施方式; [0019] FIG. 11 shows the heat-conducting device and another embodiment of the present invention, the light emitting diode chip;

[0020] 图12显示了根据本发明的一包含外壳的二极管灯泡; [0020] FIG. 12 shows an LED lamp comprising a housing according to the invention;

[0021] 图13显示了根据本发明的另一包含外壳的二极管灯泡; [0021] Figure 13 shows a housing comprising a diode lamp in accordance with another embodiment of the invention;

[0022] 图14显示了根据本发明的另一包含外壳的二极管灯泡。 [0022] Figure 14 shows a housing comprising a diode lamp according to another embodiment of the invention.

[0023] 其中,附图标记说明如下: [0023] wherein reference numerals as follows:

[0024] 10 :导热板12 :发光二极管 [0024] 10: 12 heat conductive plate: a light emitting diode

[0025] 14 :散热鳍片21 :红色发光二极管 [0025] 14: heat dissipating fin 21: red light emitting diode

[0026] 22 :绿色发光二极管23 :蓝色发光二极管 [0026] 22: 23 green LED: blue light emitting diode

[0027] 24:控制电路25:载体 [0027] 24: control circuit 25: a carrier

[0028] 30 :二极管灯泡 [0028] 30: LED lamp

[0029] 31 :导热及散热模块32 :二极管发光模块 [0029] 31: heat conduction and heat dissipating module 32: the light emitting diode module

[0030] 33 :控制电路模块34 :光学模块 [0030] 33: control circuit module 34: optical module

[0031] 311 :导热装置312 :散热鳍片 [0031] 311: heat-conducting device 312: heat dissipating fins

[0032] 313 :孔洞314 :外壳 [0032] 313: hole 314: housing

[0033] 320 :基材322:电极 [0033] 320: substrate 322: electrode

[0034] 324 :光源 [0034] 324: light source

[0035] 具体实施方式 [0035] DETAILED DESCRIPTION

[0036] 本发明的一个主要目的在于提供一种系统构装的高效率高功率二极管灯泡。 [0036] A primary object of the present invention is to provide a system in package as high efficiency, high power diode lamp.

[0037] 请参阅图3A及图;3B。 [0037] Please refer to FIG. 3A and FIG.; 3B. 图3A及图分别为根据本发明的一较佳具体实施例的二极管灯泡的侧视图及立体图。 3A and FIG respectively a side view and a perspective view of the diode lamp according to a preferred embodiment of the particular embodiment of the present invention. 根据本发明的二极管灯泡30包含一导热及散热模块31、一二 LED bulb 30 according to the present invention comprises a heat-conducting and heat-dissipating module 31, twelve

5极管发光模块32、一控制电路模块33以及一光学模块34。 32, a control circuit module 33, and an optical module 5 emitting diode module 34. 导热及散热模块31包含一导热装置311与至少一散热鳍片312。 Heat conduction and heat dissipating module 31 includes a heat-conducting device 311 and at least one heat-dissipating fin 312. 二极管发光模块32设置于导热装置311的一平坦部。 The light emitting diode module 32 disposed on a flat portion of the heat-conducting device 311. 光学模块34用以将该二极管发光模块32所发出的光线聚焦。 The optical module 34 for the light emitting diode module 32 emitted from focus. 控制电路模块33则是用以控制该二极管发光模块32。 The control circuit module 33 is a module for controlling the light emitting diode 32. 当二极管灯泡30连接至一电源时,控制电路模块33选择性地使二极管发光模块32发光,并且二极管发光模块32在发光时所产生的热是由导热装置311 自该平坦部导引至散热鳍片312,进而由散热鳍片312散热。 When the diode lamp 30 is connected to a power supply, a control circuit module 33 selectively emitting diode emitting module 32, and the heat generated when the light emitting diode emits light module 32 is guided by the heat-conducting device from the flat portion 311 to the radiating fin plate 312, and thus the heat radiation fins 312.

[0038] 如图3A及图;3B所示,由于根据本发明中的的控制电路模块33与二极管发光模块32之间有一段距离,可避免控制电路33直接受到二极管发光模块32所产生的热能影响。 [0038] FIG 3A and FIG.; 3B, since there is a according to the present invention, between the control circuit module 33 and module 32 from the light emitting diode, the control circuit 33 directly can be avoided by the light emitting diode module 32 heat generated influences.

[0039] 根据本发明,与二极管灯泡30连接的电源可为直流电源,也可为交流电源。 [0039] According to the present invention, a power source connected to the diode lamp 30 may be a DC power supply may be AC ​​power supply. 当该电源为交流电源时,控制电路模块33还进一步包含一交流至直流(AC-to-DC)转换器,将交流电转换为直流电后供给二极管灯泡30使用。 When the power supply is AC power supply, the control circuit module 33 further comprises an AC-to-DC (AC-to-DC) converter, converts AC power supplied to the lamp 30 using the LED current.

[0040] 在实际应用中,导热装置311可能为一以铜制成的热导柱或热导管。 [0040] In practice, the heat-conducting device 311 may be a thermal conductivity of a column or a heat pipe made of copper. 请参阅图4。 See Figure 4. 图4显示了导热及散热模块31中的导热及散热机制。 Figure 4 shows the mechanism of heat conduction and dissipation of heat conduction and heat dissipating module 31. 导热及散热模块31内部包含毛细组织311A以及工作流体311B。 31 internal heat conduction and heat dissipating module comprises a capillary tissues 311A ​​and working fluid 311B. 当二极管发光模块32产生热时,会使导热及散热模块31中较靠近二极管发光模块32的工作流体311B由液体蒸发为气体。 When the light emitting diode module 32 generates heat, thermal conductivity and the heat dissipation module 31 causes the module closer to the light emitting diode 32 by the working fluid 311B liquid evaporates into a gas. 气化后的工作流体311B可将热传至导热及散热模块31的另一端,经散热鳍片312散热冷却后的工作流体311B会再度凝结为液体。 Vaporized working fluid 311B can be transmitted to the other end of the heat conduction and heat dissipation module 31, the working fluid 311B after cooling heat radiation fins 312 will again condensed to a liquid. 毛细组织311A是用以将再度凝结为液体的工作流体311B传送回导热及散热模块31中较靠近二极管发光模块32的一端。 The capillary tissues 311A ​​are used again condensed liquid working fluid 311B is transferred back to the thermally conductive heat dissipating module 31 and closer to an end of the light emitting diode module 32. 由如图4所示的循环方式,可达到导热及散热效果。 A cyclic manner shown in Figure 4, heat conduction and heat dissipation can be achieved.

[0041] 请参阅图5。 [0041] See Figure 5. 在实际应用中,发光二极管模块32可能如图5所示,包含一由硅材料或金属材料所制成的基材(Substrate) 320、两电极(Electrode) 322以及一发光模块324。 In practical applications, the light emitting diode module 32 may be 5, comprising a substrate (Substrate,) a silicon or metal material made of 320, two electrodes (Electrode) 322 and a light emitting module 324. 发光模块324与电极322分别设置于基材320之上。 The light emitting module 324 and the electrode 322 are disposed on the substrate 320. 发光模块3M分别通过该两电极322 连接至控制电路模块33。 3M light-emitting module are connected to the control circuit module 33 through the two electrodes 322. 请参阅图6。 See Figure 6. 发光二极管模块32中的发光模块3M与两电极322 也可能如图6所示,直接被设置于导热装置311的平坦部之上,其中该两电极322与导热装置311之间分别有一绝缘体。 Light emitting diode module 32 3M emitting module and two electrodes 322 may also be shown in FIG. 6, is directly disposed on the flat portion 311 of the heat-conducting device, wherein the two electrodes 322 and an insulator between the heat-conducting device 311, respectively.

[0042] 在实际应用中,发光模块324包含至少一发光二极管或激光二极管(Laserdiode)。 [0042] In practical applications, the light emitting module 324 includes at least one light emitting diode or a laser diode (Laserdiode). 发光模块324中的发光二极管可能为一白光二极管,或是由一蓝光二极管与荧光粉所组成的白光二极管。 LED illumination module 324 may be a white LED, a white LED or a blue LED and a phosphor composed. 发光模块3M也可能包含至少一红光二极管、至少一蓝光二极管以及至少一绿光二极管;控制电路模块33可选择性地使该红光二极管、该蓝光二极管以及该绿光二极管发光,使得该多个不同颜色的发光二极管以不同的发光比例组成各种不同颜色的光线。 3M emitting module may also comprise at least one red LED, at least one blue light emitting diode and at least one green light diode; and a control circuit module 33 can selectively move the red LED, the blue light emitting diode and a green diode, such that the multi- light-emitting diodes of different colors at different composition ratio of various light emitting light of different colors.

[0043] 由于根据本发明的二极管灯泡是将多颗发光二极管封装在一起,发光模块3M相对于与发光模块3M配合的凹面境或整个二极管灯泡的体积相当小,因此可提供相当于点光源的发光效果。 [0043] Since the LED lamp of the present invention is a multi-segment LED package together, the light emitting module is quite small relative to the volume of 3M cooperating with 3M concave emitting module or the entire territory of a diode lamp, thus providing the equivalent of a point source glow.

[0044] 请参阅图7至图10。 [0044] Please refer to FIG. 7 to FIG. 10. 本发明中的散热鳍片312可以多种不同的样式实现。 Heat radiation fins 312 in the present invention can be implemented in many different styles. 一般的散热鳍片312环设于导热装置311的周围。 General cooling fins 312 disposed around the periphery of the heat-conducting device 311. 散热鳍片312除了如图7所示的圆盘状之外, 也可为如图8所示的不规则状,例如,锯齿状、花瓣状,或是如图9所示具有孔洞。 In addition to the heat radiation fins 312 of a disc shape as shown in FIG. 7, it may also be irregular as shown in FIG. 8, for example, zigzag, petal-like, or having holes as shown in Fig. 图9中的每一散热鳍片312上均具有至少一孔洞313,该多个孔洞313可供空气流通,帮助加速散热。 On each heat sink fins 312 in FIG 9 has at least one hole 313, the plurality of holes 313 for air circulation, helping to accelerate the heat dissipation. 图10显示了散热鳍片312的另一种实施方式,该多个散热鳍片312与导热装置311的该平坦部垂直,并环绕在导热装置311的周围。 10 shows another embodiment of the heat radiation fins 312, the plurality of heat radiation fins 312 and the heat-conducting device 311 is perpendicular to the flat portion, and surround the heat-conducting device 311.

[0045] 请参阅图11。 [0045] See Figure 11. 图11显示了本发明中的导热装置311与发光二极管模块32的另一实施方式。 Figure 11 shows another embodiment of the present invention in heat-conducting device 311 and the light emitting diode module 32 of embodiment. 如图11所示,导热装置311的一端可被设计为扁平状,而发光二极管模块32设置于该导热装置311的扁平部份之上。 11, one end of the heat-conducting device 311 may be designed to be flat, and the light emitting diode module 32 disposed on the flat portion of the heat-conducting device 311.

[0046] 在实际应用中,二极管灯泡30可进一步包含一外壳314。 [0046] In actual applications, the diode lamp 30 can further comprise a housing 314. 请参阅图12。 See Figure 12. 图12显示了一包含外壳的二极管灯泡30的实施例。 Figure 12 shows an embodiment of a housing comprising a diode lamp 30. 外壳314配合能容纳该多个散热鳍片312,不会影响散热鳍片312的散热功能。 The mating housing 314 can accommodate a plurality of heat radiation fins 312, heat does not affect the function of heat radiation fins 312. 外壳314可被设计为与现有的圆柱型电池方型电池尺寸相搭配。 Housing 314 may be designed as a conventional cylindrical battery and prismatic battery size matched. 因此,若要将根据本发明的二极管灯泡与现有的电源装置整合在一起相当容易。 Thus, relatively easy to integrate the diode lamp of the conventional power supply apparatus according to the invention.

[0047] 请参阅图13。 [0047] See Figure 13. 图13显示了根据本发明的另一较佳具体实施例的二极管灯泡。 Figure 13 shows the LED lamp according to another embodiment of the present invention is particularly preferred. 在本实施例中,导热装置311为一弯曲的导热管,发光二极管模块32设置于导热装置311的一端的平坦部。 In the present embodiment, the heat-conducting device 311 is a curved heat pipe, the light emitting diode module 32 disposed at one end of the flat portion of the heat-conducting device 311. 散热鳍片312设置于导热装置311的侧壁的周围。 Heat radiation fins 312 disposed around the side walls of the heat-conducting device 311. 发光二极管模块32所产生的热能透过导热装置311传递至散热鳍片312,再发散至周围的空气中,由此达成散热的效果。 The heat generated by the LED module through the heat conducting means 32311 to the heat transfer fins 312, and then radiate to the surrounding air, thereby to achieve cooling effect. 非封闭式的外壳314配合能容纳该至少一散热鳍片,并不会影响散热鳍片312的散热。 Non-enclosed housing 314 fitted to accommodate the at least one heat-dissipating fin, and will not affect the heat radiation fins 312 of the heat dissipation.

[0048] 请参阅图14。 [0048] See Figure 14. 图14显示了根据本发明的另一较佳具体实施例的二极管灯泡。 Figure 14 shows the LED lamp according to another embodiment of the present invention is particularly preferred. 在本实施例中,导热装置311为一弯曲的导热管,而发光二极管模块32设置于导热装置311 侧壁上的一平坦部上。 In the present embodiment, the heat-conducting device 311 is a heat pipe bent, and the LED module 32 is disposed on a flat portion 311 on the side wall heat conducting means. 散热鳍片312设置于导热装置311的两端的周围。 Heat radiation fins 312 arranged around the ends of the heat-conducting device 311. 发光二极管模块32所产生的热能透过导热装置311传递至散热鳍片312,再发散至周围的空气中,由此达成散热的效果。 The heat generated by the LED module through the heat conducting means 32311 to the heat transfer fins 312, and then radiate to the surrounding air, thereby to achieve cooling effect.

[0049] 由于本发明所提供的二极管灯泡是将导热及散热模块与发光二极管模块整合在一起,该导热及散热模块可由散热鳍片将该发光二极管模块所产生的热能立即发散至周围的空气中,大幅提升散热效率。 [0049] Since the LED lamp of the present invention is provided together with the thermally conductive heat dissipating module and a light emitting diode module, the heat conduction and heat radiation fins dissipating module may be generated by the LED module to the air immediately surrounding the divergent , significantly increasing cooling efficiency. 通过改善二极管灯泡的散热效率,解决了因过热造成发光二极管效率下降的问题,根据本发明的二极管灯泡的发光效率也可以提升。 By improving the heat dissipation efficiency of the diode lamp solves the problem of overheating due to reduced efficiency of the light emitting diode, the light emitting efficiency of the LED lamp of the present invention can also be improved. 因此,相较于先前技术,根据本发明的整合散热模块的二极管灯泡更适合应用于需要高功率高效率的二极管灯泡的照明装置中。 Therefore, compared to the prior art, the diode lamp integrated heat dissipating module according to the present invention is more suitable for high power LED lamp with high efficiency illumination device.

7 7

Claims (15)

1. 一种系统构装的高效率高功率二极管灯泡,其特征在于,包含:一导热及散热模块,包含:一热导管,该热导管具有一平坦部与一柱面,该平坦部位于该热导管的一端,且该热导管包含一毛细组织与一工作流体,其中该平坦部包含一第一外壁与一第一内壁,该柱面包含一第二外壁与一第二内壁,该毛细组织位于该平坦部的该第一内壁与该柱面的该第二内壁;以及至少一散热鳍片,该至少一散热鳍片设置于该柱面的该第二外壁;一二极管发光模块,该二极管发光模块设置于该热导管的该平坦部的第一外壁;以及一光学模块,该光学模块用以将该二极管发光模块所发出的光线聚焦;一控制电路模块,该控制电路模块用以控制该二极管发光模块;其中当该二极管灯泡连接至一电源时,该控制电路模块选择性地使该二极管发光模块发光,该二极管发光模 1. A system configuration installed high efficiency, high power diode lamp, characterized in that, comprising: a thermally conductive and heat dissipating module, comprising: a heat pipe, the heat pipe having a flat portion and a cylindrical surface, the flat portion located one end of the heat pipe and the heat pipe includes a capillary microstructure and a working fluid, wherein the planar portion comprises a first outer wall and a first inner wall of the cylinder comprises a second outer wall and a second inner wall of the capillary tissue the first inner wall of the flat portion of the inner wall of the second cylinder; and at least one heat-dissipating fin, the at least one heat-dissipating fin disposed on the outer wall of the second cylinder; a light emitting diode module, the diode the light emitting module disposed on the outer wall of the heat pipe is a first planar portion; and an optical module, the optical module is used for the light emitted by the light emitting diode module focus; a control circuit module, the module control circuit for controlling the a light emitting diode module; wherein when the diode lamp is connected to a power source, the control circuit module selectively makes the light-emitting module emitting diode, the light emitting diode die 包含一基材、多个发光二极管与两电极,所述多个发光二极管设置于该基材上且该基材附着于该热导管的该平坦部的该第一外壁,其中该光学模块覆盖于所述多个发光二极管之上,而所述多个发光二极管均位于该热导管的该平坦部的周围内,当该二极管发光模块产生热时,该导热及散热模块中较靠近该二极管发光模块的工作流体由液体蒸发为气体,气化后的工作流体将热传至该导热及散热模块的另一端,经该至少一散热鳍片散热冷却后的工作流体会再度凝结为液体,毛细组织将再度凝结为液体的工作流体传送回该导热及散热模块中较靠近二极管发光模块的一端。 Comprising a substrate, a plurality of light emitting diodes and the electrodes, the plurality of light emitting diodes disposed on the substrate and the first substrate is attached to the outer wall of the flat portion of the heat pipe, wherein the optical module covers the plurality of light emitting diodes above, while the inner periphery of the flat portion of the plurality of light emitting diodes are located in the heat pipe, when the light emitting diode module produces heat, and the thermal conductivity of the cooling module is closer to the light emitting diode module by the evaporation of the liquid working fluid is a gas, the vaporized working fluid will be transferred to the other end of the thermally conductive heat dissipation module, and, by the at least one heat dissipating fin working fluid after cooling liquid is cooled and condensed again, the capillary tissue once again condensed to a liquid working fluid transferred back to the end of the heat conduction and heat dissipation module closer to the light emitting diode module.
2.如权利要求1所述的二极管灯泡,其特征在于,该平坦部位于该热导管的一第一端, 而该控制电路模块设置于该热导管的一第二端,其中该第一端相对应于该第二端。 2. The diode lamp according to claim 1, wherein the flat portion is located at a first end of the heat pipe, and the control circuit module is disposed on a second end of the heat pipe, wherein the first end corresponds to the second end.
3.如权利要求1所述的二极管灯泡,其特征在于,该基材的两电极与该控制电路模块电性连接。 3. The diode lamp according to claim 1, wherein both electrodes of the substrate is electrically connected to the control circuit module.
4.如权利要求1所述的二极管灯泡,其特征在于,所述多个发光二极管包含一白光二极管。 4. The diode lamp according to claim 1, wherein said plurality of light emitting diodes comprises a white LED.
5.如权利要求4所述的二极管灯泡,其特征在于,该白光二极管包含蓝光二极管与荧光粉。 5. The diode lamp of claim 4, wherein the white LED comprises a blue LED and phosphors.
6.如权利要求1所述的二极管灯泡,其特征在于,该多个发光二极管包含至少一红光二极管、至少一蓝光二极管以及至少一绿光二极管。 6. The diode lamp according to claim 1, wherein the plurality of light emitting diodes comprising at least one red LED, at least one blue LED, and at least one green light diode.
7.如权利要求6所述的二极管灯泡,其特征在于,该控制电路模块选择性地使该红光二极管、该蓝光二极管以及该绿光二极管发光。 7. The diode lamp according to claim 6, wherein the control circuit module selectively to cause the red LED, the blue light emitting diode and a green light diode.
8.如权利要求1所述的二极管灯泡,其特征在于,该基材是由一硅材料或一金属材料所制成。 8. The diode lamp according to claim 1, wherein the substrate is made of a silicon material or a metal material.
9.如权利要求1所述的二极管灯泡,其特征在于,该两电极与该热导管之间分别有一绝缘体。 9. The diode lamp according to claim 1, characterized in that, between the two electrodes and the heat pipe has an insulator, respectively.
10.如权利要求1所述的二极管灯泡,其特征在于,该热导管以铜材料制成。 10. The diode lamp according to claim 1, wherein the heat pipe is made of copper material.
11.如权利要求1所述的二极管灯泡,其特征在于,该至少一散热鳍片中的每一散热鳍片环设于该热导管的周围。 11. The diode lamp according to claim 1, wherein the at least one heat-dissipating fin of each heat-dissipating fin is disposed around the periphery of the heat pipe.
12.如权利要求1所述的二极管灯泡,其特征在于,该至少一散热鳍片中的每一散热鳍片为圆盘状。 12. The diode lamp according to claim 1, wherein each of the at least one heat-dissipating fins of the heat dissipating fin is disk-shaped.
13.如权利要求1所述的二极管灯泡,其特征在于,该至少一散热鳍片中的每一散热鳍片为不规则状。 13. The diode lamp according to claim 1, wherein the at least one heat-dissipating fin of each heat dissipating fin is irregularly shaped.
14.如权利要求1所述的二极管灯泡,其特征在于,该至少一散热鳍片中的每一散热鳍片均具有至少一孔洞。 14. The diode lamp according to claim 1, wherein each of the at least one heat-dissipating fin of the heat radiation fins each having at least one aperture.
15.如权利要求1所述的二极管灯泡,其特征在于,该二极管灯泡进一步包含一外壳, 该外壳配合并能容纳该至少一散热鳍片。 15. The diode lamp according to claim 1, wherein the diode lamp further comprising a housing, with the housing and to accommodate the at least one heat-dissipating fin.
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PCT/CN2005/000389 WO2006102785A1 (en) 2005-03-28 2005-03-28 An efficient high-power led lamp
US11/887,427 US7891837B2 (en) 2005-03-28 2005-03-28 System in package high power highly efficient diode lamp
AU2005329901A AU2005329901B2 (en) 2005-03-28 2005-03-28 An efficient high-power LED lamp
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EP05732572A EP1873447A4 (en) 2005-03-28 2005-03-28 An efficient high-power led lamp
US13/006,015 US8029158B2 (en) 2005-03-28 2011-01-13 System in package high power highly efficient diode lamp
US13/224,624 US20110317423A1 (en) 2005-03-28 2011-09-02 System in Package High Power Highly Efficient Diode Lamp

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US7891837B2 (en) 2011-02-22
EP1873447A4 (en) 2009-04-22

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