TWM311844U - Heat dissipation devices for LED lamps - Google Patents

Heat dissipation devices for LED lamps Download PDF

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Publication number
TWM311844U
TWM311844U TW95220216U TW95220216U TWM311844U TW M311844 U TWM311844 U TW M311844U TW 95220216 U TW95220216 U TW 95220216U TW 95220216 U TW95220216 U TW 95220216U TW M311844 U TWM311844 U TW M311844U
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Taiwan
Prior art keywords
heat
spreader
led lighting
heat sink
heat spreader
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TW95220216U
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Chinese (zh)
Inventor
Hank Lin
Mei-Chih Lin
Shou-Hung Wei
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Mgta Consultant Co Ltd
Mei-Chih Lin
Shou-Hung Wei
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Application filed by Mgta Consultant Co Ltd, Mei-Chih Lin, Shou-Hung Wei filed Critical Mgta Consultant Co Ltd
Priority to TW95220216U priority Critical patent/TWM311844U/en
Publication of TWM311844U publication Critical patent/TWM311844U/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

M311844 八、新型說明: 【新型所屬之技術領域】 本創作有關一種LED照明散熱裝置’尤指一種適合室内外及 機器等照明設備使用之LED發光二極體照明散熱裝置。 【先前技術】 目前照明設備包括有路燈照明、廣告照明、室内照明及機器 設備照明等種類,其中一般路燈係於直立燈桿之彎折伸出端組接 一中空燈殼’供内設照明光源,並且配合加裝透光燈罩,以提供 道路及周遭環境之夜間照明。 一般室内外及機器照明設備之照明光源大多採用白熾燈泡、 曰光燈管、水銀燈等種類,除了汞蒸氣造成環境汙染外,照明效 率較差,耗電量相對增加,並且容易損壞,使用壽命短,以致須 經常維修更換,浪費人力、物力及時間,因此有待加強改善。 菱現5至内外及機器專知明没備之照明光源已考慮改採用固 態光源發光二極體,以提高照明效率,並且節省電力。惟此照明 光源必須於電路基板上排列佈置多數個發光二極體,隨著發光二 極體之a又置數罝及輸出功率增加,在電〉光〉熱轉換過程,相對產 生尚/BZL度熱里,因此必須藉助散熱鰭片進行散熱。但是全部發光 —極體本身之高溫度熱量只能透過電路基板之絕緣層傳導至散熱 鰭片進行散熱,以致散熱效率差,散熱速度慢,因此發光二極體 長期間使用時容易造成溫度過高,嚴重影響發光二極體之照明效 旎,進而造成光衰,縮減使用壽命,因此有必要進一步改良。 5 M311844 【新型内容】 本創作之目的即在提供_3| 口口 —X· tOr m χ〇7 ΤΤΡΙ、一 / 種LED照明散熱裝置,主要於導熱M311844 VIII. New Description: [New Technology Field] This creation relates to an LED lighting heat sink device, especially an LED light-emitting diode lighting heat sink suitable for indoor and outdoor lighting equipment. [Prior Art] At present, lighting equipment includes street lighting, advertising lighting, indoor lighting, and lighting of machinery and equipment. Among them, general street lights are connected to a hollow lamp housing at the bent end of the vertical pole. And with a translucent lampshade to provide night illumination of the road and surrounding environment. Generally, the illumination sources of indoor and outdoor and machine lighting equipment mostly use incandescent bulbs, neon bulbs, mercury lamps, etc. In addition to the environmental pollution caused by mercury vapor, the lighting efficiency is poor, the power consumption is relatively increased, and it is easy to damage and has a short service life. As a result, frequent repairs and replacements are required, which wastes manpower, material resources and time. Therefore, improvements are needed. The lighting source of the 5th to the inside and outside and the machine is known to have been replaced with a solid-state light-emitting diode to improve lighting efficiency and save electricity. However, the illumination source must have a plurality of light-emitting diodes arranged on the circuit substrate. As the light-emitting diodes are turned on and the output power is increased, in the electric light-thermal conversion process, the relative/BZL degree is relatively generated. In the heat, it is necessary to dissipate heat through the fins. However, all of the light-emitting body-high temperature heat can only be transmitted to the heat-dissipating fins through the insulating layer of the circuit board to dissipate heat, so that the heat-dissipating efficiency is poor and the heat-dissipating speed is slow, so that the temperature of the light-emitting diode is likely to be too high during long use. It seriously affects the lighting effect of the light-emitting diode, which in turn causes light decay and reduces the service life, so further improvement is necessary. 5 M311844 [New Content] The purpose of this creation is to provide _3| mouth-X· tOr m χ〇7 ΤΤΡΙ, one / kind of LED lighting heat sink, mainly for heat conduction

體之照明效能及使用壽命,並且容易製作, 降低成本,具備產業 ; 上利用價值。 為達上揭目的’本創作LED照明散歸置於—金料熱器 之-侧表面至少絕緣設置-陽極線路及—陰極線路,供複數個 LED發光二極體之兩接腳相對跨接導通電源;該複數個發 光二極體底端各具有-導熱凸座’以酬鱗熱器之—侧表面進 行傳導散熱。 於較佳實施例中,該陽極線路及陰極線路各包含有一絕緣 層,以絕緣設置於該導熱器之一側表面。又,上述陽極線路及陰 極線路之絕緣層彼此相隔’供該led發光二極體之導熱凸座固定 接合該導熱器之一侧表面。 在更佳實施例中,該導熱器之一侧表面設有導熱凸部,以相 對接觸該LED發光二極體之導熱凸座。 於另一實施例中,該導熱器之一侧設成散熱板,以及朝向另 一側延伸出成排散熱鰭片。又,上述導熱器於至少一散熱鰭片末 端設置一熱導管。 在次一實施例中,該導熱器設為熱導管。又,上述熱導管之 6 M311844 、· 内周壁朝内延伸出成排導熱鰭片。 【實施方式】 —有關本創作為達成上述目的,所_之技術手段及其功致, 妄么舉出可行實施例,並且配合圖面說明如下: …首先,请參閱第1 ' 2及3圖,本創作LED照明散熱裝置、高 用於室内及室外照明設備,例如:路燈照明、廣告照明、室内= 明及機續照9蔣種類,以提高_效率及節省電力。如_ 示LED照明散熱裝置中,係於一金屬導熱工〇 )之一侧表 面至少絕緣設置-陽極(P)線路(2 0 )及—陰極(N)線路(2 1 )供複數個LED發光二極體(3 〇 )之兩接腳(3 4 )、 (3 5 )相對跨接導通電源。於該複數個LED發光二極體(3 0 )底端各具有—導熱凸座(3 3 ),並且接觸該導絲(1 〇 ) 之-側表面,以進行全面迅速金屬傳導散熱,大幅度提高散熱效 • 帛,確保LED發光二極體(3 0 )之照明效能及使用壽命。 上述導熱器(1Q)係採用金屬擠型製成,例如設為銘擠型 體並且可實把陽極處理形成絕緣表面,兼具耐腐餘及美觀性。 於該導熱H ( 1 Q )之-齡面上以印刷方式或其他適當方式設 有彼此相隔之絕緣層(2 2 )、( 2 3 ),供絕緣設置銅_式 陽極(P)線路(2 0 )及陰極(N)線路(2 1 ),以連接外界電 源電路(圖未示)。 於第1、2及3圖中,將陽極(p)線路(2 〇 )及陰極(n ) 線路(2 1 )以平行方式相隔排列,上述無數個LED發光二極 7 M311844 體(3 〇)各含有透光殼體(31)及内設發光二極體,並且分 别由基體(32)伸出兩相對極腳(34)、(35),以各自 5置銲接於陽極(p)線路(2 Q )及陰極(n )線路(2 1 )上, 使各咖發光二極體(3 G )於軸職時產生發光照明。於 led發光二極體(3 〇 )底端各具有一朝外引導熱量之導熱凸座 (3 3 ) ’以相隔通過p)線路(2 〇 )及陰極⑻線路(2The lighting efficiency and service life of the body are easy to produce, reduce costs, and have the industry's value. In order to achieve the goal, the LED lighting is placed on the side surface of the gold heater - at least insulated - the anode line and the cathode line, for the two pins of the plurality of LED light-emitting diodes to be connected across the bridge The power supply; the bottom ends of the plurality of light-emitting diodes each have a heat-conducting protrusion to conduct heat dissipation from the side surface of the scale heat exchanger. In a preferred embodiment, the anode and cathode lines each include an insulating layer disposed on one side of the heat spreader. Further, the insulating layers of the anode line and the cathode line are spaced apart from each other by a heat conducting boss for the LED light-emitting diode to be fixedly coupled to one side surface of the heat spreader. In a more preferred embodiment, one of the side surfaces of the heat spreader is provided with a heat conducting projection to relatively contact the thermally conductive bump of the LED light emitting diode. In another embodiment, one side of the heat spreader is disposed as a heat sink and a row of heat sink fins extending toward the other side. Moreover, the heat spreader is provided with a heat pipe at the end of at least one of the heat dissipation fins. In the next embodiment, the heat spreader is configured as a heat pipe. Further, the inner wall of the heat pipe 6 M311844 and the inner peripheral wall extend inwardly to form a row of heat transfer fins. [Embodiment] - For the purpose of achieving the above objectives, the technical means and its merits, the feasible embodiments are illustrated, and the drawings are as follows: ... First, please refer to the 1 '2 and 3 This creation LED lighting heat sink, high for indoor and outdoor lighting equipment, such as: street lighting, advertising lighting, indoor = Ming and machine continuation 9 Jiang type, to improve efficiency and save electricity. For example, in the LED lighting heat sink, at least one side of the surface of a metal heat transfer process is insulated - an anode (P) line (20) and a cathode (N) line (2 1) for a plurality of LEDs The two pins (3 4 ) and (3 5 ) of the diode (3 )) are connected across the conduction source. The bottom ends of the plurality of LED light-emitting diodes (30) each have a heat-conducting boss (3 3 ) and contact the side surface of the guide wire (1 〇) for comprehensive rapid metal conduction heat dissipation. Improve heat dissipation • 帛 Ensure the lighting performance and service life of the LED light-emitting diode (30). The above-mentioned heat spreader (1Q) is made of a metal extrusion type, for example, it is set as an extruded body and can be anodized to form an insulating surface, which has both corrosion resistance and aesthetics. Insulating layers (2 2 ), ( 2 3 ) separated from each other by printing or other suitable means on the surface of the heat-conducting H ( 1 Q ) - for insulating the copper-type anode (P) line (2) 0) and cathode (N) line (2 1) to connect external power supply circuit (not shown). In Figures 1, 2 and 3, the anode (p) line (2) and the cathode (n) line (2 1 ) are arranged in parallel, in parallel with the innumerable LED light-emitting diodes 7 M311844 (3 〇) Each of the light-transmitting housings (31) and the inner light-emitting diodes are respectively protruded from the base body (32) by two opposite poles (34) and (35), and are respectively soldered to the anode (p) line ( On the 2 Q ) and cathode (n) lines (2 1 ), each of the coffee light-emitting diodes (3 G) is illuminated at the time of the axis. At the bottom end of the led light-emitting diode (3 〇), there is a heat conducting protrusion (3 3 ) ' for guiding heat outwardly through the p) line (2 〇 ) and the cathode (8) line (2)

、\)之間,供接觸該導熱器(1 ◦)之-侧表面上,以直接全面 迅速傳導Μ ’大幅度提高散熱效率。 >於第1至3_示之較佳實施例中,該導熱H(1 〇)之一 Η又成政熱板(1 1 ),並且朝向另一侧延伸出成排散熱韓片(1 2):以提高散熱效率。而導熱器(10)之-側表面上可一體 汉有導熱凸部(1 3 ),以相對接職LED發光二極體(3 〇 ) 之導熱凸座(3 3 )’並且兩棚可直接貼置之外,亦可採用録 接方式或導熱膠黏接。 、 於第2圖所示之導熱器(1〇)結構中,係絕緣設置有兩排 LED發光二極體(3 〇 ),並且其下方相對之兩散熱鰭片(口) 設成較大斷面寬度,以迅速傳導熱量。除此之外,在導熱器(工 0)兩侧可設有相對併接之卡接部(15)、(16),以依實 際需要併接排列多數導熱器(1 〇 )。 另外該導熱器(1Q)可設為加寬型散熱板(1 8 )(請參 閱第4圖),以設置三排LED發光二極體(3〇),並且其三 支散熱㈣(1 7 )末端各設置連接-熱導管(1 4 ),以提高 8 M311844 散熱效率。而第5圖所示之導熱器(丄〇) +,係於散熱板(工 9 )上設置四排LED發光二極體(3 〇 )。Between , \), on the side surface of the heat spreader (1 ◦), to directly and fully conduct Μ ’ significantly improve heat dissipation efficiency. > In the preferred embodiment shown in the first to third embodiments, one of the heat conduction H (1 〇) is again formed into a thermal plate (1 1 ), and a row of heat dissipation fins is extended toward the other side (1) 2): To improve heat dissipation efficiency. On the side surface of the heat spreader (10), a heat conductive convex portion (1 3 ) can be integrally formed to relatively contact the thermal conductive protrusion (3 3 ) of the LED light emitting diode (3 ') and the two sheds can be directly In addition to the placement, it can also be bonded or thermally bonded. In the structure of the heat spreader (1〇) shown in Fig. 2, two rows of LED light-emitting diodes (3 〇) are provided in the insulation, and the two opposite heat-dissipating fins (ports) are arranged to be relatively large. The width of the face to quickly transfer heat. In addition, the opposite joints (15) and (16) may be provided on both sides of the heat spreader (work 0) to arrange a plurality of heat spreaders (1 〇 ) in parallel as needed. In addition, the heat spreader (1Q) can be set as a widened heat sink (1 8) (see Figure 4) to set up three rows of LED light-emitting diodes (3 turns), and three heat sinks (4) (1 7 The end of each connection - heat pipe (1 4) to improve the efficiency of 8 M311844 heat dissipation. The heat spreader (丄〇) + shown in Figure 5 is provided with four rows of LED light-emitting diodes (3 〇) on the heat sink (Work 9).

於第6圖所示之另-實施例中’將導熱器(4〇)設為中* 長方狀斷面之熱導管(4 D,於其一側表面設有陽極(p)線^ (2 0 )、陰極(Ν)線路(2 1 )及其絕緣層(2 2 )、( 2 3 ), 供LED發光二極體(3 〇 )之兩接腳(3 4 )、( 3 5 )跨接 導通’並且其底稱熱凸座(3 3 )接觸熱導管(4 i )之^熱 凸部(4 3 )進行傳導散熱。而熱導管(4 i )兩端可設為· 式’供強制送風散熱。除此之外,熱導管(4 i)内部亦可容納 流體,並且兩端設為封閉結構。 而第7圖所示之又-實施例中,係在導熱器(4◦)之熱導 管(4 2)内周壁朝内延伸出成排導熱鰭片(44),以提高散 熱效率。 本創作LED照明散熱裝置於導熱器(工〇 )表面直接設置陽 極線路(2 0 )、陰極線路(2 1 )及LED發光二極體(3 〇 ), 使LED發光二極體(3 〇 )底端導熱凸座(3 3 )接觸導熱器(1 0 )表面,以進行全面迅速金屬傳導散熱,大幅度提高散熱效率, 確保LED發光二極體之照明效能及使用壽命,並且容易製作,降 低成本,具備產業上利用價值,爰依法提出新型專利申請。 以上所舉實施例僅用為方便說明本創作,而並非加以限制, 在不離本創作精神範4,熟悉此-行紐藝人士所可作之各種簡 易變化與修飾,均仍應含括於以下申請專利範圍中。 9 M311844 【圖式簡單說明】 第1圖係本創作較佳實施例LED照明散熱裝置之立體圖; 第2圖係第1圖之結構放大圖; 第3圖係第2圖之分解圖; 第4圖係如第2圖之加寬型結構圖; 第5圖係如第4圖之再加寬型結構圖; 第6圖係本創作另一實施例之結構圖;以及In the other embodiment shown in Fig. 6, the heat exchanger (4 〇) is set as a heat pipe (4 D in the middle * rectangular section), and an anode (p) line is provided on one side surface thereof ( 2 0 ), cathode (Ν) line (2 1 ) and its insulating layer (2 2 ), ( 2 3 ), for the two pins (3 4 ), (3 5 ) of the LED light-emitting diode (3 )) The heat conduction (4 3 ) of the heat pipe ( 4 i ) contacts the heat conduction seat ( 3 3 ) to conduct conduction heat dissipation, and the heat pipe ( 4 i ) can be set to both ends. For the forced air supply, in addition, the heat pipe (4 i) can also accommodate the fluid inside, and the two ends are arranged in a closed structure. In the embodiment shown in Fig. 7, the heat exchanger (4◦) The inner wall of the heat pipe (42) extends inwardly into a row of heat-conducting fins (44) to improve heat dissipation efficiency. The LED lighting heat sink of the present invention directly sets an anode line on the surface of the heat spreader (2 0) The cathode line (2 1 ) and the LED light-emitting diode (3 〇) enable the LED light-emitting diode (3 〇) bottom heat-conducting protrusion (3 3 ) to contact the surface of the heat-conductor (10) for rapid and comprehensive operation. Metal conduction heat dissipation, large Improve the heat dissipation efficiency, ensure the lighting performance and service life of the LED light-emitting diode, and easy to manufacture, reduce the cost, and have the industrial use value, and propose a new patent application according to law. The above embodiments are only used to illustrate the creation. Without limiting it, the various changes and modifications that can be made by those who are familiar with this art are still included in the scope of the following patent application. 9 M311844 [Simple description] 1 is a perspective view of a preferred embodiment of an LED illumination heat sink; FIG. 2 is an enlarged view of the structure of FIG. 1; FIG. 3 is an exploded view of FIG. 2; a wide structure diagram; Fig. 5 is a re-widened structure diagram as shown in Fig. 4; and Fig. 6 is a structural diagram of another embodiment of the present creation;

第7圖係本創作又一實施例之結構圖。 【主要元件符號說明】 (12)散熱鰭片 (15)卡接部 (2 2)絕緣層 (3 3)導熱凸座 (4 2)熱導管 (10)導熱器 (11)散熱板 (13)導熱凸部 (14)熱導管 (16)卡接部 (17)散熱鰭片 (1 8 )、( 1 9 )散熱板 (2 0)陽極線路 (21)陰極線路 (2 3)絕緣層 (3 0 ) LED發光二極體 (31)透光殼體 (3 2)基體 (3 4)接腳 (3 5)接腳 (4 0)導熱器 (4 1)熱導管 (4 3 )導熱凸部 (4 4)導熱鰭片Figure 7 is a block diagram of still another embodiment of the present creation. [Main component symbol description] (12) Heat sink fin (15) snap portion (2 2) Insulation layer (3 3) Thermal bump (42) Heat pipe (10) Heat spreader (11) Heat sink (13) Thermal conductive protrusion (14) heat pipe (16) snap portion (17) heat sink fin (18), (19) heat sink (20) anode line (21) cathode line (23) insulation layer (3 0) LED light-emitting diode (31) light-transmissive housing (3 2) base body (3 4) pin (3 5) pin (40) heat spreader (4 1) heat pipe (4 3) heat-conducting convex part (4 4) Thermal fins

Claims (1)

M311844 九、申請專利範圍: 1· -種LED照明散熱裝i,係於一金屬導熱器之一側表面至少絕 緣設置一陽極線路及一陰極線路,供複數個LED發光二極體之 兩接腳相對跨接導通電源;該複數個LED發光二極體底端各具 有一導熱凸座,以接觸該導熱器之一侧表面進行傳導散熱。 2·如申請專利範圍第丄項所述LED照明散熱裝置,其中該陽極線路 及陰極線路各包含有一絕緣層,以絕緣設置於該導熱器之一侧表 面0 3·如申請專利範圍第2項所述LED照明散熱裝置,其中該陽極線路 及陰極線路之絕緣層彼此相隔,供該led發光二極體之導熱凸座 固定接合該導熱器之一侧表面。 4·如申請專利範圍第1項所述LED照明散熱裝置,其中該導熱器之 一侧表面設有導熱凸部,以相對接觸該LED發光二極體之導熱凸 座0 5·如申晴專利範圍第1項所述LED照明散熱裝置,其中該導熱器之 一侧設成散熱板,以及朝向另一侧延伸出成排散熱鰭片。 6·如申請專利範圍第5項所述LED照明散熱裝置,其中該導熱器於 至少一散熱鰭片末端設置一熱導管。 7·如申請專利範圍第1項所述LE:D照明散熱裝置,其中該導熱器設 為熱導管。 8·如申請專利範圍第7項所述LED照明散熱裝置,其中該熱導管之 内周壁朝内延伸出成排導熱縛片。 11 M311844 9. 如申請專利範圍第1項所述LED照明散熱裝置,其中該導熱器兩 側設有相對併接之卡接部。 10. 如申請專利範圍第1項所述LED照明散熱裝置,其中該導熱器 具有陽極處理絕緣表面。M311844 IX. Patent application scope: 1. · A kind of LED lighting heat dissipation device i is provided on at least one side surface of a metal heat spreader, at least one anode line and one cathode line are insulated, and two pins of a plurality of LED light-emitting diodes are provided. The bottom of each of the plurality of LED light emitting diodes has a heat conducting protrusion to contact one side surface of the heat spreader for conducting heat dissipation. 2. The LED lighting heat sink according to claim 2, wherein the anode line and the cathode line each comprise an insulating layer disposed on one side of the side of the heat spreader. 3 3 as claimed in claim 2 The LED lighting heat dissipating device, wherein the insulating layers of the anode line and the cathode line are separated from each other, and the heat conducting protrusion of the LED light emitting diode is fixedly engaged with one side surface of the heat spreader. 4. The LED lighting heat sink according to claim 1, wherein one side surface of the heat spreader is provided with a heat conducting convex portion to relatively contact the heat conducting protrusion of the LED light emitting diode. The LED illumination heat dissipation device of item 1, wherein one side of the heat spreader is disposed as a heat dissipation plate, and a row of heat dissipation fins extends toward the other side. 6. The LED lighting heat sink of claim 5, wherein the heat spreader is provided with a heat pipe at the end of the at least one heat sink fin. 7. The LE:D illumination heat sink according to claim 1, wherein the heat spreader is configured as a heat pipe. 8. The LED lighting heat sink of claim 7, wherein the inner peripheral wall of the heat pipe extends inwardly into a row of heat conducting tabs. 11 M311844. The LED lighting heat sink according to claim 1, wherein the two sides of the heat spreader are provided with oppositely connected snap portions. 10. The LED lighting heat sink of claim 1, wherein the heat spreader has an anodized insulating surface. 1212
TW95220216U 2006-11-17 2006-11-17 Heat dissipation devices for LED lamps TWM311844U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385343B (en) * 2008-07-24 2013-02-11 Advanced Optoelectronic Tech Light source and passive thermal heat dissipation apparatus thereof
US8382333B2 (en) 2011-06-03 2013-02-26 Kuei-Fang Chen Light emitting device
TWI412694B (en) * 2010-02-12 2013-10-21 Asda Technology Co Ltd Light emitting diode lamp device
TWI418736B (en) * 2011-06-01 2013-12-11
US9307675B2 (en) 2010-10-11 2016-04-05 Lg Innotek Co., Ltd. Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
US9549458B2 (en) 2010-10-06 2017-01-17 Lg Innotek Co., Ltd. Radiant heat circuit board, heat generating device package having the same, and backlight unit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385343B (en) * 2008-07-24 2013-02-11 Advanced Optoelectronic Tech Light source and passive thermal heat dissipation apparatus thereof
TWI412694B (en) * 2010-02-12 2013-10-21 Asda Technology Co Ltd Light emitting diode lamp device
US9549458B2 (en) 2010-10-06 2017-01-17 Lg Innotek Co., Ltd. Radiant heat circuit board, heat generating device package having the same, and backlight unit
EP2625712B1 (en) * 2010-10-06 2019-09-18 LG Innotek Co., Ltd. Radiant heat circuit board
US9307675B2 (en) 2010-10-11 2016-04-05 Lg Innotek Co., Ltd. Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
TWI418736B (en) * 2011-06-01 2013-12-11
US8382333B2 (en) 2011-06-03 2013-02-26 Kuei-Fang Chen Light emitting device

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