TWI412694B - Light emitting diode lamp device - Google Patents

Light emitting diode lamp device Download PDF

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Publication number
TWI412694B
TWI412694B TW99104823A TW99104823A TWI412694B TW I412694 B TWI412694 B TW I412694B TW 99104823 A TW99104823 A TW 99104823A TW 99104823 A TW99104823 A TW 99104823A TW I412694 B TWI412694 B TW I412694B
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Taiwan
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light
emitting diode
columnar
emitting
bulb
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TW99104823A
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Chinese (zh)
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TW201128118A (en
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Peter P T Lin
Sanbao Lin
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Asda Technology Co Ltd
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Abstract

A Light Emitting Diode (LED) lamp device is provided. The LED lamp device structure has a male base installing on a lamp female holder, a column emitter connected the male base, and a lamp cover covering the column emitter. The column emitter has a metal board and some LED elements. The metal plate is consisted of some plate bodies, in which each two neighboring plate bodies are separated by a slot for avoiding from a physical connection existed therebetween. The LED elements are arranged along the slots, and electrically connect with both the neighboring plate bodies placed near the LED elements. Thus, The LED elements are connected with each other via the plate bodies aside.

Description

發光二極體燈泡裝置Light-emitting diode bulb device

本發明是有關於一種發光二極體燈件,特別是有關於一種發光二極體燈泡裝置。The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp device.

傳統發光二極體(Light Emitting Diode,LED)等半導體晶片之應用,均必須被一一地加以封裝成一發光二極體封裝結構,再分別從一導線架上取下,以便焊接至一電路板上以形成一發光二極體元件,才能成為一加電後可進行發光之光源。此外,發光二極體封裝結構之電極需被引出其封裝結構,以利連接電路板上之電源線路,而得以運作或發光。Applications of semiconductor chips such as Light Emitting Diodes (LEDs) must be packaged one by one into a light-emitting diode package structure and then removed from a lead frame for soldering to a circuit board. In order to form a light-emitting diode element, a light source capable of emitting light after being powered can be obtained. In addition, the electrodes of the LED package structure need to be taken out of the package structure to facilitate connection to the power line on the circuit board to operate or emit light.

傳統發光二極體燈泡之製作係由上述之發光二極體元件裝設於一公基座上。故,發光二極體燈泡便可安裝於一燈泡母座上。由於發光二極體發光時會產生之高熱,發光二極體之熱能需依序經由發光二極體封裝結構、公基座及燈泡母座座才能傳遞至空氣中,此外,也因為其熱阻過高,而導致發光二極體之散熱效果不佳,故,需要發展更有效之散熱方式來改善散熱不佳的現況,以避免發光二極體燈泡因過熱而產生損壞,造成發光效率下降以及產品壽命縮短。The conventional light-emitting diode bulb is mounted on a male base by the above-mentioned light-emitting diode element. Therefore, the LED bulb can be mounted on a bulb holder. Due to the high heat generated by the light-emitting diode, the thermal energy of the light-emitting diode needs to be transmitted to the air through the light-emitting diode package structure, the male base and the bulb female seat, and also because of its thermal resistance. If the heat is too high, the heat dissipation effect of the light-emitting diode is not good. Therefore, it is necessary to develop a more effective heat dissipation method to improve the current situation of poor heat dissipation, so as to avoid damage of the light-emitting diode bulb due to overheating, resulting in a decrease in luminous efficiency. Product life is shortened.

實作上,業者通常係於發光二極體元件與公基座之間加設不同種形式之散熱元件,以降低熱阻或提早將發光二極體元件之高熱傳遞至空氣中。In practice, the manufacturer usually adds different types of heat dissipating components between the LED component and the male base to reduce the thermal resistance or to transfer the high heat of the LED component to the air.

實作上又一例,業者更於發光二極體元件與公基座之間加設不同種形式之導熱元件(例如金屬外殼),使得發光二極體元件之高熱可經金屬外殼傳導出去,以降低整體熱阻。In another example, a different type of heat-conducting element (for example, a metal casing) is added between the light-emitting diode element and the male base, so that the high heat of the light-emitting diode element can be conducted through the metal casing to Reduce overall thermal resistance.

雖然加裝散熱元件有助降低發光二極體所產生之高熱,然而,現今發光二極體燈泡之市場競爭激烈,業者皆致力於降低成本、提高利潤,以提高市場之競爭力。如此,若能不需刻意加裝散熱元件,又可克服發光二極體所產生之高熱,並維持發光二極體原有的發光特性,便是此業界人士所欲達成之目標。Although the installation of heat-dissipating components helps to reduce the high heat generated by the light-emitting diodes, the current market for light-emitting diode bulbs is fierce, and the industry is committed to reducing costs and increasing profits to enhance the competitiveness of the market. In this way, if the heat-dissipating component is not intentionally added, the high heat generated by the light-emitting diode can be overcome, and the original light-emitting characteristics of the light-emitting diode can be maintained, which is a goal that the industry has desired to achieve.

此外,雖然加裝導熱元件可將發光二極體元件之高熱導到金屬外殼以降低整體之熱阻,有助減緩發光二極體所產生之高熱,然而,為了避免觸電之安全性顧慮,業者勢必增加絕緣裝置,又可能提高成本。In addition, although the addition of a heat-conducting element can guide the high heat of the light-emitting diode element to the metal casing to reduce the overall thermal resistance, which helps to reduce the high heat generated by the light-emitting diode, however, in order to avoid the safety concerns of electric shock, the operator It is bound to increase the insulation device, which may increase the cost.

現今發光二極體燈泡之市場競爭激烈,業者皆致力於降低成本、提高利潤,以提高市場之競爭力。如此,若能不需刻意加裝導熱元件及外殼部份為金屬,又可克服發光二極體所產生之高熱,並維持發光二極體原有的發光特性,便是此業界人士所欲達成之目標。Today's market for light-emitting diode bulbs is fierce, and companies are committed to reducing costs and increasing profits to increase market competitiveness. In this way, if it is not necessary to intentionally install the heat-conducting element and the metal part of the outer casing is used, the high heat generated by the light-emitting diode can be overcome, and the original light-emitting characteristics of the light-emitting diode are maintained, which is desired by the industry. The goal.

本發明之一目的係揭露一種發光二極體燈泡裝置,用以提供多方向且足夠亮度之照明光源。One object of the present invention is to disclose a light-emitting diode bulb device for providing an illumination source having multiple directions and sufficient brightness.

本發明之另一目的係揭露一種發光二極體燈泡裝置,不需刻意加裝散熱元件,即可降低熱阻,並提早引導發光二極體所產生之高熱至空氣中,同時維持發光二極體原有的發光特性。Another object of the present invention is to disclose a light-emitting diode bulb device, which can reduce the thermal resistance without deliberately adding a heat dissipating component, and guide the high heat generated by the light-emitting diode to the air early, while maintaining the light-emitting diode. The original luminescent properties of the body.

本發明之又一目的係揭露一種發光二極體燈泡裝置,不需刻意加裝可傳導高熱至空氣之金屬外殼,不僅可提早引導發光二極體所產生之高熱至空氣中,同時也可避免觸電發生。Another object of the present invention is to disclose a light-emitting diode bulb device that does not need to be deliberately installed with a metal casing that can conduct high heat to air, and can not only guide the high heat generated by the light-emitting diode to the air, but also avoid An electric shock occurred.

此發光二極體燈泡裝置包括一公基座、一柱狀體發光元件及一燈罩。公基座用以組裝至一燈泡母基座上。柱狀體發光元件連接此公基座,燈罩罩蓋此柱狀體發光元件。另外,柱狀體發光元件包括至少一金屬導板及多個發光二極體元件。金屬導板位於此柱狀體發光元件之一面上。金屬導板包括多個板體,任二相鄰之板體間具一間隙,各間隙分離此些板體之實體接觸。各發光二極體元件跨越其中一間隙,並連接此間隙兩側之板體,其中此些發光二極體元件彼此藉由間隙兩側之板體進行電性相接。The light-emitting diode bulb device comprises a male base, a columnar light-emitting element and a lamp cover. The male base is assembled to a bulb base. The columnar light-emitting element is connected to the male base, and the lamp cover covers the columnar light-emitting element. In addition, the columnar light-emitting element includes at least one metal guide and a plurality of light-emitting diode elements. The metal guide is located on one side of the columnar light-emitting element. The metal guide plate comprises a plurality of plate bodies, and a gap between any two adjacent plates has a gap, and each gap separates physical contact of the plate bodies. Each of the light-emitting diode elements spans one of the gaps and is connected to the plate body on both sides of the gap, wherein the light-emitting diode elements are electrically connected to each other by the plates on both sides of the gap.

如此,藉由金屬導板之高導熱特性,本發明發光二極體燈泡裝置所產生之高溫便可快速降低整體熱阻並被引導至空氣中,避免發光二極體燈泡因過熱而產生損壞,造成發光效率下降以及產品壽命縮短。同時,由於加裝散熱元件不再是散熱之必要手段,因此,若本發明發光二極體燈泡裝置省去加裝散熱元件後,其業者便可降低材料、製作成本及備料成本,降低發光二極體燈泡整體重量、提高容置空間或縮小整體體積,進而提高市場之競爭力。Thus, by the high thermal conductivity of the metal guide plate, the high temperature generated by the light-emitting diode lamp device of the present invention can quickly reduce the overall thermal resistance and be guided into the air, thereby preventing the light-emitting diode bulb from being damaged due to overheating. This results in reduced luminous efficiency and reduced product life. At the same time, since the installation of the heat dissipating component is no longer a necessary means for heat dissipation, if the light emitting diode device of the present invention eliminates the need for the heat dissipating component, the manufacturer can reduce the material, the manufacturing cost, and the cost of preparing the material, and reduce the luminous cost. The overall weight of the polar bulb, increase the accommodation space or reduce the overall volume, thereby increasing the competitiveness of the market.

以下將以圖示及詳細說明清楚說明本發明之精神,如熟悉此技術之人員在瞭解本發明之實施例後,當可由本發明所教示之技術,加以改變及修飾,其並不脫離本發明之精神與範圍。The present invention will be apparent from the following description and the detailed description of the embodiments of the present invention, which may be modified and modified by the teachings of the present invention without departing from the invention. The spirit and scope.

第1圖是本發明發光二極體燈泡結構依據一實施例下之示意圖。本發明提供一種發光二極體燈泡裝置10。此發光二極體燈泡裝置10包括一公基座20、一柱狀體發光元件30及一燈罩80。Fig. 1 is a schematic view showing the structure of a light-emitting diode bulb of the present invention according to an embodiment. The present invention provides a light emitting diode bulb device 10. The LED device 10 includes a male base 20, a columnar light-emitting element 30, and a lamp cover 80.

公基座20包括一圓柱本體21、頂面22、底面23及圓周面24。頂面22及底面23位於圓柱本體21之兩對應面,圓周面24位於圓柱本體21之表面且介於頂面22與底面23之間。圓周面24上定義有多個第一螺紋安裝部25,第一螺紋安裝部25可與一燈泡母座之第二螺紋安裝部(圖中未示)相配合,以便組裝至燈泡母座上。The male base 20 includes a cylindrical body 21, a top surface 22, a bottom surface 23, and a circumferential surface 24. The top surface 22 and the bottom surface 23 are located on two corresponding faces of the cylindrical body 21, and the circumferential surface 24 is located on the surface of the cylindrical body 21 between the top surface 22 and the bottom surface 23. A plurality of first threaded mounting portions 25 are defined on the circumferential surface 24, and the first threaded mounting portion 25 can cooperate with a second threaded mounting portion (not shown) of a bulb holder for assembly onto the bulb holder.

其可變化之例子中,公基座20呈中空狀,其中具有一連接電路組26,連接電路組26藉由公基座20電性連接柱狀體發光元件30及燈泡母座。公基座20除了與燈泡母座、柱狀體發光元件30電性連接之位置必須是導電材質外,公基座20其他部份不限為塑膠或金屬材質。In a variable example, the male base 20 is hollow, and has a connecting circuit group 26, and the connecting circuit group 26 is electrically connected to the column light-emitting element 30 and the bulb holder by the male base 20. The position of the male base 20 must be electrically conductive except for the position where the bulb base and the columnar light-emitting element 30 are electrically connected. The other parts of the male base 20 are not limited to plastic or metal.

柱狀體發光元件30位於圓柱本體21之頂面22,實體連接及電性連接公基座20(例如連接電路組26),用以藉由公基座20電性連接上述之燈泡母座。燈罩80可連接於公基座20之頂面22(如圖所示)或圓周面24,以罩蓋此柱狀體發光元件30,使得此柱狀體發光元件30位於燈罩80中。The columnar light-emitting elements 30 are located on the top surface 22 of the cylindrical body 21, and are physically and electrically connected to the male base 20 (for example, the connection circuit group 26) for electrically connecting the above-mentioned bulb holders by the male base 20. The lamp cover 80 can be coupled to the top surface 22 (as shown) or the circumferential surface 24 of the male base 20 to cover the cylindrical light-emitting element 30 such that the cylindrical light-emitting element 30 is located in the light cover 80.

其可變化之例子中,燈罩80例如為塑膠或玻璃材質、例如為透明或半透明(例如霧面)。In a variable example, the lamp cover 80 is, for example, a plastic or glass material, such as transparent or translucent (e.g., matte).

另外,柱狀體發光元件30包括至少一金屬導板40及多個發光二極體元件70(例如直流電或交流電之發光二極體元件),發光二極體元件70直接分別封裝於金屬導板40上,其中金屬導板40,例如為單層板,其材質可例如為高導熱銅片、鋁片或其他具有高導熱導電合金片。金屬導板40經裁切後可成型為多個板體50,其中任二板體50間具有一間隙G,以分隔此二鄰板體50間之實體接觸。此些發光二極體元件70分別排列於各間隙G上,跨越其中一間隙G,並各自實體連接及電性連接此間隙G兩側之板體50,此些發光二極體元件70彼此藉由間隙G兩側之板體50進行電性相接。In addition, the columnar light-emitting element 30 includes at least one metal guide 40 and a plurality of light-emitting diode elements 70 (for example, direct current or alternating current light-emitting diode elements), and the light-emitting diode elements 70 are directly packaged on the metal guides. 40, wherein the metal guide 40 is, for example, a single-layer board, and the material thereof can be, for example, a high thermal conductivity copper sheet, an aluminum sheet or other high heat conductive conductive alloy sheet. The metal guide plate 40 can be formed into a plurality of plate bodies 50 after cutting, wherein any two plates 50 have a gap G therebetween to separate the physical contact between the two adjacent plates 50. The light emitting diode elements 70 are respectively arranged on the gaps G, spanning one of the gaps G, and are physically connected and electrically connected to the board body 50 on both sides of the gap G. The light emitting diode elements 70 are borrowed from each other. Electrically connected by the plate 50 on both sides of the gap G.

藉由金屬導板40本身之導電特性,作為發光二極體元件70之間導電之媒介,使得此些發光二極體元件70之間可直接經金屬導板40經裁切後之外狀變化,而達到發光二極體元件70彼此間產生串聯或並聯之電性連接。The conductive property of the metal guide plate 40 itself serves as a medium for conducting electricity between the light-emitting diode elements 70, so that the light-emitting diode elements 70 can be directly changed by the metal guide plate 40 after being cut. The light-emitting diode elements 70 are electrically connected in series or in parallel with each other.

如此,此些發光二極體元件70無須安裝至電路板(如印刷電路板)上,即可藉由燈泡母座之電源進行發光工作。Thus, the light-emitting diode elements 70 do not need to be mounted on a circuit board (such as a printed circuit board), and can be illuminated by the power source of the bulb holder.

此外,由於金屬導板40本身具快速導熱特性以及廣大表面積之特性,本發明發光二極體燈泡裝置10便可快速降低整體熱阻並且發光二極體元件70所產生之高溫便可經金屬導板40而被快速引導至空氣中,避免發光二極體燈泡因過熱而產生損壞,造成發光效率下降以及產品壽命縮短。如此,本發明發光二極體燈泡裝置10不需刻意加裝散熱元件,也因為如此,上述公基座20之其他部份也可以為塑膠材質,如此便可降低成本,降低重量、提高容置空間或縮小整體體積。In addition, since the metal guide plate 40 itself has the characteristics of rapid thermal conductivity and a large surface area, the light-emitting diode bulb device 10 of the present invention can quickly reduce the overall thermal resistance and the high temperature generated by the light-emitting diode element 70 can be guided by the metal. The plate 40 is quickly guided into the air to prevent the LED light bulb from being damaged due to overheating, resulting in a decrease in luminous efficiency and a shortened product life. Therefore, the light-emitting diode bulb device 10 of the present invention does not need to be deliberately added with a heat dissipating component, and therefore, other parts of the male base 20 can also be made of a plastic material, thereby reducing cost, reducing weight, and improving accommodation. Space or reduce the overall volume.

此些板體50不限相同尺寸,本領域之設計人員可依實際需求調整此些發光二極體元件70之排列密度及金屬導板40之散熱面積,以提高對發光二極體元件70之散熱效果。The plate body 50 is not limited to the same size, and the designer of the art can adjust the arrangement density of the light-emitting diode elements 70 and the heat dissipation area of the metal guide plate 40 according to actual needs, so as to improve the light-emitting diode element 70. heat radiation.

本發明之另一實施例中,上述之柱狀體發光元件30具體為一多邊形柱狀體。多邊形柱狀體之變化種類可定義為其截面呈三、四、五、六、七、八邊形或同等概念之柱狀體。如第1圖所示,此說明書中僅以截面呈四邊形之柱狀體為例,其餘之柱狀體外型便可就此圖形依此類推。In another embodiment of the present invention, the columnar light-emitting element 30 is specifically a polygonal columnar body. The type of change of the polygonal columnar body can be defined as a columnar body having a cross section of three, four, five, six, seven, octagonal or equivalent concepts. As shown in Fig. 1, in this specification, only the columnar body having a quadrangular cross section is taken as an example, and the other columnar outer body type can be similarly used for this figure.

一實作上,第2A圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下於彎折前之示意圖。。金屬導板40可沿虛線L彎折後直接成型為矩形柱狀體。如此,當柱狀體發光元件30多面均具發光二極體元件70時,便可提供多方面之照明角度上。然而,各別獨立之金屬導板40亦可透過結合之方式(例如焊接或組裝)完成成上述之矩形柱狀體。In one embodiment, FIG. 2A is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed before bending according to one of the embodiments. . The metal guide 40 can be directly formed into a rectangular column after being bent along the broken line L. Thus, when the columnar light-emitting elements 30 have a plurality of light-emitting diode elements 70 on all sides, a plurality of illumination angles can be provided. However, the individual metal guide plates 40 can also be formed into a rectangular columnar body as described above by means of bonding (for example, welding or assembly).

另一實作上,第2B圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。上述之柱狀體發光元件30更包括一承載座60,承載座60對應柱狀體發光元件30之形狀,亦呈現矩形柱狀體。如此,承載座60之矩形柱狀體之各面上具有一安裝結構組62,例如固定嵌槽(如第2B圖所示)、掛勾、黏膠等。金屬導板40可為平板式,並固定於承載座60各面之安裝結構組62上。設計人員也可依實際需求加放另外之金屬導板40至多邊形柱狀體其他側面的位置。In another embodiment, Fig. 2B is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The above-mentioned columnar light-emitting element 30 further includes a carrier 60 which corresponds to the shape of the columnar light-emitting element 30 and also has a rectangular columnar body. Thus, the rectangular columnar body of the carrier 60 has a mounting structure 62 on each side, such as a fixed recess (as shown in FIG. 2B), a hook, a glue, and the like. The metal guide 40 can be flat and fixed to the mounting structure 62 on each side of the carrier 60. The designer can also add another metal guide 40 to the other side of the polygonal column as needed.

第2C圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。上述之柱狀體發光元件30具體為一圓形柱狀體。Fig. 2C is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The above-described columnar light-emitting element 30 is specifically a circular columnar body.

一實作上,金屬導板40可經彎折後直接成型為上述之圓形柱狀體(即僅第2C圖之金屬導板40)。如此,當柱狀體發光元件30周圍均勻地具有發光二極體元件70時,便可提供多方面之照明角度上。In one implementation, the metal guide 40 can be directly formed into the above-mentioned circular columnar body after being bent (ie, only the metal guide plate 40 of FIG. 2C). Thus, when the periphery of the columnar light-emitting element 30 uniformly has the light-emitting diode element 70, a plurality of illumination angles can be provided.

另一實作上,上述之柱狀體發光元件30更包括一承載座61(第2C圖),承載座61對應柱狀體發光元件30之形狀,亦呈現相當之圓形柱狀體。如此,承載座61之表面上具有一安裝結構組62,例如固定嵌槽(如第2C圖所示)、掛勾、黏膠等。金屬導板40可為捲曲式,並固定於承載座61周圍之安裝結構組62上。In another embodiment, the columnar light-emitting element 30 further includes a carrier 61 (FIG. 2C). The carrier 61 corresponds to the shape of the columnar light-emitting element 30 and also has a substantially circular columnar body. Thus, the surface of the carrier 61 has a mounting structure 62, such as a fixed recess (as shown in FIG. 2C), a hook, a glue, and the like. The metal guide 40 can be crimped and secured to the mounting structure 62 around the carrier 61.

此外,設計人員也可依實際需求加放另外之金屬導板40至圓形柱狀體頂面22或底面23的位置。In addition, the designer can also add another metal guide 40 to the position of the top surface 22 or the bottom surface 23 of the circular columnar body according to actual needs.

第2D圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。上述各實作中之承載座更可具有導線放置槽63,如此,單一金屬導板40之正、負極導線71便可隱藏於金屬導板40與承載座61、62之間,經導線放置槽63電性連接公基座20(例如連接電路組26)。Fig. 2D is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The carrier of each of the above embodiments may further have a wire placement groove 63. Thus, the positive and negative wires 71 of the single metal guide 40 can be hidden between the metal guide 40 and the carrier 61, 62. 63 is electrically connected to the male base 20 (for example, the connection circuit group 26).

第3圖是本發明發光二極體燈泡裝置之金屬導板依據此實施例之一選擇性變化下之示意圖。該些板體中例如有相平行之一第一板體200及一第二板體300。一第一間隙400位於第一板體200與第二板體300之間,並隔離第一板體200與第二板體300之實體接觸。第一板體200設有多個晶片架210,此些晶片架210分別等距地設於第一板體200之一側邊緣,且朝第一間隙400之方向伸出。此些晶片架210共同藉由第一板體200本身之導電特性彼此相互電性連接。Fig. 3 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment. For example, the first plate body 200 and the second plate body 300 are parallel to each other. A first gap 400 is located between the first plate body 200 and the second plate body 300, and isolates the physical contact between the first plate body 200 and the second plate body 300. The first board body 200 is provided with a plurality of wafer carriers 210, which are respectively disposed equidistantly on one side edge of the first board body 200 and protrude toward the first gap 400. The wafer carriers 210 are electrically connected to each other by the conductive characteristics of the first board 200 itself.

第二板體300具有多個導接部310,此些導接部310分別等距地設於第二板體300之一側邊緣、朝第一間隙400之方向伸出,且此些導接部310分別一一地對應此些晶片架210。此外,此些導接部310共同藉由第二板體300本身之導電特性彼此相互電性連接。The second plate body 300 has a plurality of guiding portions 310. The guiding portions 310 are respectively disposed equidistantly on one side edge of the second plate body 300 and protrude toward the first gap 400, and the guiding portions are connected. The portions 310 correspond to the wafer carriers 210 one by one. In addition, the guiding portions 310 are electrically connected to each other by the conductive characteristics of the second plate 300 itself.

請注意,導接部310與對應之晶片架210之間仍相隔有第一間隙400,意即導接部310仍不與對應之晶片架210實體接觸。Please note that the first gap 400 is still separated between the guiding portion 310 and the corresponding wafer carrier 210, that is, the guiding portion 310 still does not physically contact the corresponding wafer carrier 210.

見第3圖及第4圖所示,第4圖是第3圖之4-4剖面圖。一部份發光二極體元件70a分別排列於第一間隙400上,各發光二極體元件70a皆具有一發光二極體晶片510、一下封裝部520及一上封裝部530。發光二極體晶片510分別位於其中一晶片架210上,分別藉由一導線540電性連接晶片架210及導接部310。下封裝部520同時包覆晶片架210與導接部310,以結合晶片架210與導接部310為一體,而因此不致分離。上封裝部530覆蓋發光二極體晶片510,以保護發光二極體晶片510及導線540與晶片架210及導接部310之電性連接。See Figure 3 and Figure 4, and Figure 4 is a cross-sectional view of Figure 4-4. A plurality of LED components 70a are respectively arranged on the first gap 400. Each of the LED components 70a has a LED array 510, a lower package portion 520 and an upper package portion 530. The LED chips 510 are respectively disposed on one of the wafer carriers 210, and are electrically connected to the wafer carrier 210 and the guiding portion 310 by a wire 540. The lower package portion 520 simultaneously covers the wafer carrier 210 and the guiding portion 310 to integrate the wafer carrier 210 and the guiding portion 310, and thus does not separate. The upper package portion 530 covers the LED substrate 510 to protect the LEDs 510 and the wires 540 from electrically connecting to the wafer holder 210 and the guiding portion 310.

第5圖是第3圖的電路圖,參見第3圖及第5圖。具體而言,此些發光二極體元件70a分別具相反極性之第一電極511及第二電極512,第一電極511分別電性相接其發光二極體元件70a所對應之晶片架210,第二電極512分別電性相接其發光二極體元件70a所對應之導接部310。如此,發光二極體元件70a彼此並聯地電性相接。Fig. 5 is a circuit diagram of Fig. 3, see Figs. 3 and 5. Specifically, the light-emitting diode elements 70a respectively have a first electrode 511 and a second electrode 512 of opposite polarities, and the first electrodes 511 are electrically connected to the wafer carrier 210 corresponding to the light-emitting diode element 70a. The second electrode 512 is electrically connected to the guiding portion 310 corresponding to the LED body 70a. In this manner, the light emitting diode elements 70a are electrically connected in parallel with each other.

此外,參見第3圖,此些板體中更例如有一第三板體600。第三板體600平行第一板體200及第二板體300。第三板體600並排於第二板體300之一側,一第二間隙700間隔於第三板體600與第二板體300之間,並隔離第三板體600與第二板體300之實體接觸。另一部份發光二極體元件70b沿第二間隙700,線性排列於第二間隙700上。各發光二極體元件70b分別具相反極性之第三電極及第四電極(圖中未示),第三電極電性相接其一側之第二板體300。第四電極分別電性相接另側之第三板體600,其中第三電極與第二電極512之極性相反,意即當第一電極511為正極時,第二電極512為陰極,此時,第三電極為正極,而第四電極為陰極。如此,任一發光二極體元件70a與任一發光二極體元件70b彼此串聯地電性相接。In addition, referring to FIG. 3, for example, a third plate body 600 is further included in the plates. The third plate body 600 is parallel to the first plate body 200 and the second plate body 300. The third plate body 600 is arranged side by side on the side of the second plate body 300. A second gap 700 is spaced between the third plate body 600 and the second plate body 300, and isolates the third plate body 600 from the second plate body 300. Physical contact. Another portion of the light emitting diode element 70b is linearly arranged on the second gap 700 along the second gap 700. Each of the light-emitting diode elements 70b has a third electrode and a fourth electrode (not shown) of opposite polarities, and the third electrode is electrically connected to the second plate 300 of one side. The fourth electrode is electrically connected to the third plate 600 on the other side, wherein the polarity of the third electrode and the second electrode 512 are opposite, that is, when the first electrode 511 is a positive electrode, the second electrode 512 is a cathode. The third electrode is a positive electrode and the fourth electrode is a cathode. Thus, any of the light-emitting diode elements 70a and any of the light-emitting diode elements 70b are electrically connected in series to each other.

第6圖是本發明發光二極體燈泡裝置之金屬導板依據此實施例之一選擇性變化下之示意圖。第7圖是第6圖的電路圖。當朝第一間隙400與/或第二間隙700裁切一金屬導板40a時,可得至少一狹長缺口910,狹長缺口910截斷第二板體300及第三板體600後接通第一間隙400,使得被截斷成兩截後之第二板體300及第三板體600無法提供第一狹長缺口910兩側彼此間之電性連接。Fig. 6 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment. Figure 7 is a circuit diagram of Figure 6. When the metal guide 40a is cut toward the first gap 400 and/or the second gap 700, at least one narrow notch 910 is obtained, and the narrow notch 910 cuts off the second board 300 and the third board 600 and then turns on the first The gap 400 is such that the second plate body 300 and the third plate body 600 that are cut into two pieces cannot provide electrical connection between the two sides of the first elongated notch 910.

如此,被截斷後之第二板體300兩側之發光二極體元件70a彼此間為串聯之電性連接(見第7圖)。Thus, the light-emitting diode elements 70a on both sides of the second plate body 300 after being cut off are electrically connected in series with each other (see FIG. 7).

本發明之柱狀體發光元件30與公基座20之間亦可選擇性地加裝散熱元件,以更提高柱狀體發光元件30之散熱效果。此外,除加裝散熱元件,公基座20之外表面亦可選擇性地加裝金屬外殼,為考量觸電之安全性。第8圖是本發明發光二極體燈泡裝置依據此實施例之一選擇性變化下之示意圖。此散熱元件較佳地可選擇一具電絕緣特性之導熱膠H,如此,電源便無法透過導熱膠H傳遞至金屬外殼,降低觸電產生之機率。The heat dissipating component can be selectively added between the columnar light-emitting device 30 of the present invention and the male base 20 to further improve the heat dissipation effect of the columnar light-emitting device 30. In addition, in addition to the installation of the heat dissipating component, the metal base can be selectively attached to the outer surface of the male base 20 in order to consider the safety of electric shock. Figure 8 is a schematic view showing the selective replacement of the light-emitting diode bulb device of the present invention in accordance with one of the embodiments. Preferably, the heat dissipating component can select a thermal conductive adhesive H having electrical insulating properties, so that the power supply cannot be transmitted to the metal outer casing through the thermal conductive adhesive H, thereby reducing the probability of electric shock.

如此,藉由金屬導板40之高導熱特性,本發明發光二極體燈泡裝置便可快速降低整體熱阻,其產生之高溫便可快速被引導至空氣中,避免發光二極體燈泡因過熱而產生損壞,造成發光效率下降以及產品壽命縮短。Thus, by the high thermal conductivity of the metal guide 40, the light-emitting diode bulb device of the present invention can quickly reduce the overall thermal resistance, and the generated high temperature can be quickly guided into the air to prevent the LED bulb from being overheated. Damage occurs, resulting in reduced luminous efficiency and reduced product life.

同時,由於加裝散熱元件不再是散熱之必要手段,因此,若本發明發光二極體燈泡裝置省去加裝散熱元件後,其業者便可降低材料、製作成本及備料成本,提高容置空間或縮小整體體積,進而提高市場之競爭力。At the same time, since the installation of the heat dissipating component is no longer a necessary means for heat dissipation, if the light-emitting diode lamp device of the present invention eliminates the need for the heat dissipating component, the manufacturer can reduce the material, the manufacturing cost and the material preparation cost, and improve the accommodation. Space or reduce the overall volume, thereby increasing the competitiveness of the market.

以上所述,僅為本發明較佳實施例而已,故不能以此限定本發明實施的範圍,即依本發明申請專利範圍及說明書內容所作的等效變化與修飾,皆應仍屬本發明專利涵蓋的範圍內。The above is only the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still belong to the present invention. Covered by the scope.

10...發光二極體燈泡裝置10. . . Light-emitting diode bulb device

20...公基座20. . . Male base

21...圓柱本體twenty one. . . Cylindrical body

22...頂面twenty two. . . Top surface

23...底面twenty three. . . Bottom

24...圓周面twenty four. . . Circumferential surface

25...第一螺紋安裝部25. . . First threaded mounting

26...連接電路組26. . . Connected circuit group

30...柱狀體發光元件30. . . Columnar light-emitting element

40、40a...金屬導板40, 40a. . . Metal guide

50...板體50. . . Plate body

60、61...承載座60, 61. . . Carrier

62...安裝結構組62. . . Installation structure group

63...導線放置槽63. . . Wire placement slot

70、70a、70b...發光二極體元件70, 70a, 70b. . . Light-emitting diode component

71...導線71. . . wire

80...燈罩80. . . lampshade

200...第一板體200. . . First plate

300...第二板體300. . . Second plate

400...第一間隙400. . . First gap

210...晶片架210. . . Wafer holder

310...導接部310. . . Guide

510...發光二極體晶片510. . . Light-emitting diode chip

520...下封裝部520. . . Lower package

530...上封裝部530. . . Upper package

540...導線540. . . wire

511...第一電極511. . . First electrode

512...第二電極512. . . Second electrode

600...第三板體600. . . Third plate

700...第二間隙700. . . Second gap

910...狹長缺口910. . . Narrow gap

G...間隙G. . . gap

L...虛線L. . . dotted line

H...導熱膠H. . . Thermal adhesive

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之詳細說明如下:The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

第1圖是本發明發光二極體燈泡裝置依據一實施例下之示意圖。1 is a schematic view of a light-emitting diode bulb device according to an embodiment of the present invention.

第2A圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下於彎折前之示意圖。Fig. 2A is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed in accordance with one of the embodiments before bending.

第2B圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。Fig. 2B is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

第2C圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。Fig. 2C is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

第2D圖是本發明發光二極體燈泡裝置之柱狀體發光元件依據此實施例之一選擇性變化下之示意圖。Fig. 2D is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

第3圖是本發明發光二極體燈泡裝置之金屬導板依據此實施例之一選擇性變化下之示意圖。Fig. 3 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment.

第4圖是第3圖之4-4剖面圖。Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3.

第5圖是第3圖的電路圖。Fig. 5 is a circuit diagram of Fig. 3.

第6圖是本發明發光二極體燈泡裝置之金屬導板依據此實施例之一選擇性變化下之示意圖。Fig. 6 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment.

第7圖是第6圖的電路圖。Figure 7 is a circuit diagram of Figure 6.

第8圖是本發明發光二極體燈泡裝置依據此實施例之一選擇性變化下之示意圖。Figure 8 is a schematic view showing the selective replacement of the light-emitting diode bulb device of the present invention in accordance with one of the embodiments.

10...發光二極體燈泡裝置10. . . Light-emitting diode bulb device

20...公基座20. . . Male base

21...圓柱本體twenty one. . . Cylindrical body

22...頂面twenty two. . . Top surface

23...底面twenty three. . . Bottom

24...圓周面twenty four. . . Circumferential surface

25...第一螺紋安裝部25. . . First threaded mounting

26...連接電路組26. . . Connected circuit group

30...柱狀體發光元件30. . . Columnar light-emitting element

40...金屬導板40. . . Metal guide

50...板體50. . . Plate body

70...發光二極體元件70. . . Light-emitting diode component

80...燈罩80. . . lampshade

G...間隙G. . . gap

Claims (9)

一種發光二極體燈泡裝置,包括:一公基座,用以組裝至一燈泡母座;一柱狀體發光元件,連接該公基座,包括:至少一金屬導板,位於該柱狀體發光元件之一面上,該金屬導板包括:複數個板體,任二相鄰該些板體之間具一間隙,每一該些間隙分離該些板體之實體接觸,每一該些間隙一側之該板體排列有複數個晶片架,該些晶片架延伸至該間隙且彼此藉由其板體電性連接,每一該些間隙另側之該板體排列有複數個導接部,該導接部分別延伸至該間隙,並一一對應該些晶片架,且彼此藉由其板體電性連接;以及複數個發光二極體元件,每一該些發光二極體元件包括:一發光二極體晶片,位於該些晶片架其中之一,分別電性連接該間隙兩側之該晶片架及該對應之導接部;一下封裝部,跨越該些間隙其中之一並結合該間隙兩側之該晶片架與該對應之導接部;以及一上封裝部,覆蓋該發光二極體晶片;以及一燈罩,罩蓋該柱狀體發光元件。 A light-emitting diode bulb device comprising: a male base for assembling to a bulb base; a columnar light-emitting element connected to the male base, comprising: at least one metal guide plate, located in the columnar body On one side of the light-emitting element, the metal guide plate comprises: a plurality of plate bodies, and any two adjacent ones of the plates have a gap, and each of the gaps separates physical contact of the plates, and each of the gaps The board body of one side is arranged with a plurality of wafer racks, the wafer racks extend to the gap and are electrically connected to each other by a plate body, and the board body on each side of the gaps is arranged with a plurality of guiding portions The guiding portions respectively extend to the gap, and a pair of the wafer holders are electrically connected to each other by the plate body; and a plurality of light emitting diode elements, each of the light emitting diode elements includes a light-emitting diode chip, one of the chip holders, electrically connecting the wafer holders on the two sides of the gap and the corresponding guiding portions; the lower packaging portion spanning one of the gaps and combining The wafer carrier on both sides of the gap and the corresponding guide Portion; and an upper package portion, covering the light emitting diode chip; and a lampshade, the pillar cover element to emit light. 如請求項1所述之發光二極體燈泡裝置,其中該柱狀體發光元件為一多邊形柱狀體或一圓形柱狀體。 The light-emitting diode bulb device of claim 1, wherein the columnar light-emitting element is a polygonal columnar body or a circular columnar body. 如請求項1所述之發光二極體燈泡裝置,其中該至少一金屬導板為其整體彎折後所成型之一多邊形柱狀體或一圓形柱狀體。 The light-emitting diode bulb device of claim 1, wherein the at least one metal guide plate is formed by bending one of a polygonal columnar body or a circular columnar body. 如請求項1所述之發光二極體燈泡裝置,其中該柱狀體發光元件包括一承載座,該承載座之至少一面具有一安裝結構組,以供裝設該至少一金屬導板。 The light-emitting diode bulb device of claim 1, wherein the column-shaped light-emitting element comprises a carrier, and at least one side of the carrier has a mounting structure for mounting the at least one metal guide. 如請求項4所述之發光二極體燈泡裝置,其中該承載座為一多邊形柱狀體或一圓形柱狀體。 The light-emitting diode bulb device of claim 4, wherein the carrier is a polygonal columnar body or a circular columnar body. 如請求項1所述之發光二極體燈泡裝置,其中任一該些間隙上之該些發光二極體元件彼此並聯地電性相接。 The light-emitting diode device of claim 1, wherein the light-emitting diode elements on any of the gaps are electrically connected in parallel with each other. 如請求項1所述之發光二極體燈泡裝置,其中該些不同間隙上之該些發光二極體元件彼此串聯地電性相接。 The illuminating diode device of claim 1, wherein the illuminating diode elements on the different gaps are electrically connected to each other in series. 如請求項1所述之發光二極體燈泡裝置,其中該金屬導板更包括一狹長缺口,該狹長缺口截斷至少一該些板體,並接通至少一該些間隙,用以電性隔離該些被截斷板體之電性連接。 The light-emitting diode bulb device of claim 1, wherein the metal guide plate further comprises an elongated notch, the elongated notch cutting off at least one of the plates, and connecting at least one of the gaps for electrically isolating The electrically connected pieces are cut off. 如請求項1所述之發光二極體燈泡裝置,更包含一導熱膠,該導熱膠位於該公基座與該柱狀體發光元件之間。The light-emitting diode bulb device of claim 1, further comprising a thermal conductive adhesive between the male base and the columnar light-emitting element.
TW99104823A 2010-02-12 2010-02-12 Light emitting diode lamp device TWI412694B (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2006147580A (en) * 2004-11-22 2006-06-08 Osram Sylvania Inc Led lamp with led attached to heat transmissive support post, and manufacturing method for the same
TW200708684A (en) * 2005-08-31 2007-03-01 Ceramate Technical Co Ltd 360 degree light emitting vertical type high heat dissipation efficiency LED bulb
TWM311844U (en) * 2006-11-17 2007-05-11 Mgta Consultant Co Ltd Heat dissipation devices for LED lamps

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147580A (en) * 2004-11-22 2006-06-08 Osram Sylvania Inc Led lamp with led attached to heat transmissive support post, and manufacturing method for the same
TW200708684A (en) * 2005-08-31 2007-03-01 Ceramate Technical Co Ltd 360 degree light emitting vertical type high heat dissipation efficiency LED bulb
TWM311844U (en) * 2006-11-17 2007-05-11 Mgta Consultant Co Ltd Heat dissipation devices for LED lamps

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