TWI412694B - Light emitting diode lamp device - Google Patents

Abstract

A Light Emitting Diode (LED) lamp device is provided. The LED lamp device structure has a male base installing on a lamp female holder, a column emitter connected the male base, and a lamp cover covering the column emitter. The column emitter has a metal board and some LED elements. The metal plate is consisted of some plate bodies, in which each two neighboring plate bodies are separated by a slot for avoiding from a physical connection existed therebetween. The LED elements are arranged along the slots, and electrically connect with both the neighboring plate bodies placed near the LED elements. Thus, The LED elements are connected with each other via the plate bodies aside.

Description

Light-emitting diode bulb device

The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp device.

Applications of semiconductor chips such as Light Emitting Diodes (LEDs) must be packaged one by one into a light-emitting diode package structure and then removed from a lead frame for soldering to a circuit board. In order to form a light-emitting diode element, a light source capable of emitting light after being powered can be obtained. In addition, the electrodes of the LED package structure need to be taken out of the package structure to facilitate connection to the power line on the circuit board to operate or emit light.

The conventional light-emitting diode bulb is mounted on a male base by the above-mentioned light-emitting diode element. Therefore, the LED bulb can be mounted on a bulb holder. Due to the high heat generated by the light-emitting diode, the thermal energy of the light-emitting diode needs to be transmitted to the air through the light-emitting diode package structure, the male base and the bulb female seat, and also because of its thermal resistance. If the heat is too high, the heat dissipation effect of the light-emitting diode is not good. Therefore, it is necessary to develop a more effective heat dissipation method to improve the current situation of poor heat dissipation, so as to avoid damage of the light-emitting diode bulb due to overheating, resulting in a decrease in luminous efficiency. Product life is shortened.

In practice, the manufacturer usually adds different types of heat dissipating components between the LED component and the male base to reduce the thermal resistance or to transfer the high heat of the LED component to the air.

In another example, a different type of heat-conducting element (for example, a metal casing) is added between the light-emitting diode element and the male base, so that the high heat of the light-emitting diode element can be conducted through the metal casing to Reduce overall thermal resistance.

Although the installation of heat-dissipating components helps to reduce the high heat generated by the light-emitting diodes, the current market for light-emitting diode bulbs is fierce, and the industry is committed to reducing costs and increasing profits to enhance the competitiveness of the market. In this way, if the heat-dissipating component is not intentionally added, the high heat generated by the light-emitting diode can be overcome, and the original light-emitting characteristics of the light-emitting diode can be maintained, which is a goal that the industry has desired to achieve.

In addition, although the addition of a heat-conducting element can guide the high heat of the light-emitting diode element to the metal casing to reduce the overall thermal resistance, which helps to reduce the high heat generated by the light-emitting diode, however, in order to avoid the safety concerns of electric shock, the operator It is bound to increase the insulation device, which may increase the cost.

Today's market for light-emitting diode bulbs is fierce, and companies are committed to reducing costs and increasing profits to increase market competitiveness. In this way, if it is not necessary to intentionally install the heat-conducting element and the metal part of the outer casing is used, the high heat generated by the light-emitting diode can be overcome, and the original light-emitting characteristics of the light-emitting diode are maintained, which is desired by the industry. The goal.

One object of the present invention is to disclose a light-emitting diode bulb device for providing an illumination source having multiple directions and sufficient brightness.

Another object of the present invention is to disclose a light-emitting diode bulb device, which can reduce the thermal resistance without deliberately adding a heat dissipating component, and guide the high heat generated by the light-emitting diode to the air early, while maintaining the light-emitting diode. The original luminescent properties of the body.

Another object of the present invention is to disclose a light-emitting diode bulb device that does not need to be deliberately installed with a metal casing that can conduct high heat to air, and can not only guide the high heat generated by the light-emitting diode to the air, but also avoid An electric shock occurred.

The light-emitting diode bulb device comprises a male base, a columnar light-emitting element and a lamp cover. The male base is assembled to a bulb base. The columnar light-emitting element is connected to the male base, and the lamp cover covers the columnar light-emitting element. In addition, the columnar light-emitting element includes at least one metal guide and a plurality of light-emitting diode elements. The metal guide is located on one side of the columnar light-emitting element. The metal guide plate comprises a plurality of plate bodies, and a gap between any two adjacent plates has a gap, and each gap separates physical contact of the plate bodies. Each of the light-emitting diode elements spans one of the gaps and is connected to the plate body on both sides of the gap, wherein the light-emitting diode elements are electrically connected to each other by the plates on both sides of the gap.

Thus, by the high thermal conductivity of the metal guide plate, the high temperature generated by the light-emitting diode lamp device of the present invention can quickly reduce the overall thermal resistance and be guided into the air, thereby preventing the light-emitting diode bulb from being damaged due to overheating. This results in reduced luminous efficiency and reduced product life. At the same time, since the installation of the heat dissipating component is no longer a necessary means for heat dissipation, if the light emitting diode device of the present invention eliminates the need for the heat dissipating component, the manufacturer can reduce the material, the manufacturing cost, and the cost of preparing the material, and reduce the luminous cost. The overall weight of the polar bulb, increase the accommodation space or reduce the overall volume, thereby increasing the competitiveness of the market.

The present invention will be apparent from the following description and the detailed description of the embodiments of the present invention, which may be modified and modified by the teachings of the present invention without departing from the invention. The spirit and scope.

Fig. 1 is a schematic view showing the structure of a light-emitting diode bulb of the present invention according to an embodiment. The present invention provides a light emitting diode bulb device 10. The LED device 10 includes a male base 20, a columnar light-emitting element 30, and a lamp cover 80.

The male base 20 includes a cylindrical body 21, a top surface 22, a bottom surface 23, and a circumferential surface 24. The top surface 22 and the bottom surface 23 are located on two corresponding faces of the cylindrical body 21, and the circumferential surface 24 is located on the surface of the cylindrical body 21 between the top surface 22 and the bottom surface 23. A plurality of first threaded mounting portions 25 are defined on the circumferential surface 24, and the first threaded mounting portion 25 can cooperate with a second threaded mounting portion (not shown) of a bulb holder for assembly onto the bulb holder.

In a variable example, the male base 20 is hollow, and has a connecting circuit group 26, and the connecting circuit group 26 is electrically connected to the column light-emitting element 30 and the bulb holder by the male base 20. The position of the male base 20 must be electrically conductive except for the position where the bulb base and the columnar light-emitting element 30 are electrically connected. The other parts of the male base 20 are not limited to plastic or metal.

The columnar light-emitting elements 30 are located on the top surface 22 of the cylindrical body 21, and are physically and electrically connected to the male base 20 (for example, the connection circuit group 26) for electrically connecting the above-mentioned bulb holders by the male base 20. The lamp cover 80 can be coupled to the top surface 22 (as shown) or the circumferential surface 24 of the male base 20 to cover the cylindrical light-emitting element 30 such that the cylindrical light-emitting element 30 is located in the light cover 80.

In a variable example, the lamp cover 80 is, for example, a plastic or glass material, such as transparent or translucent (e.g., matte).

In addition, the columnar light-emitting element 30 includes at least one metal guide 40 and a plurality of light-emitting diode elements 70 (for example, direct current or alternating current light-emitting diode elements), and the light-emitting diode elements 70 are directly packaged on the metal guides. 40, wherein the metal guide 40 is, for example, a single-layer board, and the material thereof can be, for example, a high thermal conductivity copper sheet, an aluminum sheet or other high heat conductive conductive alloy sheet. The metal guide plate 40 can be formed into a plurality of plate bodies 50 after cutting, wherein any two plates 50 have a gap G therebetween to separate the physical contact between the two adjacent plates 50. The light emitting diode elements 70 are respectively arranged on the gaps G, spanning one of the gaps G, and are physically connected and electrically connected to the board body 50 on both sides of the gap G. The light emitting diode elements 70 are borrowed from each other. Electrically connected by the plate 50 on both sides of the gap G.

The conductive property of the metal guide plate 40 itself serves as a medium for conducting electricity between the light-emitting diode elements 70, so that the light-emitting diode elements 70 can be directly changed by the metal guide plate 40 after being cut. The light-emitting diode elements 70 are electrically connected in series or in parallel with each other.

Thus, the light-emitting diode elements 70 do not need to be mounted on a circuit board (such as a printed circuit board), and can be illuminated by the power source of the bulb holder.

In addition, since the metal guide plate 40 itself has the characteristics of rapid thermal conductivity and a large surface area, the light-emitting diode bulb device 10 of the present invention can quickly reduce the overall thermal resistance and the high temperature generated by the light-emitting diode element 70 can be guided by the metal. The plate 40 is quickly guided into the air to prevent the LED light bulb from being damaged due to overheating, resulting in a decrease in luminous efficiency and a shortened product life. Therefore, the light-emitting diode bulb device 10 of the present invention does not need to be deliberately added with a heat dissipating component, and therefore, other parts of the male base 20 can also be made of a plastic material, thereby reducing cost, reducing weight, and improving accommodation. Space or reduce the overall volume.

The plate body 50 is not limited to the same size, and the designer of the art can adjust the arrangement density of the light-emitting diode elements 70 and the heat dissipation area of the metal guide plate 40 according to actual needs, so as to improve the light-emitting diode element 70. heat radiation.

In another embodiment of the present invention, the columnar light-emitting element 30 is specifically a polygonal columnar body. The type of change of the polygonal columnar body can be defined as a columnar body having a cross section of three, four, five, six, seven, octagonal or equivalent concepts. As shown in Fig. 1, in this specification, only the columnar body having a quadrangular cross section is taken as an example, and the other columnar outer body type can be similarly used for this figure.

In one embodiment, FIG. 2A is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed before bending according to one of the embodiments. . The metal guide 40 can be directly formed into a rectangular column after being bent along the broken line L. Thus, when the columnar light-emitting elements 30 have a plurality of light-emitting diode elements 70 on all sides, a plurality of illumination angles can be provided. However, the individual metal guide plates 40 can also be formed into a rectangular columnar body as described above by means of bonding (for example, welding or assembly).

In another embodiment, Fig. 2B is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The above-mentioned columnar light-emitting element 30 further includes a carrier 60 which corresponds to the shape of the columnar light-emitting element 30 and also has a rectangular columnar body. Thus, the rectangular columnar body of the carrier 60 has a mounting structure 62 on each side, such as a fixed recess (as shown in FIG. 2B), a hook, a glue, and the like. The metal guide 40 can be flat and fixed to the mounting structure 62 on each side of the carrier 60. The designer can also add another metal guide 40 to the other side of the polygonal column as needed.

Fig. 2C is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The above-described columnar light-emitting element 30 is specifically a circular columnar body.

In one implementation, the metal guide 40 can be directly formed into the above-mentioned circular columnar body after being bent (ie, only the metal guide plate 40 of FIG. 2C). Thus, when the periphery of the columnar light-emitting element 30 uniformly has the light-emitting diode element 70, a plurality of illumination angles can be provided.

In another embodiment, the columnar light-emitting element 30 further includes a carrier 61 (FIG. 2C). The carrier 61 corresponds to the shape of the columnar light-emitting element 30 and also has a substantially circular columnar body. Thus, the surface of the carrier 61 has a mounting structure 62, such as a fixed recess (as shown in FIG. 2C), a hook, a glue, and the like. The metal guide 40 can be crimped and secured to the mounting structure 62 around the carrier 61.

In addition, the designer can also add another metal guide 40 to the position of the top surface 22 or the bottom surface 23 of the circular columnar body according to actual needs.

Fig. 2D is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments. The carrier of each of the above embodiments may further have a wire placement groove 63. Thus, the positive and negative wires 71 of the single metal guide 40 can be hidden between the metal guide 40 and the carrier 61, 62. 63 is electrically connected to the male base 20 (for example, the connection circuit group 26).

Fig. 3 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment. For example, the first plate body 200 and the second plate body 300 are parallel to each other. A first gap 400 is located between the first plate body 200 and the second plate body 300, and isolates the physical contact between the first plate body 200 and the second plate body 300. The first board body 200 is provided with a plurality of wafer carriers 210, which are respectively disposed equidistantly on one side edge of the first board body 200 and protrude toward the first gap 400. The wafer carriers 210 are electrically connected to each other by the conductive characteristics of the first board 200 itself.

The second plate body 300 has a plurality of guiding portions 310. The guiding portions 310 are respectively disposed equidistantly on one side edge of the second plate body 300 and protrude toward the first gap 400, and the guiding portions are connected. The portions 310 correspond to the wafer carriers 210 one by one. In addition, the guiding portions 310 are electrically connected to each other by the conductive characteristics of the second plate 300 itself.

Please note that the first gap 400 is still separated between the guiding portion 310 and the corresponding wafer carrier 210, that is, the guiding portion 310 still does not physically contact the corresponding wafer carrier 210.

See Figure 3 and Figure 4, and Figure 4 is a cross-sectional view of Figure 4-4. A plurality of LED components 70a are respectively arranged on the first gap 400. Each of the LED components 70a has a LED array 510, a lower package portion 520 and an upper package portion 530. The LED chips 510 are respectively disposed on one of the wafer carriers 210, and are electrically connected to the wafer carrier 210 and the guiding portion 310 by a wire 540. The lower package portion 520 simultaneously covers the wafer carrier 210 and the guiding portion 310 to integrate the wafer carrier 210 and the guiding portion 310, and thus does not separate. The upper package portion 530 covers the LED substrate 510 to protect the LEDs 510 and the wires 540 from electrically connecting to the wafer holder 210 and the guiding portion 310.

Fig. 5 is a circuit diagram of Fig. 3, see Figs. 3 and 5. Specifically, the light-emitting diode elements 70a respectively have a first electrode 511 and a second electrode 512 of opposite polarities, and the first electrodes 511 are electrically connected to the wafer carrier 210 corresponding to the light-emitting diode element 70a. The second electrode 512 is electrically connected to the guiding portion 310 corresponding to the LED body 70a. In this manner, the light emitting diode elements 70a are electrically connected in parallel with each other.

In addition, referring to FIG. 3, for example, a third plate body 600 is further included in the plates. The third plate body 600 is parallel to the first plate body 200 and the second plate body 300. The third plate body 600 is arranged side by side on the side of the second plate body 300. A second gap 700 is spaced between the third plate body 600 and the second plate body 300, and isolates the third plate body 600 from the second plate body 300. Physical contact. Another portion of the light emitting diode element 70b is linearly arranged on the second gap 700 along the second gap 700. Each of the light-emitting diode elements 70b has a third electrode and a fourth electrode (not shown) of opposite polarities, and the third electrode is electrically connected to the second plate 300 of one side. The fourth electrode is electrically connected to the third plate 600 on the other side, wherein the polarity of the third electrode and the second electrode 512 are opposite, that is, when the first electrode 511 is a positive electrode, the second electrode 512 is a cathode. The third electrode is a positive electrode and the fourth electrode is a cathode. Thus, any of the light-emitting diode elements 70a and any of the light-emitting diode elements 70b are electrically connected in series to each other.

Fig. 6 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment. Figure 7 is a circuit diagram of Figure 6. When the metal guide 40a is cut toward the first gap 400 and/or the second gap 700, at least one narrow notch 910 is obtained, and the narrow notch 910 cuts off the second board 300 and the third board 600 and then turns on the first The gap 400 is such that the second plate body 300 and the third plate body 600 that are cut into two pieces cannot provide electrical connection between the two sides of the first elongated notch 910.

Thus, the light-emitting diode elements 70a on both sides of the second plate body 300 after being cut off are electrically connected in series with each other (see FIG. 7).

The heat dissipating component can be selectively added between the columnar light-emitting device 30 of the present invention and the male base 20 to further improve the heat dissipation effect of the columnar light-emitting device 30. In addition, in addition to the installation of the heat dissipating component, the metal base can be selectively attached to the outer surface of the male base 20 in order to consider the safety of electric shock. Figure 8 is a schematic view showing the selective replacement of the light-emitting diode bulb device of the present invention in accordance with one of the embodiments. Preferably, the heat dissipating component can select a thermal conductive adhesive H having electrical insulating properties, so that the power supply cannot be transmitted to the metal outer casing through the thermal conductive adhesive H, thereby reducing the probability of electric shock.

Thus, by the high thermal conductivity of the metal guide 40, the light-emitting diode bulb device of the present invention can quickly reduce the overall thermal resistance, and the generated high temperature can be quickly guided into the air to prevent the LED bulb from being overheated. Damage occurs, resulting in reduced luminous efficiency and reduced product life.

At the same time, since the installation of the heat dissipating component is no longer a necessary means for heat dissipation, if the light-emitting diode lamp device of the present invention eliminates the need for the heat dissipating component, the manufacturer can reduce the material, the manufacturing cost and the material preparation cost, and improve the accommodation. Space or reduce the overall volume, thereby increasing the competitiveness of the market.

The above is only the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still belong to the present invention. Covered by the scope.

10. . . Light-emitting diode bulb device

20. . . Male base

twenty one. . . Cylindrical body

twenty two. . . Top surface

twenty three. . . Bottom

twenty four. . . Circumferential surface

25. . . First threaded mounting

26. . . Connected circuit group

30. . . Columnar light-emitting element

40, 40a. . . Metal guide

50. . . Plate body

60, 61. . . Carrier

62. . . Installation structure group

63. . . Wire placement slot

70, 70a, 70b. . . Light-emitting diode component

71. . . wire

80. . . lampshade

200. . . First plate

300. . . Second plate

400. . . First gap

210. . . Wafer holder

310. . . Guide

510. . . Light-emitting diode chip

520. . . Lower package

530. . . Upper package

540. . . wire

511. . . First electrode

512. . . Second electrode

600. . . Third plate

700. . . Second gap

910. . . Narrow gap

G. . . gap

L. . . dotted line

H. . . Thermal adhesive

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

1 is a schematic view of a light-emitting diode bulb device according to an embodiment of the present invention.

Fig. 2A is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed in accordance with one of the embodiments before bending.

Fig. 2B is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

Fig. 2C is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

Fig. 2D is a schematic view showing the columnar light-emitting element of the light-emitting diode bulb device of the present invention selectively changed according to one of the embodiments.

Fig. 3 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment.

Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3.

Fig. 5 is a circuit diagram of Fig. 3.

Fig. 6 is a schematic view showing the metal guide plate of the light-emitting diode bulb device of the present invention selectively changed according to one embodiment of the embodiment.

Figure 7 is a circuit diagram of Figure 6.

Figure 8 is a schematic view showing the selective replacement of the light-emitting diode bulb device of the present invention in accordance with one of the embodiments.

10. . . Light-emitting diode bulb device

20. . . Male base

twenty one. . . Cylindrical body

twenty two. . . Top surface

twenty three. . . Bottom

twenty four. . . Circumferential surface

25. . . First threaded mounting

26. . . Connected circuit group

30. . . Columnar light-emitting element

40. . . Metal guide

50. . . Plate body

70. . . Light-emitting diode component

80. . . lampshade

G. . . gap

Claims (9)

A light-emitting diode bulb device comprising: a male base for assembling to a bulb base; a columnar light-emitting element connected to the male base, comprising: at least one metal guide plate, located in the columnar body On one side of the light-emitting element, the metal guide plate comprises: a plurality of plate bodies, and any two adjacent ones of the plates have a gap, and each of the gaps separates physical contact of the plates, and each of the gaps The board body of one side is arranged with a plurality of wafer racks, the wafer racks extend to the gap and are electrically connected to each other by a plate body, and the board body on each side of the gaps is arranged with a plurality of guiding portions The guiding portions respectively extend to the gap, and a pair of the wafer holders are electrically connected to each other by the plate body; and a plurality of light emitting diode elements, each of the light emitting diode elements includes a light-emitting diode chip, one of the chip holders, electrically connecting the wafer holders on the two sides of the gap and the corresponding guiding portions; the lower packaging portion spanning one of the gaps and combining The wafer carrier on both sides of the gap and the corresponding guide Portion; and an upper package portion, covering the light emitting diode chip; and a lampshade, the pillar cover element to emit light. The light-emitting diode bulb device of claim 1, wherein the columnar light-emitting element is a polygonal columnar body or a circular columnar body. The light-emitting diode bulb device of claim 1, wherein the at least one metal guide plate is formed by bending one of a polygonal columnar body or a circular columnar body. The light-emitting diode bulb device of claim 1, wherein the column-shaped light-emitting element comprises a carrier, and at least one side of the carrier has a mounting structure for mounting the at least one metal guide. The light-emitting diode bulb device of claim 4, wherein the carrier is a polygonal columnar body or a circular columnar body. The light-emitting diode device of claim 1, wherein the light-emitting diode elements on any of the gaps are electrically connected in parallel with each other. The illuminating diode device of claim 1, wherein the illuminating diode elements on the different gaps are electrically connected to each other in series. The light-emitting diode bulb device of claim 1, wherein the metal guide plate further comprises an elongated notch, the elongated notch cutting off at least one of the plates, and connecting at least one of the gaps for electrically isolating The electrically connected pieces are cut off. The light-emitting diode bulb device of claim 1, further comprising a thermal conductive adhesive between the male base and the columnar light-emitting element.