JP2014116526A - Substrate, led unit and the same, and lighting device including led unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate which efficiently radiates heat generated by a semiconductor light emitting element, for example, an LED, and to provide an LED unit and the substrate and a lighting device including the LED unit.SOLUTION: A substrate comprises: a base 11 formed by a high heat conductive resin; and multiple electrodes 21 provided on the base 11. The electrodes 21 are formed by copper plates or copper alloy plates. Predetermined spaces are respectively provided at areas between the electrodes 21.

Description

  The present invention relates to a board, an LED unit, and the lighting fixture including the board and the LED unit.

  LED lighting will be used instead of conventional incandescent bulbs and fluorescent lamps in order to extend the life of lighting fixtures installed in general houses, offices, factories, shops, outdoors, etc. and to reduce power consumption. It has become to.

  It is known that the lifetime of LED lighting correlates with an increase in LED temperature. It is said that the LED is deteriorated due to heat generation because the LED emits high luminance light by applying a low voltage and large current during use. In the worst case, the LED is damaged, and it is difficult to realize a long life. In order to avoid the LED from being damaged by heat generation, it is necessary to keep the temperature of the semiconductor portion of the LED, that is, the junction temperature below a specified value.

  Also, LED lighting has a small LED chip, and the amount of heat generated per unit area is extremely large. From these factors, a substrate, an LED unit, and a lighting fixture including the substrate and the LED unit are required to have high heat dissipation.

JP 2010-251248 A

  However, as shown in FIG. 14, a general printed circuit board 100 is composed of an electrode 101 made of a copper foil having a thickness of 35 μm, a base 102 made of an epoxy resin, and the like. The heat generated could not be dissipated sufficiently. For this reason, the junction temperature of the LED 103 cannot be suppressed to a specified value or less, and problems such as shortening the lifetime of the LED have occurred.

  Therefore, by providing the LED lighting apparatus with a large heat sink as disclosed in Patent Document 1, the heat generated by the LED is radiated to ensure necessary heat dissipation. On the other hand, by providing a heat sink or the like, it is inevitable to increase the size and weight of the LED lighting fixture.

  The present invention has been made in view of the above problems, and an object of the present invention is to realize a reduction in size and weight of a lighting fixture, and an LED unit that can efficiently dissipate heat generated by an LED. Another object of the present invention is to provide a lighting fixture including the substrate and the LED unit.

The board | substrate of this invention made | formed in order to solve the said subject has a base formed from highly heat conductive resin, and the some electrode provided on the said base, The said electrode is a copper plate or copper It is formed from an alloy plate, and a predetermined interval is provided between the electrodes.
With this configuration, for example, when an LED is provided on the substrate, the heat generated by the LED can be efficiently radiated.

In the substrate of the present invention, the substrate is provided by simultaneously molding an electric circuit board in which the electrodes are connected by a connecting portion and the base, and the connecting portion is cut during the simultaneous forming. It is characterized by.
With this configuration, a substrate having high thermal conductivity and high heat dissipation can be manufactured by an easy process.

In the substrate of the present invention, the electrodes are arranged in a plurality of rows, and the electrodes in adjacent rows are arranged at positions shifted from each other in the row direction.
With this configuration, when the LEDs are arranged, the light emitted from the LEDs can be made more uniform.

Further, the substrate of the present invention is characterized in that the electrodes are formed in a step shape and the electrodes are arranged in the same direction.
With this configuration, the rigidity against bending of the substrate can be improved, and the thickness of the substrate can be further reduced.

Moreover, the semiconductor light emitting element unit of this invention has the board | substrate in any one of Claims 1-4, the semiconductor light emitting element arrange | positioned between the said electrodes, and the terminal block which supplies electric power to the said board | substrate. It is characterized by.
With this configuration, the semiconductor light emitting element unit, that is, the LED unit, can efficiently dissipate heat generated by the LED that is the semiconductor light emitting element.

Moreover, the lighting fixture of this invention has the semiconductor light-emitting device unit of Claim 5, and the metal heat radiation stand fixed to the said semiconductor light-emitting device unit, It is characterized by the above-mentioned.
With this configuration, heat generated from a semiconductor light-emitting element, for example, an LED can be conducted to the heat radiating table via the semiconductor light-emitting element unit, and can be radiated more efficiently.

Moreover, the lighting fixture of this invention is characterized by the said heat sink being fixed to a metal lighting fixture main body.
With this configuration, it is possible to dissipate heat more efficiently by conducting heat generated from a semiconductor light emitting element, for example, an LED, to the luminaire main body through the semiconductor light emitting element unit and the heat radiating stand.

Further, the substrate manufacturing method of the present invention includes a step of forming an electric circuit board formed of a copper plate or a copper alloy plate and having a plurality of electrodes connected by a connecting portion, and the electric circuit board is set in a predetermined formwork. And filling the melted high thermal conductive resin into the predetermined mold, and the filling portion is cut when the molten high thermal conductive resin is filled.
With this configuration, it is possible to simplify the manufacturing process of the substrate that can efficiently dissipate the heat generated by the LED, which is a semiconductor light emitting element, and to reduce the manufacturing cost.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to thermally radiate the heat | fever which LED lighting generate | occur | produces efficiently, it also becomes possible to implement | achieve size reduction and weight reduction of a LED lighting fixture.

It is the schematic diagram which showed the whole structure of the board | substrate of this embodiment. It is a component expanded view of the board | substrate of this embodiment. (A) is a schematic diagram which shows the 1st modification of the base of this embodiment, (b) is a schematic diagram which shows the 2nd modification of the base of this embodiment. (A) is a schematic diagram which shows the 3rd modification of the base of this embodiment, (b) is a schematic diagram which shows the 4th modification of the base of this embodiment, (c) is this implementation. It is a schematic diagram which shows the 5th modification of the base of a form. It is the elements on larger scale of the electrical circuit board of this embodiment. (A) is a schematic diagram which shows the 1st modification of the electrode of this embodiment, (b) is a schematic diagram which shows the 2nd modification of the electrode of this embodiment. (A) is the schematic diagram which showed the whole structure of the LED unit of this embodiment, (b) is the components expanded view of the LED unit of this embodiment. (A) is a whole figure of the lighting fixture of this embodiment, (b) is the elements on larger scale of the lighting fixture of this embodiment. (A) is a schematic diagram which shows the state before adhering a heat sink to the LED unit of this embodiment, (b) is a schematic diagram which shows the state after adhering the heat sink to the LED unit of this embodiment. is there. It is a fragmentary sectional view of the lighting fixture of this embodiment. It is a cross-sectional schematic diagram for demonstrating the LED unit of this embodiment. It is a cross-sectional schematic diagram for demonstrating one modification of the connection piece of this embodiment. It is a cross-sectional schematic diagram for demonstrating another modification of the connection piece of this embodiment. It is a cross-sectional schematic diagram for demonstrating the LED unit of a prior art.

  Hereinafter, the board | substrate, LED unit of the embodiment of this invention, the said lighting apparatus provided with the said board | substrate, and LED unit are demonstrated based on drawing.

  First, the structure of the board | substrate of this embodiment is demonstrated based on FIGS. FIG. 1 is a schematic diagram showing the overall configuration of the substrate of this embodiment. FIG. 2 is a component development view of the board of this embodiment.

  The substrate 10 includes a base 11 made of a high thermal conductive resin and a plurality of electrodes 21 provided on the base 11.

  The base 11 is formed from an injection molding material and an insulating material. For example, the base 11 is good to be formed from highly heat conductive resin. In the present embodiment, the base 11 is formed by filling molten high heat conductive resin in a mold (not shown). The base 11 may be a flat surface on the side where the electrodes 21 are not arranged.

  As a modification of the base 11, a configuration may be adopted in which the light irradiated from the LED is collected and a reflecting portion that is parallel light is integrally provided by simultaneous molding. For example, as a first modification of the base 11, a base 11a shown in FIG. 3A may have a configuration in which a cup-shaped reflecting portion 12a protrudes. The reflection part 12a can suppress the usage-amount of the material used for the base 11a.

  As a second modification of the base 11, the base 11 b shown in FIG. 3B may have a configuration having a reflecting portion 12 b cut out in a cup shape. Since the reflecting portion 12b is easier to shape than the cup shape of the reflecting portion 12a, the manufacturing process of the molding die is facilitated and the manufacturing cost can be reduced.

  As a third modification of the base 11, a base 11 c shown in FIG. 4A is configured to form engaging portions 14 and 14 that protrude outward from the side surface 13 of the base 11 c. The engaging portions 14 and 14 can engage with a fixing base (not shown) to fix the substrate 10c. And since the base 10c is being fixed, it becomes possible to solder the LED32 mentioned later smoothly.

  As a fourth modification of the base 11, the base 11 d shown in FIG. 4B may be provided with a protrusion 15 that engages with an electrode 21 described later. The protrusion 15 can prevent the electrode 21 from shifting from a predetermined position.

  Furthermore, as a fifth modification of the base 11, a base 11 e shown in FIG. 4C may form a terminal block 32 to be described later and a holding portion 16 that holds it. In order to securely hold the end stop portion 32, the holding portion 16 makes it difficult to remove the end stop portion 32 when the substrate 10 is fixed to a heat radiating base 41, which will be described later, and facilitates the fixing operation.

  The electrodes 21 are formed from a copper plate or a copper alloy plate, and a predetermined interval is provided between the electrodes 21. In this embodiment, the electrode 21 is formed from a copper plate or a copper alloy plate having a thickness of 0.2 to 0.4 mm. Connection pieces 22 are formed so as to protrude outward from both sides of the left and right side surfaces of the electrode 21. The connection piece 22 is soldered to the LED 31 described later, whereby the electrode 21 is electrically connected to the LED 31.

  In the present embodiment, the electrode 21 is formed in a rectangular shape. The row of electrodes 21 composed of a plurality of electrodes 21 is arranged in parallel on the base 11 such that the connection pieces 22 of one electrode 21 and the connection pieces 22 of the other electrode 21 face each other. In addition, the electrode 21 may not be a rectangular shape but may have another shape, or a configuration in which only one row is arranged. In addition, you may provide the protrusion part 23 which protrudes in the back surface side of the electrode 21. FIG. The protrusion 23 prevents a problem that the electrode 21 is displaced from a predetermined position (see FIG. 5).

  As a first modification of the electrode 21, as shown in FIG. 6A, the electrodes 21a and 21a in the adjacent rows are arranged in positions shifted in the column direction, arranged in a plurality of rows made up of a plurality of electrodes 21a. The The LED 31 soldered between the connecting pieces 22 and 22 of the electrode 21a is arranged so as to be shifted between adjacent rows, and the light emitted from the LED 31 is made uniform.

  As a second modification of the electrode 21, as shown in FIG. 6 (b), the electrodes 21b are formed in a step shape, and the electrodes 21b are arranged in the same row, and the electrodes 21b are arranged apart from each other. The configuration. Specifically, the electrode 21b includes a first step portion 211, a second step portion 212, and a third step portion 213, and is formed in a step shape. The first step portion 211 of one electrode 21b and the first step portion 211 of the other electrode 21b are arranged in the same row. Similarly, the second stepped portion 212 of one electrode 21b and the second stepped portion 212 of the other electrode 21b are arranged in the same row. Further, the third stepped portion 213 of one electrode 21b and the third stepped portion 213 of the other electrode 21b are arranged in the same row. That is, one electrode 21b and the other electrode 21b are arranged like a concrete block stacked on a brick or an outer wall laid on a road or the like. With such an arrangement, the electrode 21b always passes through a cross section perpendicular to the column direction of the substrate 10b. With this configuration, the bending strength of the substrate 10b can be increased, and the thickness of the substrate 10b can be reduced. Therefore, the weight of the substrate 10b can be reduced.

  Further, the insulating layer 26 may be provided over the entire surface of the substrate 10 (see FIG. 11). For example, the insulating layer 26 is deposited by silk screen printing on the surface of the substrate 10 on the side where the electrodes 21 are provided. In the present embodiment, the insulating layer 26 is formed on the entire surface of the substrate 10 except for the connection piece 22 of the electrode 21. Further, as the insulating layer 26, an insulating resin may cover the surface of the substrate 10 on the side where the electrode 21 is provided. On the other hand, a configuration in which the insulating layer 26 is not provided is also possible.

  An example of the manufacturing procedure of the substrate 10 will be described below.

  First, a copper plate or a copper alloy plate (not shown) is pressed to form an electric circuit plate 25 in which a plurality of electrodes 21 are connected via connecting portions 24.

  After the molded electric circuit board 25 is set in a mold (not shown), the molten high heat conductive resin is filled in the mold, and the base 11 is formed, whereby the substrate 10 is simultaneously molded. In the simultaneous molding, the connecting portion 24 between the electrodes 21 is cut by a cutting machine (not shown).

  An insulating layer 26 is deposited on the surface of the simultaneously formed substrate 10 by silk screen printing. In the present embodiment, the insulating layer 26 is deposited on the entire surface of the substrate 10 except for the connection piece 22 of the electrode 21.

  Next, the structure of the LED unit 30 of this embodiment is demonstrated based on FIG. FIG. 7A is a schematic view showing the overall configuration of the LED unit 30 of the present embodiment, and FIG. 7B is a component development view of the LED unit 30 of the present embodiment.

  The LED unit 30 includes a substrate 10, an LED 31 that is a semiconductor light emitting element disposed between the electrodes 21, and a terminal block 32 that supplies power to the substrate 10.

  The LED 31 includes a general LED chip and a terminal that can be electrically connected to the electrode 21. Here, a general LED chip is an LED chip that emits white light or light bulb light by passing blue LED light through a yellow phosphor. Also, general LED chips include LED chips that emit white light or light bulbs by mixing three colors of blue, red, and green. Furthermore, the LED 31 is electrically connected by being soldered to the connection piece 22 of one electrode 21 and the connection piece 22 of the other electrode 21.

  The terminal block 32 includes a terminal 33 that can be electrically connected to the electrode 21, an electric cord 34 that can be electrically connected to a power source (not shown), and a terminal block main body 35 that converts alternating current supplied from the electric cord 34 into direct current. And have. As shown in FIG. 7, the terminal block 32 is disposed at a predetermined position on the substrate 10, and the terminal 33 is electrically connected to the electrode 21.

  The LED unit 30 is fixed to a heat radiating table 41 described later with screws 43. Further, the base 11 of the LED unit 30 is fixed so as to be in close contact with the heat radiating base 41.

  The manufacturing procedure of the LED unit 30 will be described below.

  The substrate 10 is fixed to a fixed base (not shown) with the side on which the electrode 21 is provided being the front side. Then, the terminal of the LED 31 is soldered between the connection pieces 22 and 22 of the electrode 21. The terminal block 32 is disposed at a predetermined position on the substrate 10 so as to connect the terminal 33 to the electrode 21.

  Furthermore, the structure of the lighting fixture 40 of this embodiment is demonstrated based on FIGS. Moreover, Fig.8 (a) is a general view of the lighting fixture of this embodiment, FIG.8 (b) is the elements on larger scale of the lighting fixture of this embodiment. FIG. 9A is a schematic diagram showing a state before the heat sink is fixed to the LED unit of the present embodiment, and FIG. 9B is a state after the heat sink is fixed to the LED unit of the present embodiment. It is a schematic diagram shown. FIG. 10 is a partial cross-sectional view of the lighting fixture of the present embodiment.

  As for the lighting fixture 40, the heat sink 41 is fixed to the metal lighting fixture main body 42. As shown in FIG. The lighting fixture 40 is, for example, a disk-shaped lighting fixture that can be installed on the ceiling.

  The heat radiating table 41 is preferably made of metal, particularly aluminum having high thermal conductivity and light weight. The LED unit 30 is fixed to the heat sink 41. Further, the heat radiating table 41 is fixed at a predetermined position of the lighting fixture main body 42. In this embodiment, the heat sink 41 is arrange | positioned radially.

  The luminaire main body 42 may be made of metal, particularly aluminum having high thermal conductivity and light weight. The luminaire main body 42 may have a configuration in which a long hole or the like is provided in order to ensure heat dissipation and reduce the weight of the luminaire.

  The manufacturing procedure of the lighting fixture 40 will be described below.

  The LED unit 30 is fixed to the heat radiation table 41 so that the surface on which the electrodes 21 are not arranged, that is, the back surface of the substrate 10 is in close contact. In the present embodiment, the LED unit 30 is screwed to the heat radiating table 41 with screws 43. Since the back surface of the substrate 10 is formed into a flat surface, the substrate 10 and the heat radiation table 41 can be easily adhered to each other. Specifically, as shown in FIG. 11, the heat generated from the LED 31 is conducted from the electrode 21 to the base 11 and from the base 11 to the heat radiating base 41, whereby the thermal conductivity of the LED unit 30 is increased. It becomes easier to ensure sufficient heat dissipation.

  The heat sink 41 to which the LED unit 30 is fixed is fixed to the lighting fixture main body 42. In this embodiment, the heat sink 41 is fixed to the lighting fixture main body 42 so that it may arrange | position radially.

  The electrode 21 which comprises the board | substrate 10 of this embodiment is formed from a copper plate or a copper alloy plate, and the plate | board thickness is very large compared with copper foil. With this configuration, the heat generated by the LED 31 is conducted not only in the horizontal direction of the electrode 21 but also in the vertical direction, so that the electrode 21 has a higher thermal conductivity than an electrode made of copper foil. That is, since the electrode 21 has high thermal conductivity, sufficient heat dissipation can be ensured.

  Moreover, since the base 11 which comprises the board | substrate 10 of this embodiment is shape | molded from highly heat conductive resin, the heat which LED31 generate | occur | produces can be conducted efficiently, and sufficient heat dissipation is ensured. it can.

  In the LED unit 30 of the present embodiment, the heat radiating base 41 efficiently conducts heat generated from the LEDs and can improve heat dissipation. Moreover, since the LED unit 30 is lightweight, the number which can be arrange | positioned to a lighting fixture can be increased, and it is possible to raise the emitted light intensity of a lighting fixture. Furthermore, since the LED unit 30 has ensured sufficient heat dissipation, it is possible to use an LED with higher emission intensity.

  Since the lighting fixture 40 of this embodiment can conduct the heat | fever which LED generate | occur | produces efficiently because the heat sink 41 and the lighting fixture main body 42 are the products made from aluminum, it is possible to radiate more reliably. Become.

  In addition, this invention is not limited to embodiment mentioned above, A various change is possible within the range of the summary.

  The substrate 10 of this embodiment may be configured such that the surface of the base 11 on which the electrode 21 is not provided, that is, the shape of the back surface is provided with an uneven portion. Due to the uneven portion, sufficient heat dissipation can be ensured, and the heat radiating table 41 becomes unnecessary. In addition, the substrate 10 provided with the concavo-convex portion can be directly attached to the luminaire main body 42.

  As shown in FIG. 12, the connection piece 22 of this embodiment may be a connection piece 22a bent inward, and the LED 31 may be press-fitted between one connection piece 22a and another connection piece 22a. The LED 31 is temporarily fixed by the spring characteristic of the connection piece 22a. It is possible to prevent the LED 31 from being displaced during the subsequent soldering between the connection piece 22a and the LED 31. It is also possible to adopt a configuration in which the connection piece 22a and the LED 31 are not soldered.

  As shown in FIG. 13, one of the connection pieces 22 and 22 on both sides of the electrode 21 of the present embodiment may be a convex portion. By soldering the LED 31 with a predetermined inclination, the irradiation direction of the LED 31 can be inclined in an arbitrary direction.

  Further, when the substrate 10 of the present embodiment is simultaneously formed, the surface of the base 11 on which the electrode 21 is not provided, that is, the shape of the back surface may be formed in an uneven shape. Due to this uneven shape, sufficient heat dissipation can be ensured, the heat radiation base 41 is not required, and the substrate 10 can be directly attached to the lighting fixture main body 42.

DESCRIPTION OF SYMBOLS 10 ... Board | substrate 11, 11a, 11b, 11c, 11d, 11e ... Base 12a, 12b ... Reflection part 13 ... Side surface 14 ... Engagement part 15 ... Protrusion part 16 ... Holding part 21, 21a, 21b ... Electrode 22, 22a ... Connection piece 23 ... Projection part 24 ... Connection part 25 ... Electric circuit board 26 ... Insulating layer 30 ... LED unit 31 ... LED
32 ... Terminal block 33 ... Terminal 34 ... Electrical cord 35 ... Terminal block body 40 ... Lighting fixture 41 ... Radiation table 42 ... Lighting fixture main body 100 ... Printed circuit board 101 ... Electrode 102 ... Base 103 ... LED
211 ... 1st step part 212 ... 2nd step part 213 ... 3rd step part

Claims (8)

A base formed from a high thermal conductive resin;
A plurality of electrodes provided on the base;
Have
The substrate is formed of a copper plate or a copper alloy plate, and a predetermined interval is provided between the electrodes.   2. The board according to claim 1, wherein the substrate is provided by simultaneously molding an electric circuit board in which the electrodes are connected by a connecting portion and the base, and the connecting portion is cut during the simultaneous forming. The substrate described.   The substrate according to claim 1, wherein the electrodes are arranged in a plurality of rows, and the electrodes in adjacent rows are arranged at positions shifted from each other in the row direction.   The substrate according to claim 1, wherein the electrodes are formed in a stepped shape, and the electrodes are arranged in the same direction. A substrate according to any one of claims 1 to 4,
A semiconductor light emitting device disposed between the electrodes;
A terminal block for supplying power to the substrate;
A semiconductor light emitting element unit comprising: The semiconductor light-emitting element unit according to claim 5;
A metal heat sink fixed to the semiconductor light emitting element unit;
The lighting fixture characterized by having.   The luminaire according to claim 6, wherein the heat radiating stand is fixed to a metal luminaire main body. Forming a circuit board formed of a copper plate or a copper alloy plate and having a plurality of electrodes connected by a connecting portion;
Setting the electrical circuit board in a predetermined mold, and filling the melted high thermal conductive resin in the predetermined mold,
The substrate manufacturing method is characterized in that the connecting portion is cut when the molten high thermal conductive resin is filled.

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