JP3112555U - Light-emitting diode lamp heat dissipation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a light emitting diode lamp capable of effectively radiating heat generated from the light emitting diode, protecting the light emitting diode and enabling long-term use.
SOLUTION: A heat radiating plate 2 made of a material having high thermal conductivity and a substrate 4 are laminated with a heat conductive pad 3 made of a material having high thermal conductivity and rich in insulation sandwiched therebetween, and the heat radiating plate 2 A plurality of light emitting diodes 1 are arranged on the surface of the light emitting diode 1 to form a planar light emitting body, and the terminals 11 of the light emitting diodes 1 are inserted into the upper insertion holes 21 formed in the heat radiating plate 2, thereby It penetrates and is inserted and joined to a lower insertion hole 41 formed in the substrate 4.
[Selection] Figure 3

Description

  The present invention relates to a heat dissipation structure of a light-emitting diode lamp suitable for a high-efficiency lamp such as a street light, a beam light, and a traffic light lamp.

Household lamps have changed from incandescent bulbs with high wattage to fluorescent lamps for a long time, and then changed from fluorescent lamps to power-saving PL lights and bulbs with stable periods. There has been significant progress in the meantime.
However, lamps that require high projectability and high illumination intensity remain at a stage where power consumption and heat generation are high for a long time, which poses a major safety problem.
In particular, street lamps and beam lights are used in a state in which the lamp cover is completely sealed. Therefore, the temperature rise in the sealed space due to the heat of the lamp becomes very large, and the danger is high.

For this reason, in recent years, street lamps, beam lights, etc. have been gradually improved and replaced by light emitting diodes. The light emitting diode has various features such as high brightness, excellent projection distance and light collection, low power consumption, and low price.
However, even if a light emitting diode is used, the problem of temperature rise due to generated heat cannot be avoided, and it is well known that high heat causes burning.

  The problem to be solved by the present invention is to provide a heat dissipation structure of a light-emitting diode lamp that can quickly dissipate heat generated from the light-emitting diode, protect the light-emitting diode, and enable long-term use. is there.

  The heat-dissipating structure of the light-emitting diode lamp of the present invention is formed by laminating a heat conduction pad made of a material having high thermal conductivity and high insulation between a heat dissipation plate made of a material having high heat conductivity and a substrate. A plurality of light emitting diodes are arranged on the surface of the heat radiating plate to form a planar light emitting body, and terminals of the light emitting diodes are inserted into upper insertion holes formed in the heat radiating plate, and the heat conduction pad is formed. It penetrates and is inserted and joined to a lower insertion hole formed in the substrate.

  According to the present invention, the heat generated from the light emitting diode is diffused over the entire surface of the heat conduction pad and further transmitted to the entire surface of the heat radiating plate. Even if the light emitting diode is installed not only in a space but also in a narrow sealed space in the lamp cover, the light emitting diode can efficiently emit light for a long time without being damaged by the temperature rise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The light-emitting diode lamp heat dissipating structure of the present invention includes a plurality of light-emitting diodes 1, a heat dissipating plate 2, a heat conducting pad 3 and a substrate 4, as shown in FIGS.
The light-emitting diode 1 is a high-luminance type, and a plurality of light-emitting diodes 1 are arranged at the center of the surface of the heat sink 2 to form a planar light-emitting body.

The heat radiating plate 2 is made of a material having a high thermal conductivity such as metal, and two heat conductive pins 11 (terminals, see FIG. 1) of the light emitting diode 1 are inserted into a place where the light emitting diode 1 is installed 2. Each upper insertion hole 21 is drilled. The upper insertion hole 21 is insulated.
The heat conductive pad 3 is made of a material such as soft plastic having high heat conductivity and insulation, and is attached to the entire back surface of the heat sink 2.
The substrate 4 is laminated on the back surface of the heat conduction pad 3, and on the circuit wired to the substrate 4, a lower insertion hole 41 for inserting and joining the heat conduction pin 11 at a position corresponding to the upper insertion hole 21. Are respectively drilled.

As shown in FIG. 4, the heat conducting pin 11 of the light emitting diode 1 is inserted into the upper insertion hole 21 of the heat radiating plate 2, passes through the heat transfer pad 3, and is inserted into the lower insertion hole 41 of the substrate to be joined. The The light emitting diode 1 is positioned at an appropriate position of the planar light emitter by joining to the lower insertion hole 41.
There is a heat generating part A above the heat conductive pin 11 of the light emitting diode 1 and this heat generating part A is surrounded by the heat conductive pad 3, so that the generated heat is diffused over the entire surface of the heat conductive pad 3 having high heat conductivity. Furthermore, it is conducted to the entire heat radiating plate 2 and quickly radiated.

If the heat radiating plate 2 is molded as a part of the lamp cover and the heat radiating plate 2 is brought into contact with the outside air, the temperature rise in the narrow sealed space in the lamp cover can be reliably suppressed.
Moreover, since the heat conductive pad 3 has high insulation, the heat conductive pin 11 is electrically insulated and safety is high.

The side view of the light emitting diode which concerns on the Example of this invention. The perspective view of the heat dissipation structure of the light emitting diode lamp which shows the Example of this invention. The disassembled perspective view of the heat dissipation structure of the light emitting diode lamp which shows the Example of this invention. The sectional view of the heat dissipation structure of the light emitting diode lamp which shows the example of the present invention.

Explanation of symbols

1 Light-emitting diode 11 Thermal conduction pin (terminal)
2 Heat sink 21 Upper insertion hole 3 Thermal conduction pad 4 Substrate 41 Lower insertion hole A Heating part

Claims (1)

A plurality of light-emitting diodes are formed on the surface of the heat dissipation plate, with a heat conduction pad made of a material having high heat conductivity and high insulation between the heat dissipation plate and the substrate made of a material having high heat conductivity. To form a planar light-emitting body, and the terminal of the light-emitting diode is inserted into the upper insertion hole formed in the heat radiating plate, penetrates the heat conduction pad, and the lower part formed in the substrate. A heat dissipation structure for a light emitting diode lamp, wherein the heat dissipation structure is inserted into the insertion hole and joined.

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