1309286 九、發明說明： 【發明所屬之技術領域】 . 本發明涉及一種發光二極體模組，特別係指一種具有 散熱器之發光二極體模組。 ’ 【先前技術】 LED ( Light Emitting Diode )即發光二極體，係一種半 導體固體發光器件。它係利用半導體晶片作為發光器件， 在半導體中通過子發生複合放出過剩之能量而引起光 子發射，直接發出紅、黃、藍、綠、青、撥、紫、白色之 光。 LED照明產品係利用LED作為光源製造出來之昭明器 具。低功率之LED已廣泛應用於指示燈及顯示幕上、，、、因发 功率低，所以傳統LED並沒有太大之散熱問題。惟，廣泛 用於通訊、照明、交通、戶外看板等領域之高亮度、高功 率LED則會因溫度之升高而發光效率明顯下將，甚至造成 兀件之抽壞。故，如何散去LED元件所發出敎 將LED應用在照明上首先需要解決之重要問題。”、、成為 【發明内容】 有繁於此，有必要提供一種具有較佳散熱性能之 二極體模組。 一種發光二極體模組包括：複數發光二極體；及 广，用於冷卻該等發光二極體。該散熱器包括：複 …塊，-基板；及-熱管’該熱管位於導熱塊和基板之間。 1309286 其中每一導熱塊至少冷卻一發光二極體，該熱管將該等導 熱塊串連，用以將導熱塊之熱量傳遞給基板。 - 一種發光二極體模組，包括：複數發光二極體；及一 -散熱器，用於冷卻發光二極體。該散熱器包括：複數導熱 塊；一基板；及二熱管，該二熱管位於導熱塊和基板之間。 其中每一導熱塊至少冷卻一發光二極體，一熱管將一部分 導熱塊串連，而另一熱管將其他之導熱塊串連，該等導熱 塊可拆卸地安裝於基板上。 > 與習知技術相比，所述發光二極體模組中利用熱管及 導熱塊將發光二極體產生之熱量均勻分佈到整個基板，有 利於提昇發光二極體模組之散熱性能。 【實施方式】 圖1至圖3所示為本發明發光二極體模組100之第一實 施例。該發光二極體模組100可應用於許多領域，例如指示 燈、顯示幕及照明等領域。 > 該發光二極體模組100大體上包括一散熱器200及複數 發光二極體300，其中，每一發光二極體300通過一電路板 400設於散熱器200上。每一電路板400之中心區域設有一穿 孔（圖中未標號）。該等發光二極體300分別組合於該等電 路板400上之通孔内，並與電路板400上之電路（圖中未示） 電性連接，如此，該等發光二極體300則可以在電路板400 之控制下進行發光。 在使用該發光二極體300前，需要將散熱器200安裝於 1309286 電路板400之底面，以便將發光二極體300工作時所產生之 熱量及時散發。 ' 該散熱器200大體上包括一基板230、置於基板230上之 -複數導熱塊210,以及夾置於基板230和導熱塊210之間之兩 個直熱管250。此外，可在基板230之底部上設置複數散熱 片270，以增加基板230之散熱面積。在本實施例中，該等 導熱塊210之形狀相同；此外，可通過改變導熱塊210之一 些尺寸參數，如長、寬、高等，以令該等導熱塊210具有相 *似或不同之形狀。以下首先針對導熱塊210之具體結構進行 說明。 導熱塊210係由導熱性能良好之材料，如金屬銅、鋁等 製成，其頂部為一平面，以便與設於其上之發光二極體300 直接接觸，及時吸收該發光二極體300所發出之熱量。在導 熱塊210之底部中心區域形成有一溝槽212，該溝槽212從導 熱塊210之一端延伸至相對之另一端，以容納熱管250之一 鲁部分。該溝槽212之内表面為曲面，並與熱管250之外形相 配合，從而可以使熱管250與導熱塊210緊密接觸，降低兩 者之間之熱阻。 此外，在導熱塊210之四角分別形成有一通孔214，且 該等通孔214環繞導熱塊210上之電路板400。螺釘（圖中未 示）穿過導熱塊210上之通孔214後再旋入基板230内，即可 將導熱塊210固定在基板230上。 基板230置於上述導熱塊210之底部，其頂部上形成有 1309286 兩個相互平行之直凹槽232以容納熱管250。在每一直凹槽 232之兩側分別形成有複數螺孔234 ,該等螺孔234按照預定 間距排列，從而與導熱塊21〇上之通孔214分別對應，以便 •可以通過螺釘將導熱塊21〇、熱管250組合於基板230上。導 熱塊210、熱管250及基板230之間組合過程如下所述。 首先’將兩個直熱管250分別放置於基板230上之兩個 直凹槽232内，然後，將導熱塊21〇放置於基板230之頂部， 鲁並令導熱塊210上之溝槽212與基板230上相應之直溝槽232 相互對應，如此，每一導熱塊21〇橫跨於相應之熱管25〇上， 並知：知預疋之間距排列形成一個兩列四行之矩陣，換言 之，熱管250沿基板230上之凹槽232將該等導熱塊210依次 連接；最後，令螺釘穿過導熱塊21〇上之通孔214並旋入於 基板230上相應之螺孔234内。如此，即可完成組裝過程， 組成上述發光二極體模組1〇〇。 當需要更換或維修某一發光二極體3〇〇時，只需要卸下 #相應導熱塊210上之螺釘，即可將該導熱塊21〇及其上之發 光一極體300從發光二極體模組1〇〇上拆卸下來，以便進行 更換或維修。 如上所述，每一熱管250將四個導熱塊210依次串連， 從而將導熱塊210所吸收之熱量均勻地分佈在基板23〇上。 熱管250與導熱塊210連接之部分吸收導熱塊21〇所吸收之 熱量’為熱管250之蒸發段；而熱管250之其他部分，即在 相鄰導熱塊210之間延伸之部分將蒸發段吸收之熱量分佈 到基板230上，為熱管250之冷凝段。如此，熱管250之蒸發 1309286 段和冷凝段間隔交替設置；換言之，每一熱管250之每一冷 凝段夾設於兩相鄰之蒸發段之間。這樣佈置，可充分利用 -熱管250之每一段進行熱傳導，有利於將發光二極體300所 -產生之熱量均勻地分佈到整個基板230上，從而加速熱量散 發，故可以將發光二極體300之溫度保持在一定範圍内，降 低發光二極體300之溫度波動，有利於發光二極體300正常 工作。 上述為本發明發光二極體模組之第一實施例，在該實 ®施例中，導熱塊210排列形成兩列並通過兩根熱管250串 連。此外，在其他實施例中，導熱塊可以通過一根或多根 直熱管連接；另外，導熱塊還可以通過其他形狀之熱管連 接，如U形熱管、S形熱管、V形熱管，或者其他形狀之熱 管，或者不同形狀熱管之組合。 例如，圖4和圖5所示為利用兩個U形熱管將導熱塊連接 之一發光二極體模組l〇〇a。該發光二極體模組100a與前述 春之發光二極體模組100之間之主要不同在於熱管250a呈U 形，在基板230a上並列形成兩個U形凹槽232a以容納熱管 250a。每一熱管250a包括相互平行之第一段252a和將兩個第 一段252a連接之一第二段254a。兩個U形熱管250a並排地置 於基板230a上之兩個U形凹槽232a内，並令每一熱管250a之 每一第一段252a串聯兩個間隔設置之導熱塊210a，而熱管 250a之第二段254a位於基板230a之相對兩側。熱管250a上與 導熱塊210a連接之部分為熱管250a之蒸發段，相應地，其 他部分為熱管250a之冷凝段。故，在本實施例中，每一根 Ϊ309286 熱管250a之母一蒸發段位於兩相鄰之冷凝段之間。 圖6所示為本發明發光二極體模組1〇〇b之第三實施 、例。該發光二極體模組l〇〇b與第二實施例中之發光二極體 模組100a相似。該發光二極體模組1〇〇b包括複數發光二極 體300b，且β亥荨發光二極體3〇〇b之功率不完全相同，特別 地，位於基板230b中心之發光二極體3〇〇b之功率高於其他 發光一極體300b之功率。如此，位於基板230b中心之發光 _二極體300b為該發光二極體模組1〇〇b之主燈，而其他發光 二極體300b為該發光二極體模組i〇〇b之副燈。這樣佈置， 有利於滿足不同使用者之不同需要；當然，可以根據實際 使用狀況’調整主燈之位置及數量等，以下針對本實施例 之發光二極體模組100b進行說明。 在使用過程中’與副燈相比，主燈將產生更多之廢熱 需要及時散發，故，主燈對散熱要求相對更高。 為確保主、副燈之正常工作，兩根U形熱管250b並排地 籲置於基板230b内之後，令兩根U形熱管250b之開口朝向相反 方向，並令兩根熱管250b之第二段254b在基板230b之中心 區域相鄰或接觸，從而使主燈同時與兩根熱管250b之第二 段254b接觸。此外，每一熱管250b之第一段252b按照第二 實施例中描述之方式將兩個副燈串連。這樣一來，熱管250b 之分佈（即第一段252b、第二段254b之分佈）狀況與主燈 和副燈之功率高低相適應；換言之，發光二極體300b之功 率越高，則對其散熱之熱管250b之數量越多，從而可以確 保及時將該發光二極體300b產生之熱量散發，使整個發光 11 1309286 上極體模組l〇〇b正常運行。 ' 上述為本發明發光二極體模組之幾個實施例，在該等 •實施例中，當發光二極體在電路板之驅動下發光時，發光 -二極體所產生之熱量首先通過導熱塊和熱管分佈到整個基 板上，然後通過基板上之散熱片散發到周圍環境中去。 為便於對發光二極體進行散熱，該等發光二極體之底 面設為彼此共面而形成一平面，該平面既可以與電路板之 底面共面，又可按照預定之間距設于電路板之下方。這樣 *佈置，可使發光二極體與相應之導熱塊直接接觸，從而加 速熱量之散發。 此外，電路板及其上之發光二極體可通過導熱膠或其 他方式設於相應之導熱塊上。再者，為便於對發光二極體 模組進行組裝、維修，電路板可以通過螺釘固定在導熱塊 上，相關結構可參考圖7。 圖7所示為本發明發光二極體模組100c之第四實施 #例。在該實施例中，每一電路板400c之形狀、大小與相應 導熱塊210c相同，並在每一電路板400c之四角分別形成一 透孔414c。每一電路板400c上之透孔414c與相應之導熱塊 210c上之穿孔分別對應。 當將電路板400c、導熱塊210c組裝到基板上時，令螺 釘依次穿過電路板400c上之透孔414c、導熱塊210c上之穿孔 後，旋入基板上之螺孔内，從而形成上述發光二極體模組 100c。當需要更換或維修某一發光二極體300c時，只需要 12 1309286 卸下相應導熱塊21〇(；上之螺釘，即可令該導熱塊21〇c、該 導熱塊210cl之發光二極體300c和電路板400c、基板相互分 離，以便進行更換或維修。故，該發光二極體模組1〇加具 *有較1¾之通用性。 本發明發光二極體模組利用熱管及導熱塊將發光二極 體產生之熱量均勻分佈到整個基板，有利於散熱以確保整 個發光一極體模組之正常運行。此外，導熱塊係通過螺釘 _等可拆卸地安裝於基板上，有利於對某一個或幾個發光二 極體進行維修或更換，提昇發光二極體模組之通用性。另 外，在上述幾個實施例中，發光二極體之數量為8〜9個，而 本，明中發光二極體之數量並不僅限於此，#光二極體之 數1可根據發光二極體模組應用領域等具體使用情 調整。 叮 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡孰 籲悉本案技藝之人士，在爰依本發明精神所作之等效修飾= 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體模組之第一實施例之立體圖。 圖2係圖1中發光二極體模組之立體分解圖。 "。 圖3係圖ί中發光二極體模組之底部朝上時之立體分解 13 1309286 圖4係本發明發光二極體模組之第二實施例之立體圖。 圖5係圖4中發光二極體模組之部分分解圖。 圖6係本發明發光二極體模組之第三實施例之俯視圖。 圖7係本發明發光二極體模組之第四實施例之立體圖。 【主要元件符號說明】1309286 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode module, and more particularly to a light-emitting diode module having a heat sink. [Prior Art] LED (Light Emitting Diode) is a semiconductor solid-state light-emitting device. It uses a semiconductor wafer as a light-emitting device, in which a photon is emitted by a sub-combination of excess energy to cause photon emission, and directly emits red, yellow, blue, green, cyan, dial, violet, and white light. LED lighting products are manufactured using LEDs as a light source. Low-power LEDs have been widely used in indicators and display screens, and because of low power, traditional LEDs do not have much heat dissipation. However, high-brightness, high-power LEDs, which are widely used in communications, lighting, transportation, outdoor signage, etc., will have a significant luminous efficiency due to the increase in temperature, and even cause damage to the components. Therefore, how to dissipate the LED components? The application of LEDs to lighting is an important issue that needs to be solved first. It is necessary to provide a diode module with better heat dissipation performance. A light-emitting diode module includes: a plurality of light-emitting diodes; and a wide range for cooling The light emitting diode comprises: a heat sink, a substrate, and a heat pipe, wherein the heat pipe is located between the heat conducting block and the substrate. 1309286 wherein each of the heat conducting blocks cools at least one light emitting diode, the heat pipe The heat conducting blocks are connected in series to transfer heat of the heat conducting block to the substrate. - A light emitting diode module comprising: a plurality of light emitting diodes; and a heat sink for cooling the light emitting diodes. The heat sink comprises: a plurality of heat conducting blocks; a substrate; and two heat pipes, the heat pipes are located between the heat conducting block and the substrate. Each of the heat conducting blocks cools at least one light emitting diode, and one heat pipe connects a part of the heat conducting blocks in series, and the other heat pipe A heat pipe is connected in series with other heat conducting blocks, and the heat conducting blocks are detachably mounted on the substrate. > Compared with the prior art, the light emitting diode module uses a heat pipe and a heat conducting block to light the diode Heat generated The uniform distribution of the amount to the entire substrate is advantageous for improving the heat dissipation performance of the LED module. [Embodiment] FIG. 1 to FIG. 3 show a first embodiment of the LED module 100 of the present invention. The polar body module 100 can be applied to many fields, such as an indicator light, a display screen, and illumination. The light emitting diode module 100 generally includes a heat sink 200 and a plurality of light emitting diodes 300, wherein each A light-emitting diode 300 is disposed on the heat sink 200 through a circuit board 400. A central portion of each circuit board 400 is provided with a through hole (not labeled). The light-emitting diodes 300 are respectively combined on the circuit board. The through hole in the 400 is electrically connected to a circuit (not shown) on the circuit board 400. Thus, the light emitting diodes 300 can be illuminated under the control of the circuit board 400. Before the diode 300, the heat sink 200 needs to be mounted on the bottom surface of the 1309286 circuit board 400 to dissipate the heat generated by the operation of the LED 201 in time. The heat sink 200 generally includes a substrate 230 and is placed. On the substrate 230 - The heat conducting block 210 and the two direct heat pipes 250 sandwiched between the substrate 230 and the heat conducting block 210. Further, a plurality of heat sinks 270 may be disposed on the bottom of the substrate 230 to increase the heat dissipation area of the substrate 230. For example, the heat-conducting blocks 210 have the same shape; in addition, some of the size parameters of the heat-conducting block 210, such as length, width, height, etc., may be changed to make the heat-conducting blocks 210 have a similar or different shape. The specific structure of the heat conducting block 210 is described. The heat conducting block 210 is made of a material having good thermal conductivity, such as metal copper, aluminum, etc., and has a flat top portion so as to be in direct contact with the light emitting diode 300 disposed thereon. The heat emitted by the light-emitting diode 300 is absorbed in time. A groove 212 is formed in a central portion of the bottom portion of the heat conducting block 210, and the groove 212 extends from one end of the heat conducting block 210 to the opposite end to accommodate a portion of the heat pipe 250. The inner surface of the groove 212 is curved and cooperates with the outer shape of the heat pipe 250, so that the heat pipe 250 can be in close contact with the heat conducting block 210, reducing the thermal resistance between the two. In addition, through holes 214 are formed at four corners of the heat conducting block 210, and the through holes 214 surround the circuit board 400 on the heat conducting block 210. A screw (not shown) is passed through the through hole 214 of the heat conducting block 210 and then screwed into the substrate 230 to fix the heat conducting block 210 to the substrate 230. The substrate 230 is placed at the bottom of the heat conducting block 210, and a top surface of the two parallel grooves 232 is formed on the top of the heat conducting block 210 to accommodate the heat pipe 250. A plurality of screw holes 234 are formed on each of the two sides of each of the grooves 232, and the screw holes 234 are arranged at a predetermined pitch so as to correspond to the through holes 214 of the heat conducting block 21, respectively, so that the heat conducting block 21 can be screwed. The crucible and the heat pipe 250 are combined on the substrate 230. The process of combining between the heat conducting block 210, the heat pipe 250, and the substrate 230 is as follows. First, the two direct heat pipes 250 are respectively placed in the two straight grooves 232 on the substrate 230. Then, the heat conducting block 21 is placed on the top of the substrate 230, and the trench 212 and the substrate on the heat conducting block 210 are arranged. The corresponding straight grooves 232 of the 230 correspond to each other. Thus, each of the heat conducting blocks 21 〇 straddles the corresponding heat pipe 25〇, and it is known that the distance between the pre-twisted turns forms a matrix of two columns and four rows, in other words, the heat pipe 250, the heat conducting blocks 210 are sequentially connected along the grooves 232 on the substrate 230. Finally, the screws are passed through the through holes 214 of the heat conducting block 21 and screwed into the corresponding screw holes 234 of the substrate 230. In this way, the assembly process can be completed to form the above-mentioned light-emitting diode module 1〇〇. When it is necessary to replace or repair a light-emitting diode 3〇〇, only the screw on the corresponding heat-conducting block 210 needs to be removed, and the heat-conducting block 21〇 and the light-emitting body 300 thereon can be removed from the light-emitting diode. The body module 1 is removed for replacement or repair. As described above, each of the heat pipes 250 sequentially connects the four heat conducting blocks 210 in series, thereby uniformly distributing the heat absorbed by the heat conducting blocks 210 on the substrate 23A. The portion of the heat pipe 250 connected to the heat conducting block 210 absorbs the heat absorbed by the heat conducting block 21' is the evaporation portion of the heat pipe 250; and the other portion of the heat pipe 250, that is, the portion extending between the adjacent heat conducting blocks 210, absorbs the evaporation portion. Heat is distributed to the substrate 230 as a condensation section of the heat pipe 250. Thus, the evaporation 1309286 section of the heat pipe 250 and the condensing section are alternately arranged; in other words, each condensing section of each heat pipe 250 is sandwiched between two adjacent evaporation sections. In this way, the heat conduction of each segment of the heat pipe 250 can be fully utilized, which is advantageous for uniformly distributing the heat generated by the light-emitting diode 300 to the entire substrate 230, thereby accelerating heat dissipation, so that the light-emitting diode 300 can be used. The temperature is kept within a certain range, and the temperature fluctuation of the light-emitting diode 300 is lowered, which is favorable for the normal operation of the light-emitting diode 300. The above is the first embodiment of the light-emitting diode module of the present invention. In the embodiment, the heat-conducting blocks 210 are arranged in two rows and connected in series by two heat pipes 250. In addition, in other embodiments, the heat conducting blocks may be connected by one or more direct heat pipes; in addition, the heat conducting blocks may also be connected by other shapes of heat pipes, such as U-shaped heat pipes, S-shaped heat pipes, V-shaped heat pipes, or other shapes. a heat pipe, or a combination of heat pipes of different shapes. For example, Figures 4 and 5 show the use of two U-shaped heat pipes to connect the heat conducting block to one of the light emitting diode modules 10a. The main difference between the LED module 100a and the spring LED module 100 is that the heat pipe 250a has a U shape, and two U-shaped grooves 232a are juxtaposed on the substrate 230a to accommodate the heat pipe 250a. Each heat pipe 250a includes a first segment 252a that is parallel to each other and a second segment 254a that connects the two first segments 252a. Two U-shaped heat pipes 250a are placed side by side in the two U-shaped grooves 232a on the substrate 230a, and each of the first sections 252a of each heat pipe 250a is connected in series with two spaced-apart heat-conducting blocks 210a, and the heat pipes 250a The second segment 254a is located on opposite sides of the substrate 230a. The portion of the heat pipe 250a that is connected to the heat conducting block 210a is the evaporation section of the heat pipe 250a, and correspondingly, the other portion is the condensation section of the heat pipe 250a. Therefore, in the present embodiment, the mother-evaporation section of each of the Ϊ309286 heat pipes 250a is located between two adjacent condensation sections. Fig. 6 shows a third embodiment of the light-emitting diode module 1b according to the present invention. The light emitting diode module 10b is similar to the light emitting diode module 100a of the second embodiment. The LED module 1B includes a plurality of LEDs 300b, and the power of the β-lamps 3b is not completely the same, in particular, the LEDs 3 located at the center of the substrate 230b. The power of 〇〇b is higher than the power of other light-emitting body 300b. Thus, the light-emitting diode 300b located at the center of the substrate 230b is the main light of the light-emitting diode module 1〇〇b, and the other light-emitting diodes 300b are the pair of the light-emitting diode module i〇〇b. light. In this way, it is advantageous to meet the different needs of different users; of course, the position and number of the main lamps can be adjusted according to the actual use condition, and the light-emitting diode module 100b of the present embodiment will be described below. In the course of use, the main lamp will generate more waste heat than the sub-lamp. It needs to be dissipated in time. Therefore, the main lamp has a relatively higher heat dissipation requirement. In order to ensure the normal operation of the primary and secondary lamps, after the two U-shaped heat pipes 250b are placed side by side in the substrate 230b, the openings of the two U-shaped heat pipes 250b are oriented in opposite directions, and the second segments 254b of the two heat pipes 250b are made. The central region of the substrate 230b is adjacent or in contact such that the main lamp is simultaneously in contact with the second segment 254b of the two heat pipes 250b. In addition, the first segment 252b of each heat pipe 250b is connected in series in the manner described in the second embodiment. In this way, the distribution of the heat pipes 250b (ie, the distribution of the first segment 252b and the second segment 254b) is adapted to the power levels of the primary and secondary lamps; in other words, the higher the power of the LEDs 300b, the higher the power The greater the number of heat-dissipating heat pipes 250b, the more the heat generated by the light-emitting diodes 300b can be dissipated in time, so that the polar body modules 10b on the entire light-emitting 11 1309286 operate normally. The above is a few embodiments of the light-emitting diode module of the present invention. In the embodiments, when the light-emitting diode is driven by the circuit board, the heat generated by the light-emitting diode first passes. The heat conducting block and the heat pipe are distributed to the entire substrate and then radiated to the surrounding environment through the heat sink on the substrate. In order to facilitate heat dissipation of the light-emitting diodes, the bottom surfaces of the light-emitting diodes are disposed to be coplanar with each other to form a plane, which may be coplanar with the bottom surface of the circuit board, and may be disposed on the circuit board according to a predetermined distance. Below it. Such an arrangement allows the light-emitting diode to be in direct contact with the corresponding heat-conducting block, thereby accelerating the dissipation of heat. In addition, the circuit board and the light-emitting diodes thereon can be disposed on the corresponding heat-conducting blocks by thermal conductive glue or the like. Furthermore, in order to facilitate assembly and maintenance of the LED module, the circuit board can be fixed on the heat conducting block by screws. For related structure, refer to FIG. 7. FIG. 7 shows a fourth embodiment of the light-emitting diode module 100c of the present invention. In this embodiment, each of the circuit boards 400c has the same shape and size as the corresponding heat conducting block 210c, and a through hole 414c is formed at each of the four corners of each of the circuit boards 400c. The through holes 414c on each of the circuit boards 400c correspond to the through holes on the corresponding heat conducting blocks 210c, respectively. When the circuit board 400c and the heat conducting block 210c are assembled on the substrate, the screws are sequentially inserted through the through holes 414c of the circuit board 400c and the through holes on the heat conducting block 210c, and then screwed into the screw holes on the substrate to form the above light. Diode module 100c. When it is necessary to replace or repair a light-emitting diode 300c, only 12 1309286 is required to remove the corresponding heat-conducting block 21〇 (the screw on the top, so that the heat-conducting block 21〇c, the light-emitting diode of the heat-conducting block 210cl) The 300c and the circuit board 400c and the substrate are separated from each other for replacement or repair. Therefore, the LED module 1 has a versatility of being more than 13⁄4. The LED module of the present invention utilizes a heat pipe and a heat conducting block. The heat generated by the light-emitting diode is evenly distributed to the entire substrate, which is favorable for heat dissipation to ensure the normal operation of the entire light-emitting diode module. Further, the heat-conducting block is detachably mounted on the substrate by screws _ or the like, which is advantageous for One or more of the light-emitting diodes are repaired or replaced, and the versatility of the light-emitting diode module is improved. In addition, in the above embodiments, the number of the light-emitting diodes is 8 to 9, and The number of light-emitting diodes in the Ming Dynasty is not limited to this, and the number 1 of the light-emitting diodes can be adjusted according to the specific use conditions of the application field of the light-emitting diode module. As described above, the present invention complies with the invention patent requirements, According to law Patent application. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will appreciate that the equivalent modification/change in the spirit of the present invention should be covered by the following patent application scope. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a first embodiment of a light-emitting diode module of the present invention. Figure 2 is an exploded perspective view of the light-emitting diode module of Figure 1. < Figure 3 Figure 3 is a perspective view of the second embodiment of the light-emitting diode module of the present invention. Figure 5 is a perspective view of the second embodiment of the light-emitting diode module of the present invention. Figure 6 is a plan view of a third embodiment of the light-emitting diode module of the present invention. Figure 7 is a perspective view of a fourth embodiment of the light-emitting diode module of the present invention.
發光二極體模組 100 、 100a 、 100b ' 100c 導熱塊 210 ' 210a 、 210c 基板 230 > 230a ' 230b 熱管 250 、 250a 、 250b 發光二極體 300 、 300b 、 300c 電路板 400 > 400c 散熱器 200、200c 溝槽 212 通孔 214 凹槽 232、232a 螺孔 234 散熱片 270 第一段 252a、252b 第二段 254a ' 254b 透孔 414c 14LED module 100, 100a, 100b' 100c thermal block 210' 210a, 210c substrate 230 > 230a '230b heat pipe 250, 250a, 250b LED 300, 300b, 300c circuit board 400 > 400c heat sink 200, 200c groove 212 through hole 214 groove 232, 232a screw hole 234 heat sink 270 first segment 252a, 252b second segment 254a '254b through hole 414c 14