200918806 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體模組，特別是一種包括一 散熱裝置之發光二極體模組。 【先前技術】 疋 發光二極體（Light Emitting Diode，簡稱LED)〜# 半導體發光器件，它是利用半導體晶片作為發光器件，在 半導體中藉由載流子發生複合放出過剩之能量而引起光子 發射，直接發出白、監等各種顏色之光，發光二極體照明 產品就是利用發光二極體作為光源製造出來之照明器具， 廣泛用於通訊、照明、交通、戶外看板等領域。但是，高 亮度、高功率發光二極體則會因溫度升高而導致發光效率 月,4下降’甚至造成兀件損壞，因此，如何將發光二極體 ，具之工作溫度保持在—定^圍内以避免上述現象發生， ^們目前急需解決之問題。目前，#界通常做法是在發 :極體電路板下方貼設一散熱器以散發其熱量，如美國 t^s 6,517,218B2號即揭露了 —種發光二極體模組，其 :特：ί及自該基座上延伸而出之多數散熱鰭片，由於 L 片進行散熱，該散熱裝置之散熱效率受到 片'、、、了、散熱效率’可增加散熱鰭片數量或增大, i尺寸’但如此以來使得發光二極體模組之體積過大^ 【發明内容】 200918806 有鑒於此，有必要提供一種具有較高散熱效率且結構 緊湊之發光二極體模組。 一種發光二極體模組，包括複數發光二極體組及一散 熱器，該散熱器包括一基座和形成於基座一側之複數散熱 片，該散熱器於基座之另一側嵌設有與基座之該側表面共 面之複數熱管，一導熱板貼設該基座之另一側並與熱管接 觸，該等發光二極體組貼設在導熱板上。 上述熱管嵌設於散熱器基座之另一侧並與其共面，保 證發光二極體模組整體結構之緊湊、輕巧；同時導熱板貼 設於該基座之另一侧並與熱管接觸，使集中在導熱板之熱 量能快速藉由基座與熱管傳遞至散熱片，保證發光二極體 模組具有較高散熱效率。 【實施方式】 請參閱圖1至圖2,為本發明一較佳實施例之發光二極 體模組，包括複數組發光二極體組100及用以對其散熱之 散熱裝置（未標號）。該散熱裝置包括一散熱器220、貼設 在散熱器220之複數熱管240、及同時貼設於散熱器220 與熱管240上之導熱板260。發光二極體組100緊密貼設於 導熱板260上，用作發光源，其包括相互平行之複數電路 板120和複數發光二極體124 (圖中僅顯示一個），每一電 路板120上間隔設有複數孔洞122，這些發光二極體124 均勻裝設在該等電路板120之孔洞122並與該等電路板120 電性連接。 7 200918806 散熱器22〇採用高導熱率之金屬或 义合金，如銅、ί呂或 銅鋁合金材料製成，包括水平放置呈 每形板狀之一基座 222。該基座222之一側，即基座222之卜+ 夂底表面並垂直向下 側，即基座222 延伸複數散熱片224 ;該基座222之 之頂表面沿其縱長方向平行設有複數溝槽 管240於其中。 ” 每一熱管240均呈扁平狀設置，台 匕祛—頂表面242及 與頂表面242相對之底表面（圖未示） . 」’該等熱管240焊 接固定於散熱器220之基座222之溝榉％ 畔〜226内，使熱管240 之頂表面242與基座222之頂表面共面。 該導熱板260為矩形，其材料是接^ ^ 用高導熱率之金屬 或合金，如銅、鋁或銅鋁合金。該導熱被設有第一表 面262及與第一表面262相對之第二表 土 — 又面（圖未不）。該 V熱板260之第二表面緊密貼設在該等 ^ 年熱管240之頂表面 242與基座222之頂表面。該導熱板2 双26〇之第一表面262 緊密貼設於發光二極體模組組合100之 <電路板120之底表 面，以便快速吸收發光二極體124產生之熱量。 請參閱圖3及圖4，發光二極體模組工作時，其產生之 熱里首先被導熱板260及熱管240吸收，之後被傳導至散 熱器220之基座222上’最後，熱量沿散熱器22〇之散熱 片224散發到周圍空氣中去，實現散熱。 本實施例中，在散熱器220之基座222上設置溝槽226， 使熱管240能完全收容在基座222另一側内並與該侧基座 8 200918806 222之表面，即基座222之頂表面共面，保證發光二極體模 組整體結構之緊湊、輕巧；另外，由於導熱板260同時與基 座222及熱管240之頂表面242緊密貼設，使集中在導熱板 260之熱量能快速藉由基座222及熱管240傳至散熱器220之 散熱片224，保證了發光二極體模組具有較高散熱效率。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明一較佳實施例之發光二極體模組之立體 分解圖。 圖2係圖1之發光二極體模組之部分立體組合圖。 圖3係圖1之發光二極體模組之立體組合圖。 圖4係圖3之發光二極體模組之倒置示意圖。 【主要元件符號說明】 發光二極體組 100 電路板 120 孔洞 122 發光二極體 124 散熱器 220 基座 222 散熱片 224 溝槽 226 軌管 *、、、 P 240 頂表面 242 導熱板 260 第一表面 262BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode module, and more particularly to a light emitting diode module including a heat sink. [Prior Art] A Light Emitting Diode (LED)~# semiconductor light-emitting device uses a semiconductor wafer as a light-emitting device to cause photon emission by recombining excess energy in a semiconductor by a carrier. Directly emit white, supervised and other colors of light, the light-emitting diode lighting products are lighting fixtures made by using light-emitting diodes as light sources, widely used in communications, lighting, transportation, outdoor billboards and other fields. However, high-brightness, high-power light-emitting diodes will cause luminous efficiency due to temperature rise, and 4 drops, even causing damage to the components. Therefore, how to keep the operating temperature of the light-emitting diodes is fixed. In order to avoid the above phenomenon, we are in urgent need of solving the problem. At present, the common practice in the #界界 is to attach a heat sink under the polar body board to dissipate its heat. For example, the US t^s 6,517, 218B2 exposes a kind of light-emitting diode module, which: And a plurality of heat-dissipating fins extending from the pedestal, the heat dissipation efficiency of the heat-dissipating device is increased by the heat dissipation efficiency of the heat-dissipating device by the L-chip, and the number of heat-dissipating fins can be increased or increased. 'But the volume of the light-emitting diode module is too large. [Inventive content] 200918806 In view of this, it is necessary to provide a light-emitting diode module having a high heat dissipation efficiency and a compact structure. A light emitting diode module includes a plurality of light emitting diode groups and a heat sink, the heat sink including a base and a plurality of heat sinks formed on one side of the base, the heat sink being embedded on the other side of the base A heat pipe is disposed on the heat conducting plate. The heat conducting plate is disposed on the other side of the base and is in contact with the heat pipe. The light emitting diode group is disposed on the heat conducting plate. The heat pipe is embedded on the other side of the heat sink base and coplanar thereto, so that the overall structure of the light emitting diode module is compact and light, and the heat conducting plate is attached to the other side of the base and is in contact with the heat pipe. The heat concentrated on the heat conducting plate can be quickly transmitted to the heat sink through the base and the heat pipe, thereby ensuring high efficiency of the light emitting diode module. [Embodiment] Referring to FIG. 1 to FIG. 2, a light emitting diode module according to a preferred embodiment of the present invention includes a complex array of LED groups 100 and a heat dissipating device (not labeled) for dissipating heat thereof. . The heat dissipating device comprises a heat sink 220, a plurality of heat pipes 240 attached to the heat sink 220, and a heat conducting plate 260 attached to the heat sink 220 and the heat pipe 240 at the same time. The LED group 100 is closely attached to the heat conducting plate 260 and serves as a light source. The circuit board 120 includes a plurality of circuit boards 120 and a plurality of light emitting diodes 124 (only one is shown) on each of the circuit boards 120. A plurality of holes 122 are formed in the space, and the light-emitting diodes 124 are evenly disposed on the holes 122 of the circuit boards 120 and electrically connected to the circuit boards 120. 7 200918806 The heat sink 22 is made of a high thermal conductivity metal or alloy, such as copper, ф, or copper-aluminum alloy, including a pedestal 222 that is placed horizontally in each shape. One side of the base 222, that is, the bottom surface of the base 222 and the bottom surface of the base 222, the base 222 extends a plurality of fins 224; the top surface of the base 222 is parallel along the longitudinal direction thereof. A plurality of grooved tubes 240 are therein. Each of the heat pipes 240 is disposed in a flat shape, and the top surface 242 and the bottom surface (not shown) opposite to the top surface 242. The heat pipes 240 are welded and fixed to the base 222 of the heat sink 220. The top surface 242 of the heat pipe 240 is coplanar with the top surface of the pedestal 222. The heat conducting plate 260 is rectangular in shape and is made of a metal or alloy of high thermal conductivity such as copper, aluminum or copper aluminum alloy. The heat conduction is provided with a first surface 262 and a second top surface opposite the first surface 262 - again (not shown). The second surface of the V-hot plate 260 is closely attached to the top surface 242 of the heat pipe 240 and the top surface of the base 222. The first surface 262 of the heat conducting plate 2 is closely attached to the bottom surface of the circuit board 120 of the LED module 100 to quickly absorb the heat generated by the LED 124. Referring to FIG. 3 and FIG. 4, when the LED module is in operation, the heat generated by the LED module is first absorbed by the heat conducting plate 260 and the heat pipe 240, and then transmitted to the base 222 of the heat sink 220. Finally, the heat is dissipated along the heat. The heat sink 224 of the device 22 is radiated to the surrounding air to achieve heat dissipation. In this embodiment, a groove 226 is disposed on the base 222 of the heat sink 220, so that the heat pipe 240 can be completely received in the other side of the base 222 and the surface of the side base 8 200918806 222, that is, the base 222 The top surface is coplanar to ensure that the overall structure of the LED module is compact and lightweight; in addition, since the heat conducting plate 260 is closely attached to the top surface 242 of the base 222 and the heat pipe 240, the heat energy concentrated on the heat conducting plate 260 can be The heat sink 224 of the heat sink 220 is quickly transferred to the heat sink 220 by the pedestal 222 and the heat pipe 240, thereby ensuring high efficiency of heat dissipation of the light emitting diode module. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a light emitting diode module in accordance with a preferred embodiment of the present invention. 2 is a partial perspective assembled view of the LED module of FIG. 1. 3 is a perspective assembled view of the light emitting diode module of FIG. 1. 4 is an inverted schematic view of the LED module of FIG. 3. [Main component symbol description] LED group 100 Circuit board 120 Hole 122 Light-emitting diode 124 Heat sink 220 Base 222 Heat sink 224 Groove 226 Rail tube *,,, P 240 Top surface 242 Thermal plate 260 First Surface 262