M342471 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種照明設備之散熱裝置，旨在提供一 種有效達到散熱之功效，且結構簡單之散熱裝置，更可應 用於汽車頭燈、手電筒、檯燈、投射燈、路燈、集魚燈、 室内或戶外照明燈等照明設備中。 【先前技術】 近來，由於發光二極體（Light Emitting Diode，簡 稱LED)具有省電、壽命長、無水銀污染等優點，已逐漸 取代傳統燈泡而廣泛使用於各項照明設備中。而不論使用 何種照明體，其於照明時皆會因内部損耗及功能轉換而產 生熱量，此熱量會使照明裝置溫度升高，而使各種元件容 易損壞或壽命減短，故如何降低照明裝置產生之熱量，遂 為大家所重視。 習知路燈結構並未設置任何散熱裝置，以致使照明裝 置產生之熱量無法適時排除；且照明裝置並非完全密閉， 灰塵、水分、蚊蟲等皆有可能進入燈罩中，造成燈罩内部 髒亂，影響照明之效果及亮度。故一種具散熱裝置之路燈 結構即發展出來，可參閱台灣專利公告號第M292042號專 利，如第一圖所示，其係採用一上蓋11及一下蓋12所合 成之一封閉容置空間，中間並有一隔板14將此容置空間 區隔為一第一空間111及一第二空間121。其中隔板14 M342471 上有一開孔141供一導熱基板15設置，此導熱基板15大 於此開孔141 ’並裝設於此開孔141上方使此開孔141處 封閉，則第二空間121為完全密閉，此外並有數個LED燈 13設置於此導熱基板15另一面上。一導熱件16將由LED 燈13產生之熱量經導熱基板15傳遞至散熱鰭片18上， 並由風扇17將散熱鰭片18上之熱藉由設於上蓋丨丨開設 之導流孔（圖未顯示）而排散出去，以達散熱效果。 惟’此種路燈結構因燈罩内部空間有限，散熱籍片裝 设數里被受限制，故散熱效果不佳，而若為了可以裝設該 散熱籍片及風扇，則必須使燈罩體積放大，使得整體路燈 錄構體積變大；同時每一路燈皆需裝設至少一台之風扇； 風扇使用壽命有限，且因路燈皆設於較高位置處，當風扇 故障損壞時亦不易發覺，更換也不方便，因而影響照明效 率0 【新型内容】 有4監於此，本創作即針對照明設備之散熱裝置加以改 良’以提供一種有效達到散熱之功效，且結構簡單之散熱 裝置，更可應用於汽車頭燈、手電筒、檯燈、投射燈、路 燈、集魚燈、室内或戶外照明燈等照明設備中。 為達上揭目的，本創作之照明設備係至少包含有··座 體、散熱裝置以及至少一光源，該散熱裝置係設於該座體 處’該散熱褒置係設有由陶瓷粒子以及複數奈米級無機半 導體粒子混合之散熱基板，而該光源係設於散熱基板上， 6 M342471 該光源發光所產生之熱源，使該散熱基板產生熱電效應， 而將熱源從散熱基板之另側散去，有效達到散熱之功效。 【實施方式】 本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地瞭解。 本創作之散熱裝置可應用於汽車頭燈、手電.筒、檯 燈、投射燈、路燈、集魚燈、室内或戶外照明燈等照明設 備中，不僅可以達到較佳之散熱效果，且結構簡單，不需 要如習有照明裝置（例如第一圖所示之路燈）中，裝設散熱 鰭片以及風扇等結構作為散熱，使本創作之照明裝置結構 簡單且體積較小。 如第二圖所示係為本創作散熱裝置應用於路燈之結 構示意圖，其中該照明設備20係至少包含有： 座體21，該座體21係用以承置散熱裝置22及光源 23，該座體21並進一步設有燈罩211，以保護該散熱裝 置22及光源23，且該座體211 —側並連接有一支撐架 212 ； 散熱裝置22，該散熱裝置22係設於該座體21處， 請同時參閱第三圖所示，該散熱裝置22係設有由陶瓷粒 子A以及複數奈米級無機半導體粒子B混合之散熱基板 221 ； 至少一光源23，該光源23係設於散熱基板221上， 而該光源23係設有導電接點231，該光源23可以為雷 M342471 射、紅外線、奈米碳管、OLED，HID、LED及燈泡等相關 可發光之元件。 其中，如第三圖（A)所示之第一實施例中，該光源23 及散熱基板221之間係設有導電導熱層24，該導電導熱 •層24可以為銀膠層，以使該光源23得以固定於散熱基板 .221上，且該導電導熱層24進一步形成複數與導電接點 231構成電性連接之圖案241，以及設有電源輸入點242 ; I當然，該圖案可以為銀材質圖案上電鍍鎳及錫。 如第三圖（B)所示之第二實施例中，該散熱基板221 進一步設有複數凹坑狀之容置部225，該容置部225中可 設置光源23以及導電導熱層24，而該光源23可以為封 裝完成之發光二極體，且該導電接點231係設於底部而可 構成與導電導熱層24之電性連接。 如第三圖（C)所示之第三實施例中，該散熱基板221 進一步設有複數凹坑狀之容置部225,該容置部225中可 鲁設置光源23以及導電導熱層24，而該光源23至少包含 發光晶片232，該導電導熱層24係設於發光晶片232及 • 散熱基板221之間，而該容置部225並進一步設有封裝膠 麵 體233，以將發光晶片232覆蓋。 另外，該光源23及散熱基板221之間係設有載板 25，如第四圖所示之第四實施例中，該載板25可以為電 路板’該載板2 5上並设有複數導電線路2 51以及電源輸 入點252，而該散熱基板221與載板25間可進一步設有 黏著導熱層253,以藉由該黏著導熱層253使該散熱基板 M342471 221與載板25得以相互黏貼固定，其中該黏著導熱層253 可以為導熱膠或銀膠；當然，亦可藉由固定件將該散熱基 板與載板相互組裝固定，如第五圖之第五實施例所示，該 固定件254可以為螺絲，該固定件254係設於散熱基板 • 221與載板25間。 而散熱基板221之作用在於：當各光源23工作所發 出之熱源，使該熱源傳導至散熱基板221時，令該散熱基 板221產生熱電效應，其中該散熱基板本體内之N、P型 *半導體的溫度差產生熱電動勢，改變電流流向，而將熱源 從散熱基板221之另侧散去，有效達到散熱之功效，並將 各光源之熱源加以冷卻’以確保光源之工作效能及效率。 另外，該散熱基板可以為平板狀，如第三圖至第五圖 所示，且可視所需調整該散熱基板之厚度，或調整複數奈 米級無機半導體粒子之組成以形成不同顏色，而該散熱基 板亦可以為不同形狀，而如第六圖所示之另一實施例中， 籲該散熱基板221可具有平板狀之本體222,以及該本體222 遠離光源23 —側延伸有複數散熱鰭片223，另外如第七 -圖所示之再一實施例中，該散熱基板221可具有平板狀之 一本體222，以及該本體222遠離光源23 —側延伸有複數 一波浪狀散熱片體224,以藉由該本體222與光源23接觸， 並將光源23工作所發出之熱源朝另側傳導，再利用複數 散熱鰭片223或複數波浪狀散熱片體224將熱源進一步朝 外界散去。 y 冨然，本創作之散熱裝置亦可應用於手電筒(如第 M342471 八圖及第九圖所示）、檯燈40(如第十圖所示）、或室内、 戶外照明燈50(如第十一圖所示）等照明設備中，而該照 明設備可以為單向發光也可以為多個方向發光，如第十一 圖所示，該散熱裝置22 —侧設置有光源23，使其形成單 向發光之照明設備；而如第十二圖所示，係為雙向發光， 係該散熱裝置22至少一侧設置有光源23,使其形成雙向 發光之照明設備；亦可視所需於該散熱基板相對於光源另 側進一步設有散熱組件（例如散熱鰭片或風扇或其組 合），更可加強其散熱效果。 另外，如第十一圖之實施例所示，該固定件254可以 鎖入照明燈之殼體51中，並使該散熱基板221與該殼體 51間可形成一散熱間隙P。 而本創作相較於習有係具有下列優點： 1、 習有散熱方式係藉由熱傳導方式，而本創作係藉 由熱電效應，使陰、陽原子碰撞、耦合讓能量消失，進而 造成冷卻效果，其散熱較果較佳。 2、 本創作利用單一散熱基板即可取代習有之散熱結 構（包含有散熱鰭片、風扇、熱導管等），其結構簡單成本 較低，且不需要繁雜之組裝結構即可成型。 3、 單一散熱基板之結構可使整體照明裝置之體積大 為減少，且可依所需设計成不同外型，使整體照明裝置之 外型更具實用性及美觀。 綜上所述，本創作提供一較佳可行之照明設備之散熱 裝置，爰依法提呈新型專利之申請；再者，本創作之技術 M342471 内容及技術特點已揭示如上，然而熟悉本項技術之人士仍 可能基於本創作之揭示而作各種不背離本案創作精神之 替換及修飾。因此，本創作之保護範圍應不限於實施例所 ‘揭示者，而應包括各種不背離本創作之替換及修飾，並為 •以下之申請專利範圍所涵蓋。 【圖式簡單說明】 ®第一圖係為習有路燈中散熱裝置之結構示意圖。 第二圖係為本創作中散熱裝置應用於路燈之結構示意圖。 第三圖（A)係為本創作中散熱裝置第一實施例之結構示意 圖。 第三圖（B)係為本創作中散熱裝置第二實施例之結構示意 圖。 第三圖（C)係為本創作中散熱裝置第三實施例之結構示意 圖。 胃第四圖係為本創作中散熱裝置第四實施例之結構示意圖。 第五圖係為本創作中散熱裝置第五實施例之結構示意圖。 第六圖係為本創作中散熱裝置第六實施例之結構示意圖。 ‘第七圖係為本創作中散熱裝置第七實施例之結構示意圖。 第八圖係為本創作中散熱裝置應用於手電筒之結構分解 圖。 第九圖係為本創作中散熱裝置應用於手電筒之結構立體 圖0 11 M342471 ^ 士圖係為本創作中散熱裝置應用於檯燈之結構立體圖。 第十一圖係為本創作中散熱裝置應用於室内、戶外照明燈 •之結構示意圖。 …且 第十二圖係為本創作中散熱裝置應用於雙向發光室内、戶 外照明燈之結構示意圖。 【主要元件代表符號說明】 _上蓋11 '第一空間111 蓋12 第二空間121 LED 燈 13 隔板14 開孔141 導熱基板15 _導熱件16 風扇17 散熱鰭片18 照明設備20 座體21 燈罩211 支撐架212 散熱裝置22 散熱基板221 12 M342471 本體222 散熱鰭片223 波浪狀散熱片體224 容置部225 光源2 3 導電接點231 發光晶片232 封裝膠體233 導電導熱層24 圖案241 電源輸入點242 載板25 導電線路251 電源輸入點252 黏著導熱層253 固定件254 手電筒30 檯燈40 照明燈50 殼體51 13M342471 VIII. New Description: [New Technology Field] This creation is about a heat sink for lighting equipment. It is designed to provide a heat sink that is effective in achieving heat dissipation and has a simple structure. It can also be applied to automotive headlights and flashlights. Lighting equipment such as table lamps, projection lamps, street lamps, fishing lights, indoor or outdoor lighting. [Prior Art] Recently, Light Emitting Diode (LED) has the advantages of power saving, long life, and mercury-free pollution. It has gradually replaced traditional light bulbs and is widely used in various lighting equipment. Regardless of the type of illuminating body used, it generates heat due to internal loss and function conversion during lighting. This heat causes the temperature of the illuminating device to rise, and the various components are easily damaged or the life is shortened, so how to reduce the illuminating device The heat generated is worthy of everyone's attention. The conventional street lamp structure does not have any heat sinks, so that the heat generated by the lighting device cannot be removed in time; and the lighting device is not completely sealed, dust, moisture, mosquitoes, etc. may enter the lampshade, causing messy interior of the lampshade, affecting lighting. The effect and brightness. Therefore, a street lamp structure with a heat sink is developed, and can be referred to the Taiwan Patent Publication No. M292042. As shown in the first figure, it adopts a closed cover space formed by an upper cover 11 and a lower cover 12, in the middle. And a partition 14 partitions the accommodating space into a first space 111 and a second space 121. The partition 14 M342471 has an opening 141 for a heat-conducting substrate 15 . The heat-conducting substrate 15 is larger than the opening 141 ′ and is disposed above the opening 141 to close the opening 141 . The second space 121 is It is completely sealed, and a plurality of LED lamps 13 are disposed on the other surface of the heat-conducting substrate 15. A heat conducting member 16 transfers the heat generated by the LED lamp 13 to the heat dissipating fins 18 via the heat conducting substrate 15, and the heat on the heat dissipating fins 18 is provided by the fan 17 through the diversion holes provided in the upper cover ( (Fig. Display) and drain out to achieve heat dissipation. However, due to the limited internal space of the lampshade, the heat sink is limited in number of installations, so the heat dissipation effect is not good. If the heat sink and the fan can be installed, the volume of the lamp cover must be enlarged. The overall street lamp recording volume becomes larger; at the same time, each street lamp needs to be equipped with at least one fan; the fan has a limited service life, and the street lamp is set at a higher position, and it is not easy to detect when the fan is damaged, and the replacement is not easy. Convenient, thus affecting the lighting efficiency 0 [New content] There are 4 monitors, this creation is to improve the heat sink of the lighting device to provide a heat sink that effectively achieves the heat dissipation effect, and has a simple structure, and can be applied to the automobile. Headlights, flashlights, table lamps, projection lights, street lights, fish lights, indoor or outdoor lighting, etc. In order to achieve the above, the lighting device of the present invention comprises at least a body, a heat sink and at least one light source, and the heat sink is disposed at the seat body. The heat sink is provided with ceramic particles and plural a heat-dissipating substrate in which the nano-sized inorganic semiconductor particles are mixed, and the light source is disposed on the heat-dissipating substrate, and the heat source generated by the light source of the 6 M342471 causes the heat-dissipating substrate to generate a thermoelectric effect, and the heat source is dispersed from the other side of the heat-dissipating substrate , effectively achieve the effect of heat dissipation. [Embodiment] The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the embodiments. The heat sink of the present invention can be applied to lighting equipment such as automobile headlights, flashlights, desk lamps, projection lamps, street lamps, fishing lamps, indoor or outdoor lighting, etc., not only can achieve better heat dissipation effect, but also has a simple structure and does not need to be used. In the lighting device (for example, the street lamp shown in the first figure), a heat dissipating fin and a fan are disposed as heat dissipation, so that the lighting device of the present invention has a simple structure and a small volume. As shown in the second figure, the structure of the heat sink is applied to the street lamp. The lighting device 20 includes at least a seat body 21 for receiving the heat sink 22 and the light source 23, The base 21 is further provided with a lamp cover 211 for protecting the heat sink 22 and the light source 23, and the base 211 is connected to a side of the support frame 212. The heat sink 22 is disposed at the base 21. As shown in the third figure, the heat sink 22 is provided with a heat dissipation substrate 221 mixed with ceramic particles A and a plurality of nano-sized inorganic semiconductor particles B. At least one light source 23 is disposed on the heat dissipation substrate 221 The light source 23 is provided with a conductive contact 231. The light source 23 can be a related illuminable component such as Ray M342471, infrared, carbon nanotube, OLED, HID, LED and bulb. In the first embodiment, as shown in the third embodiment (A), a conductive and thermally conductive layer 24 is disposed between the light source 23 and the heat dissipation substrate 221, and the conductive and thermal conductive layer 24 may be a silver paste layer. The light source 23 is fixed on the heat dissipation substrate 221, and the conductive heat conduction layer 24 further forms a plurality of patterns 241 electrically connected to the conductive contacts 231, and is provided with a power input point 242; I of course, the pattern can be silver The pattern is plated with nickel and tin. In the second embodiment shown in FIG. 3B, the heat dissipation substrate 221 is further provided with a plurality of recessed accommodating portions 225, and the light source 23 and the conductive and thermally conductive layer 24 are disposed in the accommodating portion 225. The light source 23 can be a packaged light emitting diode, and the conductive contact 231 is disposed at the bottom to form an electrical connection with the conductive and thermally conductive layer 24. In the third embodiment shown in FIG. 3C , the heat dissipation substrate 221 is further provided with a plurality of recessed accommodating portions 225 , and the light source 23 and the conductive and thermally conductive layer 24 are disposed in the receiving portion 225 . The light source 23 includes at least a light-emitting chip 232. The conductive heat-conducting layer 24 is disposed between the light-emitting chip 232 and the heat-dissipating substrate 221, and the receiving portion 225 is further provided with a sealing rubber body 233 for the light-emitting chip 232. cover. In addition, a carrier 25 is disposed between the light source 23 and the heat dissipation substrate 221. In the fourth embodiment shown in FIG. 4, the carrier 25 may be a circuit board 'the carrier 25 and provided with a plurality of The conductive circuit 2 51 and the power input point 252, and the heat conductive layer 253 may be further disposed between the heat dissipation substrate 221 and the carrier 25 to adhere the heat dissipation substrate M342471 221 and the carrier 25 to each other by the adhesive heat conductive layer 253. The fixing heat conductive layer 253 may be a thermal conductive adhesive or a silver adhesive; of course, the heat dissipation substrate and the carrier plate may be assembled and fixed to each other by a fixing member, as shown in the fifth embodiment of the fifth figure, the fixing member The 254 may be a screw, and the fixing member 254 is disposed between the heat dissipation substrate 221 and the carrier 25. The heat-dissipating substrate 221 functions to: when the heat source generated by each light source 23 is transmitted to the heat-dissipating substrate 221, the heat-dissipating substrate 221 generates a thermoelectric effect, wherein the heat-dissipating substrate body has N, P-type* semiconductors. The temperature difference generates a thermoelectromotive force, changes the current flow direction, and dissipates the heat source from the other side of the heat dissipation substrate 221, effectively achieving the heat dissipation effect, and cooling the heat source of each light source to ensure the working efficiency and efficiency of the light source. In addition, the heat dissipation substrate may be in the form of a flat plate, as shown in the third to fifth figures, and the thickness of the heat dissipation substrate may be adjusted as needed, or the composition of the plurality of nano-sized inorganic semiconductor particles may be adjusted to form different colors. The heat dissipating substrate may have a different shape. In another embodiment, as shown in FIG. 6, the heat dissipating substrate 221 may have a flat body 222, and the body 222 has a plurality of fins extending away from the side of the light source 23. In another embodiment, as shown in the seventh embodiment, the heat dissipation substrate 221 may have a flat body 222, and the body 222 extends from the side of the light source 23 to form a plurality of wavy fin bodies 224. The main body 222 is in contact with the light source 23, and the heat source emitted by the operation of the light source 23 is conducted to the other side, and the heat source is further dissipated to the outside by the plurality of heat dissipation fins 223 or the plurality of wave fins 224. y 冨然, the creation of the heat sink can also be applied to flashlights (such as shown in Figure 8 and Figure VIII of the M342471), table lamp 40 (as shown in Figure 10), or indoor and outdoor lighting 50 (such as the tenth In the lighting device, etc., the lighting device may be unidirectionally illuminating or illuminating in multiple directions. As shown in FIG. 11 , the heat dissipating device 22 is provided with a light source 23 on the side to form a single sheet. The illuminating device for illuminating; and as shown in FIG. 12, is a two-way illuminating device, wherein the heat dissipating device 22 is provided with a light source 23 on at least one side thereof to form a bidirectional illuminating illuminating device; Further, a heat dissipating component (for example, a heat dissipating fin or a fan or a combination thereof) is further disposed on the other side of the light source, thereby further enhancing the heat dissipating effect. In addition, as shown in the embodiment of the eleventh embodiment, the fixing member 254 can be locked into the housing 51 of the illumination lamp, and a heat dissipation gap P can be formed between the heat dissipation substrate 221 and the housing 51. Compared with Xiyou, this creation has the following advantages: 1. The heat dissipation method is based on heat conduction, and the creation system uses the thermoelectric effect to cause the atoms of the yin and yang to collide and couple to make the energy disappear, thereby causing the cooling effect. Its heat dissipation is better. 2. This creation can replace the conventional heat dissipation structure (including heat sink fins, fans, heat pipes, etc.) with a single heat sink substrate. The structure is simple and low cost, and it can be molded without complicated assembly structure. 3. The structure of the single heat-dissipating substrate can greatly reduce the volume of the overall lighting device, and can be designed into different shapes according to the requirements, so that the overall lighting device is more practical and beautiful. In summary, the present invention provides a heat-dissipating device for a better and feasible lighting device, and submits a new patent application according to law; further, the content and technical features of the present technology M342471 have been disclosed above, but are familiar with the technology. Persons may still make substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of this creation should not be limited to the 'disclosed' of the examples, but should include all kinds of substitutions and modifications that do not depart from the creation, and are covered by the following patent application. [Simple description of the diagram] ® The first diagram is a schematic diagram of the structure of the heat sink in the street lamp. The second figure is a schematic diagram of the structure of the heat sink applied to the street lamp in the present creation. The third figure (A) is a schematic structural view of the first embodiment of the heat sink device in the present creation. The third figure (B) is a schematic structural view of the second embodiment of the heat sink device in the present creation. The third figure (C) is a schematic structural view of the third embodiment of the heat sink device in the present creation. The fourth figure of the stomach is a schematic structural view of the fourth embodiment of the heat dissipating device in the present creation. The fifth figure is a schematic structural view of the fifth embodiment of the heat sink device in the present creation. The sixth figure is a schematic structural view of the sixth embodiment of the heat sink device in the present creation. ‘The seventh figure is a schematic structural view of the seventh embodiment of the heat sink device in the present creation. The eighth figure is an exploded view of the structure of the heat sink applied to the flashlight. The ninth picture shows the structure of the heat sink applied to the flashlight in this creation. Figure 10 11 M342471 ^ The figure is the perspective view of the structure of the heat sink applied to the lamp. The eleventh figure is a schematic diagram of the structure of the heat sink applied to indoor and outdoor lighting. ... and the twelfth figure is a schematic diagram of the structure of the heat dissipating device applied to the two-way lighting indoor and outdoor lighting. [Description of main component representative symbols] _Upper cover 11 'First space 111 Cover 12 Second space 121 LED lamp 13 Partition 14 Opening 141 Thermal substrate 15 _ Heat conductive member 16 Fan 17 Heat sink fin 18 Lighting device 20 Body 21 Lampshade 211 Support frame 212 Heat sink 22 Heat sink 221 12 M342471 Body 222 Heat sink fin 223 Wave heat sink body 224 Socket 225 Light source 2 3 Conductive contact 231 Light-emitting chip 232 Package gel 233 Conductive heat-conducting layer 24 Pattern 241 Power input point 242 Carrier 25 Conductive line 251 Power input point 252 Adhesive thermal layer 253 Fixing piece 254 Flashlight 30 Table lamp 40 Illuminator 50 Housing 51 13